553results about "Conductive pattern polishing/cleaning" patented technology

The invention discloses a roll-to-roll cleaning control method and system for a flexible circuit board electronic structural member, and relates to the technical field of electronic manufacturing, and the method comprises the steps: carrying out the partitioning processing of a to-be-cleaned member, and obtaining a thin region and a thick region; the drying cavity is partitioned on the basis of the thin area and the thick area, and a partitioned temperature control method is constructed; a dehumidification drying module is placed, and a hot air drying method is obtained based on a chilled mirror dew-point instrument; the roll-to-roll cleaning control method is used for solving the problems that in an existing roll-to-roll cleaning control method for the flexible circuit board electronic structural part, differential temperature control is not carried out on a thick area and a thin area, and the influence of environment humidity in a drying cavity on the drying effect is not considered; the problems that a thin plate is overheated after being dried, water in a thick plate is not completely evaporated, watermarks which cannot be wiped appear on the surface of the electronic structural part, and then the practicability of the cleaned electronic structural part is affected are solved.

The invention discloses a circuit board production method and a circuit board. The method comprises the following steps: laminating at least two substrates and at least one prepreg to obtain a first circuit board; performing drilling and copper deposition treatment on the first circuit board to obtain at least one target via hole; performing resin hole plugging on the target via hole to obtain a second circuit board; performing uniform copper deposition electroplating on the target surface with the target via hole on the second circuit board to obtain a third circuit board; grinding and polishing the hole filling copper layer on the third circuit board to obtain a fourth circuit board with a target copper layer; and performing line forming processing on the fourth circuit board to obtain a target circuit board. The generated hole filling copper layer is filled with the first groove generated after the resin is cooled, and the hole filling copper layer is ground and polished to obtain the target copper layer, so that the flatness of the surface of the circuit board can be improved, and the welding quality of the chip is ensured.

The present invention belongs to the technical field of computer motherboard production, and specifically relates to a high-precision computer motherboard automatic patch processing device, the high-precision computer motherboard automatic patch processing device comprises a motherboard transport platform, the motherboard transport platform is provided with a jacking component, the jacking component is provided with a coating component, one side of the coating component is provided with an activation unit, one side of the activation unit is provided with a patch module, and the end of the motherboard transport platform away from the patch module is provided with a cleaning component; the coating component comprises a scraper moving unit and a solder paste replenishing unit, the scraper moving unit drives the ratchet and the angle wheel to rotate through the movement of the telescopic plate, so that the movable extrusion plates on both sides move and drive the scraper to move, and through the squeezing action of the scraper, it passes through the small holes on the silk screen template and is coated on the specified position of the circuit board, and at the same time drives the activation unit to regulate the temperature of the solder paste, to ensure that the solder paste enters the patch module at a suitable temperature for patching.

The invention provides improved techniques for bonding devices using copper-to-copper or other types of bonds. A substrate is cleaned to remove surface oxides and contaminants and then rinsed. The rinsed substrate is provided to coating unit where a protective coating is applied to the substrate. The protective coating may be applied by immersing the substrate in a bath or via chemical vapor deposition. In an aspect, the protective coating may be copper selective so that the protective coating is only applied to copper features of the substrate. The protective coating minimizes formation of oxides and other bond weakening forces that may form during bonding processes, such as bonding a copper wire to a copper bond pad of the substrate. In an aspect, an annealing process is used to cure the protective coating and remove small imperfections and other abnormalities in the protective coating prior to the bonding process.

The invention relates to a protective layer coating method of a stepped golden finger three-dimensional structure. The protective layer coating method comprises the following steps: step 1, surface activating treatment: performing plasma cleaning on the surface of a printed circuit board; step 2, coating a three-dimensional curved surface: adopting non-contact spraying equipment, coating a protective material in sections along the height change direction of the step structure of the golden finger, independently controlling the coating amount of each section, and forming an inclined angle between a dispensing head and the plate surface during coating; and step 3, step curing treatment: carrying out ultraviolet light curing on the coating area. The invention provides a method for coating a protective layer of a stepped golden finger three-dimensional structure. The core of the method is to solve the covering problem of a stepped region through segmented control and non-contact coating.

