20results about How to "Meet packaging requirements" patented technology

The invention relates to the technical field of liquid silicone rubber, in particular to high-refractive-index low-haze addition type liquid silicone rubber and a preparation method thereof, and the high-refractive-index low-haze addition type liquid silicone rubber is prepared from vinyl silicone oil, a catalyst, an inhibitor, a cross-linking agent, hydrophobic white carbon black, a white carbon black surface treating agent and the like. According to the method, by regulating and controlling the surface state of the white carbon black and the refractive index of the silicone oil, the addition type liquid silicone rubber with high refractive index, high light transmittance and low haze at the same time is realized, and the addition type liquid silicone rubber is good in mechanical property and fluidity, can adapt to continuous extrusion production, and is suitable for large-scale production. After vulcanization, the Shore A hardness is 50-53, the light transmittance is 94% or above, the haze is lower than 3%, the refractive index reaches 1.54 or above, and the polyurethane resin can be applied to the fields of optical devices, LED packaging and the like.

The invention relates to a high-temperature-resistant high-thermal-conductivity single-component epoxy pouring sealant and a preparation method thereof, and the high-temperature-resistant high-thermal-conductivity single-component epoxy pouring sealant comprises the following components: 1-10 parts of modified high-temperature-resistant epoxy resin, 0.5-5 parts of modified core-shell epoxy resin, 90-98 parts of thermal conductive powder, 0.5-5 parts of a phenyl-containing diluent, 10-50 parts of a dicyandiamide curing agent, 0.1-1 part of a powder dispersant and 0.1-2 parts of an accelerant. The modified high-temperature-resistant epoxy resin is obtained by grafting phenolic resin to epoxy resin. And dispersing the organic silicon core-shell nanoparticles in epoxy resin to obtain the modified core-shell epoxy resin. When the epoxy pouring sealant is prepared, a small amount of modified resin is added, and the dicyandiamide curing agent, the phenyl-containing diluent and different types of heat-conducting powder are matched, so that the heat stability of the epoxy pouring sealant can be remarkably improved.

The invention provides a cone yarn contact pressure control system and method.The cone yarn contact pressure control system comprises a complete machine head, a cone machine compressed air channel, a cone machine single spindle and a control system, the cone machine single spindle comprises a groove drum, a groove drum transmission mechanism and a cone yarn pressurization mechanism, and the cone yarn pressurization mechanism comprises a cone yarn cradle, a balance air cylinder, a tension spring and a cone yarn cradle swing assembly; the device is characterized in that a compressed air channel of the winding machine comprises a low-balance air pressure air channel and a high-balance air pressure air channel, an electromagnetic valve arranged on each balance air cylinder comprises two air inlets and an air outlet, and the two air inlets are respectively communicated with the low-balance air pressure air channel and the high-balance air pressure air channel through connecting pipelines. The air outlet is communicated with an air inlet of the balance cylinder. The electromagnetic valve is controlled by a control system and used for periodically and alternately inputting balanced air pressure gas or high-balanced air pressure gas into the balanced air cylinder when the cone yarn is wound in an overlapping area, variable accurate control over the cone yarn contact pressure is achieved, and the cone yarn anti-overlapping effect and the cone yarn quality are improved.

The present invention proposes a method for manufacturing a PCB with a stepped groove, comprising the following steps: S1: manufacturing a blank plate to be milled; S2: etching the first conductive layer in the inner layer; S3: using a depth-controlled milling machine to install a preset parameter milling groove according to the distance from the sensing base plate; S4: manufacturing a conductive stepped groove. The present invention uses the sensing base plate and the sensing component to accurately adjust the depth of the milling cutter by measuring the distance from the sensing base plate, thereby achieving accurate control of the thickness between the dielectric layer and the second conductive layer, and can form stepped grooves of various sizes at one time to meet the packaging requirements during special shapes.

The invention discloses a preparation method of a solvent-corrosion-resistant and high-heat-sealing-strength packaging coating film. The preparation method comprises the following steps: S1, preparing a modified polyvinylidene chloride emulsion; the modified polyvinylidene chloride emulsion is prepared by mixing the following raw materials in parts by weight: 80-89 parts of copolymerized vinylidene chloride emulsion with the medium polymerization degree solid content of 40%-50%, 10 parts of distilled water and 1-10 parts of accelerant, and reacting at preset temperature and pressure; s2, preparing an inorganic nano silicon dioxide solution, wherein the inorganic nano silicon dioxide solution is prepared by mixing 1-10 parts by weight of inorganic nano silicon dioxide, 87-98.9 parts by weight of distilled water and 0.1-3 parts by weight of an emulsifier. The preparation method of the solvent-corrosion-resistant high-heat-sealing-strength packaging coating film provided by the invention overcomes the defects that the coating of the coating film is corroded and damaged by a solvent or an aromatic, the peeling strength of the coating of the coating film is low, the coating film is adhered in the processing process, and an additive is separated out.

