The invention relates to a cleaning solution for a
copper surface of a
ceramic-based
printed circuit board and an application method of the cleaning solution, relates to the technical field of cleaning of
ceramic-based printed circuit boards, and aims to solve the problem of poor appearance of'
white spots' or'white dots' caused by bubble attachment at a
grain boundary during traditional micro-
etching cleaning of a large-grain
copper layer generated by an active
metal brazing process. The cleaning solution is prepared by mixing an oil removing agent and a micro-
etching agent according to a
specific volume ratio; the application method of the mixed cleaning solution comprises the following steps: adding pure water into a clean cleaning tank, adding the oil removal liquid and the micro-
etching liquid according to a preset proportion, supplementing the pure water to a working liquid level, circularly heating to a set temperature, and immersing a
ceramic-based
printed circuit board to be treated into the mixed cleaning solution for treatment; according to the method, oil removal and micro-etching processes which are carried out step by step in a traditional
production line are integrated into one step, and aggregation and attachment of micro-etching reaction bubbles on a
copper surface
grain boundary and holes are effectively inhibited by utilizing the synergistic effect of components in the
mixed solution, so that the phenomenon of'
white spots' is eliminated from the source.