782results about "Conductive pattern polishing/cleaning" patented technology

The invention discloses a double-sided semi-embedded packaging substrate and a processing method thereof, and the processing method comprises the steps: carrying out the N times of double-sided circuit manufacturing and the N-1 times of double-sided layer adding of a multi-layer substrate alternately, and obtaining an operation board with two groups of symmetrical circuit structures; the circuit structure is provided with an outer circuit layer and (N-1) inner circuit layers which are communicated with each other, and the inner circuit layer located on the innermost side is provided with a bonding pad. Performing laser groove burning on the working board, and processing a blind groove which is provided with an opening at the outer circuit layer and takes the other inner circuit layer adjacent to the innermost inner circuit layer as the groove bottom locally on each group of circuit structure; removing the copper foil on the bottom of the blind groove; the bonding pads are completely exposed in the blind grooves corresponding to the bonding pads, the blind grooves in the two sets of circuit structures are communicated, and a through groove structure is obtained; and cleaning the surface of the bonding pad to obtain the double-sided semi-embedded packaging substrate. The processing method is simple and reasonable, the processing cost is low, the processing efficiency is high, and the reliability of the obtained double-sided semi-embedded packaging substrate is very high.

To provide a ceramic board which has good heat dissipation, and in which an integration density is high.SOLUTION: According to an embodiment, the present invention discloses a manufacturing method of an ultrathin high-density multilayer interconnection ceramic board, containing steps of: preparing a ceramic wafer, performing a laser punching to the ceramic wafer, and forming a via hole; performing a vacuum magnetron sputtering to the ceramic wafer, and forming a seed titan layer and a copper layer onto a front surface of the ceramic wafer and on a wall of the via hole by the sputtering; manufacturing a ceramic double-layer core plate; manufacturing a multilayer substrate; manufacturing a vertical interconnection multilayer substrate; and manufacturing a high-end multilayer HDI ceramic board. The multilayer ceramic plate manufactured in the above mentioned processing can be easily processed as compared with LTCC and HTCC, and an energy consumption amount for the processing is deteriorated. A heat conductivity of a finished product is improved. A wiring is more accurate; a conductive resistance is low; and a signal transmission loss is low.SELECTED DRAWING: Figure 1

The invention discloses a roll-to-roll cleaning control method and system for a flexible circuit board electronic structural member, and relates to the technical field of electronic manufacturing, and the method comprises the steps: carrying out the partitioning processing of a to-be-cleaned member, and obtaining a thin region and a thick region; the drying cavity is partitioned on the basis of the thin area and the thick area, and a partitioned temperature control method is constructed; a dehumidification drying module is placed, and a hot air drying method is obtained based on a chilled mirror dew-point instrument; the roll-to-roll cleaning control method is used for solving the problems that in an existing roll-to-roll cleaning control method for the flexible circuit board electronic structural part, differential temperature control is not carried out on a thick area and a thin area, and the influence of environment humidity in a drying cavity on the drying effect is not considered; the problems that a thin plate is overheated after being dried, water in a thick plate is not completely evaporated, watermarks which cannot be wiped appear on the surface of the electronic structural part, and then the practicability of the cleaned electronic structural part is affected are solved.

The invention discloses a circuit board production method and a circuit board. The method comprises the following steps: laminating at least two substrates and at least one prepreg to obtain a first circuit board; performing drilling and copper deposition treatment on the first circuit board to obtain at least one target via hole; performing resin hole plugging on the target via hole to obtain a second circuit board; performing uniform copper deposition electroplating on the target surface with the target via hole on the second circuit board to obtain a third circuit board; grinding and polishing the hole filling copper layer on the third circuit board to obtain a fourth circuit board with a target copper layer; and performing line forming processing on the fourth circuit board to obtain a target circuit board. The generated hole filling copper layer is filled with the first groove generated after the resin is cooled, and the hole filling copper layer is ground and polished to obtain the target copper layer, so that the flatness of the surface of the circuit board can be improved, and the welding quality of the chip is ensured.

