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296results about "Conductive pattern polishing/cleaning" patented technology

Roll-to-roll cleaning control method and system for flexible circuit board electronic structural member

ActiveCN121865528Aprevent appearanceavoid practicalityCleaning using toolsPrinted circuit dryingTemperature controlThick plate
The invention discloses a roll-to-roll cleaning control method and system for a flexible circuit board electronic structural member, and relates to the technical field of electronic manufacturing, and the method comprises the steps: carrying out the partitioning processing of a to-be-cleaned member, and obtaining a thin region and a thick region; the drying cavity is partitioned on the basis of the thin area and the thick area, and a partitioned temperature control method is constructed; a dehumidification drying module is placed, and a hot air drying method is obtained based on a chilled mirror dew-point instrument; the roll-to-roll cleaning control method is used for solving the problems that in an existing roll-to-roll cleaning control method for the flexible circuit board electronic structural part, differential temperature control is not carried out on a thick area and a thin area, and the influence of environment humidity in a drying cavity on the drying effect is not considered; the problems that a thin plate is overheated after being dried, water in a thick plate is not completely evaporated, watermarks which cannot be wiped appear on the surface of the electronic structural part, and then the practicability of the cleaned electronic structural part is affected are solved.
Owner:SHENZHEN SHENGHONGYUN TECH CO LTD

Passivation coating on copper metal surface for copper wire bonding application

The invention provides improved techniques for bonding devices using copper-to-copper or other types of bonds. A substrate is cleaned to remove surface oxides and contaminants and then rinsed. The rinsed substrate is provided to coating unit where a protective coating is applied to the substrate. The protective coating may be applied by immersing the substrate in a bath or via chemical vapor deposition. In an aspect, the protective coating may be copper selective so that the protective coating is only applied to copper features of the substrate. The protective coating minimizes formation of oxides and other bond weakening forces that may form during bonding processes, such as bonding a copper wire to a copper bond pad of the substrate. In an aspect, an annealing process is used to cure the protective coating and remove small imperfections and other abnormalities in the protective coating prior to the bonding process.
Owner:UNIVERSITY OF NORTH TEXAS

Circuit board degumming processing method, circuit board degumming equipment, circuit board processing system and circuit board

The invention relates to a circuit board glue removing processing method, circuit board glue removing equipment, a circuit board processing system and a circuit board. The method comprises the steps of determining a glue overflowing area of a to-be-processed circuit board, detecting the glue overflowing thickness of the to-be-processed circuit board, and determining laser power of a glue overflowing position based on the glue overflowing thickness so as to remove overflowing glue in the glue overflowing area. Wherein the glue overflowing area comprises a plurality of glue overflowing positions, each glue overflowing position corresponds to one glue overflowing thickness, and at least two glue overflowing thicknesses are not equal. According to the method, the excessive glue thicknesses of the multiple excessive glue positions are accurately detected, the corresponding laser power is determined based on different excessive glue thicknesses, and the excessive glue at the excessive glue positions is correspondingly removed, so that the excessive glue in the excessive glue area is accurately removed, the excessive glue is accurately removed, and the processing efficiency of a circuit board is improved.
Owner:HANS CNC SCI & TECH

An improved semi-additive process based on customized ultra-thin copper foil flexible copper-clad plate and fine line board

The application discloses an improved semi-additive process based on customized ultra-thin copper foil flexible copper-clad plate and a fine circuit board, and belongs to the technical field of flexible printed circuit boards. The process adopts a customized ultra-thin copper foil FCCL substrate, and the circuit is prepared through substrate selection pretreatment, pattern size pre-compensation, laser drilling and black shadow process hole metallization, pattern transfer and selective electroplating thickening, film stripping and flash etching forming. The micro-etching amount is cooperatively controlled throughout the process, and combined with optimized plasma cleaning and high hole filling electroplating, the fine circuit production with a minimum line width and line spacing of 45 microns or less can be stably realized, and the highest fine circuit production can reach 25 / 25 microns. The application solves the problems of traditional process, such as large side etching, low precision, poor yield and the like, and the circuit board prepared has the advantages of excellent size stability, strong heat resistance and uniform micro-hole filling, is suitable for high-density interconnection and high-end consumer electronic demand, and has significant advantages of precision, yield and reliability compared with existing processes.
Owner:SHENZHEN XINYU TENGYUE ELECTRONICS

