1058results about "Conductive pattern polishing/cleaning" patented technology

The invention relates to the field of circuit board processing, and discloses a printed circuit board splitting device, which comprises a workbench, the top end of the workbench is fixedly provided with a protective cover, and the outer wall of the protective cover is connected with an opening and closing door through a hinge; the movable cleaning assembly is arranged on the workbench and used for cleaning dust on the surface of the circuit board while moving the circuit board; the supporting and collecting assembly is arranged on the workbench and used for limiting the circuit board and collecting impurities generated during machining; the processing assembly is arranged on the workbench and used for cutting and splitting the circuit board; the auxiliary assembly is arranged on the workbench and used for assisting the machining assembly; and the placing assembly is arranged on the workbench and is used for placing the unprocessed circuit board and the processed circuit board. And through cooperation of internal structures of the movable cleaning assembly, the effect that residual dust and chippings on the surface of the circuit board are effectively cleaned through the cleaning device while the circuit board is accurately moved is achieved.

The invention discloses a PCB (printed circuit board) spraying etching machine and a method thereof, belongs to the technical field of spraying etching machines, and provides the following scheme that the PCB spraying etching machine comprises a spraying etching mechanism, a cleaning mechanism is assembled in the spraying etching mechanism, and the spraying etching mechanism comprises etching equipment; the first motor drives the rotating shaft to rotate, the rotating shaft drives the worm and the worm gear to conduct transmission, the polygonal cylinder drives the conveying wheel to rotate, the conveying wheel can achieve the purpose of automatic material conveying, meanwhile, the conveying pump sprays etching liquid to a circuit board through the spraying heads, the angles of the spraying heads are different, and therefore spraying uniformity can be kept, and the spraying efficiency is improved. And the rotating shaft also drives the cam to rotate, so that the cam extrudes the pulley to move, and the cam can be matched with the first spring to realize the reciprocating translational motion of the polygonal cylinder, so that the conveying wheel drives the circuit board to do reciprocating motion, the circuit board can be uniformly etched, and the processing quality of the circuit board is improved.

The invention provides an automatic degumming device and degumming method for circuit board production, and the device comprises a conveying assembly which comprises a supporting frame, a side plate, a sliding groove, a sliding block, a mounting hole, and a chain. Through the elaborate design of the conveying assembly, the distance between the U-shaped frames is accurately adjusted through the synchronous electric cylinder so as to adapt to circuit boards with different widths, the stable and automatic conveying of the circuit boards among all degumming procedures is achieved in cooperation with the cooperative operation of the conveying motor, the driving wheel, the driven wheel and the chain, the degumming efficiency is greatly improved, the large-scale production requirement is met, and the production cost is reduced. Compared with a traditional manual or simple mechanical glue removing mode, the glue removing time of a single circuit board is greatly shortened, and the overall productivity of a production line is improved; the liquid collecting hopper and the filtering frame are arranged above the sol agent storage tank and the water storage tank, so that a sol agent and cleaning water which are scattered in the glue removing process can be collected and filtered, cyclic utilization of the sol agent and water resources is achieved, consumption of raw materials is reduced, and the production cost is reduced.

The invention discloses a double-sided semi-embedded packaging substrate and a processing method thereof, and the processing method comprises the steps: carrying out the N times of double-sided circuit manufacturing and the N-1 times of double-sided layer adding of a multi-layer substrate alternately, and obtaining an operation board with two groups of symmetrical circuit structures; the circuit structure is provided with an outer circuit layer and (N-1) inner circuit layers which are communicated with each other, and the inner circuit layer located on the innermost side is provided with a bonding pad. Performing laser groove burning on the working board, and processing a blind groove which is provided with an opening at the outer circuit layer and takes the other inner circuit layer adjacent to the innermost inner circuit layer as the groove bottom locally on each group of circuit structure; removing the copper foil on the bottom of the blind groove; the bonding pads are completely exposed in the blind grooves corresponding to the bonding pads, the blind grooves in the two sets of circuit structures are communicated, and a through groove structure is obtained; and cleaning the surface of the bonding pad to obtain the double-sided semi-embedded packaging substrate. The processing method is simple and reasonable, the processing cost is low, the processing efficiency is high, and the reliability of the obtained double-sided semi-embedded packaging substrate is very high.

