21 results about "Stencil printing" patented technology

An apparatus for determining the condition of a printed circuit board, including a stencil database for storing a plurality of stencil data files corresponding to stencils of different dimensions, an image capturing device having an area where the printed circuit board is laid thereon for a surface profile of the printed circuit board to be captured for generating a surface data file of the printed circuit board, and a condition determination module that compares data from the surface data file with data from one or more stencil data file as a nominal reference via a matching process to determine the condition of the printed circuit board based on a set of categories. The printed circuit board is sent for further processing (i.e., stencil printing) after being determined to be in a match-successful condition where data from the surface data file falls within a tolerance of the nominal reference.

The present disclosure provides a printable structural adhesive composition. The present disclosure further provides methods for applying a structural adhesive onto a substrate, the method comprising printing the structural adhesive onto the substrate. Printing may be carried out by jet printing, pad printing, screen printing and / or stencil printing.

A stencil printer for printing assembly materials on an electronic substrate includes a frame, a stencil coupled to the frame, the stencil having an aperture formed therein, a support assembly coupled to the frame, the support assembly configured to support the electronic substrate, a print head gantry coupled to the frame, and a print head assembly supported by the print head gantry in a manner such that the print head assembly is configured to traverse the stencil during a print stroke. The stencil printer further includes a verification system for determining whether an item placed within the stencil printer is properly installed within the stencil printer.

The application relates to the technical field of electronic fabrics, in particular to an electronic fabric based on laser-activated printable conductive ink and a preparation method thereof. Bismuth, indium and tin are mixed to obtain a mixture, the mixture is smelted to completely melt, and a molten alloy is obtained; the molten alloy is mixed with boiling water and ultrasonically treated to obtain an alloy dispersion liquid; the alloy dispersion liquid is centrifuged to obtain alloy particles which are dried and then mixed with a binder solution and stirred to obtain an alloy particle and binder solution composite ink; the ink is then patterned on a fiber pad in a stencil printing mode, and after activation, an electronic fabric is obtained. By combining an electrospun polyimide nanofiber base material and a laser-sintering-activated printable bismuth alloy conductive ink, the prepared electronic fabric has high flexibility, high air permeability and high conductivity, and the square resistance can reach 0.5 omega / D.

The utility model provides a stencil printing machine which is used for printing assembly materials on an electronic substrate. A stencil printer includes a frame, a printhead gantry, and a transfer device. The print head gantry is movably coupled to the frame in a first direction. The transfer device is supported by the printing head door frame and comprises a transfer tray, a first direction air cylinder and a second direction driving device, the first direction air cylinder comprises a cylinder barrel and a piston rod, the piston rod of the first direction air cylinder has a free moving state relative to the cylinder barrel of the first direction air cylinder, and the piston rod of the first direction air cylinder is connected to the transfer tray. A cylinder barrel of the first directional cylinder is coupled to the second directional drive.

The constant-pressure and constant-speed doctor blade mechanism comprises a support and a rigid knife rest, a mounting frame is movably mounted on the inner side of one end of the support, two mounting strips are fixedly mounted on the back face of the mounting frame, and mounting plates are fixedly mounted at the two ends of the mounting frame; the two ends of the support are in threaded connection with limiting columns, and the outer sides of the limiting columns are movably sleeved with hydraulic synchronous telescopic rods through supporting rings. When fine adjustment is needed, the control system synchronously and accurately controls the telescopic amount of the high-precision telescopic rod and the electromagnetic strength of the first electromagnet, so that the electromagnetic adjustment effect is generated between the auxiliary spring and the first electromagnet, the first piston and the supporting column are pushed to change the position, and then the limiting barrel and the rigid tool rest are pushed out; further, the gap between the flexible liner and the doctor blade body relative to the ink transfer roller is changed, the attaching position of the doctor blade body is changed, the purpose of fine adjustment is achieved, the adjustment precision is high, and response is rapid.

A stencil printer is configured to print assembly material on an electronic substrate. The stencil printer includes a frame, a stencil coupled to the frame, a support assembly coupled to the frame, and a print head gantry coupled to the frame. The print head gantry includes an elongated beam spanning along a track disposed on the frame, and a print head assembly supported by the print head gantry in a manner such that the print head assembly is configured to traverse the stencil during a print stroke. The print head assembly includes a print head having a squeegee blade assembly configured to cause solder paste to roll along the stencil. The stencil printer further includes a solder paste bead recovery system configured to remove solder paste beads from a top surface of the stencil and deposit the solder paste beads onto a new replacement stencil.