Pickling device for computer circuit board

The invention discloses a pickling device for a computer circuit board, and relates to the technical field of circuit board production, the pickling device comprises a pickling tank and two lifting cylinders, the two lifting cylinders are installed on the outer side of the pickling tank, the movable ends of the two lifting cylinders are jointly connected with a connecting frame, four connecting rods are connected to the lower portion of the connecting frame, and the connecting rods are connected with the pickling tank. The lower end of each connecting rod is connected with a cleaning frame, and a clamping conversion mechanism is arranged on the cleaning frame and used for alternately replacing clamping parts of a circuit board. The clamping conversion mechanism is arranged, and the first sliding block and the second sliding block are driven to slide in opposite directions by using the change of the liquid level in the pickling tank and taking buoyancy as a drive; the second limiting block replaces the first limiting block to clamp and limit the circuit board, so that clamping conversion is realized, a clamped area on the circuit board can be in contact with a pickling solution, a pickling missing area of the circuit board is avoided, and the pickling quality is ensured.
Owner:ANQING NORMAL UNIV

Circuit board and processing method thereof

The invention belongs to the field of circuit board processing, and particularly relates to a circuit board and a processing method thereof, and the method comprises the following steps: transferring an image on a production film to a plate; electroplating a conductive layer on the exposed copper sheet of the circuit pattern of the board and the hole wall; removing an anti-electroplating covering film layer of the plate by using a cleaning solution to expose a non-circuit copper layer of the plate; the plate is installed in a machining device to be subjected to acid pickling, an exposed copper layer on the plate is removed through an acid pickling solution, and the residual acid pickling solution on the plate is removed while the plate is separated from the acid pickling solution; the board is immersed in water, the board is cleaned, residual water on the board is removed while the board is separated from the water, the board is dried, and the circuit board is obtained; according to the method, the residual pickling solution on the plate can be removed while the plate is separated from the pickling solution, and the pickling solution is prevented from dripping on other equipment.
Owner:蔡坤

Roller of circuit board horizontal processing equipment

The utility model discloses a roller of circuit board horizontal processing equipment. A plurality of convex rollers and concave rollers are alternately arranged in sequence; the single side diameter of the concave roller is smaller than that of the convex roller; the diameter of the concave roller is 2 / 3 to 7 / 8 of that of the convex roller; the length of the concave roller is more than or equal to three times that of the convex roller; the convex roller wheels and the concave roller wheels which are small in height difference are arranged, the width between every two adjacent convex roller wheels is large, the convex roller wheels make contact with the plate face in a small area, the problem that foreign matter adheres to the plate face is solved, the concave roller wheels are large in diameter, impact of sprayed liquid medicine can be effectively blocked, meanwhile, a certain space is formed between the concave roller wheels and the surface of a to-be-machined plate, and the surface of the to-be-machined plate is protected. The whole structure prevents the problem that spraying liquid medicine is difficult to retain on the plate surface of the to-be-processed plate; the state that the liquid medicine can be retained but cannot be excessively retained can be formed, and the effect that the force of liquid medicine exchange is moderate is achieved.
Owner:ZHONGSHAN JIXIANG ELECTRONIC TECH CO LTD

Aluminum nitride thin film circuit substrate and method for manufacturing the same

The application discloses an aluminum nitride film circuit substrate and a preparation method thereof, and relates to the technical field of aluminum nitride substrates.The application is characterized by the following steps: a titanium film is plated on the surface of an aluminum nitride ceramic substrate by magnetron sputtering, and then a copper film is plated on the surface of the titanium film by magnetron sputtering; and a nickel film is plated on the surface of the copper film by a chemical plating method to prepare the aluminum nitride film circuit substrate.Through the titanium-copper gradient dynamic transition technology, a gradient alloy layer is formed to reduce the interface stress; the titanium and the surface of the aluminum nitride are combined through a chemical bond to form a dense transition layer, thereby relieving the difference in the thermal expansion coefficient; the copper enhances the conductive performance of the surface of the aluminum nitride ceramic substrate; the titanium compensates for the interface defects of the mismatch between the copper and the aluminum nitride ceramic lattice; the chemical nickel plating enhances the hardness and corrosion resistance of the aluminum nitride ceramic substrate, and the aluminum nitride film substrate is endowed with weldability and bondability.
Owner:江苏富乐华功率半导体研究院有限公司 +1