To provide a ceramic board which has good heat dissipation, and in which an integration density is high.SOLUTION: According to an embodiment, the present invention discloses a manufacturing method of an ultrathin high-density multilayer interconnection ceramic board, containing steps of: preparing a ceramic wafer, performing a laser punching to the ceramic wafer, and forming a via hole; performing a vacuum magnetron sputtering to the ceramic wafer, and forming a seed titan layer and a copper layer onto a front surface of the ceramic wafer and on a wall of the via hole by the sputtering; manufacturing a ceramic double-layer core plate; manufacturing a multilayer substrate; manufacturing a vertical interconnection multilayer substrate; and manufacturing a high-end multilayer HDI ceramic board. The multilayer ceramic plate manufactured in the above mentioned processing can be easily processed as compared with LTCC and HTCC, and an energy consumption amount for the processing is deteriorated. A heat conductivity of a finished product is improved. A wiring is more accurate; a conductive resistance is low; and a signal transmission loss is low.SELECTED DRAWING: Figure 1

The invention discloses a roll-to-roll cleaning control method and system for a flexible circuit board electronic structural member, and relates to the technical field of electronic manufacturing, and the method comprises the steps: carrying out the partitioning processing of a to-be-cleaned member, and obtaining a thin region and a thick region; the drying cavity is partitioned on the basis of the thin area and the thick area, and a partitioned temperature control method is constructed; a dehumidification drying module is placed, and a hot air drying method is obtained based on a chilled mirror dew-point instrument; the roll-to-roll cleaning control method is used for solving the problems that in an existing roll-to-roll cleaning control method for the flexible circuit board electronic structural part, differential temperature control is not carried out on a thick area and a thin area, and the influence of environment humidity in a drying cavity on the drying effect is not considered; the problems that a thin plate is overheated after being dried, water in a thick plate is not completely evaporated, watermarks which cannot be wiped appear on the surface of the electronic structural part, and then the practicability of the cleaned electronic structural part is affected are solved.

The invention relates to the technical field of copper-clad plate cold pressing machining, in particular to a new energy automobile charging pile copper-clad plate cold pressing machining device and a machining method thereof.The new energy automobile charging pile copper-clad plate cold pressing machining device comprises a supporting table, the upper end of the supporting table is sunken downwards to form a rotating circular groove, and the bottom of the rotating circular groove is downwards provided with a fan-shaped groove in a penetrating mode; a plurality of cleaning brushes are fixedly installed in the fan-shaped groove at equal intervals, a bearing table is fixedly installed at the bottom of the rotating circular groove, a concave frame is fixedly connected to the upper end of the supporting table in a crossing mode, a stamping oil cylinder is fixedly installed at the upper end of the concave frame, an upper die base is fixedly installed at the lower end of the stamping oil cylinder, and the bearing table is arranged under the upper die base. The cold pressing device has the beneficial effects that the upper portion of the supporting table is sequentially provided with the feeding area, the cold pressing area, the overturning discharging area and the returning area in an annular array mode, and the feeding area, the cold pressing area, the overturning discharging area and the returning area of the four areas can work at the same time and do not interfere with one another.

The invention discloses a circuit board production method and a circuit board. The method comprises the following steps: laminating at least two substrates and at least one prepreg to obtain a first circuit board; performing drilling and copper deposition treatment on the first circuit board to obtain at least one target via hole; performing resin hole plugging on the target via hole to obtain a second circuit board; performing uniform copper deposition electroplating on the target surface with the target via hole on the second circuit board to obtain a third circuit board; grinding and polishing the hole filling copper layer on the third circuit board to obtain a fourth circuit board with a target copper layer; and performing line forming processing on the fourth circuit board to obtain a target circuit board. The generated hole filling copper layer is filled with the first groove generated after the resin is cooled, and the hole filling copper layer is ground and polished to obtain the target copper layer, so that the flatness of the surface of the circuit board can be improved, and the welding quality of the chip is ensured.