The invention relates to the field of printed circuit board manufacturing, and particularly discloses a method for removing a wet film in a selective process of a printed circuit board and the printed circuit board. The method comprises the following steps: S1, providing a printed circuit board with a wet film formed on the surface; s2, a primary bulking process; s3, a pressurized ultrasonic spraying and bulking process; s4, a preliminary film stripping process; s5, a first pressurized spraying film stripping process; s7, a multi-section type pressure difference pressurization spraying washing process; wherein a film stripping agent solution with the mass concentration of 10-20 kg / m < 3 > is adopted in the step S2, the step S3, the step S4 and the step S5; the film removing agent comprises the following components in percentage by mass: 15-55% of compound alkali, 1-10% of a polyether surfactant and the balance of water. The wet film on the surface of the printed current board can be rapidly and thoroughly removed, meanwhile, the oxidation blackening phenomenon cannot occur on the copper surface after film removal, the product quality is improved, factory benefits are improved, and the method has excellent application prospects.

The invention relates to the technical field of circuit board etching, and discloses PCB etching equipment and an etching method.The PCB etching equipment comprises an etching assembly, the etching assembly comprises an etching chamber, a conveying assembly and two spraying assemblies are arranged in the etching chamber, the conveying assembly is arranged between the two spraying assemblies, the two spraying assemblies are symmetrically arranged, and the spraying assemblies are arranged in the etching chamber. Flow guide positioning assemblies are arranged on the two sides of the conveying assembly, and adjusting assemblies are arranged above the flow guide positioning assemblies. Through cooperation of the two symmetrically-arranged spraying assemblies and the conveying assembly, the purpose of double-sided etching of the PCB is achieved, meanwhile, the spraying amount of the two sides of the position of the PCB is adjusted through the adjusting assembly, the overall etching effect of the PCB is improved, and the problem that overall etching of the PCB is not uniform is solved.

The utility model discloses a spraying device for circuit board processing, which comprises a spraying device and a swinging device, the spraying device comprises a plurality of upper spraying pipes, a plurality of lower spraying pipes, an upper connecting pipe and a lower connecting pipe; the upper spraying pipe and the lower spraying pipe are distributed in the conveying direction of the circuit board, the upper spraying pipe is located above the lower spraying pipe, and nozzles used for spraying liquid medicine to the circuit board are fixed to the upper spraying pipe and the lower spraying pipe; the upper connecting pipe and the lower connecting pipe extend in the conveying direction of the circuit board, the upper connecting pipe is connected with the upper spraying pipe and used for conveying liquid medicine to the upper spraying pipe, and the lower connecting pipe is connected with the lower spraying pipe and used for conveying liquid medicine to the lower spraying pipe; the upper connecting pipe and the lower connecting pipe are both connected with a swing device, and the swing device is used for driving the upper connecting pipe and the lower connecting pipe to reciprocate in the horizontal direction perpendicular to the conveying direction of the circuit board. The liquid medicine pipeline is convenient to arrange.

The invention discloses a preparation process of a thin-glue bending-resistant LED flexible circuit, and belongs to the field of LED flexible circuit board preparation, and the preparation process comprises the following steps: adopting a material with a glue layer thickness of 6-8 UM, and setting a double-sided material composition as copper, glue, PI, glue and copper; s2, performing line exposure and etching on the top copper foil in a roll-to-roll mode to form a circuit pattern; s3, through holes are formed through laser drilling, the thickness of an adhesive layer is detected through a sensor in the drilling process, the laser power or the scanning speed is adjusted by a control system according to detection data, and dynamic adjustment of the laser efficiency is achieved; the thickness of the adhesive layer is reduced to 6-8 UM, so that the flexibility of the copper foil is remarkably improved, the bending frequency of the circuit board is increased to 100 or more, and the high-flexibility application requirement is met; the glue layer thinning is combined with the laser efficiency dynamic adjustment technology, the glue shrinkage problem of laser drilling is reduced, and the drilling efficiency is improved; the electroplating process is simplified, the plasma cleaning step is omitted, meanwhile, material use is optimized, and the overall production cost is reduced.

