43 results about "Stencil printing" patented technology

An apparatus for determining the condition of a printed circuit board, including a stencil database for storing a plurality of stencil data files corresponding to stencils of different dimensions, an image capturing device having an area where the printed circuit board is laid thereon for a surface profile of the printed circuit board to be captured for generating a surface data file of the printed circuit board, and a condition determination module that compares data from the surface data file with data from one or more stencil data file as a nominal reference via a matching process to determine the condition of the printed circuit board based on a set of categories. The printed circuit board is sent for further processing (i.e., stencil printing) after being determined to be in a match-successful condition where data from the surface data file falls within a tolerance of the nominal reference.

The present disclosure provides a printable structural adhesive composition. The present disclosure further provides methods for applying a structural adhesive onto a substrate, the method comprising printing the structural adhesive onto the substrate. Printing may be carried out by jet printing, pad printing, screen printing and / or stencil printing.

Various embodiments of the teachings herein include a method for producing a rotationally symmetrical magnetic sheet having a plurality of radially running winding teeth for a laminated core of an electric machine. An example includes: producing a green body by applying a printing paste onto a substrate using a stencil printing method, wherein the printing paste comprises binders and iron particles having more than 95 wt. % of iron; producing a preform from the green body using a first thermal treatment wherein the binders are removed from the green body; producing the magnetic sheet from the preform using a second thermal treatment including a sintering process; and pressing the magnetic sheet with a pressure of more than 5 MPa in a uniaxial manner in the sheet plane thereof with a pressing ram. The pressing generates an anisotropic texture in the winding teeth.

A stencil printer for printing assembly materials on an electronic substrate includes a frame, a stencil coupled to the frame, the stencil having an aperture formed therein, a support assembly coupled to the frame, the support assembly configured to support the electronic substrate, a print head gantry coupled to the frame, and a print head assembly supported by the print head gantry in a manner such that the print head assembly is configured to traverse the stencil during a print stroke. The stencil printer further includes a verification system for determining whether an item placed within the stencil printer is properly installed within the stencil printer.

The invention relates to a preparation method and application of water-in-oil type emulsified oil ink for a porous plate, and belongs to the technical field of new materials. The emulsified oil ink comprises the following raw materials: an oil phase: white oil, an organic polymer pigment, an emulsifier and alkyl modified polycarboxylate; and a water phase: purified water, sulfates, diethanol and a sterilizing agent. The preparation method of the emulsified ink comprises the following steps: mixing an oil-phase material and a water-phase material, starting stirring and emulsifying, and vacuumizing by using an energy flow vacuum pump to remove impurities and trace bubbles, thereby obtaining the emulsified ink. The ink prepared by the invention is applied to ink supply types required by a printing kit of a printing facility, the ink passes through a porous plate of an ink box nozzle, is subjected to rolling development by a transfer printing shaft and realizes printing by virtue of an oil-based water-in-oil ink filling core, and is particularly suitable for wide and large-area card paper, paper skin and skin surface; and a print scene including an oil surface that is not compatible with other inks.

A vision system for use in a stencil printer configured to print an assembly material on an electronic substrate. The vision system includes a housing, a dual camera assembly supported by the housing, and a prism assembly supported by the housing and configured with the dual camera assembly to provide a first optical path viewed vertically upward at the bottom of the stencil and a second optical path viewed vertically downward on the electronic substrate.

A cover of a stencil printer is hingedly mounted to a frame and is movable between a closed position and an open position. The cover includes an elongated opening formed therein and a movable door configured to selectively close the elongated opening. The elongated opening is sized such that a stencil and / or tool tray can pass therethrough. The controller is configured to control movement of the movable door between the closed position and the open position. A sensor assembly is proximate the elongated opening. A sensor assembly is coupled to the controller and is configured to detect an object within the elongate opening when the movable door is moved to the closed position. The sensor is configured to generate a signal to the controller when an object within the elongated opening is detected. The controller, upon receiving a signal from the sensor, is configured to move the movable door to an open position.

