183 results about "Benzocyclobutene" patented technology

The invention belongs to the technical field of dielectric materials, and particularly relates to a dielectric material based on polybenzocyclobutene as well as a preparation method and application of the dielectric material. According to the multi-benzocyclobutene-based dielectric material provided by the invention, different halogenated hydrocarbon, olefin and other raw materials are used, and on the basis of containing more than two benzocyclobutene groups, a specific group can be introduced into a connecting group so as to improve the dielectric property and thermal stability of the material; meanwhile, specific groups can be introduced into R2 and R3 through secondary Heck reaction to further improve the dielectric property and thermal stability of the material, so that the dielectric material with excellent comprehensive properties such as dielectric property and thermal stability is provided, and the technical problem of lack of dielectric materials for high-frequency and high-speed printed circuit boards (PCBs) in the prior art can be solved.

The invention provides a thermosetting resin composition, a resin adhesive film and application thereof. The thermosetting resin composition comprises the following components in parts by mass: 5-95 parts of benzocyclobutene resin, 5-95 parts of a component containing C = C unsaturated bonds, 5-300 parts of a modified filler and 0.1-10 parts of an initiator, the modified filler is an inorganic filler subjected to surface treatment by a coupling agent containing unsaturated groups, and the unsaturated groups are selected from any one or a combination of at least two of styryl, acryloyloxy, methacryloyloxy and polybutadiene groups. A resin adhesive film prepared from the thermosetting resin composition is excellent in dielectric property, low in dielectric loss tangent Df, good in dielectric stability, small in Df (10GHz) variation amplitude after HAST, high in chemical copper binding force and capable of fully meeting the performance requirement for preparing a high-frequency and high-speed printed circuit board through a semi-addition method or an addition method.

The invention discloses a large-current-carrying-capacity flexible power cable, which belongs to the technical field of cable preparation, is used for solving the technical problem that the flame retardant property and the mechanical property of the power cable need to be further improved in the prior art, and specifically comprises a cable core, a wrapping layer, an insulating layer and a sheath layer which are sequentially arranged from inside to outside. The preparation method comprises the following steps: preparing alkoxy silane containing a benzocyclobutene group, preparing flame-retardant particles by using a sol-gel method, preparing modified polyurethane by using modified polysiloxane and 2, 5-furandimethanol as soft segments, naphthalene diisocyanate as a hard segment and trimethylolpropane as a chain extender, and preparing the flame-retardant flame-retardant polyurethane. The linear low-density polyethylene, the MAH-g-PE, the modified polyurethane, the flame-retardant particles and the auxiliary additive are melted and extruded outside the wire core to form the insulating layer, so that the power cable is obtained, the flame-retardant property of the power cable is effectively improved, and the mechanical property and the current-carrying stability of the power cable are also improved.

The invention provides a resin composition and application thereof, and the resin composition comprises the following components by weight: 1-80 parts of benzoxazine resin; 20 to 100 parts by weight of epoxy resin; 5-50 parts by weight of a curing agent; the benzoxazine resin contains the following structural formula (1a) or structural formula (1b): # imgabs0 #, and Ar is methylene, ethylene and # imgabs1 #. The resin composition provided by the invention comprises the benzoxazine resin with allyl and benzocyclobutenyl, so that the dielectric constant and dielectric loss of the resin composition can be reduced; the resin composition can be applied to a high-performance electronic substrate.

The invention relates to a resin composition and a preparation method thereof, a prepreg, a laminated board and a printed circuit board. The resin composition is prepared from the following components in parts by mass: 30 to 80 parts of modified bismaleimide prepolymer and 20 to 60 parts of cyanate ester resin, the modified bismaleimide prepolymer is prepared from the following raw materials: bismaleimide resin and a diamine compound, wherein the diamine compound contains a benzocyclobutene structure. In the resin composition, the modified bismaleimide prepolymer prepared from specific preparation raw materials and the cyanate ester resin are matched according to a specific proportion, so that the resin composition has a relatively low thermal expansion coefficient; meanwhile, the glass transition temperature and the thermal decomposition temperature are higher, the peel strength and the elastic modulus are higher, and the dielectric constant and the dielectric loss are lower, so that the high thermal stability, the size stability, the mechanical property and the dielectric property are better.

