The invention discloses an automatic coupling package method of a butterfly-shaped semiconductor laser, and relates to the field of automatic coupling package of electronic devices. The automatic coupling package method comprises the steps of feeding-onto-machine of accessories, coupling alignment, welding and the like. An automatic coupling package device realizing the automatic coupling packagemethod comprises vertical columns, a transverse beam, an optical fiber clamp, a lens clamp mechanism, a lower clamp device, a material disc mechanism, a laser power meter and the like, wherein the optical fiber clamp, the lens clamp mechanism, the lower clamp device, the material disc mechanism and the laser power meter are arranged on a base; and the positions of the optical fiber clamp, the lensclamp mechanism and an optical fiber automatic angle-adjusting welding device can be adjusted so as to realize accurate coupling package of the butterfly-shaped semiconductor laser. The automatic coupling package method is high in automation degree and high in package efficiency; the coupling package device adopted by the automatic coupling package method is reasonable in structural design, the complete subsequent procedures from coupling alignment to package can be automatically completed, and compared with a traditional manual production line, the automatic coupling package device has the advantages of being easy and convenient to operate, low in production cost, stable in product quality and the like.