This invention belongs to the field of aluminum wire bonding production technology, specifically relating to an automated drawing system for aluminum wire bonding production. The system includes a wire feeding device, a wire threading and drawing device, an intelligent wire storage device, a wire expansion and drawing device, and a wire take-up device arranged sequentially. The wire threading and drawing device performs initial diameter reduction and surface smoothing of the aluminum wire, and its internal oil supply structure effectively reduces friction damage during drawing. The intelligent wire storage device enables slow storage and release of the aluminum wire and automatic tension adjustment, ensuring that the operation of upstream and downstream processes does not interfere with each other. The wire expansion and drawing device uses a frustum-shaped expansion and drawing cylinder to perform secondary precise drawing and fine-tuning of the aluminum wire. The expansion strength detection component on the cylinder automatically adjusts the detection counterweight and rotational impact angle to perform real-time strength testing of the aluminum wire after drawing. This invention is rationally designed and can complete product quality sampling inspection of bonded aluminum wire without interrupting upstream production, thus improving the production efficiency of bonded aluminum wire.

The invention discloses a cleaning and silicification-free production process for a butyl rubber plug. The cleaning and silicification-free production process comprises the following steps: S01, spraying a release agent on a mold closing surface of a vulcanization mold of the butyl rubber plug; s02, placing the calendered rubber sheet in a vulcanization mold, and closing the mold for vulcanization; s03, taking out the rubber plug molding connecting sheet from the vulcanization mold, spreading, atomizing and spraying a curing liquid to the rubber plug molding connecting sheet, and curing to form a film; s04, rubber plug forming connecting pieces are cut, and butyl rubber plugs are cleaned and dried; the release agent is mainly composed of hydroxyl-terminated polydimethylsiloxane, a wetting agent and a first solvent. The curing liquid mainly comprises an end-capping reagent, a catalyst and a second solvent; the end-capping reagent is hydroxyl silicone oil with the viscosity of 45-100 cSt at the temperature of 20 DEG C, and the catalyst is an acid catalyst. Hydroxyl-terminated polydimethylsiloxane is introduced into the surface of the rubber plug through vulcanization, a catalyst and an end-capping reagent are atomized and sprayed, and waste heat of a vulcanized rubber sheet is used for thermocuring and film forming, so that the production steps of the rubber plug are simplified, and the production efficiency of the rubber plug is improved.

The present invention relates to a silicon dioxide filler for chip-level bottom filling glue and a preparation method and application thereof. The preparation method comprises the following steps: mixing a cosolvent solution with a silicon source compound to obtain a solution A; mixing a catalyst aqueous solution with the obtained solution A to obtain a suspension; solid-liquid separation of the obtained suspension, drying to obtain a powder A; calcining the obtained powder A to obtain the chip-level SiO2 filler. The chip-level silicon dioxide filler prepared by the preparation method of the present invention has high purity, high sphericity, low impurity ion content, and a particle size distribution that meets the requirements of flip chip packaging. In addition, by regulating the ratio of the cosolvent, the catalyst and the silicon source compound, the average particle size and the cut-off point of the prepared silicon dioxide can be controlled, without the need for subsequent classification, screening and grading process operations.

This invention relates to the field of advanced semiconductor packaging materials technology, and particularly to a low-modulus, high-strength, and low-moisture-absorbing epoxy resin composition and its preparation method. By weight, the epoxy resin composition comprises: 20-60 parts of MAR-type epoxy resin base material one, 15-40 parts of modified masterbatch, 0.01-5 parts of a first catalyst, 30-700 parts of silicon powder, 0-30 parts of additives, and 25-60 parts of curing agent; the modified masterbatch is prepared from: MAR-type epoxy resin base material two, a second catalyst, and HTPB; the curing agent is MAR-type phenolic resin. This invention introduces HTPB into the MAR-type resin system to create a synergistic effect, resulting in a packaging material with low modulus, high strength, and low moisture absorption. The obtained composition can achieve a moisture sensitivity level of MSL1, meeting the high reliability packaging requirements of DFN / QFN and other packaging forms.

The invention discloses silicate glass powder for passivating and packaging a semiconductor. The silicate glass powder is prepared from the following components in parts by weight: 40 to 60 parts of silicon dioxide, 5 to 20 parts of aluminum oxide, 20 to 30 parts of lead oxide, 10 to 25 parts of lanthanum oxide, 5 to 15 parts of barium oxide, 10 to 20 parts of silicon nitride, 10 to 20 parts of titanium dioxide and 5 to 15 parts of poly-p-phenylene terephthamide. The heat resistance and mechanical properties of the glass powder are improved, and the comprehensive properties of the glass powder are improved.