PCB cleaning device

The utility model discloses a PCB (printed circuit board) cleaning device which comprises a board pushing mechanism and a cleaning mechanism, the cleaning mechanism comprises a fan, and an air outlet of the fan faces a PCB to be cleaned; the push plate mechanism is used for placing and pushing a to-be-cleaned PCB to move towards an air outlet of the fan, the push plate mechanism is provided with a control unit, and the control unit controls the push plate mechanism to move through a push plate signal; an electromagnetic valve is arranged at an air source of the fan, the electromagnetic valve is used for controlling the opening and closing of the air source, the electromagnetic valve is connected to the control unit, and the control unit can control the opening and closing of the electromagnetic valve through a driving signal; the push plate signal and the driving signal are triggered at the same time. Compared with the prior art, the PCB cleaning device can clean PCBs while pushing the PCBs, manual board brushing is not needed, the labor cost is reduced, and the productivity is improved.
Owner:HUNAN FURUIKANG ELECTRONICS CO LTD

PCB oxidation prevention processing device

The application discloses a PCB oxidation-preventing treatment device, and relates to the oxidation-preventing treatment field of pretreatment plates, which comprises a main frame body, a spraying box body is arranged on the upper surface of the main frame body, and a micro-etching mechanism is arranged on the upper surface of the main frame body. The micro-etching mechanism comprises a cleaning assembly and a soaking assembly. The cleaning assembly comprises a sliding table body, the sliding table body is arranged on the upper surface of the main frame body, one side surface of the sliding table body is further provided with a sliding groove, one side of the inside of the sliding groove is provided with a bottom protruding block, and the inside of the sliding groove is provided with a limiting sleeve block. The soaking assembly comprises a vertical sliding rail, the bottom surface of the vertical sliding rail is connected with one side surface of a liquid pool bottom plate, and the inside of the vertical sliding rail is provided with an internal hydraulic rod. In the scheme, the micro-etching mechanism can efficiently remove the oxidation layer and pollutants of the pretreatment plate, provide a clean surface, and can also realize operations such as vibration liquid removal, liquid filtration and purification, and concentrated liquid recycling, so that the treatment effect and resource utilization rate are improved.
Owner:FUJIAN PROVINCE ZHOUTUO CIRCUIT TECH CO LTD

LCD flexible circuit board hot-pressing binding equipment facilitating excessive glue cleaning

The invention relates to the technical field of circuit board processing equipment, and particularly discloses LCD flexible circuit board hot-pressing binding equipment convenient for excessive glue cleaning, the LCD flexible circuit board hot-pressing binding equipment comprises a bottom ring, the upper surface of the edge of the bottom ring is fixedly connected with a supporting rod, and the top of the supporting rod is fixedly connected with a top ring. The side surface of the circuit board is continuously rubbed with the polishing strip on the moving block through the rotating circuit board, and solidified overflowing glue on the side surface of the circuit board is rubbed and scraped, so that the overflowing glue on the side surface of the circuit board is automatically cleaned after hot pressing is completed, the automation degree of the equipment is greatly improved, and the production efficiency is improved. Meanwhile, the follow-up procedure of manually cleaning excessive glue is removed, the production efficiency is greatly improved, meanwhile, when the driving ring moves to the bottom, the upper heating disc and the lower heating disc can be driven to start synchronous forward and reverse rotation by continuously and intermittently moving the driving disc up and down through hydraulic equipment, and the grinding effect on the circuit board is greatly improved in combination with a grinding strip; and thus, the capability of cleaning the excessive glue is greatly improved.
Owner:JIANGXI HAIDI PHOTOELECTRIC CO LTD

Clamping assembly and suspension frame

The utility model discloses a kind of clamping assembly and suspension frame, it is related to circuit board processing technical field.Chip assembly includes fixed part and movable clamp, fixed part has the first fixed surface and the second fixed surface of adjacent arrangement, first fixed surface is equipped with first combined clamp fixed position and first clamping position, and the second fixed surface is equipped with first open clamp fixed position.Movable clamp is rotatably connected in first fixed surface by pivot, and one end of movable clamp is provided with second clamping position and second combined clamp fixed position, and the other end is provided with second open clamp fixed position.Movable clamp is fixedly connected when in closed state second combined clamp fixed position and first combined clamp fixed position, so that first clamping position and second clamping position are closed to hold the clamped part.Movable clamp is fixedly connected when in open state second open clamp fixed position and first open clamp fixed position, so that first clamping position and second clamping position are opened with set angle, and set angle is greater than or equal to 90 °, improve the clamping efficiency of the clamped part and the cleaning efficiency of clamping assembly.
Owner:JIANGXI UNIVERSE INTELLIGENT EQUIP CO LTD