The invention belongs to the field of high polymer materials, and discloses a POSS (Polyhedral Oligomeric Silsesquioxane) modified monomer as well as a preparation method and application thereof. According to the POSS modified monomer, a vinyl POSS (T8-POSS) basic framework with a T8 structure is adopted, a hydrophobic perfluoroalkyl chain (SF) and a thermosensitive benzocyclobutenyl (Si-B) unit are introduced to an inorganic cage, when the POSS modified monomer is subjected to thermocuring to form a multifunctional coating, a hybrid network structure can be constructed by adjusting the content of the SF and the content of the Si-B unit, and therefore the multifunctional coating is formed. The effects of controlling the optical, mechanical, thermal and surface wettability of the coating are achieved, and the coating has high mechanical strength and environment barrier efficiency. Meanwhile, the invention also discloses a preparation method of the POSS modified monomer and a coating prepared from the POSS modified monomer.

The application belongs to the technical field of welding materials, and discloses a preformed soldering sheet and a preparation method thereof, the preparation method comprising: a flux preparation method, wherein benocyclobutene resin, a thixotropic agent, an active agent, a surfactant, an antioxidant, a corrosion inhibitor and a solvent are weighed, mixed and heated and stirred to mix, and then cooled to obtain the required flux; a processing method of a preformed soldering sheet body soldering strip, wherein lead-free filler metal is melted at high temperature to form a soldering strip; and a preformed soldering sheet preparation method, wherein the soldering strip is uniformly coated with the flux by a coating machine, and the flux is cured and attached to the soldering strip after baking; the preformed soldering sheet is obtained by the above preparation method. The application realizes improved welding quality of the soldering sheet coated with the flux film and solder metal oxidation resistance, and the preformed soldering sheet has high stability, good wettability and good weldability, and can meet the requirements of the market for the use of the preformed soldering sheet with low cavities.

The invention discloses a low-temperature curing photoresist applied to a flexible display panel and a preparation method of the low-temperature curing photoresist, and belongs to the technical field of energy conservation and environmental protection. The photoresist is prepared by compounding a reactive organic-inorganic mixed nano filler, a photosensitive resin matrix, a benzocyclobutenyl silicone oligomer (BSA resin) and an additive. The preparation method comprises the following steps: preparation and surface modification of the nanofiller; synthesizing a photosensitive resin matrix; compounding the oligomer with an additive; dispersing the slurry and adding a nano corrugated template; spin coating, ultraviolet pre-curing, low-temperature baking and heat post-curing are carried out. The curing temperature of the photoresist is lower than 120 DEG C, the resolution ratio is superior to 3 microns, and the bending tolerance frequency is gt; the adhesion strength is gt after 20000 times; 15 Kgf / cm < 2 >, and the water vapor permeability is lt; 10 <-6 >, heat resistance gt; the temperature is 150 DEG C, and the dielectric constant is lt; 3.5, VOC (Volatile Organic Compounds) emission lt; the organic light-emitting material has excellent flexibility, thermal stability and environmental protection performance, is suitable for a pixel definition layer of an OLED flexible display panel, and improves the light extraction efficiency and the anti-fatigue performance.

The invention discloses a resin composition for a benzocyclobutenyl cyclotriphosphazene copper-clad plate as well as a preparation method and application of the resin composition, and belongs to the field of electronic resin synthesis. Comprising 20-33 parts by weight of benzocyclobutenyl cyclotriphosphazene, 67-80 parts by weight of hydrocarbon resin, 0.0-0.22 part by weight of an initiator, 25-53 parts by weight of a filler, and a first solvent accounting for 34-36 wt% of the total weight of the benzocyclobutenyl cyclotriphosphazene, the hydrocarbon resin and the filler, when the resin composition for the copper-clad plate is applied to the preparation of the copper-clad plate, the resin composition is firstly prepared into a resin glue solution, then glass fiber cloth is impregnated in the resin glue solution, and the halogen-free flame-retardant copper-clad plate is prepared through the steps of baking, sheet overlapping, hot pressing, cooling and pressure relief. The resin composition for the copper-clad plate has excellent flame retardant property, dielectric property, heat resistance and the like under the interaction of benzocyclobutenyl cyclotriphosphazene and hydrocarbon resin, and can endow the copper-clad plate with excellent flame retardant property, dielectric property, heat resistance and the like.

