Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Pattern electroplating method for two-sided and multi-layer flexible printed circuit board

A graphic electroplating and flexible printing technology, applied in chemical/electrolytic methods to remove conductive materials, multi-layer circuit manufacturing, secondary treatment of printed circuits, etc., can solve problems such as disconnection of hole plates and lines, and improve bending performance, improved soldering performance, and low impedance

Active Publication Date: 2009-11-18
靖江市华信科技创业园有限公司
View PDF3 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The technical problem to be solved by the present invention is to make up for the defect that the hole plate and the circuit are disconnected in the above-mentioned existing pattern electroplating method, and propose a pattern electroplating method for double-sided and multi-layer flexible printed circuit boards

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

specific Embodiment approach 1

[0016] A pattern electroplating method for double-sided flexible printed circuit boards has the following steps in sequence:

[0017] Cutting → mechanical drilling → black hole

[0018] →Press dry film→Exposure→Development

[0019] →Line etching

[0020] →Remove the dry film→Chemical cleaning→Re-press the dry film→Re-exposure→Re-developing

[0021] →Graphic plating

[0022] →Go to the dry film again→Chemical cleaning.

[0023] The blanking is cutting the raw material of the copper clad laminate into a set size.

[0024] The mechanical drilling is to use a drill to drill through holes on the copper clad laminate.

[0025] The black hole is to adhere a conductive carbon powder layer on the inner wall surface of the through hole of the copper clad laminate.

[0026] The pressing dry film is to press the dry film on the surface of the copper clad laminate, and the dry film is a 30 μm thick ultraviolet photosensitive polymer film resistant to corrosion by the electroplating solution, w...

specific Embodiment approach 2

[0038] A pattern electroplating method for a five-layer flexible printed circuit board, the steps are the same as the first embodiment.

[0039] The outermost line width and line spacing of the five-layer flexible printed circuit board are both 0.1mm. After removing the dry film and before chemical cleaning, make hole slices to observe whether the hole wall is plated with copper to confirm the reliability of copper plating; use AOI to check the circuit pattern, record the yield and compare with the existing conventional production methods . The comparison results are shown in Table 2 below. The yield rate reaches 94%, which is significantly better than conventional production methods.

[0040] Table 2

[0041] Item

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a pattern electroplating method for double-sided and multi-layer flexible printed circuit boards, which comprises the following steps in sequence: blanking → mechanical drilling → black holes → pressing dry film → exposure → development → circuit etching → dedrying Membrane→chemical cleaning→repress dry film→reexposure→redevelop→graphic plating→remove dry film→chemical cleaning again. In the present invention, the dry film and the developed copper-clad laminate are contacted with the etchant for circuit etching, and there is no height difference between the hole plate and the connected circuit layer, and the pattern electroplating is carried out after the circuit etching, and there will be no hole plate and circuit disconnection problem. In the present invention, the copper-clad board after re-pressing the dry film and re-developing will be in contact with the electroplating solution, and the parts to be welded include via holes and the surface of the hole plate, that is, the pad and the plated copper layer of the board edge connector. The copper in these parts The layer is relatively thick and has low impedance, which can improve the soldering performance; while the bendable part, that is, the surface of the circuit pattern is not coated with copper layer, and the copper layer in these parts is relatively thin, which can improve the bending performance.

Description

Technical field [0001] The invention relates to the surface treatment of printed circuit boards, in particular to a pattern plating method for double-sided and multilayer flexible printed circuit boards. Background technique [0002] The double-sided or multilayer flexible printed circuit board (FPC) has wires on both sides. In order to realize the connection of the wires of different layers, the inner wall of the hole must be plated after drilling the circuit board. A layer of copper with a conductive function makes it a via, which connects the wires of different layers connected to the via. The existing FPC pattern electroplating method, also known as "hole plating", is an important part of the FPC manufacturing method, including the following steps: blanking→mechanical drilling→black hole→pressing dry film→exposing only the orifice plate→ Development → pattern plating → dry film removal → chemical cleaning → re-pressing the dry film → re-exposure → re-development → circuit etc...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/46H05K3/06H05K3/26
Inventor 张芬菊
Owner 靖江市华信科技创业园有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com