The invention relates to the technical field of cleaning machines, in particular to a PCB after-copper-deposition cleaning machine which comprises a pickling machine, a clear water flushing machine is arranged on the left side of the pickling machine, a cold air drying machine is arranged on the left side of the clear water flushing machine, a hot air drying machine is arranged on the left side of the cold air drying machine, and a turnover box is arranged on the left side of the hot air drying machine. A conveying mechanism used for conveying PCBs is jointly arranged in the pickling machine, the clean water flushing machine, the cold air drying machine and the hot air drying machine, and the PCBs are conveyed and cleaned from right to left. Through cooperative use of the driving assembly, the reciprocating assembly and the rotating assembly, rotation of the rotating nozzles is synchronously achieved while the rotating nozzles are driven to do linear reciprocating motion; by means of the technical scheme, reciprocating linear spraying and rotary spraying are achieved, the washing coverage area is increased, compared with fixed spray head washing, dynamic washing reduces cleaning blind areas, shearing force to stains is increased through a complex water flow mode generated by rotation and reciprocating actions, pollutants can be stripped and taken away easily, and the cleaning effect is good.

A workpiece cleaning device comprises a liquid storage tank which comprises a cleaning area and a filtering area; the filtering body is assembled in the filtering area; the pump circulation assembly is respectively communicated with the cleaning area and the filtering area and is used for circulating a cleaning medium between the cleaning area and the filtering area; and the bearing assembly is arranged in the cleaning area, and the bearing assembly is used for bearing and fixing the multiple workpieces. By additionally arranging the pump circulation assembly, a cleaning medium can be recycled, and impurities in the cleaning medium can be effectively filtered in cooperation with the additionally arranged filtering body so as to be used for continuous cleaning of workpieces of the next batch, so that consumption of the cleaning medium can be effectively reduced, and the cleaning cost of the workpieces is reduced. And by additionally arranging the bearing assembly, the multiple workpieces can be conveniently placed, meanwhile, the multiple workpieces can be conveniently taken and placed at the same time, and the cleaning efficiency is improved.

The invention discloses a film stripping and cleaning device for PCB production, and belongs to the technical field of integrated circuit manufacturing. Comprising a supporting frame, a roller conveying module is arranged on the supporting frame, two sets of spraying modules are arranged in the supporting frame, each spraying module comprises a liquid inlet pipe, the liquid inlet pipes are fixedly connected to the supporting frame in a penetrating mode, and the liquid inlet pipes and the supporting frame are jointly and rotationally connected with symmetrically-distributed spraying pipes. The spraying pipes are fixedly connected with connecting gears, rack frames which are symmetrically distributed are slidably connected into the supporting frame, the connecting gears are meshed with the corresponding rack frames, and a pushing assembly is arranged on the supporting frame. The connecting gears drive the corresponding rotating liquid pipes to swing in a reciprocating mode, the rotating liquid pipes swing in a reciprocating mode to drive the nozzle sets on the rotating liquid pipes to swing synchronously, then the cleaning positions of the nozzle sets on the circuit board are continuously changed, and therefore the cleaning uniformity of the multiple nozzle sets on the circuit board is improved.

The invention relates to a circuit board glue removing processing method, circuit board glue removing equipment, a circuit board processing system and a circuit board. The method comprises the steps of determining a glue overflowing area of a to-be-processed circuit board, detecting the glue overflowing thickness of the to-be-processed circuit board, and determining laser power of a glue overflowing position based on the glue overflowing thickness so as to remove overflowing glue in the glue overflowing area. Wherein the glue overflowing area comprises a plurality of glue overflowing positions, each glue overflowing position corresponds to one glue overflowing thickness, and at least two glue overflowing thicknesses are not equal. According to the method, the excessive glue thicknesses of the multiple excessive glue positions are accurately detected, the corresponding laser power is determined based on different excessive glue thicknesses, and the excessive glue at the excessive glue positions is correspondingly removed, so that the excessive glue in the excessive glue area is accurately removed, the excessive glue is accurately removed, and the processing efficiency of a circuit board is improved.

The invention relates to the technical field of circuit board manufacturing equipment, in particular to integrated circuit board processing and manufacturing equipment which comprises an operation table, a feeding structure, a conveying structure, a discharging structure, a sorting structure, a dust removal structure, a PCB jointed board and a cutting structure. The feeding structure is arranged in cooperation with the conveying structure, automatic conveying of jointed PCBs is conveniently achieved, the conveying efficiency is improved, the sorting structure is arranged on the discharging structure, the sorting structure is used in cooperation with the cutting structure, cut waste and formed independent circuit boards are conveniently and rapidly separated, manual screening is avoided, the operation efficiency is improved, practicability is high, and practicability is high. And a dust removal structure is arranged on the sorting structure in a matched mode, waste chips generated in the cutting process can be effectively sucked and removed through the dust removal structure, and cleaning is convenient.

The invention discloses a board dividing machine for camera PCBs, and relates to the field of board dividing machines. The board dividing machine comprises a board dividing machine body, an equipment frame is arranged above the board dividing machine body, a machining base is arranged at the top of the board dividing machine body, a collecting structure is arranged in the board dividing machine body, and a limiting frame is fixed to the top end of the machining base. Through arrangement of an adsorption plate, negative pressure suction pipes, a storage box and an air extracting pump, an adjusting rod drives the adsorption plate to rotate towards one side, a second motor drives the adsorption plate to rotate to be aligned with a limiting frame and a dust collection frame on a machining base, the adsorption plate moves downwards through a hydraulic push rod, the multiple negative pressure suction pipes make contact with the surface of a PCB on a containing block, and the PCB is placed on the containing block; negative pressure is generated through an air suction pump and an air suction pipe, then PCBs are adsorbed and fixed, then the PCBs are driven to move upwards, rotate and move downwards, then the PCBs are conveyed into a storage box, all the PCBs are transferred at a time, stacking is conducted, the multiple PCBs on the two machining bases are sequentially and rapidly collected, and the board separation efficiency is improved.

The utility model relates to the technical field of GPS (Global Positioning System) antenna production, in particular to full-automatic production equipment for a GPS antenna, which realizes surface cleaning, double-sided printing, pin insertion, solder paste brushing and welding, process processing and blanking and placing of a substrate, is high in automation degree, reduces the labor cost and the labor intensity, and greatly improves the production efficiency of the GPS antenna.

The invention relates to the field of circuit boards, in particular to surface treatment equipment for PCB (printed circuit board) processing, which comprises a bottom plate, a soaking box and a driving assembly, the bottom plate is fixedly connected with a soaking box; the bottom plate is connected with a driving assembly used for driving the fixing frame and the parts on the fixing frame to move. The device further comprises a fixing frame and the like. The driving assembly is connected with a fixing frame; the fixed frame is fixedly connected with a plurality of electric push rods I; the telescopic ends of all the electric push rods I are jointly and fixedly connected with a connecting plate, and the connecting plate is slidably connected with the fixing frame. An electric push rod III is controlled to enable a rectangular plate to drive a connecting pipe and an absorption barrel to move towards one side close to a corresponding blind hole, the absorption barrel and corresponding absorption cotton are separated from each other until the absorption barrel enters the blind hole, redundant soaking liquid in the blind hole is absorbed and cleaned through the sponge on the surface of the absorption barrel, and the cleaning efficiency is improved. The problems that the thickness of a protective layer in the blind hole is relatively high and the draining efficiency is low due to the fact that residual soaking liquid in the blind hole cannot be thoroughly drained in the prior art are solved.

The application discloses an improved semi-additive process based on customized ultra-thin copper foil flexible copper-clad plate and a fine circuit board, and belongs to the technical field of flexible printed circuit boards. The process adopts a customized ultra-thin copper foil FCCL substrate, and the circuit is prepared through substrate selection pretreatment, pattern size pre-compensation, laser drilling and black shadow process hole metallization, pattern transfer and selective electroplating thickening, film stripping and flash etching forming. The micro-etching amount is cooperatively controlled throughout the process, and combined with optimized plasma cleaning and high hole filling electroplating, the fine circuit production with a minimum line width and line spacing of 45 microns or less can be stably realized, and the highest fine circuit production can reach 25 / 25 microns. The application solves the problems of traditional process, such as large side etching, low precision, poor yield and the like, and the circuit board prepared has the advantages of excellent size stability, strong heat resistance and uniform micro-hole filling, is suitable for high-density interconnection and high-end consumer electronic demand, and has significant advantages of precision, yield and reliability compared with existing processes.

The invention discloses a circuit board cleaning method, which relates to the technical field of intelligent manufacturing, and comprises the following steps: identifying a to-be-cleaned area on a circuit board, and obtaining height data; determining a cleaning start point and a cleaning end point; a cleaning path point corresponding to the circuit board and a cleaning height corresponding to the circuit board are output through a pre-constructed cleaning path model, so that a cleaning path is determined; according to the method, the cleaning instruction of the cleaning equipment is generated, the circuit board is cleaned in response to the cleaning instruction until certain cleaning conditions are met, the problems that manual cleaning is high in cost and prone to causing product damage are solved, and the reject ratio is increased; the technical problems of high cleaning time consumption and low cleaning quality and efficiency of a machine are solved, and the technical effects of automatically identifying the cleaning area, fully considering the height difference, automatically adjusting the cleaning path, avoiding collision, reducing the equipment loss risk, greatly reducing the setting time and the cleaning time of the cleaning equipment and improving the cleaning efficiency and quality are achieved.