The invention relates to the field of printed circuit board manufacturing, and particularly discloses a method for removing a wet film in a selective process of a printed circuit board and the printed circuit board. The method comprises the following steps: S1, providing a printed circuit board with a wet film formed on the surface; s2, a primary bulking process; s3, a pressurized ultrasonic spraying and bulking process; s4, a preliminary film stripping process; s5, a first pressurized spraying film stripping process; s7, a multi-section type pressure difference pressurization spraying washing process; wherein a film stripping agent solution with the mass concentration of 10-20 kg / m < 3 > is adopted in the step S2, the step S3, the step S4 and the step S5; the film removing agent comprises the following components in percentage by mass: 15-55% of compound alkali, 1-10% of a polyether surfactant and the balance of water. The wet film on the surface of the printed current board can be rapidly and thoroughly removed, meanwhile, the oxidation blackening phenomenon cannot occur on the copper surface after film removal, the product quality is improved, factory benefits are improved, and the method has excellent application prospects.

The utility model discloses a PCB (Printed Circuit Board) processor with a double-cavity structure, which comprises a plasma gas source generator, a first plasma processing cavity and a second plasma processing cavity, and a main gas source pipeline is arranged on the top side of the plasma gas source generator; the main gas source pipeline is provided with a first branch pipeline for dividing a gas source into two paths which are respectively communicated with the first plasma processing cavity and a second branch pipeline which is communicated with the second plasma processing cavity; a first stop valve is arranged on the first branch pipeline, and a second stop valve is arranged on the second branch pipeline; the two plasma processing cavities are switched and controlled by one plasma gas source generator through sequential replacement opening of the two branch pipelines, etching processing and degumming cleaning are carried out on a PCB, and the processing quality and the production efficiency are effectively improved.

The utility model relates to the technical field of circuit board production, and discloses a water-saving control system for a horizontal line. Comprising a conveying assembly used for conveying a circuit board, a laser sensor used for detecting whether the circuit board exists or not, an overflow washing assembly used for cleaning the circuit board and a water supply device used for supplying pure water, a cleaning station is arranged on the conveying assembly, and the laser irradiation range of the laser sensor covers the area of the cleaning station. The overflow washing assembly comprises an electromagnetic valve and a spray head, the spray head is arranged above the cleaning station, the working range of the spray head covers the cleaning station, the water supply device is communicated with the electromagnetic valve, the electromagnetic valve is in signal connection with the laser sensor, and the electromagnetic valve is communicated with the spray head. According to the system, the sensor is additionally arranged, the whole set of device is intelligently modified, the use amount of pure water is reduced due to the detection and washing working mode, and the FPC manufacturing cost is reduced.

The invention discloses an automatic conveying device for circuit board electroplating cleaning, and relates to the field of circuit board cleaning and conveying, the automatic conveying device comprises a rotary conveying disc, the top of the rotary conveying disc is uniformly provided with a plurality of conveying sliding seats in the circumferential direction of the rotary conveying disc, and the conveying sliding seats are provided with circuit board tool mechanisms; a feeding mechanism, a cleaning mechanism, a rinsing mechanism and a discharging mechanism are sequentially arranged along the conveying track path of the rotary conveying disc, the feeding mechanism comprises a feeding box and a jacking plate, the top of the feeding box is open, a jacking groove is formed in the inner bottom wall of the feeding box, the jacking plate is matched with the jacking groove in a sliding mode, and the jacking plate moves in the height direction of the feeding box. The cleaning mechanism comprises a cleaning pool, the rinsing mechanism comprises a rinsing pool, the discharging mechanism comprises a bottom plate and belt conveyors, the two sets of belt conveyors are oppositely arranged on the top face of the bottom plate, the cleaning pool, the rinsing pool and the bottom plate all have the freedom degree of moving in the vertical direction, automatic conveying is achieved, the cleaning efficiency is improved, and the cost is reduced.