A soldering method for blind slot PCBs includes the following steps: S1: Pre-soldering preparation: Inspect, clean, and bake the blind slot PCB; S2: Determine the solder paste printing method: For non-blind slot pads, use traditional stencil printing of solder paste; for blind slot pads, use a spray gun to spray solder paste; S3: Component mounting: Use a pick-and-place machine to mount components; S4: Assembly fixture: Assemble a detachable soldering fixture according to the component distribution on the PCB; S5: Soldering the PCB: Set the reflow oven temperature profile and perform soldering; S6: Component removal: After soldering, remove the workpiece, rinse with water, and inspect. The advantages of this invention are: Combining stencil printing and spray gun printing to apply solder paste improves production efficiency and saves production costs; modular soldering fixtures reduce soldering deformation caused by inconsistent thickness of the blind slot PCB, reducing the soldering defect rate; and reducing the reflow oven heating rate reduces PCB deformation.

A stencil printer includes a frame, a stencil coupled to the frame, and a support assembly coupled to the frame, the support assembly including a tool configured to support an electronic substrate in a print position beneath the stencil. The stencil printer further includes a print head assembly coupled to the frame in a manner such that the print head assembly is configured to traverse the stencil during a print stroke. The print head assembly includes a squeegee blade assembly and at least one paste cartridge for depositing solder paste on the stencil. The stencil printer further includes an end-of-arm tooling configured to pick up an article from a tool tray and release the article to the tool tray. The stencil printer further includes a movable cart configured to interface with the stencil printer to deliver replacement and / or replacement articles within the stencil printer.

The invention discloses a packaging structure and a packaging method of a semiconductor power module, and relates to the technical field of power semiconductor packaging, and the method comprises the steps: printing a first soldering paste on an intermediate carrier of a lead frame through a steel mesh printing technology, and bonding an MOSFET chip on the lead frame through the first soldering paste; gluing a second soldering paste on the source electrode of the MOSFET chip and the source electrode of the lead frame, and bonding a copper sheet on the source electrode of the MOSFET chip and the pin of the lead frame by using the second soldering paste; performing vacuum reflow soldering on the bonded device; bonding a driving chip to the copper sheet of the cleaned device by using a chip bonding material, and baking the device bonded with the driving chip in a nitrogen-filled oven; bonding the MOSFET chip, the driving chip and the lead frame of the baked device by using a gold-palladium-copper bonding wire; and carrying out plastic packaging treatment and cutting forming on the bonded device. The small size and heat dissipation requirements of a power product can be met, the chip welding quality can be guaranteed, and the low internal resistance requirement of the product can be met.

The invention belongs to the technical field of ultrathin planar transformers, and particularly relates to a method for manufacturing a thick copper PCB (printed circuit board) of an ultrathin planar transformer coil, which comprises the following steps of: pretreating a base material, selecting an epoxy resin PP (polypropylene) filled copper-clad plate as the base material, performing inner-layer pattern and micro-etching treatment on the surface of the base material, removing an oxide layer and forming a rough surface; the edge of the base material is polished, burrs are removed, and the flatness of the base material is optimized; and steel mesh printing: printing areas except the coil copper layer pattern on the surface of the pretreated base material by adopting a nano steel mesh vacuum printing process. The 2N-layer PCB is divided into two N-layer units for manufacturing, the flatness of the base material is improved in cooperation with ceramic polishing, the alignment error between layers is reduced, and the manufacturing difficulty is lowered; and interlayer bubbles are reduced by a vacuum glue filling process, and the multi-layer thick copper PCB can realize a more ultrathin design on the premise of not influencing the performance, so that the requirement of customers on the ultrathin thick copper of special products is met.

A selective stencil mask and a stencil printing method are provided. The stencil mask is for printing a fluid material onto a substrate, and comprises: a stencil member comprising: at least one printing region each having an array of apertures that allow the fluid material to flow therethrough and deposit onto the substrate; and a blocking region configured to prevent the fluid material from flowing therethrough; and a supporting member attached to the stencil member and configured to, when the stencil mask is placed on the substrate, contact the substrate and create a gap between the stencil member and the substrate.

A method for adjusting a solder paste stencil includes preloading a solder paste stencil in contact with a printed circuit board. Processing warpage is measured between the solder paste stencil and the printed circuit board to determine a dimensional offset strain due to the warpage. A stress to be applied to the stencil is determined by accessing a neural network to output the stress based on the dimensional offset strain. The stress is applied to the stencil to compensate for the warpage.

A stencil mask and a stencil printing method are provided. The stencil mask includes: a non-reinforcement portion having a mask surface configured to contact a substrate surface of a substrate; and a reinforcement portion having a thickness greater than that of the non-reinforcement portion, wherein the reinforcement portion includes: an embossed surface for insertion into a cavity of the substrate and configured to contact a cavity bottom surface when the stencil mask is placed onto the substrate for stencil printing; and at least one first stencil window that allows the fluid material to flow through the reinforcement portion, wherein the at least one first stencil window is aligned with at least one printing region within the cavity when the stencil mask is placed onto the substrate for stencil printing.

This invention discloses an LED display module, its fabrication method, and a display device. By using magnetic adsorption, the two electrodes of the LED light-emitting chip are respectively fixed to two pads within a sub-pixel region, eliminating the need for die bonding via stencil printing. This reduces costs, improves die bonding reliability, and meets the requirements for LED display devices with a pixel pitch of less than P0.5mm. Furthermore, since the magnetic poles of the two magnets within each sub-pixel region are opposite, the orientation of the LED light-emitting chip during die bonding is guaranteed to meet preset requirements, preventing reverse electrode connection during the die bonding process.

A method for forming a stencil mask is provided. The method includes: providing a reinforcement base frame; and etching a portion of the reinforcement base frame to form a non-reinforcement portion, such that a remaining portion of the reinforcement base frame forms a reinforcement portion. The non-reinforcement portion has a mask surface configured to contact a substrate surface. The reinforcement portion has a thickness greater than that of the non-reinforcement portion, and includes: an embossed surface for insertion into a cavity of the substrate and configured to contact a cavity bottom surface when the stencil mask is placed onto the substrate for stencil printing; and at least one first stencil window that allows a fluid material to flow therethrough, wherein the at least one first stencil window is aligned with at least one printing region within the cavity when the stencil mask is placed onto the substrate for stencil printing.

The invention discloses an online cleaning device and method for a ball mounting plate of a semiconductor ball mounting machine, and relates to the technical field of semiconductor ball mounting plates. The recycling box is detachably mounted at the lower part of the supporting frame, and a left bin and a right bin are formed on two opposite sides of the recycling box; the ball spraying mechanism is arranged above the left bin and is mounted at the upper part of the supporting frame; the cleaning roller is located above the right bin, bristles are installed on the circumferential face of the cleaning roller, the cleaning roller is rotatably installed on the upper portion of the bearing frame and arranged on the downstream of the ball spraying mechanism, and a driving mechanism is installed on the bearing frame; the air blowing mechanism is installed on the upper portion of the bearing frame and arranged on the downstream of the cleaning roller, the air blowing mechanism is arranged above the right bin, and a blowing opening of the air blowing mechanism faces the right bin; and the controller is in signal connection with the ball spraying mechanism, the driving mechanism, the air blowing mechanism and the ball mounter. The problem that in an existing template printing ball mounting technology, a ball mounting plate needs to be detached and cleaned off line, and consequently continuous operation is interrupted is solved.

The application discloses a kind of preparation flexible solid-state battery and method using light curing auxiliary hole plate printing, belong to zinc ion battery field;The battery includes positive electrode layer, negative electrode layer and solid electrolyte layer;Positive electrode layer includes raw material and mass fraction ratio is positive electrode active material 25~30%, electronic conductive agent 3~6%, photosensitive polymer network matrix 65~75%;Solid electrolyte layer includes raw material and mass fraction ratio is inorganic nano active filler 28~35%, photosensitive polymer network matrix 65~72%;Negative electrode layer is zinc metal sheet;Preparation method effectively combines light curing technology and hole plate printing technology, utilizes the principle of ultraviolet light initiation polymerization to make positive electrode and electrolyte ink solidification, without performing post-processing such as degreasing, sintering, save preparation time, reduce raw material waste, reduce preparation cost, preparation process energy saving and environmental protection and can realize large-scale batch production.

A solder paste dispensing and transfer system for a stencil printer is configured to print assembly material on an electronic substrate. The transfer system includes a solder paste cassette mechanism coupled to a printhead assembly of the stencil printer, and a rotary indexing mechanism coupled to a frame of the stencil printer. The solder paste dispensing and transfer system is configured to transfer used solder paste cassettes from the printhead assembly to the rotary indexing mechanism supported by the frame, and to transfer new solder paste cassettes from the rotary indexing mechanism to the printhead assembly.

A method for adjusting a solder paste stencil includes preloading a solder paste stencil in contact with a printed circuit board. Processing warpage is measured between the solder paste stencil and the printed circuit board to determine a dimensional offset strain due to the warpage. A stress to be applied to the stencil is determined by accessing a neural network to output the stress based on the dimensional offset strain. The stress is applied to the stencil to compensate for the warpage.

The present disclosure provides a stencil printer for printing a viscous substance onto a substrate. The stencil printer comprises a frame, a stencil, a support table, a squeegee blade mount, a squeegee blade and a squeegee blade holder. The stencil is connected to the frame. The support table is connected to the frame and configured to support the substrate in a printing position. The support table is provided below the stencil. The squeegee blade mount is connected to the frame and provided above the stencil. The squeegee blade extends in an X direction and performing a squeegeeing operation in a Y direction perpendicular to the X direction. The squeegee blade holder comprises a fixed holder and a movable holder. The fixed holder is fixedly mounted to the squeegee blade mount, and the squeegee blade is held on the movable holder. The movable holder is configured to be movably connected to the fixed holder in the X direction to enable the squeegee blade to move relative to the support table in the X direction, so that the squeegee blade is adjustable in the X direction to a position aligned with the support table and the stencil.