The utility model discloses a PCB (Printed Circuit Board) cleaning device in the technical field of circuit board processing equipment, and aims to solve the problems that the cleaning effect of a PCB is difficult to guarantee and the cleaning process is inconvenient in the prior art. The ultrasonic cleaning device comprises an ultrasonic cleaning tank, a lifting mechanism arranged on one side of the ultrasonic cleaning tank and a plurality of placing plates, a mounting plate is arranged at the output end of the lifting mechanism, the mounting plate can move in the vertical direction and is immersed in cleaning liquid of the ultrasonic cleaning tank, a plurality of positioning pieces are arranged on the mounting plate in the vertical direction, and the positioning pieces are arranged on the mounting plate. The positioning piece can be used for positioning and fixing the placing plate in the horizontal direction, a plurality of placing grooves are formed in the placing plate, and the placing grooves are used for placing PCBs. According to the PCB cleaning device, stains on the surface of a PCB are efficiently removed through the cavitation effect of the ultrasonic cleaning tank, the surface of the PCB is not prone to being damaged, manual operation is simplified through the provided automatic batch cleaning mode, and the cleaning efficiency of the PCB can be improved.

The invention discloses a pickling device for a computer circuit board, and relates to the technical field of circuit board production, the pickling device comprises a pickling tank and two lifting cylinders, the two lifting cylinders are installed on the outer side of the pickling tank, the movable ends of the two lifting cylinders are jointly connected with a connecting frame, four connecting rods are connected to the lower portion of the connecting frame, and the connecting rods are connected with the pickling tank. The lower end of each connecting rod is connected with a cleaning frame, and a clamping conversion mechanism is arranged on the cleaning frame and used for alternately replacing clamping parts of a circuit board. The clamping conversion mechanism is arranged, and the first sliding block and the second sliding block are driven to slide in opposite directions by using the change of the liquid level in the pickling tank and taking buoyancy as a drive; the second limiting block replaces the first limiting block to clamp and limit the circuit board, so that clamping conversion is realized, a clamped area on the circuit board can be in contact with a pickling solution, a pickling missing area of the circuit board is avoided, and the pickling quality is ensured.

The invention belongs to the field of circuit board processing, and particularly relates to a circuit board and a processing method thereof, and the method comprises the following steps: transferring an image on a production film to a plate; electroplating a conductive layer on the exposed copper sheet of the circuit pattern of the board and the hole wall; removing an anti-electroplating covering film layer of the plate by using a cleaning solution to expose a non-circuit copper layer of the plate; the plate is installed in a machining device to be subjected to acid pickling, an exposed copper layer on the plate is removed through an acid pickling solution, and the residual acid pickling solution on the plate is removed while the plate is separated from the acid pickling solution; the board is immersed in water, the board is cleaned, residual water on the board is removed while the board is separated from the water, the board is dried, and the circuit board is obtained; according to the method, the residual pickling solution on the plate can be removed while the plate is separated from the pickling solution, and the pickling solution is prevented from dripping on other equipment.

The invention relates to the technical field of PCB manufacturing, in particular to a dust cleaning device for a PCB separator, which comprises a rack, a conveying unit, a carrying mechanism and a dust removal mechanism, the conveying unit, the carrying mechanism and the dust removal mechanism are mounted on the rack, and a casing surrounding the conveying unit, the carrying mechanism and the dust removal mechanism is mounted outside the rack. The conveying unit comprises a feeding area arranged on one side of the rack, a discharging area arranged on the other side of the rack and a turnover area located between the feeding area and the discharging area. The turnover area comprises a sliding module installed on the rack and a dust removal jig installed at the output end of the sliding module, and the sliding module is used for driving the dust removal jig and PCBs on the dust removal jig to enter and exit from the dust removal mechanism. The dust removal mechanism is used for outputting ion cyclone; the high-speed ion cyclone is generated through the dust removal mechanism, dust is lifted and rapidly sucked away, and dead-corner-free dust removal of the PCB is achieved.