The present invention belongs to the technical field of computer motherboard production, and specifically relates to a high-precision computer motherboard automatic patch processing device, the high-precision computer motherboard automatic patch processing device comprises a motherboard transport platform, the motherboard transport platform is provided with a jacking component, the jacking component is provided with a coating component, one side of the coating component is provided with an activation unit, one side of the activation unit is provided with a patch module, and the end of the motherboard transport platform away from the patch module is provided with a cleaning component; the coating component comprises a scraper moving unit and a solder paste replenishing unit, the scraper moving unit drives the ratchet and the angle wheel to rotate through the movement of the telescopic plate, so that the movable extrusion plates on both sides move and drive the scraper to move, and through the squeezing action of the scraper, it passes through the small holes on the silk screen template and is coated on the specified position of the circuit board, and at the same time drives the activation unit to regulate the temperature of the solder paste, to ensure that the solder paste enters the patch module at a suitable temperature for patching.

The invention provides improved techniques for bonding devices using copper-to-copper or other types of bonds. A substrate is cleaned to remove surface oxides and contaminants and then rinsed. The rinsed substrate is provided to coating unit where a protective coating is applied to the substrate. The protective coating may be applied by immersing the substrate in a bath or via chemical vapor deposition. In an aspect, the protective coating may be copper selective so that the protective coating is only applied to copper features of the substrate. The protective coating minimizes formation of oxides and other bond weakening forces that may form during bonding processes, such as bonding a copper wire to a copper bond pad of the substrate. In an aspect, an annealing process is used to cure the protective coating and remove small imperfections and other abnormalities in the protective coating prior to the bonding process.

The present invention belongs to the technical field of metal material coating oxidation, and discloses a device for improving the coating oxidation of products after organic film stripping and a method for using the device, comprising a chassis, wherein both end boxes near the bottom of the chassis are penetrated and clamped with discharge plugs for discharging the coating solution, and a magnetic plate frame is fixedly welded on the outer wall of one end of the chassis, and further comprising: the chassis is provided with a feeding and discharging structure and a symmetrical stretching barrier structure and a piston cleaning structure, and the bellows is stretched by the downward movement of the vertical rod to generate a suction force inside the bellows, thereby guiding the water in the water tank into the bellows, and when the vertical rod moves upward, the bellows is squeezed, so that the water drawn into the bellows in advance can pass through the pipe and the hollow ball valve, and finally be ejected with impact from the water plate, and the ejected water can clean the PCB board that has been soaked in the coating in the grid groove plate, thereby avoiding residual solution on the board body, and preventing the oxide layer of the PCB board from being distorted due to untimely cleaning.

The invention relates to the technical field of PCB processing, and particularly discloses an anti-offset PCB short slot processing device. Comprising a fixing square plate, an electric push rod is fixedly connected to the bottom of the fixing square plate, a driving shaft of the electric push rod penetrates through the fixing square plate and is fixedly connected with a pressing plate, a square rubber pad is fixedly connected to the bottom of the pressing plate, and a bottom penetrating rod is fixedly connected to the bottom of the pressing plate. The square rubber pad is used for fixing the plate body in an elastic pressing mode, the static friction force of the plate body is increased through the rubber face of the square rubber pad, and the situation that the machining precision of the short groove hole is affected by continuous slight deviation caused by shaking or shaking when the plate body is subjected to drilling machining is prevented. And a hollow area is arranged between the fixed square plate and the pressing plate, so that cleaned scraps can be conveniently discharged to the outer side, and the situation that the cleaned scraps are pushed to the position between the fixed square plate and the pressing plate by the cleaning device to be accumulated to affect subsequent placement of the PCB during drilling of the drill bit is prevented.

The invention relates to the technical field of PCB cleaning production, in particular to a cleaning process of a PCB. According to the cleaning process, the problem that the cleaning effect on the PCB is poor in a traditional process is solved. By optimizing the cleaning process, the total inorganic ion residues on the surface of the PCB are remarkably reduced by adopting conductivity gradient control, supercritical carbon dioxide fluid cleaning and ethanol entrainer, chelating agent and other technologies; surface pollutants and oxide layers are systematically removed through the processes of alkaline degreasing, micro-etching activation, plasma cleaning and the like, and coating defects are avoided; the cleaning process is adjusted according to different stages, supercritical carbon dioxide, an entrainer and countercurrent rinsing are applied, and the surface cleanliness is greatly improved. And the cleaned PCB is low in total inorganic ion content and low in dirt amount, and is suitable for the field of electronics with high requirements on cleanliness.

The invention relates to a protective layer coating method of a stepped golden finger three-dimensional structure. The protective layer coating method comprises the following steps: step 1, surface activating treatment: performing plasma cleaning on the surface of a printed circuit board; step 2, coating a three-dimensional curved surface: adopting non-contact spraying equipment, coating a protective material in sections along the height change direction of the step structure of the golden finger, independently controlling the coating amount of each section, and forming an inclined angle between a dispensing head and the plate surface during coating; and step 3, step curing treatment: carrying out ultraviolet light curing on the coating area. The invention provides a method for coating a protective layer of a stepped golden finger three-dimensional structure. The core of the method is to solve the covering problem of a stepped region through segmented control and non-contact coating.

The invention discloses a novel ball mounting method without a steel mesh and a substrate structure, and the method employs a pyrolysis film and laser drilling technology to replace a traditional steel mesh. The method comprises the core steps of pasting a pyrolysis film and a PET protective film, drilling a blind hole to a bonding pad through laser, cleaning glue residues through high-pressure water, blade-coating solder paste containing soldering flux, stripping the PET film, forming solder balls through reflow soldering, cleaning the soldering flux and flattening the solder balls. A steel mesh is replaced by the pyrolysis film and laser drilling, use of the steel mesh is eliminated, use of the steel mesh and customization of the steel mesh are not needed, the cost is saved, and the manufacturing period is shortened. The pyrolysis film is pasted on the substrate, the pattern is manufactured in a laser drilling mode, the expansion and contraction are completely consistent with those of the substrate, and the risk of solder ball deviation is reduced; in addition, the method does not need to change the design of the substrate, the ball mounting pattern is directly manufactured according to customer information, drilling is carried out, the process is simple, meanwhile, different types of substrates can be compatible, and compatibility is high.

The invention relates to the technical field of cleaning equipment, in particular to PCB hole cleaning equipment and a PCB thereof.The PCB hole cleaning equipment comprises a rack, a first cleaning mechanism, a second cleaning mechanism and a third cleaning mechanism, a moving mechanism is arranged on the top face of the rack and arranged along the long edge of the rack, and the first cleaning mechanism comprises a first liquid supply assembly and a spraying assembly; one end of the spraying assembly is connected with the output end of the first liquid supply assembly; the second cleaning mechanism is arranged on one side of the first cleaning mechanism, the second cleaning mechanism comprises a first spraying assembly, the first spraying assembly is arranged at the top of the moving mechanism, and the first spraying assembly can obliquely spray water flow; the fourth cleaning mechanism comprises a first rolling brush set, and the first rolling brush set is rotationally connected to the top of the rack; the ultrasonic cleaning mechanism is arranged on one side of the fourth cleaning mechanism; and the fifth cleaning mechanism is located on one side of the ultrasonic cleaning mechanism, so that the PCB can be cleaned more thoroughly.

