Pattern electroplating method for two-sided and multi-layer flexible printed circuit board

A graphic electroplating and flexible printing technology, applied in chemical/electrolytic methods to remove conductive materials, multi-layer circuit manufacturing, secondary treatment of printed circuits, etc., can solve problems such as disconnection of hole plates and lines, and improve bending performance, improved soldering performance, and low impedance

Active Publication Date: 2008-02-06
靖江市华信科技创业园有限公司
View PDF0 Cites 29 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The technical problem to be solved by the present invention is to make up for the defect that the hole plate and the circuit are disconnected in the abov

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

specific Embodiment approach 1

[0016] A pattern electroplating method for double-sided flexible printed circuit boards, which has the following steps in sequence:

[0017] Cutting→mechanical drilling→black hole

[0018] →Dry film→Exposure→Development

[0019] →Line etching

[0020] → Remove dry film → chemical cleaning → press dry film again → re-exposure → re-develop

[0021] → Graphic plating

[0022] → Then remove the dry film → Chemical cleaning.

[0023] The blanking is to cut the copper clad laminate raw material into a set size.

[0024] The mechanical drilling is to use a drill to drill through holes on the copper clad laminate.

[0025] The black hole is that a conductive carbon powder layer is adhered on the inner wall surface of the through hole of the copper clad laminate.

[0026] The pressing of the dry film is to press and stick the dry film on the surface of the copper clad board. The dry film is an ultraviolet photosensitive polymer film with a thickness of 30 μm and is corrosion-resi...

specific Embodiment approach 2

[0038] A pattern electroplating method for a five-layer flexible printed circuit board, the steps of which are the same as the first embodiment.

[0039] The line width and line spacing of the outermost layer of the five-layer flexible printed circuit board are both 0.1mm. After removing the dry film and before chemical cleaning, make hole slices to observe whether the hole wall is plated with copper to confirm the reliability of copper plating; use AOI to check the circuit pattern, record the yield rate and compare it with the existing conventional production method . The results of the comparison are listed in Table 2 below. The good product rate reaches 94%, which is obviously better than the conventional production method.

[0040] Table 2

[0041] project

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
Thicknessaaaaaaaaaa
Thicknessaaaaaaaaaa
Thicknessaaaaaaaaaa
Login to view more

Abstract

The present invention discloses a figure plating method which in used in double face or multilevel printing line board and has the following steps in orders: baiting, mechanical hole boring, hole discoloring, dry film pressing, exposing, developing, line etching, dry film eliminating, chemical cleaning, dry film pressing again, exposing again, developing again, figure plating, dry film eliminating again, and chemical cleaning again. The present invention does line etching to the copper-clad plate and the etching liquid contacting; no height difference exists between a hole tray and the connected line; the figure plating is carried on after the line etching so that no hole tray and line disconnection happens. The present invention also makes the copper-clad plate after dry film pressing again and developing again contact with the plating liquid; the part which needs to be welded comprises a through hole, the hole tray surface and a plate edge connecting head copper-clad layer and the copper layer of the parts is thick relatively with low impedance so as to improve the welding capability; the flexure, namely the line figure surface, is not plated with copper-clad layer and the copper layer of the parts is thin relatively so as to improve the bending capability.

Description

technical field [0001] The invention relates to surface treatment of printed circuit boards, in particular to a pattern electroplating method for double-sided and multilayer flexible printed circuit boards. Background technique [0002] Both sides of the double-sided or multi-layer flexible printed circuit board (Flexible Printed Circuit board, referred to as FPC) are covered with wires. In order to realize the connection of the wires of different layers, the inner wall of the hole must be plated A layer of copper having a conductive function makes it a via, which connects the wires of different layers connected to the via. The existing FPC pattern electroplating method, also known as "hole plating", is an important part of the FPC manufacturing method, including the following steps: blanking→mechanical drilling→black holes→pressing dry film→exposing only the hole plate→ Development→graphic plating→dry film removal→chemical cleaning→repressing dry film→re-exposure→re-develo...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): H05K3/46H05K3/06H05K3/26
Inventor 张芬菊
Owner 靖江市华信科技创业园有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap