A reflow process welding method includes the steps: firstly, printing solder paste on a bottom plate through metal stencil printing; secondly, performing reflow welding for the bottom plate printed with the solder paste, forming an alloy welding layer on the bottom plate, and attaching soldering flux separated out from the solder paste on the surface of the bottom plate; thirdly, cleaning the bottom plate and removing the soldering flux separated out from the solder paste on the surface of the bottom plate; fourthly, coating the surface of the alloy welding layer with the soldering flux, and placing a workpiece to be welded on the alloy welding layer coated with the soldering flux; fifthly, performing reflow welding again. The size of the solder paste is same as that of the workpiece to be welded. The melting-point temperature of the solder paste is reference temperature N DEG C. Compared with the prior art, the process method is more convenient to operate and lower in cost, pollution caused by the soldering flux in the reflow process is avoided, and the method is particularly applicable to surface welding with a large-area contact surface.