The invention relates to a method for producing a seal on a substrate, in particular on a layer of an electrochemical cell, by means of stencil printing, the method comprising the following steps: a) applying a sealant and / or adhesive (3) to a stencil (4) resting on the substrate to be printed; b) filling at least one recess (5) of the stencil (4) with the sealant and / or adhesive (3) using a doctor blade (6) which is drawn over the stencil (4) in a predetermined doctor blade direction for this purpose such that the doctor blade (6) presses the sealant and / or adhesive (3) into the at least one recess (5); and c) releasing the sealant and / or adhesive (3) from the stencil (4). According to the invention, the doctor blade process in step b) is recorded with the aid of at least one camera (7), and the recording is subjected to an image analysis in order to detect defects, in particular trapped air bubbles (8).

The present invention provides a device and method for controlling the void ratio of a large-area thermal interface connection of a power electronic device. In the device part, by optimizing the design of the grid structure shape of the stencil printing module, it is ensured that the organic solvents and water vapor in the solder paste layer can be discharged smoothly, thereby effectively reducing the void ratio during the welding process; in the method part, through the optimization of the reflow soldering process, including the temperature control and vacuum degree optimization in each stage such as the heating process, heat preservation process, pre-reflow and reflow processes, the gas escape time is appropriately extended, so that the void ratio is controlled below 1%, the interface thermal resistance is reduced, and the heat dissipation performance is improved. The present invention simplifies the production process through optimized design and process, is more convenient to operate and has low cost, and is suitable for large-scale production; at the same time, since the void ratio is effectively controlled, the product quality consistency in the production process is guaranteed, and the heat dissipation efficiency and service life of the power electronic device are improved.

The invention relates to a method for producing a seal and / or adhesive structure on a substrate (2), in particular on a layer of an electrochemical cell, by means of stencil printing, the method comprising the following steps: a) placing the substrate (2) on a printing table (10); b) bringing the substrate (2) into contact with a one-piece stencil or at least one stencil part (3.1) of a multi-part stencil; c) securing the position of the stencil or of the at least one stencil part (3.1) relative to the substrate (2); d) filling at least one recess (4) of the one-piece or multi-part stencil with a sealant and / or adhesive in a doctor blade process; and e) releasing the sealant and / or adhesive from the at least one recess (4). According to the invention, the position of the stencil or of the at least one stencil part (3.1) relative to the substrate (2) is secured in step c) by means of a magnetic or suction force which pulls the stencil or the at least one stencil part (3.1) towards the substrate (2).

The application relates to the technical field of electronic fabrics, in particular to an electronic fabric based on laser-activated printable conductive ink and a preparation method thereof. Bismuth, indium and tin are mixed to obtain a mixture, the mixture is smelted to completely melt, and a molten alloy is obtained; the molten alloy is mixed with boiling water and ultrasonically treated to obtain an alloy dispersion liquid; the alloy dispersion liquid is centrifuged to obtain alloy particles which are dried and then mixed with a binder solution and stirred to obtain an alloy particle and binder solution composite ink; the ink is then patterned on a fiber pad in a stencil printing mode, and after activation, an electronic fabric is obtained. By combining an electrospun polyimide nanofiber base material and a laser-sintering-activated printable bismuth alloy conductive ink, the prepared electronic fabric has high flexibility, high air permeability and high conductivity, and the square resistance can reach 0.5 omega / D.

The utility model provides a stencil printing machine which is used for printing assembly materials on an electronic substrate. A stencil printer includes a frame, a printhead gantry, and a transfer device. The print head gantry is movably coupled to the frame in a first direction. The transfer device is supported by the printing head door frame and comprises a transfer tray, a first direction air cylinder and a second direction driving device, the first direction air cylinder comprises a cylinder barrel and a piston rod, the piston rod of the first direction air cylinder has a free moving state relative to the cylinder barrel of the first direction air cylinder, and the piston rod of the first direction air cylinder is connected to the transfer tray. A cylinder barrel of the first directional cylinder is coupled to the second directional drive.

Methods for die attachment of multichip and single components may involve printing a sintering paste on a substrate or on the back side of a die. Printing may involve stencil printing, screen printing, or a dispensing process. Paste may be printed on the back side of an entire wafer prior to dicing, or on the back side of an individual die. Sintering films may also be fabricated and transferred to a wafer, die or substrate. A post-sintering step may increase throughput.