System and process for manufacturing flexible circuit board by laser cutting

PendingUS20260150198A1Printed circuit aspectsCircuit inspection/monitoring/aligningFlexible circuitsHemt circuits
A system and process for manufacturing a flexible circuit board by laser cutting are provided. The process includes the steps of: S1, loading and adding protective layers, introducing a copper foil base layer, and laminating the protective layers to upper and lower surfaces of the copper foil base layer, respectively, S2, performing laser cutting on a semi-finished product treated in S1 to form a circuit structure; S3, removing scraps from the semi-finished product treated in S2, performing activated cleaning on the surfaces of the copper foil, and performing pseudo-lamination hot-pressing for; S4, performing combinational hot-pressing on the semi-finished product treated in S3; S5, performing a windowing operation on the semi-finished product treated in S4; and S6, detecting and coding the semi-finished product treated in S5.
Owner:HUAIAN M & T NEW MATERIAL TECHNOLOGY CO LTD

Circuit board high-density protective film surface treatment method and circuit board

The application provides a circuit board high-density protective film surface treatment method and a circuit board. The circuit board high-density protective film surface treatment method comprises the following steps: obtaining a circuit board; placing the circuit board into a modified OSP solution for soaking, wherein the modified OSP solution comprises an alkyl amide benzimidazole composition, a transition metal salt, an organic acid solvent, a chelating agent and water; using a cooling circulation spraying device to spray the soaked circuit board; and drying the sprayed circuit board to obtain the circuit board. By the method, the heat resistance of a traditional organic compound film is improved, the stability of the metal-organic compound film itself is improved, a high-density metal-organic compound film is obtained to improve the protection of the copper surface, the wastewater discharge amount is reduced, energy saving and emission reduction are achieved, and the water recycling rate is improved.
Owner:YANCHENG BAIKAL ELECTRONIC MATERIALS CO LTD

Washing line feeding device capable of automatically identifying metal surface of PCB (Printed Circuit Board)

The utility model discloses a washing line feeding device capable of automatically identifying the metal surface of a PCB (Printed Circuit Board), which comprises a fixed plate, the upper surface of the fixed plate is connected with a conveying belt, the bottom surface of the fixed plate is connected with a bracket, the upper surface of the fixed plate is connected with a support frame, the upper surface of the support frame is connected with a moving mechanism, and the moving mechanism is connected with a conveying belt. A sliding opening is formed in the upper surface of the supporting frame. According to the utility model, through the design of the identification camera and the display, the printed circuit board can be conveniently shot and identified, through the cooperation of the driving motor and the rolling bearing, the driving motor can conveniently drive the positive and negative rotation threaded rod to rotate, and the internal thread moving cylinder can move according to the connection relation between the positive and negative rotation threaded rod and the internal thread moving cylinder. The internal thread moving cylinder can drive the moving sliding plate to slide in the sliding opening when moving on the surface of the internal thread moving cylinder, then the correction plate can get close to the printed circuit board conveniently through movement of the moving sliding plate, meanwhile, accurate correction of the printed circuit board is facilitated, and then accurate feeding of the printed circuit board is achieved.
Owner:HONGHUASHENG PRECISION ELECTRONICS (YANTAI) CO LTD

Dust removal device and PCB testing equipment

This utility model belongs to the field of PCB board testing technology, and relates to a dust removal device and PCB board testing equipment. The dust removal device includes a first conveying mechanism, a second conveying mechanism, and a dust removal mechanism. The first conveying mechanism includes a first width adjustment drive assembly, a first width adjustment frame, a second width adjustment frame, a first transmission assembly, and a second transmission assembly. The first width adjustment drive assembly drives the first and second width adjustment frames to move closer or further apart along a second direction. The first transmission assembly is mounted on the first width adjustment frame, and the second transmission assembly is mounted on the second width adjustment frame. The first transmission assembly cooperates with the second transmission assembly to convey materials to the dust removal mechanism along a first direction. The dust removal mechanism removes dust from both sides of the material. The second conveying mechanism receives the dust-removed material along the first direction. This dust removal device can automatically adjust the material conveying width.
Owner:HANS CNC SCI & TECH +1

