The invention comprises a manufacturing method of an evanescent wave coupling high-speed high-power photoelectric detector. The method comprises a, sequentially growing an InP stress buffering layer, ten cycle-alternating InP/InGaAsP diluted waveguide layers, two InGaAsP light matching layers, three InGaAs absorbing layers, an InP diffusion barrier layer and an InGaAs contact layer; b, doping the InGaAs contact layer through a Zn3As2 source; c, fabricating a P electrode; d, defining an active area; e, defining an optical fiber input waveguide area; f, defining a coupling waveguide area; g, fabricating an N electrode; h, guaranteeing good ohmic contact between the P electrode and the N electrode through a rapid annealing method; i, planarizing the whole table board through benzocylobutene materials to the same plane with the P electrode; j, fabricating coplanar waveguide electrodes; k, thinning epitaxial wafers to 110 mu m and cleaving the epitaxial wafers to strip array chips; l, coating film on the waveguide end surfaces of the strip array chips; m, cleaving the array chips into unit chips.