The invention relates to the technical field of cleaning machines, in particular to a PCB after-copper-deposition cleaning machine which comprises a pickling machine, a clear water flushing machine is arranged on the left side of the pickling machine, a cold air drying machine is arranged on the left side of the clear water flushing machine, a hot air drying machine is arranged on the left side of the cold air drying machine, and a turnover box is arranged on the left side of the hot air drying machine. A conveying mechanism used for conveying PCBs is jointly arranged in the pickling machine, the clean water flushing machine, the cold air drying machine and the hot air drying machine, and the PCBs are conveyed and cleaned from right to left. Through cooperative use of the driving assembly, the reciprocating assembly and the rotating assembly, rotation of the rotating nozzles is synchronously achieved while the rotating nozzles are driven to do linear reciprocating motion; by means of the technical scheme, reciprocating linear spraying and rotary spraying are achieved, the washing coverage area is increased, compared with fixed spray head washing, dynamic washing reduces cleaning blind areas, shearing force to stains is increased through a complex water flow mode generated by rotation and reciprocating actions, pollutants can be stripped and taken away easily, and the cleaning effect is good.

A workpiece cleaning device comprises a liquid storage tank which comprises a cleaning area and a filtering area; the filtering body is assembled in the filtering area; the pump circulation assembly is respectively communicated with the cleaning area and the filtering area and is used for circulating a cleaning medium between the cleaning area and the filtering area; and the bearing assembly is arranged in the cleaning area, and the bearing assembly is used for bearing and fixing the multiple workpieces. By additionally arranging the pump circulation assembly, a cleaning medium can be recycled, and impurities in the cleaning medium can be effectively filtered in cooperation with the additionally arranged filtering body so as to be used for continuous cleaning of workpieces of the next batch, so that consumption of the cleaning medium can be effectively reduced, and the cleaning cost of the workpieces is reduced. And by additionally arranging the bearing assembly, the multiple workpieces can be conveniently placed, meanwhile, the multiple workpieces can be conveniently taken and placed at the same time, and the cleaning efficiency is improved.

The invention discloses a film stripping and cleaning device for PCB production, and belongs to the technical field of integrated circuit manufacturing. Comprising a supporting frame, a roller conveying module is arranged on the supporting frame, two sets of spraying modules are arranged in the supporting frame, each spraying module comprises a liquid inlet pipe, the liquid inlet pipes are fixedly connected to the supporting frame in a penetrating mode, and the liquid inlet pipes and the supporting frame are jointly and rotationally connected with symmetrically-distributed spraying pipes. The spraying pipes are fixedly connected with connecting gears, rack frames which are symmetrically distributed are slidably connected into the supporting frame, the connecting gears are meshed with the corresponding rack frames, and a pushing assembly is arranged on the supporting frame. The connecting gears drive the corresponding rotating liquid pipes to swing in a reciprocating mode, the rotating liquid pipes swing in a reciprocating mode to drive the nozzle sets on the rotating liquid pipes to swing synchronously, then the cleaning positions of the nozzle sets on the circuit board are continuously changed, and therefore the cleaning uniformity of the multiple nozzle sets on the circuit board is improved.

The invention relates to the technical field of new energy automobile circuit board production, in particular to cleaning and impurity removing equipment for new energy automobile circuit board production, which comprises a frame body and a water pump mounted on the frame body, the water outlet end of the water pump is connected with a hose, the tail end of the hose penetrates through the frame body in a sliding manner, and a spray head is fixedly connected between the tail ends of the hose. A flat belt drives a clamping plate to intermittently rotate forwards through a u-shaped plate, an inner spline cylinder and a spline shaft, the clamping plate drives a circuit board to intermittently move backwards, the circuit board makes contact with a cleaning agent in a frame body firstly for soaking treatment, and most impurities on the circuit board are dissolved or stripped in a soaking mode; according to the circuit board cleaning and impurity removing device, impurities on the portions, difficult to touch, of the circuit board are effectively removed, then the soaked circuit board is moved to the scrubbing area to be scrubbed by the scrubbing brush and the banister brush, the circuit board can be continuously soaked and then scrubbed, cleaning and impurity removing are more comprehensive and thorough, and therefore the cleaning and impurity removing effect is improved.