Printed circuit board cleaning device

The invention relates to the technical field of printed circuit board cleaning, and discloses a printed circuit board cleaning device which comprises a supporting bed body, a supporting plate is fixedly connected to the lower surface of the supporting bed body, a supporting plate is fixedly connected to the top of the supporting plate, a supporting frame is fixedly connected to the top of the supporting bed body, and a flushing device is arranged above the supporting bed body. A cleaning device is arranged above the supporting bed body, and a collecting device is arranged above the supporting bed body. When a motor is started, an output end drives a pulley to move back and forth in a sliding rail through a threaded rod, when a telescopic rod enables the pulley to move, the position is more stable, when the pulley moves, a supporting column is driven through a sliding plate so that a supporting sliding rod can move, and when the supporting sliding rod moves, the position is more stable. The movable plate drives the hose and the nozzle to stretch the limiting hose to stretch, so that the machine can fully adjust the water spraying position, the working efficiency of the machine is improved, and meanwhile, the position of the limiting hose is stable when the limiting hose moves through the elastic piece.
Owner:HESHAN JIALINUO ELECTRONIC CO LTD

A surface treatment device for PCB circuit board processing

The application relates to the field of circuit boards, in particular to surface treatment equipment for PCB (Printed Circuit Board) processing, which comprises a bottom plate, a soaking box and a driving assembly; the soaking box is fixedly connected to the bottom plate; the bottom plate is connected with the driving assembly used for driving the movement of a fixing frame and parts thereon; the surface treatment equipment further comprises the fixing frame and the like; the driving assembly is connected with the fixing frame; a plurality of electric push rods I are fixedly connected to the fixing frame; the extension ends of all the electric push rods I are collectively fixedly connected with a connecting plate, and the connecting plate is slidingly connected with the fixing frame. The rectangular plate drives the connecting pipe and the absorption cylinder to move to the side close to the corresponding blind hole by controlling the electric push rod III, the absorption cylinder and the corresponding absorption cotton are separated from each other, until the absorption cylinder enters the blind hole, the sponge on the surface of the absorption cylinder absorbs and cleans the excess soaking liquid in the blind hole, and the problem that the soaking liquid remaining in the blind hole cannot be completely drained in the prior art, the thickness of the protective layer in the blind hole is relatively higher, and the draining efficiency is low is avoided.
Owner:GANZHOU YIHAO IND CO LTD

A multi-station welding device for processing a circuit board

The utility model relates to the technical field of circuit board welding, concretely to a kind of multi-station welding equipment for circuit board processing, including machine table, the top of machine table is provided with three supports, the inner cavity of support in middle part is provided with welding machine, the inner cavity of other two supports is respectively provided with hair dryer and cooling machine, the bottom of machine table is provided with rack, the inner cavity of rack is provided with sliding assembly, the top of sliding assembly extends to the top of machine table and is provided with sliding plate, the right side of sliding plate is provided with moving assembly, moving assembly extends to the top of sliding plate and is provided with two fixing frames, lifting assembly is provided on each described fixing frame. The multi-station welding equipment for circuit board processing solves the welding equipment of prior art only has welding function, before welding, other equipment needs to be used to clean circuit board, after welding, other equipment needs to be used to cool circuit board.
Owner:SHENZHEN JIUBABA ELECTRONICS

Automatic cleaning and stacking device for printed circuit board substrate

The invention belongs to the technical field of circuit board conveying and processing equipment, and particularly relates to a printed circuit board substrate automatic cleaning and stacking device which comprises a rack and an automatic cleaning assembly arranged on the rack. The automatic cleaning assembly comprises a first conveying unit, a second conveying unit in transmission connection with the conveying tail end of the first conveying unit, and a bag stacking unit arranged at the conveying tail end of the second conveying unit. The spraying unit, the sweeping unit and the drying unit are arranged below the second conveying unit and are sequentially arranged in the conveying direction of the second conveying unit. Through sequential cooperation of the first conveying unit, the second conveying unit, the spraying unit, the sweeping unit, the drying unit and the bag stacking unit, automatic cleaning and stacking of the substrates can be achieved in the conveying process of the circuit board substrates, and therefore the production quality of circuit boards is effectively improved.
Owner:GUANGDE PEAKSTAR ELECTRONIC TECH CO LTD