To provide a polyester resin composition suitable for use in a film for high-sensitivity thermal stencil printing base paper, which is excellent in perforation sensitivity and can improve film formability.SOLUTION: A polyester resin composition contains a polyester resin containing polyethylene terephthalate and polybutylene terephthalate as main components, and has a minimum melting point (Tm1) of 219±2°C and a maximum melting point (Tm2) of 223±2°C.SELECTED DRAWING: None

The invention relates to a method for producing a seal (1) and / or adhesive structure on a substrate (2), in particular on a layer or ply of an electrochemical cell, by means of stencil printing, comprising the steps: a) placing the substrate (2) on a printing table (10), b) bringing the substrate (2) into contact with a one-part stencil (3) or at least one stencil part (3.1, 3.2, 3.3) of a multi-part stencil (3), c) fixing the position of the template (3) or of the at least one template part (3.1, 3.2, 3.3) with respect to the substrate (2), d) filling at least one recess (4) of the single-part or multi-part stencil (3) with a sealant and / or adhesive (6) in a doctor blade process and e) releasing the sealant and / or adhesive (6) from the at least one recess (4). According to the invention, the fixing of the position of the template (3) or of the at least one template part (3.1, 3.2, 3.3) with respect to the substrate (2) in step c) is effected by means of a magnetic or suction force which draws the template (3) or the at least one template part (3.1, 3.2, 3.3) in the direction of the substrate (2).

The invention relates to a method for the simultaneous application of at least two polymer materials (12, 14) to a substrate (10), which either remains in a stationary position (16) or moves in a feed direction (66). The following method steps are carried out: A first polymer functional material (12) is applied by means of at least one application element (22, 26, 60, 62) to at least first application surfaces (28, 30) of the substrate. The second polymer functional material (14) is then applied by means of at least one application element (24, 60, 62) to a third application surface (32) enclosed by or adjacent to the at least two application surfaces (28, 30). Furthermore, the invention relates to the use of the method for applying at least two polymer functional materials (12, 14) by screen or stencil printing to monopolar or bipolar plates.

The constant-pressure and constant-speed doctor blade mechanism comprises a support and a rigid knife rest, a mounting frame is movably mounted on the inner side of one end of the support, two mounting strips are fixedly mounted on the back face of the mounting frame, and mounting plates are fixedly mounted at the two ends of the mounting frame; the two ends of the support are in threaded connection with limiting columns, and the outer sides of the limiting columns are movably sleeved with hydraulic synchronous telescopic rods through supporting rings. When fine adjustment is needed, the control system synchronously and accurately controls the telescopic amount of the high-precision telescopic rod and the electromagnetic strength of the first electromagnet, so that the electromagnetic adjustment effect is generated between the auxiliary spring and the first electromagnet, the first piston and the supporting column are pushed to change the position, and then the limiting barrel and the rigid tool rest are pushed out; further, the gap between the flexible liner and the doctor blade body relative to the ink transfer roller is changed, the attaching position of the doctor blade body is changed, the purpose of fine adjustment is achieved, the adjustment precision is high, and response is rapid.

A stencil printer is configured to print assembly material on an electronic substrate. The stencil printer includes a frame, a stencil coupled to the frame, a support assembly coupled to the frame, and a print head gantry coupled to the frame. The print head gantry includes an elongated beam spanning along a track disposed on the frame, and a print head assembly supported by the print head gantry in a manner such that the print head assembly is configured to traverse the stencil during a print stroke. The print head assembly includes a print head having a squeegee blade assembly configured to cause solder paste to roll along the stencil. The stencil printer further includes a solder paste bead recovery system configured to remove solder paste beads from a top surface of the stencil and deposit the solder paste beads onto a new replacement stencil.

A soldering method for blind slot PCBs includes the following steps: S1: Pre-soldering preparation: Inspect, clean, and bake the blind slot PCB; S2: Determine the solder paste printing method: For non-blind slot pads, use traditional stencil printing of solder paste; for blind slot pads, use a spray gun to spray solder paste; S3: Component mounting: Use a pick-and-place machine to mount components; S4: Assembly fixture: Assemble a detachable soldering fixture according to the component distribution on the PCB; S5: Soldering the PCB: Set the reflow oven temperature profile and perform soldering; S6: Component removal: After soldering, remove the workpiece, rinse with water, and inspect. The advantages of this invention are: Combining stencil printing and spray gun printing to apply solder paste improves production efficiency and saves production costs; modular soldering fixtures reduce soldering deformation caused by inconsistent thickness of the blind slot PCB, reducing the soldering defect rate; and reducing the reflow oven heating rate reduces PCB deformation.