The invention provides a resin composition, and a prepreg, a laminated board and a metal foil-clad laminated board containing the same. The resin composition comprises the following components in parts by mass: 20-90 parts of a component A and 5-60 parts of a component B, the component A comprises addition reactants of a maleimide compound a1 containing at least two N-substituted maleimide groups in one molecule and an amine compound a2 containing at least two primary amino groups in one molecule; and the component B is benzocyclobutene resin. Through design and mutual compounding of the component A and the component B, the problem of phase splitting caused by insufficient compatibility of a maleimide compound and low-polarity resin is solved, and the warping degree of a laminated board and a metal foil-clad laminated board at room temperature and after reflow soldering is further reduced; the resin composition and the laminated board and the metal foil-clad laminated board comprising the same have excellent performances such as high glass transition temperature and low thermal expansion coefficient, and fully meet the performance requirements of high-speed packaging substrate materials.

The invention provides a resin composition, a resin film containing the same and a printed circuit board. The resin composition comprises the following components in parts by mass: 5-95 parts of benzocyclobutene modified polyphenyl ether resin, 5-95 parts of a component containing C = C unsaturated bonds, 5-300 parts of a modified filler and 0.1-10 parts of an initiator, the modified filler is an inorganic filler subjected to surface treatment by a double-bond group-containing coupling agent. The benzocyclobutene modified polyphenyl ether resin has good reaction activity, and is compounded with a component containing a C = C unsaturated bond and a modified filler containing a double-bond group to form a condensate with high crosslinking density and excellent interface consistency. The cured product of the resin composition has the advantages of excellent dielectric property, low dielectric loss tangent Df, good dielectric stability, small change amplitude of Df (10GHz) after HAST, and high chemical copper binding force, and can be applied to a high-frequency high-speed printed circuit board prepared by a semi-addition method or an addition method.

The invention provides a benzoxazine compound, a benzoxazine mixture, a resin composition and application of the resin composition, the structural formula of the benzoxazine compound is a structural formula (1a) or a structural formula (1b), # imgabs 0 #, Ar is methylene, ethylidene and # imgabs 1 #, the benzoxazine compound provided by the invention has allyl and benzocyclobutene groups, and the benzoxazine compound has a structure shown in the description. Dielectric properties of the benzoxazine compound can be improved, and heat resistance and dimensional stability of the benzoxazine compound can be maintained.

The invention discloses halogen-free flame-retardant modified hydrocarbon resin and a preparation method thereof, a resin composition for a copper-clad plate and application of the resin composition, and belongs to the technical field of electronic resin. The halogen-free flame-retardant modified hydrocarbon resin comprises a hydrocarbon resin main chain, an organic silicon side chain and a benzocyclobutene group, the hydrocarbon resin main chain has a plurality of main chain double bonds and molecular side chain suspension double bonds; the benzocyclobutene group is grafted to at least one of the hanging double bonds; the silicone side chain is grafted to at least one of the plurality of dangling double bonds; the resin composition for the copper-clad plate comprises halogen-free flame-retardant modified hydrocarbon resin, phosphorus-containing unsaturated resin, an initiator, a filler and a solvent, the invention further discloses application of the resin composition for the copper-clad plate to preparation of the halogen-free flame-retardant copper-clad plate. The halogen-free flame-retardant modified hydrocarbon resin provided by the invention contains a silicon element, can provide halogen-free flame-retardant characteristics, has excellent heat resistance, dimensional stability, dielectric properties and the like, and can be used in the field of high-frequency and high-speed printed circuit boards.

The invention relates to a method for efficiently preparing hydroxylamine hydrochloride. The method comprises the following steps: mixing a diacetylmonoxime solution and a hydrochloric acid solution, pretreating through a pressurized nano-bubble fluidized bed, and carrying out reaction distillation under heating and pressurizing; after the reaction is finished, cooling reaction liquid, performing primary filtration and suction filtration through cross-flow filtration equipment, and collecting hydroxylamine hydrochloride crystals; and washing the crystal with absolute ethyl alcohol, recovering ethyl alcohol through cross-flow filtration equipment, and finally freeze-drying to obtain the high-purity hydroxylamine hydrochloride. The preparation method comprises the following steps: stirring quinoline-8-yl acrylate, tributyltin acrylate, 4-vinyl benzocyclobutene, ethanol and benzoyl peroxide to obtain a mixed solution; immersing the PTFE membrane subjected to low-temperature plasma pretreatment into the mixed solution, and then carrying out ultrasonic cleaning and vacuum drying to obtain a polymer modified PTFE membrane; the hydroxylamine hydrochloride prepared by the method disclosed by the invention has relatively high purity and yield, and meanwhile, the content of heavy metal ions and the content of water are effectively reduced.