High-precision circuit board processing technology

The invention discloses a high-precision circuit board processing technology. The high-precision circuit board processing technology comprises the following steps: S1, manufacturing an inner layer core; s2, laminating and drilling are carried out; s3, outer layer manufacturing and surface treatment; s4, performing final detection and verification; the step S1 comprises the following steps: S11, adopting a copper-clad plate with a preset size; s12, carrying out chemical cleaning and plasma treatment on the copper-clad plate; s13, coating a high-resolution dry film, directly receiving CAD (Computer Aided Design) data, and directly scanning and exposing on the substrate by using an ultraviolet laser beam; s14, exposing a copper circuit needing to be thickened after developing, performing micro-etching coarsening, then performing pattern electroplating, and increasing the copper thickness of the circuit to a target value; and S15, after the thin copper substrate is etched off, the high-resolution AOI equipment is immediately used for 100% scanning. According to the processing technology of the high-precision circuit board, the ultra-thin copper foil is adopted, the amount of copper needing to be etched in the subsequent mSAP process is extremely small, and lateral erosion can be reduced to the maximum extent.
Owner:HUIZHOU ANPULIAN ELECTRONICS CO LTD

Photoresist stripping liquid and preparation method thereof

The invention belongs to the technical field of circuit board cleaning, and discloses a photoresist stripping liquid and a preparation method thereof.The preparation method comprises the following preparation steps that in the nitrogen atmosphere, an amine compound, an alkylating reagent and a catalyst are mixed, heated and stirred, a sterically hindered amine compound is obtained, the alkylating reagent contains an alkyl group and a halogen group, and the alkylating reagent contains an alkyl group and a halogen group; at least one carbon atom in the alkyl groups is connected with three alkyl groups; adding the copper corrosion inhibitor into the inorganic alkali solution, and stirring and mixing to obtain a premixed solution; and adding a steric hindrance amine compound and a wetting agent into the premixed solution, and stirring and dissolving to obtain the photoresist stripping solution. Through the preparation method, the content of inorganic ammonium ions in the film stripping liquid is reduced, the film stripping rate of the film stripping liquid is increased, and copper surface oxidation is avoided.
Owner:SHENZHEN CYPRESS IND DEV CO LTD +2

Method for improving poor gold surface of nickel immersion gold

The invention relates to the technical field of printed circuit board manufacturing, and discloses a method for improving poor gold surface of nickel immersion gold. The method comprises the following steps: sequentially carrying out board grinding and sand blasting pretreatment on the copper surface of the circuit board, carrying out automatic visual inspection to identify defects of the copper surface, overhauling and sorting based on defect identification, carrying out secondary sand blasting treatment and carrying out nickel-gold immersion treatment. According to the method, a closed-loop process of automatic visual inspection and maintenance sorting is embedded before the main process of nickel and gold immersion of the circuit board, so that the conversion from passive scrapping to active prevention is realized, the copper surface defects can be accurately identified and repaired on line, the poor gold surface caused by the defects is completely eradicated from the source, and the product rejection rate is remarkably reduced; and meanwhile, the unrepairable units are blocked, so that invalid consumption of precious metal materials is avoided, and the production cost is saved. In addition, a process optimization closed loop is formed based on feedback adjustment of detection data, and the quality stability and the production yield are improved.
Owner:GUANGDONG ELLINGTON ELECTRONICS TECH CO LTD

Processing methods for printed circuit boards

The present invention provides a method for processing printed circuit boards, comprising: preparing an acidic oxidizing agent solution, wherein the acidic oxidizing agent solution comprises ferrous oxide, nitric acid, and hydrochloric acid; placing the printed circuit board in the acidic oxidizing agent solution and controlling the immersion temperature and immersion time; and removing the printed circuit board and cleaning it. This processing method is highly efficient and effective, reducing surface corrosion and environmental pollution.
Owner:SAE TECH DELEVOPMENT DONGGUAN