Ink compositions are disclosed that can be applied to, and resin components thereof adhered onto, a variety of substrates. Particular compositions utilize electromagnetic susceptor particles that, upon being subjected to electromagnetic energy of the appropriate wavelength (e.g., radiofrequency (RF) energy or microwave energy), heat thermoplastic resin particles of the composition cause localized heating. This can, in turn, result in melting and consolidation of thermoplastic resin particles onto a substrate. Direct heating may also be used to cause consolidation. Other compositions, comprising thermosetting resin particles, can be cured onto a substrate by exposure to actinic radiation, heat, moisture, or a combination of these. The ink compositions can be applied according to a variety of possible methods, including inkjet printing, intaglio printing, silk screen printing, stencil printing, painting, etc. Further flexibility resides in the possible use of a transfer medium (e.g., transfer film) onto which the ink composition is printed, for indirect application to the substrate.

A stencil printer includes a frame, a stencil coupled to the frame, and a support assembly coupled to the frame, the support assembly including a tool configured to support an electronic substrate in a print position beneath the stencil. The stencil printer further includes a print head assembly coupled to the frame in a manner such that the print head assembly is configured to traverse the stencil during a print stroke. The print head assembly includes a squeegee blade assembly and at least one paste cartridge for depositing solder paste on the stencil. The stencil printer further includes an end-of-arm tooling configured to pick up an article from a tool tray and release the article to the tool tray. The stencil printer further includes a movable cart configured to interface with the stencil printer to deliver replacement and / or replacement articles within the stencil printer.

The invention discloses a packaging structure and a packaging method of a semiconductor power module, and relates to the technical field of power semiconductor packaging, and the method comprises the steps: printing a first soldering paste on an intermediate carrier of a lead frame through a steel mesh printing technology, and bonding an MOSFET chip on the lead frame through the first soldering paste; gluing a second soldering paste on the source electrode of the MOSFET chip and the source electrode of the lead frame, and bonding a copper sheet on the source electrode of the MOSFET chip and the pin of the lead frame by using the second soldering paste; performing vacuum reflow soldering on the bonded device; bonding a driving chip to the copper sheet of the cleaned device by using a chip bonding material, and baking the device bonded with the driving chip in a nitrogen-filled oven; bonding the MOSFET chip, the driving chip and the lead frame of the baked device by using a gold-palladium-copper bonding wire; and carrying out plastic packaging treatment and cutting forming on the bonded device. The small size and heat dissipation requirements of a power product can be met, the chip welding quality can be guaranteed, and the low internal resistance requirement of the product can be met.

The invention belongs to the technical field of ultrathin planar transformers, and particularly relates to a method for manufacturing a thick copper PCB (printed circuit board) of an ultrathin planar transformer coil, which comprises the following steps of: pretreating a base material, selecting an epoxy resin PP (polypropylene) filled copper-clad plate as the base material, performing inner-layer pattern and micro-etching treatment on the surface of the base material, removing an oxide layer and forming a rough surface; the edge of the base material is polished, burrs are removed, and the flatness of the base material is optimized; and steel mesh printing: printing areas except the coil copper layer pattern on the surface of the pretreated base material by adopting a nano steel mesh vacuum printing process. The 2N-layer PCB is divided into two N-layer units for manufacturing, the flatness of the base material is improved in cooperation with ceramic polishing, the alignment error between layers is reduced, and the manufacturing difficulty is lowered; and interlayer bubbles are reduced by a vacuum glue filling process, and the multi-layer thick copper PCB can realize a more ultrathin design on the premise of not influencing the performance, so that the requirement of customers on the ultrathin thick copper of special products is met.