The invention relates to the technical field of circuit board processing, in particular to a cleaning and drying integrated device for circuit board processing, a frame body drives a circuit board to rotate in a reciprocating mode, cleaning liquid collected on the circuit board is poured out, then drying operation is carried out, the drying efficiency is improved, and meanwhile the drying efficiency is improved. The frame body is used for pouring cleaning liquid collected on the upper side surface of the circuit board, and is also used for being matched with the air bag to form an air curtain at the left opening of the frame body, so that hot air in the drying machine can be prevented from penetrating through the frame body and flowing into the cleaning machine, and the heat loss in the drying machine can be greatly reduced; a cleaning and drying integrated device for circuit board processing comprises a frame body, a first partition plate, a second partition plate, an air bag, a first pipeline, a first one-way valve, a second pipeline, a second one-way valve and a driving assembly. The box body is connected with a driving assembly; the driving assembly is connected with a frame body; one side of the box body is fixedly connected with a partition plate I, and the other side of the box body is fixedly connected with a partition plate II; the first partition plate and the second partition plate make contact with the frame body.

The invention relates to the technical field of circuit board production, in particular to a pretreatment device for a graphene circuit board base material. Comprising a machine frame, the machine frame is fixedly connected with partition plates which are symmetrically distributed, and the machine frame is provided with two transmission devices and two extrusion pieces; and the first guide plate is fixedly connected into the rack, the second guide plate is fixedly connected into the rack, the first guide plate and the second guide plate are both located between the symmetrically-distributed partition plates, and the rack, the first guide plate, the second guide plate and the symmetrically-distributed partition plates jointly form a pickling cavity. The first guide plate and the second guide plate are additionally arranged, the circuit board substrate is turned over in the horizontal moving process of the circuit board substrate, small bubbles are not prevented from floating upwards when the circuit board substrate is turned over to the vertical state, the probability that the small bubbles remain on the lower surface of the circuit board substrate is further reduced, and the production efficiency is improved. And the cleaning effect of the acid liquor on the circuit board base material is improved.

The utility model discloses a surface treatment device for flexible circuit board production, which comprises a stable base, a group of supporting side plates are arranged on the top surface of the stable base in a bilateral symmetry manner, a plurality of processing screen frames are arranged between the supporting side plates, and a cleaning brush is arranged at the top end of each processing screen frame. A first sliding groove and a second sliding groove are symmetrically formed in the top face of the stable base, a first sliding rod is arranged in the first sliding groove in a sliding mode, a second sliding rod is arranged in the second sliding groove in a sliding mode, a plurality of moving plates located at the top end of the machining net frame are connected between the first sliding rod and the second sliding rod, and the sweeping brushes are located on the bottom faces of the moving plates. Compared with the prior art, the circuit board machining device has the advantages that a plurality of circuit boards are placed in the machining screen frame at the same time, then the same moving mechanism is used for driving the sweeping brush to sweep the surfaces of the circuit boards, impurities and dust are removed, simultaneous machining of the circuit boards is achieved, and efficiency is improved to a great extent.

The invention relates to the technical field of circuit board etching, and discloses PCB etching equipment and an etching method.The PCB etching equipment comprises an etching assembly, the etching assembly comprises an etching chamber, a conveying assembly and two spraying assemblies are arranged in the etching chamber, the conveying assembly is arranged between the two spraying assemblies, the two spraying assemblies are symmetrically arranged, and the spraying assemblies are arranged in the etching chamber. Flow guide positioning assemblies are arranged on the two sides of the conveying assembly, and adjusting assemblies are arranged above the flow guide positioning assemblies. Through cooperation of the two symmetrically-arranged spraying assemblies and the conveying assembly, the purpose of double-sided etching of the PCB is achieved, meanwhile, the spraying amount of the two sides of the position of the PCB is adjusted through the adjusting assembly, the overall etching effect of the PCB is improved, and the problem that overall etching of the PCB is not uniform is solved.

The utility model discloses a spraying device for circuit board processing, which comprises a spraying device and a swinging device, the spraying device comprises a plurality of upper spraying pipes, a plurality of lower spraying pipes, an upper connecting pipe and a lower connecting pipe; the upper spraying pipe and the lower spraying pipe are distributed in the conveying direction of the circuit board, the upper spraying pipe is located above the lower spraying pipe, and nozzles used for spraying liquid medicine to the circuit board are fixed to the upper spraying pipe and the lower spraying pipe; the upper connecting pipe and the lower connecting pipe extend in the conveying direction of the circuit board, the upper connecting pipe is connected with the upper spraying pipe and used for conveying liquid medicine to the upper spraying pipe, and the lower connecting pipe is connected with the lower spraying pipe and used for conveying liquid medicine to the lower spraying pipe; the upper connecting pipe and the lower connecting pipe are both connected with a swing device, and the swing device is used for driving the upper connecting pipe and the lower connecting pipe to reciprocate in the horizontal direction perpendicular to the conveying direction of the circuit board. The liquid medicine pipeline is convenient to arrange.