Anti-glue jig

The utility model provides an anti-glue jig which is used for being assembled on a three-prevention jig, the three-prevention jig comprises a bottom plate and a plurality of limiting blocks, the anti-glue jig comprises a main body, a plurality of cover plates and a plurality of shielding pieces, and the main body is provided with an avoiding space used for avoiding an LED module; the plurality of cover plates are connected with the main body and extend into the avoiding space from the main body, and the plurality of cover plates are in one-to-one correspondence with the plurality of limiting blocks and are used for covering the upper parts of the limiting blocks; the shielding piece is movably connected to the main body and can move into the avoiding space so as to shield a socket on the LED module. In this way, the cover plate can cover the limiting block, the situation that three-proofing glue is accumulated on the limiting block is effectively reduced, the cleaning difficulty can be reduced, the influence on the placement space of the PCB can be reduced, and the phenomenon that a lamp tube is collided when the PCB is placed and taken is reduced. Besides, the shielding piece is movably connected to the main body and can move into the avoiding space, so that the socket on the LED module can be shielded, and the interface of the socket is prevented from being sealed by the three-proofing glue.
Owner:FUJIAN QIANGLI PHOTOELECTRICITY

Gummed paper mounting structure of PCB cleaning device

The utility model discloses a gummed paper mounting structure of a PCB (printed circuit board) cleaning device, which is applied to the technical field of gummed paper mounting structures. The two ends, in the pulling and sliding direction, of the pulling and sliding base are slidably connected with elastic lifting bases in the vertical direction based on elastic lifting assemblies, and the elastic lifting bases away from the pulling end are rotationally connected with positioning mounting shafts used for positioning one end of the adhesive tape roller in parallel. Positioning abutting shafts used for abutting against the other end of the gummed paper roller are rotationally connected to the elastic lifting base close to the drawing end in parallel based on an elastic drawing assembly, and positioning boss assemblies used for positioning positioning grooves in the two ends of the gummed paper roller are arranged on the positioning mounting shaft and the positioning abutting shafts. The cleaning device has the technical effects of simple structure and good cleaning effect.
Owner:SUZHOU TAISONG INTELLIGENT TECHNOLOGY CO LTD

Low-toxicity degradable PCB (Printed Circuit Board) cleaning agent as well as preparation method and application thereof

The invention relates to the technical field of industrial cleaning, and particularly discloses a low-toxicity degradable PCB (Printed Circuit Board) cleaning agent as well as a preparation method and application thereof. The low-toxicity degradable PCB cleaning agent is characterized by being prepared by mixing the following raw materials in percentage by weight: 50%-90% of D-methyl lactate, 10%-30% of isopropanol, 0-5% of glucoside and 0-5% of benzotriazole. The cleaning agent is reasonable in formula, all the components are synergistic, and the cleaning agent has the characteristics of being high in cleaning efficiency, mild to a base material and environmentally friendly, is free of residues after volatilization, is free of corrosion and damage to metal parts, is suitable for cleaning the surfaces of various materials such as electronic elements and metal workpieces, is especially suitable for precise cleaning of copper-containing metal parts, and has good application prospects. The application prospect is wide.
Owner:SHANDONG JIANGSHAN NEW MATERIAL TECHNOLOGY R&D CO LTD

PCB hole full-automatic metallization device for PCB manufacturing

The invention belongs to the technical field of PCB manufacturing, and particularly relates to a PCB hole full-automatic metallization device for PCB manufacturing, which comprises a bubble box for soaking a PCB and an accommodating box arranged below the bubble box, one side of the bubble box is provided with a drain pipe, the other end of the bubble box is divided into a water outlet bin through a partition plate, the partition plate is provided with a plurality of water leakage holes, and the water leakage holes are communicated with the drain pipe. The interior of the water outlet bin communicates with the containing box through a blow-off pipe, a circulation assembly is arranged on the containing box and used for communicating the containing box with the drainage pipe, a water filtering barrel with an opening in the top is arranged in the containing box, a first conical filter screen with an upward tip is arranged in the water filtering barrel, and oil dirt in the liquid medicine is rapidly intercepted through the first conical filter screen when the liquid medicine directionally flows towards the water outlet bin; the core problems of tank liquid oil stain accumulation, emulsification performance reduction and secondary pollution in conventional soaking type oil removal are solved, and the service life of the oil removal agent is remarkably prolonged.
Owner:WEIHAI SIFLEX ELECTRONIC CO LTD