The present invention relates to a benzocyclobutene resin, a resin composition, and uses thereof. The benzocyclobutene resin comprises at least one structural unit A and at least one structural unit B, where structural unit A has a structure represented by Formula I and structural unit B has a structure represented by Formula II. The benzocyclobutene resin has an all-hydrocarbon structure and has a sufficiently low dielectric constant Dk and dielectric dissipation factor Df. The benzocyclobutene resin also has a high glass transition temperature, low water absorption, good heat resistance and moist heat resistance, excellent dielectric properties, high modulus, and mechanical properties. Furthermore, the benzocyclobutene resin also has good processability, fully meeting the performance requirements for resin materials in high-performance PCBs.

The invention belongs to the technical field of organic-inorganic thermosetting resin materials, and particularly relates to open-cage benzocyclobutenyl polysilsesquioxane thermosetting resin as well as a preparation method and application thereof. The invention provides open-cage benzocyclobutenyl polysilsesquioxane. The structural formula of the open-cage benzocyclobutenyl polysilsesquioxane is shown as a formula 1 or a formula 2. The thermosetting resin based on the open-cage benzocyclobutenyl polysilsesquioxane disclosed by the invention has an ultralow dielectric constant and low dielectric loss; the thermosetting resin prepared by the preparation method has high heat resistance and good flexibility, can be prepared into a firm block material by a casting method, and can be prepared into a flexible thermosetting resin film by a spin coating or dispensing method. The homogeneous intramolecular organic-inorganic hybrid thermosetting resin is prepared by taking the open-cage POSS as a monomer through thermal crosslinking of the open-cage POSS, and the problems that the POSS is non-uniformly dispersed, the threshold value of the addition amount is low and the improvement of the material performance is limited when a polymer is modified by the POSS are solved. # imgabs0 #

The invention discloses a high-frequency low dielectric loss benzocyclobutene resin and its preparation method and application. The 1,3-position diene, benzocyclobutene group, vinyl compound, initiator and organic solvent are polymerized under the conditions of 5°C to 78°C and then treated to obtain a high-frequency low dielectric loss benzocyclobutene resin. The high-frequency low dielectric loss benzocyclobutene resin prepared by the present invention has excellent thermal stability, mechanical properties and dielectric properties after high-temperature curing. At a frequency of 10 GHz, its dielectric constant (Dk) is 2.35-2.60, dielectric loss (Df) is 0.0004-0.0007, T 5％ The thermal decomposition temperature is 442‑465°C, and the thermal expansion coefficient of the cured resin is 32‑88ppm / °C@50°C. Therefore, it can be used as high-temperature resistant dielectric materials, high-performance composite materials, electronic packaging materials, and aviation materials; it can be used in 5G / 6G high-frequency PCB boards and interlayer packaging of chips, etc.

The invention discloses preparation of thermocuring benzocyclobutenyl MQ silicon resin and application of the thermocuring benzocyclobutenyl MQ silicon resin in preparation of glass fiber composites.The preparation method comprises the steps that an organic silicon source, a solvent, a catalyst and water are stirred to react for 30-90 min at the temperature of 30-50 DEG C, and a mixed solution A is formed; uniformly mixing divinyl siloxane-dibenzocyclobutene and a solvent to form a mixed solution B, adding the mixed solution B into the mixed solution A, heating to 65-80 DEG C, and reacting for 1-3 hours; after the reaction is finished, adding an organic phase for extraction, washing with water for multiple times until the solution is neutral, performing vacuum distillation to remove the solvent, and performing vacuum drying; the thermocuring benzocyclobutenyl MQ silicon resin is obtained. Cured resin formed by thermal crosslinking of the thermocuring benzocyclobutenyl MQ silicon resin has relatively excellent dielectric properties, mechanical properties, heat resistance and chemical stability, and then the cured resin and glass fibers are used for preparing a composite material with the properties of low dielectric, high tensile strength, high bending strength, chemical stability, heat resistance and the like.

The application discloses a Low-alpha silicon powder / benzocyclobutene chip packaging composite material, which comprises 55-60wt% of phosphonate-benzocyclobutene resin matrix, 35-40wt% of filler system and 3-5wt% of bismaleimide synergistic additive; the phosphonate-benzocyclobutene resin matrix is obtained through ring-opening metathesis polymerization of norbornene phosphonate imidazole monomer and co-curing of benzocyclobutene monomer; the filler system contains epoxy silane modified double-particle-size Low-alpha silicon powder and aluminum hypophosphite modified nano Mg(OH)2; the alpha emissivity of the epoxy silane modified double-particle-size Low-alpha silicon powder is <0.001 cph / (cm 2 ·h), U≤0.1ppm, Th≤0.2ppm. The dielectric constant of the obtained chip packaging composite material is ≤2.45@77GHz, the dielectric loss is <0.0016, and the interfacial bonding strength is ≥7.2MPa, so that the chip packaging composite material is suitable for vehicle 77GHz millimeter wave radar packaging and meets the requirements of high frequency, radiation resistance and high reliability.