The invention discloses a preparation process of a thin-glue bending-resistant LED flexible circuit, and belongs to the field of LED flexible circuit board preparation, and the preparation process comprises the following steps: adopting a material with a glue layer thickness of 6-8 UM, and setting a double-sided material composition as copper, glue, PI, glue and copper; s2, performing line exposure and etching on the top copper foil in a roll-to-roll mode to form a circuit pattern; s3, through holes are formed through laser drilling, the thickness of an adhesive layer is detected through a sensor in the drilling process, the laser power or the scanning speed is adjusted by a control system according to detection data, and dynamic adjustment of the laser efficiency is achieved; the thickness of the adhesive layer is reduced to 6-8 UM, so that the flexibility of the copper foil is remarkably improved, the bending frequency of the circuit board is increased to 100 or more, and the high-flexibility application requirement is met; the glue layer thinning is combined with the laser efficiency dynamic adjustment technology, the glue shrinkage problem of laser drilling is reduced, and the drilling efficiency is improved; the electroplating process is simplified, the plasma cleaning step is omitted, meanwhile, material use is optimized, and the overall production cost is reduced.

The utility model provides an FPC board cleaning device, and relates to the technical field of FPC processing, the FPC board cleaning device comprises a rack, the rack is provided with a discharging roller, a traction assembly, dust sticking assemblies, a clearing assembly, a deviation rectifying assembly and a winding roller, the discharging roller and the winding roller are arranged at the two ends of the rack, the dust sticking assemblies are arranged on the two sides of the clearing assembly, the traction assembly is located below the dust sticking assemblies, and the deviation rectifying assembly is located below the dust sticking assemblies. Through the arrangement of an ultrasonic cleaner of the cleaning assembly, the edges of the two sides of the FPC can be better cleaned, the cleaning pressure of a rear-section dust-sticking rubber roller is relieved, and meanwhile, a vacuum adsorption platform can effectively adsorb and collect dust particles falling during cleaning and prevent the dust particles from splashing.

The invention belongs to the technical field of FPC flexible board processing, and particularly relates to an FPC flexible board film laminating machine which comprises a rectangular board, a film laminating device is arranged on one side of the upper end of the rectangular board and comprises a coiled film arranged at the upper end of the rectangular board, and a cleaning device is arranged on one side of the film. The cleaning device comprises coiled adhesive tape arranged on one side of the thin film, first L-shaped strips are rotationally arranged on the two sides of the adhesive tape correspondingly, a second rotating wheel is rotationally connected between the two first L-shaped strips, a clamping assembly is arranged between the first L-shaped strips, and the clamping assembly is used for clamping the end of the coiled thin film. The thin film is pulled out through the clamping assembly, the thin film moves along with one side of the adhesive tape, the upper end of the cleaned FPC flexible board can be covered with the thin film immediately, dust existing between the thin film and the FPC flexible board is greatly reduced, the adhesive face of the adhesive tape rolls at the upper end of the FPC flexible board to adhere and remove the dust, and friction caused to the FPC flexible board can be reduced.

The present invention belongs to the technical field of computer motherboard production, and specifically relates to a high-precision computer motherboard automatic patch processing device, the high-precision computer motherboard automatic patch processing device comprises a motherboard transport platform, the motherboard transport platform is provided with a jacking component, the jacking component is provided with a coating component, one side of the coating component is provided with an activation unit, one side of the activation unit is provided with a patch module, and the end of the motherboard transport platform away from the patch module is provided with a cleaning component; the coating component comprises a scraper moving unit and a solder paste replenishing unit, the scraper moving unit drives the ratchet and the angle wheel to rotate through the movement of the telescopic plate, so that the movable extrusion plates on both sides move and drive the scraper to move, and through the squeezing action of the scraper, it passes through the small holes on the silk screen template and is coated on the specified position of the circuit board, and at the same time drives the activation unit to regulate the temperature of the solder paste, to ensure that the solder paste enters the patch module at a suitable temperature for patching.

