274 results about "Stencil printing" patented technology

A voltage variable material (“VVM”) including an insulative binder that is formulated to intrinsically adhere to conductive and non-conductive surfaces is provided. The binder and thus the VVM is self-curable and applicable in a spreadable form that dries before use. The binder eliminates the need to place the VVM in a separate device or to provide separate printed circuit board pads on which to electrically connect the VVM. The binder and thus the VVM can be directly applied to many different types of substrates, such as a rigid FR-4 laminate, a polyimide, a polymer or a multilayer PCB via a process such as screen or stencil printing. In one embodiment, the VVM includes two types of conductive particles, one with a core and one without a core. The VVM can also have core-shell type semiconductive particles.

A process of cleaning of objects that relate to semiconductor fabrication processes, such as, for example, conductive paste screening in the production of multilayer ceramic substrates and composite solder paste by stencil printing in electronic circuit assembly. Specifically, the process removes a metal / polymer composite paste from screening masks and associated paste making and processing equipment used in printing conductive metal pattern onto ceramic green sheet in the fabrication of semiconductor packaging substrates. The process also cleans solder paste residue from stencil printing equipment used in electronic module assembly surface mount technology for SMT discretes, solder column attachment, and BGA (Ball Grid Array) attachment on ceramic chip carrier or for screening solder paste onto printed circuit board. More particularly, paste residue is cleaned from metal, ceramic, and plastic substrates by a non-alkaline semi-aqueous cleaning method employing high boiling propylene glycol alkyl ether or mixtures of propylene glycol alkyl ether and propylene glycol solvents.

A substrate for a pre-soldering material and a fabrication method of the substrate are proposed. The substrate having at least one surface formed with a plurality of conductive pads is provided. An insulating layer is formed over the surface of the substrate in such a way that a top surface of each of the conductive pads is exposed. Next, a conductive film and a resist layer are formed in sequence on the insulating layer and the conductive pads, wherein a plurality of openings are formed in the resist layer to expose a part of the conductive film above the conductive pad. Then, a pre-soldering material is deposited over the conductive pad by stencil printing or electroplating process.

The invention provides a printing device capable of ensuring a larger stencil adsorption area during printing. The printing device of the present invention includes: a pair of clips (31a), (31b) that clamp and hold the substrate (W) from both sides; when the substrate is held by the clips, a positioning device ( 41a, 41b); in the state that the positioning device (41a, 41b) is withdrawn from the substrate to the side, the stencil (51) arranged on the substrate held by a pair of clips (31a, 31b); Sliding on the stencil, the solder (S) on the stencil is spread and coated on the squeegee (61) on the substrate (W). A stencil (51) is placed on the positioning device in the retracted state, and a positioning device side suction device (45) for absorbing the stencil (51) is provided on the upper surface of the positioning devices (41a, 41b).

A peelable stenciling ink for imprinting indicia such as letters, numbers and symbols on a surface of an article such as a sport ball made of leather or a synthetic polymer, e.g., a thermoplastic material, consists of a solvent, a dye dispersed in the solvent, and a film-forming polymer soluble in the dye-solvent solution to form a thick paste and hardenable into a solid, flexible film upon evaporation of the solvent from a thin layer of ink applied to an article surface. A method of using the ink comprises the steps of temporarily adhering a stencil sheet in fluid-tight contact to an article surface by a pressure-sensitive adhesive layer, smearing a layer of the ink on the obverse surface area of the stencil sheet through indicia-shaped openings through the sheet onto the article surface, allowing sufficient time for dye in the ink to penetrate the article surface, and for the solvent to evaporate and cause the film-forming substance to harden into a solid film peelable from the article surface, and peeling the stencil sheet and solid film off the article surface, thereby leaving indicia markings imprinted on and dye-penetrated beneath the article surface, thus making the markings resistant to obliteration by scuffing or abrasion.