The invention discloses efficient exposure equipment for circuit board MSAP process processing, and belongs to the technical field of circuit board processing, the efficient exposure equipment comprises a box body, movable doors are hinged to the two sides of the front end of the box body, a first motor is installed at the lower end in the box body, a supporting plate is arranged at the output end of the first motor, an exposure lamp is arranged on the upper side in the box body, and positioning assemblies are arranged on the two sides of the upper end of the supporting plate; a cleaning assembly is arranged on the lower side of one end of the box body; the exposure lamp is connected with the box body through a moving assembly; by arranging the moving assembly, a second motor is started to drive a first screw rod to rotate, the first screw rod rotates to drive a first sliding base and a strip-shaped box to move, the strip-shaped box moves to drive an exposure lamp to move transversely, a third motor is started to drive a second screw rod to rotate, and the second screw rod rotates to drive a second sliding base to move in the strip-shaped box; the exposure lamp on the lower side can be driven to move longitudinally by movement of the second sliding seat, the exposure lamp can be moved and adjusted according to requirements by arranging the moving assembly, and the application range of the exposure lamp is widened.

The invention discloses a cleaning method and device for a printed circuit board assembly, a storage medium and a program product, and relates to the technical field of printed circuit board assembly cleaning. A corresponding three-dimensional cleaning path is generated by combining a deep learning model and a path planning model, automatic cleaning of the printed circuit board assembly to be cleaned can be achieved, and the cleaning efficiency is improved. The product cleaning efficiency is improved, the cleaning result is verified, foreign matter residues are avoided, then the product cleaning quality and reliability are improved, and on the basis, the labor cost can be reduced, the production efficiency can be improved, and the product yield can also be improved.

The invention provides a regional degumming device for a vehicle machine mainboard, and relates to the technical field of degumming devices.The regional degumming device comprises a degumming machine and the vehicle machine mainboard, a camera shooting assembly is fixedly installed on the side wall of the top of the degumming machine, and the left side and the right side of the top of the degumming machine are each provided with a first driving assembly; a driving frame is arranged between the threaded rods of the two first driving assemblies, a second driving assembly is arranged in the driving frame, the threaded rods of the second driving assembly are sleeved with an upper moving frame, and a sleeve frame is arranged below the upper moving frame; through cooperation of the flow guide pipe, the extrusion sleeve, the first electric soldering iron, the second electric soldering iron and the tin suction belt, a series of glue removing operation can be conducted on the surface of the vehicle machine mainboard, manual glue removing is not needed, the glue removing operation is complete, glue can be well removed while other positions of the vehicle machine mainboard are not damaged, and compared with traditional manual glue removing, the glue removing efficiency is greatly improved. The device has the advantages of being complete in glue removal and small in damage.

The invention relates to a circuit board glue removing processing method, circuit board glue removing equipment, a circuit board processing system and a circuit board. The method comprises the steps of determining a glue overflowing area of a to-be-processed circuit board, detecting the glue overflowing thickness of the to-be-processed circuit board, and determining laser power of a glue overflowing position based on the glue overflowing thickness so as to remove overflowing glue in the glue overflowing area. Wherein the glue overflowing area comprises a plurality of glue overflowing positions, each glue overflowing position corresponds to one glue overflowing thickness, and at least two glue overflowing thicknesses are not equal. According to the method, the excessive glue thicknesses of the multiple excessive glue positions are accurately detected, the corresponding laser power is determined based on different excessive glue thicknesses, and the excessive glue at the excessive glue positions is correspondingly removed, so that the excessive glue in the excessive glue area is accurately removed, the excessive glue is accurately removed, and the processing efficiency of a circuit board is improved.

The invention relates to the technical field of electronic device manufacturing, and discloses an automobile laser radar rigid-flexible PCB manufacturing method, which comprises the following steps: preparing a rigid layer-flexible layer-covering layer composite base material, performing plasma activation on a flexible layer copper surface, spraying a coupling agent, and pre-curing to form a bonding layer; the method comprises the following steps of: preparing a golden finger region, precisely pasting a PI (Polyimide) protective adhesive tape coated with nano TiO2 on the golden finger region, constructing an eight-layer structure by adopting a staged laminating process, forming an interconnection structure through laser drilling and hole metallization, and finally processing the outline of the golden finger by combining a precise mold and carrying out UV (Ultraviolet) photolysis surface treatment. The performance of the rigid-flex board is improved through collaborative innovation of materials and processes; heat conduction and bending resistance are optimized through gradient filler; the multi-scale bonding enhances the damp-heat resistance of the interface; photolysis-adhesive tape synergistically cleans residual adhesive; the signal loss is reduced through plasma-laser; stress relief and warping prevention are achieved through staged pressing, and the stability and signal integrity of the high-density rigid-flex board in high-frequency, mechanical and thermal environments are achieved.