The invention relates to the technical field of copper surface micro-etching processing, in particular to a copper surface organic acid type super coarsening agent micro-etching device which comprises a cleaning pool, a first conveying frame is fixed to the outer wall of one side of the top of the cleaning pool, a first assembly line is installed on the inner wall of the top of the first conveying frame, and a micro-etching pool is arranged on the outer wall of one side of the cleaning pool. A second conveying frame is fixed to the outer wall of the top between the cleaning pool and the micro-etching pool, a second assembly line is installed on the inner wall of the top of the second conveying frame, and lifting frames are symmetrically erected and fixed to the inner walls of the two sides of the bottoms of the cleaning pool and the micro-etching pool; the copper surface organic acid type super coarsening agent micro-etching device is composed of the assembly line, the cleaning pool and the micro-etching pool, the liftable conveying belts are arranged in the cleaning pool and the micro-etching pool, automatic feeding and discharging of micro-etching treatment PCBs can be achieved, and copper surface oil removal cleaning, copper surface micro-etching treatment and cleaning after copper surface micro-etching are sequentially completed; and the automation level of the copper surface organic acid type super coarsening agent micro-etching device is improved.

The invention provides improved techniques for bonding devices using copper-to-copper or other types of bonds. A substrate is cleaned to remove surface oxides and contaminants and then rinsed. The rinsed substrate is provided to coating unit where a protective coating is applied to the substrate. The protective coating may be applied by immersing the substrate in a bath or via chemical vapor deposition. In an aspect, the protective coating may be copper selective so that the protective coating is only applied to copper features of the substrate. The protective coating minimizes formation of oxides and other bond weakening forces that may form during bonding processes, such as bonding a copper wire to a copper bond pad of the substrate. In an aspect, an annealing process is used to cure the protective coating and remove small imperfections and other abnormalities in the protective coating prior to the bonding process.

The present invention belongs to the technical field of metal material coating oxidation, and discloses a device for improving the coating oxidation of products after organic film stripping and a method for using the device, comprising a chassis, wherein both end boxes near the bottom of the chassis are penetrated and clamped with discharge plugs for discharging the coating solution, and a magnetic plate frame is fixedly welded on the outer wall of one end of the chassis, and further comprising: the chassis is provided with a feeding and discharging structure and a symmetrical stretching barrier structure and a piston cleaning structure, and the bellows is stretched by the downward movement of the vertical rod to generate a suction force inside the bellows, thereby guiding the water in the water tank into the bellows, and when the vertical rod moves upward, the bellows is squeezed, so that the water drawn into the bellows in advance can pass through the pipe and the hollow ball valve, and finally be ejected with impact from the water plate, and the ejected water can clean the PCB board that has been soaked in the coating in the grid groove plate, thereby avoiding residual solution on the board body, and preventing the oxide layer of the PCB board from being distorted due to untimely cleaning.

The invention discloses a circuit board etching device and an etching method thereof, and relates to the technical field of circuit board etching, the circuit board etching device comprises a bottom base, the upper end of the bottom base is fixedly provided with a top shell, and the bottom base and the top shell are internally provided with a chain conveying structure; etching liquid spraying assemblies are symmetrically arranged in the top shell and located on the left side and the right side of the chain conveying structure, a pre-cleaning assembly is fixedly installed at the position, located at the front end of the top shell, of the front end of the bottom base at the same time, and the pre-cleaning assembly and spraying cleaning nozzles are arranged on the front sides of the etching liquid spraying assemblies, so that cleaning and etching of a circuit board can be integrated; therefore, the problem that dust and sundries are attached to the circuit board again when the circuit board cleaning step and the circuit board etching step are separated and the cleaned circuit board is transferred into the etching equipment can be avoided, on one hand, the etching yield of the circuit board can be guaranteed, on the other hand, the circuit board production step can be simplified, and the circuit board production efficiency can be improved.