The invention discloses organic silicon gel for packaging a high-power IGBT (Insulated Gate Bipolar Translator) for preventing erosion of hydrogen sulfide gas as well as a preparation method and application of the organic silicon gel, and relates to the field of organic silicon gel. The component M comprises polysiloxane with silicon-vinyl structures at two ends, polysiloxane with a silicon-vinyl structure at a single end, polyhydrosiloxane with silicon-hydrogen structures at two ends, polyhydrosiloxane with a silicon-hydrogen structure on a side chain, a functional filler, an antioxidant and an inhibitor; the component N comprises polysiloxane with silicon vinyl structures at two ends, polysiloxane with a silicon vinyl structure at a single end, a functional filler, an antioxidant and a catalyst. According to the material, silicon-vinyl-containing polydimethylsiloxane with different structures and polydimethylhydrosiloxane with different structures are compounded with a functional filler and the like, so that the protection problem of a high-power IGBT (Insulated Gate Bipolar Translator) module in environments with H2S gas, high humidity and the like can be met, and the long-term safe operation of the module is ensured.

The invention relates to the technical field of feed additive preparation, and discloses a fermentation process for preparing an organic chelated calcium feed additive from inorganic calcium by a microbial conversion method, and the process comprises the following steps: mixing and crushing an inorganic calcium source, a carbon and nitrogen source feed and auxiliary materials to prepare a solid fermentation base material; adding activated composite transformed strain inoculation liquid and adjusting the total moisture content; carrying out aerobic fermentation on the material, and carrying out coordination chelation reaction on organic acid, amino acid and small molecule peptide generated by microbial metabolism and dissociated inorganic calcium to convert into water-soluble organic calcium; and after fermentation, drying with low-temperature hot air, and crushing to obtain an organic calcium product. According to the method, a multi-strain synergistic fermentation system is adopted, acid production, substrate enzymolysis and calcium ion chelation are synchronously completed in the same environment, the conversion efficiency of insoluble inorganic calcium is improved, chemical reagent residues are avoided, and the activity of probiotics and biological metabolic enzymes in the system is effectively reserved.

The utility model belongs to the field of implantable medical treatment, and particularly relates to a controller and an implantable nerve collection stimulator. According to the controller, the shell is divided into the metal shell and the ceramic shell according to the packaging characteristic of the shell material, the metal connecting layer is arranged on the ceramic shell in advance before the component is installed, the metal connecting layer is connected with the metal shell to realize integral packaging, the brazing process of ceramic and ceramic packaging is avoided after the component is installed, and the cost is reduced. The influence of a brazing process on internal components of the packaging body is effectively avoided, and the packaging requirement between a metal shell and a ceramic shell is met.

The lithium ion battery composite packaging film sequentially comprises a composite metal foil layer and a thermoplastic resin layer from outside to inside, and the composite metal foil layer comprises a reinforced metal layer and a corrosion-resistant metal layer. The corrosion-resistant metal layers are arranged on the two sides of the reinforcing metal layer, or the corrosion-resistant metal layers are arranged on the side, facing the thermoplastic resin layer, of the reinforcing metal layer. The composite packaging film for the lithium ion battery has the characteristics of low thickness and light weight, and gives consideration to both mechanical strength and ductility.

This utility model relates to the field of copper coil packaging technology, specifically a packaging structure for large loose copper coils, including a base plate. The upper surface of the base plate has an installation groove, and a lower protective plate is installed within the installation groove. A base column is located in the center of the upper surface of the installation groove, including a lower base column and an upper base column. Beneficial effects: Stable packaging: By setting up the base plate, base columns, internal support components, and side columns, the large loose copper coils can be fixed and supported in all directions. The lower base column is placed in the center of the bottom cavity of the copper coil. The internal support components can be adjusted according to the size of the inner cavity of the copper coil and maintain close contact with it to achieve internal fixation. The side columns, through a combination of side and middle side columns and crossbar connections, form a stable frame structure, effectively preventing the copper coils from shaking and shifting within the packaging, ensuring the stability of the packaging, and reducing the risk of damage during transportation.