The invention relates to the technical field of circuit board manufacturing equipment, in particular to integrated circuit board processing and manufacturing equipment which comprises an operation table, a feeding structure, a conveying structure, a discharging structure, a sorting structure, a dust removal structure, a PCB jointed board and a cutting structure. The feeding structure is arranged in cooperation with the conveying structure, automatic conveying of jointed PCBs is conveniently achieved, the conveying efficiency is improved, the sorting structure is arranged on the discharging structure, the sorting structure is used in cooperation with the cutting structure, cut waste and formed independent circuit boards are conveniently and rapidly separated, manual screening is avoided, the operation efficiency is improved, practicability is high, and practicability is high. And a dust removal structure is arranged on the sorting structure in a matched mode, waste chips generated in the cutting process can be effectively sucked and removed through the dust removal structure, and cleaning is convenient.

The utility model relates to the field of circuit board processing, in particular to a circuit board cleaning device which comprises a machine frame, two conveying shafts are arranged on the machine frame, the conveying shafts are driven by a conveying motor to rotate, the two conveying shafts are connected in a winding mode through a conveying belt, and a sliding rod and a lead screw are arranged on the machine frame above the conveying belt. The lead screw is driven by a scraping motor to rotate, a sliding plate is further arranged above the conveying belt, the lead screw penetrates through the sliding plate and is in threaded connection with the sliding plate, the sliding rod penetrates through the sliding plate and is in sliding connection with the sliding plate, a plurality of lifting air cylinders are further fixed to the sliding plate, and the tail ends of piston rods of the lifting air cylinders are all fixed to a mounting plate. A scraper is fixed to the bottom of the mounting plate, turnover shafts are arranged on the portions, on the two sides of the tail end of the conveying belt, of the rack, connecting blocks are fixed to the tail ends of the turnover shafts, and a U-shaped fixing groove is fixed between the two connecting blocks. According to the device, the two end faces of the circuit board can be automatically subjected to glue scraping operation, and the production efficiency of the circuit board is greatly improved.

The invention discloses a board dividing machine for camera PCBs, and relates to the field of board dividing machines. The board dividing machine comprises a board dividing machine body, an equipment frame is arranged above the board dividing machine body, a machining base is arranged at the top of the board dividing machine body, a collecting structure is arranged in the board dividing machine body, and a limiting frame is fixed to the top end of the machining base. Through arrangement of an adsorption plate, negative pressure suction pipes, a storage box and an air extracting pump, an adjusting rod drives the adsorption plate to rotate towards one side, a second motor drives the adsorption plate to rotate to be aligned with a limiting frame and a dust collection frame on a machining base, the adsorption plate moves downwards through a hydraulic push rod, the multiple negative pressure suction pipes make contact with the surface of a PCB on a containing block, and the PCB is placed on the containing block; negative pressure is generated through an air suction pump and an air suction pipe, then PCBs are adsorbed and fixed, then the PCBs are driven to move upwards, rotate and move downwards, then the PCBs are conveyed into a storage box, all the PCBs are transferred at a time, stacking is conducted, the multiple PCBs on the two machining bases are sequentially and rapidly collected, and the board separation efficiency is improved.

The utility model relates to the technical field of GPS (Global Positioning System) antenna production, in particular to full-automatic production equipment for a GPS antenna, which realizes surface cleaning, double-sided printing, pin insertion, solder paste brushing and welding, process processing and blanking and placing of a substrate, is high in automation degree, reduces the labor cost and the labor intensity, and greatly improves the production efficiency of the GPS antenna.