A resin composition includes 100 parts by weight of an unsaturated C═C double bond-containing polyphenylene ether resin; 5 parts by weight to 100 parts by weight of a compound of Formula (1), a compound of Formula (2), an oligomer of the compound of Formula (1), an oligomer of the compound of Formula (2) or a combination thereof; and 5 parts by weight to 100 parts by weight of a benzocyclobutene-modified polyolefin. Moreover, also provided is an article made from the resin composition, including a prepreg, a resin film, a laminate or a printed circuit board, and improvements in various properties can be achieved including post-plating copper foil peeling strength uniformity, Z-axis coefficient of thermal expansion and storage modulus variation rate.

The application discloses a modified bismaleimide resin and a preparation method and application thereof, and comprises the following steps: mixing a benzocyclobutene compound with a bismaleimide, pre-polymerizing under the condition of 140-160 DEG C to obtain the modified bismaleimide resin, and then curing; wherein the structural formula of the benzocyclobutene compound is as follows: The modified bismaleimide resin obtained by pre-polymerizing and curing the benzocyclobutene compound (BZBA) with the specific structure and the bismaleimide has excellent heat resistance, low water absorption, high modulus, low dielectric constant and dielectric loss, and good toughness.

The invention belongs to the field of aviation composite material manufacturing, and particularly relates to a preparation method of a benzocyclobutene modified cyanate ester composite material. Common high-temperature-resistant resin cannot have the characteristics of low dielectric, low loss, high temperature resistance and thermal oxidative aging resistance at the same time. The preparation method comprises the following steps: adding chloroplatinic acid with the mass fraction of 1%-5% into a benzocyclobutene monomer, and carrying out prepolymerization to obtain a benzocyclobutene prepolymer with the viscosity of 500-1000 mpas; the preparation method comprises the following steps: carrying out copolymerization on a benzocyclobutene prepolymer and cyanate ester according to a molar ratio of (1: 9)-(1: 1) to obtain a benzocyclobutene modified cyanate ester copolymer with the viscosity of 5000mpas-20000mpas; coating the release paper with the modified cyanate ester copolymer by using a hot melting method prepreg machine, wherein the coating temperature is 50-100 DEG C; then the benzocyclobutene modified phenolic aldehyde type cyanate ester prepreg is obtained through compounding with a fiber fabric, the compounding temperature is 50-100 DEG C, and the glue content of the prepreg is 33%-43%; and laminating and curing a certain number of layers of prepreg according to the thickness. The high temperature resistance and thermo-oxidative aging resistance of the cyanate ester resin can be improved, and the characteristics of low dielectric constant and low loss of the cyanate ester resin are maintained. The requirements of the high-temperature-resistant thermo-oxidative-aging-resistant wave-transparent resin-based composite material for the radome are met.

The invention relates to a preparation method of a semiconductor structure and a copper electroplating solution. The semiconductor structure comprises a glass substrate, a barrier layer, a dielectric layer, a buffer layer and a redistribution layer which are sequentially stacked, the barrier layer comprises silicon dioxide, the dielectric layer comprises benzocyclobutene, and the buffer layer comprises at least one of tantalum and titanium tungsten. Benzocyclobutene is used as the dielectric layer, the dielectric constant is low, and the transmission loss of high-frequency signals is small; the silicon dioxide is used as the barrier layer and is arranged between the glass substrate and the dielectric layer, so that the dielectric layer can be prevented from being damaged by chemical substance etching of the glass substrate, and the adhesive force between the glass substrate and the dielectric layer can be enhanced; the buffer layer comprising at least one of tantalum and titanium tungsten is arranged between the dielectric layer and the redistribution layer, so that the adhesive force and the electromigration resistance between the dielectric layer and the redistribution layer can be improved, and the high-frequency signal transmission loss can be reduced; all the layers interact with each other, so that the electrical property and the reliability of the semiconductor structure are relatively good.

