5results about How to "Meet packaging requirements" patented technology

This invention belongs to the field of aluminum wire bonding production technology, specifically relating to an automated drawing system for aluminum wire bonding production. The system includes a wire feeding device, a wire threading and drawing device, an intelligent wire storage device, a wire expansion and drawing device, and a wire take-up device arranged sequentially. The wire threading and drawing device performs initial diameter reduction and surface smoothing of the aluminum wire, and its internal oil supply structure effectively reduces friction damage during drawing. The intelligent wire storage device enables slow storage and release of the aluminum wire and automatic tension adjustment, ensuring that the operation of upstream and downstream processes does not interfere with each other. The wire expansion and drawing device uses a frustum-shaped expansion and drawing cylinder to perform secondary precise drawing and fine-tuning of the aluminum wire. The expansion strength detection component on the cylinder automatically adjusts the detection counterweight and rotational impact angle to perform real-time strength testing of the aluminum wire after drawing. This invention is rationally designed and can complete product quality sampling inspection of bonded aluminum wire without interrupting upstream production, thus improving the production efficiency of bonded aluminum wire.

This invention relates to the field of advanced semiconductor packaging materials technology, and particularly to a low-modulus, high-strength, and low-moisture-absorbing epoxy resin composition and its preparation method. By weight, the epoxy resin composition comprises: 20-60 parts of MAR-type epoxy resin base material one, 15-40 parts of modified masterbatch, 0.01-5 parts of a first catalyst, 30-700 parts of silicon powder, 0-30 parts of additives, and 25-60 parts of curing agent; the modified masterbatch is prepared from: MAR-type epoxy resin base material two, a second catalyst, and HTPB; the curing agent is MAR-type phenolic resin. This invention introduces HTPB into the MAR-type resin system to create a synergistic effect, resulting in a packaging material with low modulus, high strength, and low moisture absorption. The obtained composition can achieve a moisture sensitivity level of MSL1, meeting the high reliability packaging requirements of DFN / QFN and other packaging forms.

The invention relates to the technical field of feed additive preparation, and discloses a fermentation process for preparing an organic chelated calcium feed additive from inorganic calcium by a microbial conversion method, and the process comprises the following steps: mixing and crushing an inorganic calcium source, a carbon and nitrogen source feed and auxiliary materials to prepare a solid fermentation base material; adding activated composite transformed strain inoculation liquid and adjusting the total moisture content; carrying out aerobic fermentation on the material, and carrying out coordination chelation reaction on organic acid, amino acid and small molecule peptide generated by microbial metabolism and dissociated inorganic calcium to convert into water-soluble organic calcium; and after fermentation, drying with low-temperature hot air, and crushing to obtain an organic calcium product. According to the method, a multi-strain synergistic fermentation system is adopted, acid production, substrate enzymolysis and calcium ion chelation are synchronously completed in the same environment, the conversion efficiency of insoluble inorganic calcium is improved, chemical reagent residues are avoided, and the activity of probiotics and biological metabolic enzymes in the system is effectively reserved.

This utility model relates to the field of copper coil packaging technology, specifically a packaging structure for large loose copper coils, including a base plate. The upper surface of the base plate has an installation groove, and a lower protective plate is installed within the installation groove. A base column is located in the center of the upper surface of the installation groove, including a lower base column and an upper base column. Beneficial effects: Stable packaging: By setting up the base plate, base columns, internal support components, and side columns, the large loose copper coils can be fixed and supported in all directions. The lower base column is placed in the center of the bottom cavity of the copper coil. The internal support components can be adjusted according to the size of the inner cavity of the copper coil and maintain close contact with it to achieve internal fixation. The side columns, through a combination of side and middle side columns and crossbar connections, form a stable frame structure, effectively preventing the copper coils from shaking and shifting within the packaging, ensuring the stability of the packaging, and reducing the risk of damage during transportation.

The utility model relates to chip processing equipment technical field, and disclose a kind of chip milling and sealing device, including equipment box, milling and sealing mechanism, support, electric power wiring assembly, console, feeding assembly, discharge assembly constitute, equipment box is as the basis bearing structure of entire device, using solid material quality manufacturing, provide stable installation space for internal milling and sealing mechanism, electric power wiring assembly and other components, simultaneously play the protection effect to internal component, barrier external dust, impurity, guarantee equipment stable operation.The utility model is through the integration milling, packaging function, through orderly cooperation of each component, realize the coherent processing of chip from raw material to packaged product, reduce process circulation time consumption, improve overall processing efficiency, adapt to various needs, milling assembly adjustable cutter adapts different chip milling;Packaging component supports heat sealing, cold sealing switching, satisfies various chip packaging requirements, the buffer structure of feeding, discharge adapts continuous production, improves equipment versatility and flexibility.