The application discloses a kind of printed circuit board wet chemical treatment equipment and its using method, the present application relates to the field of wet chemical treatment of printed circuit board, including equipment body, the top left side of the equipment body Two ends of symmetry are equipped with lifting assembly, the top and bottom of the inner cavity of reinforcing assembly are symmetrically movably connected with triangular plate, the two sides of the inner cavity of reinforcing assembly are symmetrically movably connected with displacement assembly, the two ends of installation component bottom are symmetrically installed with rack, and the side of rack is provided with brush roller.The printed circuit board wet chemical treatment equipment and its using method of the application, by the installation component of up and down movement, can drive rack to move up and down, rack can be engaged with gear at this time, so that brush roller can rotate, so that brush roller can contact the bottom of printed circuit board, when wet chemical treatment is carried out to printed circuit board, the efficiency of processing can be improved.

The utility model discloses a roller of circuit board horizontal processing equipment. A plurality of convex rollers and concave rollers are alternately arranged in sequence; the single side diameter of the concave roller is smaller than that of the convex roller; the diameter of the concave roller is 2 / 3 to 7 / 8 of that of the convex roller; the length of the concave roller is more than or equal to three times that of the convex roller; the convex roller wheels and the concave roller wheels which are small in height difference are arranged, the width between every two adjacent convex roller wheels is large, the convex roller wheels make contact with the plate face in a small area, the problem that foreign matter adheres to the plate face is solved, the concave roller wheels are large in diameter, impact of sprayed liquid medicine can be effectively blocked, meanwhile, a certain space is formed between the concave roller wheels and the surface of a to-be-machined plate, and the surface of the to-be-machined plate is protected. The whole structure prevents the problem that spraying liquid medicine is difficult to retain on the plate surface of the to-be-processed plate; the state that the liquid medicine can be retained but cannot be excessively retained can be formed, and the effect that the force of liquid medicine exchange is moderate is achieved.

The application discloses an aluminum nitride film circuit substrate and a preparation method thereof, and relates to the technical field of aluminum nitride substrates.The application is characterized by the following steps: a titanium film is plated on the surface of an aluminum nitride ceramic substrate by magnetron sputtering, and then a copper film is plated on the surface of the titanium film by magnetron sputtering; and a nickel film is plated on the surface of the copper film by a chemical plating method to prepare the aluminum nitride film circuit substrate.Through the titanium-copper gradient dynamic transition technology, a gradient alloy layer is formed to reduce the interface stress; the titanium and the surface of the aluminum nitride are combined through a chemical bond to form a dense transition layer, thereby relieving the difference in the thermal expansion coefficient; the copper enhances the conductive performance of the surface of the aluminum nitride ceramic substrate; the titanium compensates for the interface defects of the mismatch between the copper and the aluminum nitride ceramic lattice; the chemical nickel plating enhances the hardness and corrosion resistance of the aluminum nitride ceramic substrate, and the aluminum nitride film substrate is endowed with weldability and bondability.

The utility model discloses a PCB (printed circuit board) cleaning device which comprises a board pushing mechanism and a cleaning mechanism, the cleaning mechanism comprises a fan, and an air outlet of the fan faces a PCB to be cleaned; the push plate mechanism is used for placing and pushing a to-be-cleaned PCB to move towards an air outlet of the fan, the push plate mechanism is provided with a control unit, and the control unit controls the push plate mechanism to move through a push plate signal; an electromagnetic valve is arranged at an air source of the fan, the electromagnetic valve is used for controlling the opening and closing of the air source, the electromagnetic valve is connected to the control unit, and the control unit can control the opening and closing of the electromagnetic valve through a driving signal; the push plate signal and the driving signal are triggered at the same time. Compared with the prior art, the PCB cleaning device can clean PCBs while pushing the PCBs, manual board brushing is not needed, the labor cost is reduced, and the productivity is improved.

The invention discloses an automatic turn-over multi-layer circuit board cleaning machine, and relates to the technical field of circuit board cleaning, the automatic turn-over multi-layer circuit board cleaning machine comprises an ultrasonic cleaning box, a multi-layer processing mechanism is arranged at the top end and in the ultrasonic cleaning box, and the multi-layer processing mechanism is used for clamping a circuit board during cleaning and controlling the circuit board to enter and exit from the interior of the ultrasonic cleaning box; the multi-layer processing mechanism can scrape the surface of a water body in the ultrasonic cleaning box during turning over and spray liquid on the surface of the circuit board after the circuit board is turned over, the circuit board can be turned over by moving the cleaning box upwards, therefore, turning over can be conducted without manual work or an additional power source, energy loss is reduced, the whole manual operation process is simplified, and the working efficiency is improved. When the circuit board is turned over, the spraying plate can be driven to move in a reciprocating mode, impurities floating on the surface of a water body can be removed when the circuit board is turned over, then cross contamination generated in the cleaning process is reduced, it is guaranteed that the two faces of the circuit board can be cleaned, and the cleaning effect of the circuit board is improved.