The invention relates to the technical field of high-frequency and high-speed substrate resin and packaging materials of microelectronic devices, and particularly discloses hydrocarbon resin of dibenzocyclobutene fluorene and derivatives thereof and a preparation method of the hydrocarbon resin, and the hydrocarbon resin is prepared by mixing 9, 9-disubstituent-9H-fluorene and / or the dibenzocyclobutene fluorene derivatives according to a specific proportion, adding a solvent, and stirring to obtain the hydrocarbon resin of the dibenzocyclobutene fluorene and the derivatives of the dibenzocyclobutene fluorene and the derivatives of the dibenzocyclobutene fluorene. And carrying out a thermocuring reaction to obtain the product. The dibenzocyclobutene fluorene derivative is prepared by carrying out Heck reaction on 9, 9-disubstituent-9H-fluorene and halogenated benzocyclobutene under the catalysis of a base catalyst and a modified palladium catalyst, the prepared hydrocarbon resin has very low dielectric constant and dielectric loss and higher softening point and peel strength, and can better meet market requirements.

Provided herein are composite membranes or hollow fiber membranes comprising norbomyl benzocyclobutene moieties, and methods of separating mixtures of fluids using the same.

The invention belongs to the technical field of gas separation membranes, and relates to a blended gas separation membrane containing benzocyclobutene polyimide and a preparation method of the blended gas separation membrane. The blended composite gas separation membrane comprises benzocyclobutenyl polyimide and polybenzimidazole, wherein the polybenzimidazole contains a Troger base. The blended composite gas separation membrane provided by the invention has excellent gas permeability coefficient and gas selectivity, is easy to process and form and simple in preparation process, and has a wide application prospect in the field of gas separation membranes.

The invention relates to a resin composition and a product thereof, the resin composition at least comprises benzocyclobutene-modified hydrocarbon resin, modified hydrocarbon resin and a nitroxide-containing free radical compound, the benzocyclobutene-modified hydrocarbon resin contains carbon-carbon unsaturated bonds, the modified hydrocarbon resin does not contain unsaturated bonds, the tensile strength is more than 10 MPa, and the nitroxide-containing free radical compound contains nitrogen and oxygen radicals. The nitroxide free radical-containing compound has a # imgabs0 # structure, and X1 in the structure is an oxygen free radical or a hydroxyl group. In the resin composition, the nitroxide free radical-containing compound can promote benzocyclobutene modified hydrocarbon resin and high-tension-strength modified hydrocarbon resin to form a good interpenetrating network structure, the curing reaction speed and the fluidity are optimized, the curing reaction degree and the adhesive filling property are improved, the crosslinking degree is increased, the thermal expansion coefficient is reduced, and then the thermal expansion performance of the resin composition is improved. The Df of the circuit substrate prepared from the resin composition is less than 0.001 under 10GHz, and the circuit substrate has excellent interconnection structure reliability, thermal expansion coefficient and adhesive filling property.

The present invention provides benzocyclobutene resins containing olefinic bonds and preparing methods thereof, which relate to a technical field of high-performance resins. The resin structural formula of the present invention is:wherein R1, R2 and R3 are benzocyclobutenyls or hydrogen atoms, at least one of R1, R2 and R3 is a benzocyclobutenyl; R4, R5 and R6 are alkyls, vinyls or hydrogen atoms and are identical with each other; the preparing method thereof is to prepare the benzocyclobutene resin by reacting unsaturated resins of different molecular weights with halogenated benzocyclobutene through Heck reaction. The conditions for preparing the benzocyclobutene resin are mild and easy to produce, and the resin formed by ring-opening polymerizing and curing through further heating which has high crosslinking density, good heat resistance, good resin smoothness, and extremely low dielectric constant and dielectric loss performance, so it is a good photoelectric material.

The application discloses a kind of surface smooth Tg140 leadless PP bonding sheet and its preparation process, belong to copper-clad plate technical field.The surface smooth Tg140 leadless PP bonding sheet preparation raw material includes: brominated epoxy resin 30-50 parts, bisphenol A type epoxy resin 10-30 parts, multi-block copolymer 5-12 parts, benzocyclobutene resin 10-15 parts, phenolic resin 35-60 parts, composite filler 15-25 parts, thickening agent 0.5-1.5 parts, and paper base material or glass fiber cloth;Multi-block copolymer is ethylene-polybutadiene-glycidyl methacrylate-epoxy resin block copolymer.The application not only can significantly reduce the thermal expansion coefficient of the prepared bonding sheet, while avoiding its use performance reduction, also can keep surface smooth, using the bonding sheet can prepare green environmental protection, heat resistance is strong, high strength, low thermal expansion coefficient high-performance copper-clad plate.