A surface treatment method. Atmospheric plasma is provided, and an object to be treated is placed in an atmospheric plasma atmosphere, wherein a residual oxygen level in the atmospheric plasma atmosphere is lower than a pre-set value. A soldering process is integrated into an atmospheric plasma treatment system without any flux protection, and it is ensured that the oxygen level in the atmosphere is reduced to an extremely low level, which can meet the high requirements for surface soldering performance.

The invention relates to the technical field of PCB processing, and particularly discloses an anti-offset PCB short slot processing device. Comprising a fixing square plate, an electric push rod is fixedly connected to the bottom of the fixing square plate, a driving shaft of the electric push rod penetrates through the fixing square plate and is fixedly connected with a pressing plate, a square rubber pad is fixedly connected to the bottom of the pressing plate, and a bottom penetrating rod is fixedly connected to the bottom of the pressing plate. The square rubber pad is used for fixing the plate body in an elastic pressing mode, the static friction force of the plate body is increased through the rubber face of the square rubber pad, and the situation that the machining precision of the short groove hole is affected by continuous slight deviation caused by shaking or shaking when the plate body is subjected to drilling machining is prevented. And a hollow area is arranged between the fixed square plate and the pressing plate, so that cleaned scraps can be conveniently discharged to the outer side, and the situation that the cleaned scraps are pushed to the position between the fixed square plate and the pressing plate by the cleaning device to be accumulated to affect subsequent placement of the PCB during drilling of the drill bit is prevented.

The invention relates to the technical field of PCB cleaning production, in particular to a cleaning process of a PCB. According to the cleaning process, the problem that the cleaning effect on the PCB is poor in a traditional process is solved. By optimizing the cleaning process, the total inorganic ion residues on the surface of the PCB are remarkably reduced by adopting conductivity gradient control, supercritical carbon dioxide fluid cleaning and ethanol entrainer, chelating agent and other technologies; surface pollutants and oxide layers are systematically removed through the processes of alkaline degreasing, micro-etching activation, plasma cleaning and the like, and coating defects are avoided; the cleaning process is adjusted according to different stages, supercritical carbon dioxide, an entrainer and countercurrent rinsing are applied, and the surface cleanliness is greatly improved. And the cleaned PCB is low in total inorganic ion content and low in dirt amount, and is suitable for the field of electronics with high requirements on cleanliness.

The invention relates to a protective layer coating method of a stepped golden finger three-dimensional structure. The protective layer coating method comprises the following steps: step 1, surface activating treatment: performing plasma cleaning on the surface of a printed circuit board; step 2, coating a three-dimensional curved surface: adopting non-contact spraying equipment, coating a protective material in sections along the height change direction of the step structure of the golden finger, independently controlling the coating amount of each section, and forming an inclined angle between a dispensing head and the plate surface during coating; and step 3, step curing treatment: carrying out ultraviolet light curing on the coating area. The invention provides a method for coating a protective layer of a stepped golden finger three-dimensional structure. The core of the method is to solve the covering problem of a stepped region through segmented control and non-contact coating.

The invention discloses a novel ball mounting method without a steel mesh and a substrate structure, and the method employs a pyrolysis film and laser drilling technology to replace a traditional steel mesh. The method comprises the core steps of pasting a pyrolysis film and a PET protective film, drilling a blind hole to a bonding pad through laser, cleaning glue residues through high-pressure water, blade-coating solder paste containing soldering flux, stripping the PET film, forming solder balls through reflow soldering, cleaning the soldering flux and flattening the solder balls. A steel mesh is replaced by the pyrolysis film and laser drilling, use of the steel mesh is eliminated, use of the steel mesh and customization of the steel mesh are not needed, the cost is saved, and the manufacturing period is shortened. The pyrolysis film is pasted on the substrate, the pattern is manufactured in a laser drilling mode, the expansion and contraction are completely consistent with those of the substrate, and the risk of solder ball deviation is reduced; in addition, the method does not need to change the design of the substrate, the ball mounting pattern is directly manufactured according to customer information, drilling is carried out, the process is simple, meanwhile, different types of substrates can be compatible, and compatibility is high.