A selective stencil mask and a stencil printing method are provided. The stencil mask is for printing a fluid material onto a substrate, and comprises: a stencil member comprising: at least one printing region each having an array of apertures that allow the fluid material to flow therethrough and deposit onto the substrate; and a blocking region configured to prevent the fluid material from flowing therethrough; and a supporting member attached to the stencil member and configured to, when the stencil mask is placed on the substrate, contact the substrate and create a gap between the stencil member and the substrate.

This invention discloses a high-efficiency spray solder paste and its preparation method, comprising the following raw materials in weight percentages: 75%–85% lead-free solder powder; the particle size of the lead-free solder powder is 15–25 μm; and 15%–25% flux; the flux is composed of the following raw materials in parts by weight: 15–25 parts polymerized rosin; 5–15 parts hydrogenated rosin; 5–10 parts rosin glyceryl ester; 3–5 parts ethyl palmitate; and 3–5 parts calcium chloride, etc. By using lead-free solder powder with a particle size of 15–25 μm, the cost is low. Combined with the flux formulated in this invention, this product can be sprayed using various spraying devices, replacing the traditional stencil printing method, effectively improving the efficiency of solder paste application. Furthermore, this solder paste exhibits excellent wettability during spraying, resulting in smooth spraying and stable solder joint quality, which is beneficial for improving the reliability and production efficiency of electronic products.

The invention relates to a method for producing a seal and / or adhesive structure on a substrate (2), in particular on a layer of an electrochemical cell, by means of stencil printing, the method comprising the following steps: a) placing the substrate (2) on a printing table (10); b) bringing the substrate (2) into contact with a one-piece stencil or at least one stencil part (3.1) of a multi-part stencil; c) securing the position of the stencil or of the at least one stencil part (3.1) relative to the substrate (2); d) filling at least one recess (4) of the one-piece or multi-part stencil with a sealant and / or adhesive in a doctor blade process; and e) releasing the sealant and / or adhesive from the at least one recess (4). According to the invention, the position of the stencil or of the at least one stencil part (3.1) relative to the substrate (2) is secured in step c) by means of a magnetic or suction force which pulls the stencil or the at least one stencil part (3.1) towards the substrate (2).

A method for adjusting a solder paste stencil includes preloading a solder paste stencil in contact with a printed circuit board. Processing warpage is measured between the solder paste stencil and the printed circuit board to determine a dimensional offset strain due to the warpage. A stress to be applied to the stencil is determined by accessing a neural network to output the stress based on the dimensional offset strain. The stress is applied to the stencil to compensate for the warpage.

The invention relates to a method for producing a seal on a substrate, in particular on a layer of an electrochemical cell, by means of stencil printing, the method comprising the following steps: a) applying a sealant and / or adhesive (3) to a stencil (4) resting on the substrate to be printed; b) filling at least one recess (5) of the stencil (4) with the sealant and / or adhesive (3) using a doctor blade (6) which is drawn over the stencil (4) in a predetermined doctor blade direction for this purpose such that the doctor blade (6) presses the sealant and / or adhesive (3) into the at least one recess (5); and c) releasing the sealant and / or adhesive (3) from the stencil (4). According to the invention, the doctor blade process in step b) is recorded with the aid of at least one camera (7), and the recording is subjected to an image analysis in order to detect defects, in particular trapped air bubbles (8).

Methods for die attachment of multichip and single components may involve printing a sintering paste on a substrate or on the back side of a die. Printing may involve stencil printing, screen printing, or a dispensing process. Paste may be printed on the back side of an entire wafer prior to dicing, or on the back side of an individual die. Sintering films may also be fabricated and transferred to a wafer, die or substrate. A post-sintering step may increase throughput.

A stencil mask and a stencil printing method are provided. The stencil mask includes: a non-reinforcement portion having a mask surface configured to contact a substrate surface of a substrate; and a reinforcement portion having a thickness greater than that of the non-reinforcement portion, wherein the reinforcement portion includes: an embossed surface for insertion into a cavity of the substrate and configured to contact a cavity bottom surface when the stencil mask is placed onto the substrate for stencil printing; and at least one first stencil window that allows the fluid material to flow through the reinforcement portion, wherein the at least one first stencil window is aligned with at least one printing region within the cavity when the stencil mask is placed onto the substrate for stencil printing.