The utility model discloses a flip chip and lead bonding chip integrated windowing ball grid array packaging structure, which relates to the technical field of semiconductor packaging and comprises a substrate, a flip chip body and a main control chip. A windowing through groove is formed in the middle of the base plate, and the base plate is separated by the windowing through groove; the number of the flip chip bodies is two, and the two flip chip bodies are respectively connected and fixed on the top surface of the substrate at the two sides of the windowing through groove. The main control chip is connected and fixed above the two flip chip bodies, and the main control chip is electrically connected with the substrates on the two sides of the windowing through groove through bonding wires; according to the scheme, three chip packaging interconnection technologies including the lead bonding technology, the flip chip technology and the windowing ball grid array packaging are combined, the flash memory capacity is improved, meanwhile, the main control chip is packaged in one structure, the cost is reduced, meanwhile, competition opponent effect simulation can be avoided, and the flash memory capacity is improved. And the packaging requirements of confidential chips can be met.

The present invention belongs to the technical field of packaging insulating materials for high-power semiconductor devices, and discloses a phenyl silicone elastomer for packaging high-power semiconductor devices and a preparation method thereof; the preparation method is: in a protective gas atmosphere, in toluene, octamethylcyclotetrasiloxane and octaphenylcyclotetrasiloxane are used as raw materials and polymerized under the catalysis of tetramethylammonium hydroxide to obtain methylphenyl polysiloxane; the copolymerization product of dimethyl-terminated vinyl silicone oil and methylphenyl polysiloxane is mixed with an inhibitor, methylphenyl side chain hydrogen-containing silicone oil and methylphenyl end hydrogen-containing silicone oil, and then cross-linked under the catalysis of a platinum catalyst to form a phenyl silicone elastomer for packaging high-power semiconductor devices. The phenyl silicone elastomer prepared by the present invention has a breakdown voltage of up to 66kv / mm under a DC electric field, a maximum withstand voltage of up to 71kv / mm, a temperature resistance of up to 250°C, can work in a 200°C environment for a long time, and can meet the packaging requirements of new high-power semiconductor devices.

The utility model discloses a honeycomb paperboard packaging box which comprises a box body, the five faces of the box body are closed, an opening is formed in the side face of one side of the box body, and the face of the opening side of the box body is closed through a side cover plate at the opening position of the side face. The side plates, the top plate and the side cover plates of the box body all take honeycomb paperboards as base plates, the outer edge of the base plate corresponding to the opening side of the box body is wrapped with a reinforcing clamping strip, and the reinforcing clamping strip is an annular metal clamping strip matched with the opening; a bottom plate of the box body is a combined plate body, the combined plate body comprises a bottom plate and a bottom plate panel, the bottom plate is a high-density plastic plate or a hot-pressed paperboard which is integrally formed, the bottom plate panel is a honeycomb paperboard and is formed on the surface of a bottom plate base plate, a plurality of hole sites are formed in the bottom plate panel, and guide wheels are fixedly embedded in the hole sites. The packaging box is stable in forming and high in compressive strength, facilitates packaging of medium-sized and large-sized articles, and is easy to load and take out the articles.

The utility model discloses an all-solid-state film lithium battery which comprises an anode current collector layer, an anode tab connected with the anode current collector layer and a composite module arranged on the anode current collector layer, wherein the composite module comprises a negative electrode tab, an insulation barrier layer, and a positive electrode layer, a solid electrolyte layer, a negative electrode layer and a packaging protection film coating layer which are stacked in sequence, the positive electrode layer and the insulation barrier layer are arranged on the positive electrode current collector layer, the insulation barrier layer is arranged on one side of the positive electrode layer, and the packaging protection film coating layer is arranged on the other side of the solid electrolyte layer. The solid electrolyte layer covers the positive electrode layer and the insulating barrier layer, the negative electrode layer is arranged on the solid electrolyte layer, and the packaging protective coating layer covers the outer sides of the negative electrode layer and the solid electrolyte layer. According to the utility model, the packaging protection coating layer is used for packaging, so that the thickness of the packaging layer can be reduced, the integration level of the battery is improved, and the packaging protection coating layer is high in fitting tightness, so that the packaging requirement can be met.

The utility model relates to chip processing equipment technical field, and disclose a kind of chip milling and sealing device, including equipment box, milling and sealing mechanism, support, electric power wiring assembly, console, feeding assembly, discharge assembly constitute, equipment box is as the basis bearing structure of entire device, using solid material quality manufacturing, provide stable installation space for internal milling and sealing mechanism, electric power wiring assembly and other components, simultaneously play the protection effect to internal component, barrier external dust, impurity, guarantee equipment stable operation.The utility model is through the integration milling, packaging function, through orderly cooperation of each component, realize the coherent processing of chip from raw material to packaged product, reduce process circulation time consumption, improve overall processing efficiency, adapt to various needs, milling assembly adjustable cutter adapts different chip milling;Packaging component supports heat sealing, cold sealing switching, satisfies various chip packaging requirements, the buffer structure of feeding, discharge adapts continuous production, improves equipment versatility and flexibility.