The invention discloses a PCB surface treatment process based on local gold plating and nickel and gold immersion, and relates to the technical field of surface treatment processes. The method is used for processing a PCB which needs local hard gold plating and nickel gold immersion at other positions, and comprises the following steps: S1, pre-processing: processing the PCB to a copper thickness before electroplating; s2, first-layer pattern processing: pasting a dry film on the CS surface of the PCB and etching to form a pattern; s3, gold plating preparation; s4, local gold plating; s5, removing the film and processing a second layer of pattern; s6, removing the wire; s7, resistance welding and protection; and S8, nickel and gold immersion treatment. According to the surface treatment process, the microcosmic roughness of the surface of the substrate is accurately controlled through multi-step pretreatment, and high-pressure water washing and plasma cleaning are combined, so that the mechanical embedding force of a plating layer and a copper layer is ensured, and the problem that the plating layer is not uniform due to too large roughness is avoided. And meanwhile, the current distribution is regulated and controlled by adopting pulse current and a magnetic mask in the copper deposition and electroplating stages, so that the compactness and thickness uniformity of the coating are improved.

The invention provides a positioning processing device for electronic components, which relates to the field of electronic manufacturing and comprises a chip mounter main body, a feeding conveying belt, a mounting head main body, a feeding bearing tray, an anti-static brush roller, a conveying mounting mechanism and an extrusion dustproof mechanism. The feeding conveying belts are fixedly connected to the interior of the chip mounter body. The control box body is fixedly connected to the front of the chip mounter main body; the chip mounting moving truss is fixedly connected to the inner side of the chip mounter main body; the mounting head main body is connected to the outer side of the mounting moving truss in a sliding manner; the anti-static brush roller is arranged above the feeding bearing tray; the conveying and mounting mechanism is arranged on the outer side of the feeding bearing tray. The extrusion dustproof mechanism is arranged above the feeding bearing tray, the machining quality of electronic components is improved, the machining yield of the electronic components is increased, and the problems that when an existing conveying belt runs, mechanical vibration is generated, and edge warping deformation of a base plate is likely to happen are solved.

The utility model relates to the technical field of circuit board production, and discloses a waste residue cleaning device for circuit board production, which is characterized in that the top end of a box body is provided with a box cover, the inner wall of the box body is fixedly provided with a partition plate, the lower side of the box body is provided with a collecting assembly for collecting waste residues, and the two ends of the partition plate are respectively provided with an air cylinder; according to the waste residue cleaning device for circuit board production, the cleaning mechanism is arranged to be matched with the fixing assemblies, so that the circuit board can be cleaned, a large amount of industrial waste residues remaining on the surface of the circuit board in the production process can be cleaned more conveniently, and the production efficiency is improved. And the inserting blocks are arranged to be inserted into the inserting grooves, so that the cleaning brush is more convenient to install, meanwhile, the cleaning brush is more convenient to detach, and when the cleaning effect is affected by the conditions such as abrasion of the cleaning brush, the cleaning brush can be replaced more timely and more conveniently.

The utility model relates to the technical field of dust removal devices, and discloses a surface dust removal device for circuit board processing, which comprises a bottom plate, a sliding rod is arranged above the bottom plate, the sliding rod is provided with a clamping assembly for clamping a circuit board, the clamping assembly comprises a frame for clamping, the frame is hollow, and the frame is provided with a driving structure for controlling the opening and closing actions of clamping; dust removal equipment is arranged on the surface of the bottom plate and comprises a dust suction machine, and the dust suction machine is connected with two dust suction caps which are symmetrically arranged up and down; the bottom plate is provided with a first lead screw assembly for driving the sliding rod to move back and forth so that the frame can enter and exit between the two dust collection caps. The bottom plate is provided with an ejection mechanism for vertically conveying a circuit board to a frame station; and an air suction type symmetrical dust removal mode is adopted, so that scrapping of the circuit board caused by static electricity during dust removal is reduced, and the qualified rate of circuit board production is improved.