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Method for preparing high-plasticity welding wire by use of brittle Sn-Bi alloy

A high plasticity, tin-bismuth technology, applied in welding/cutting media/materials, welding media, welding equipment, etc., can solve problems such as inability to alloy and optimize performance, corrosion, cracking electrochemistry, etc. Simple process and uniform composition

Active Publication Date: 2012-07-04
浙江亚通新材料股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The alloy solder wire prepared by this method is a combination of the physical shape of the two component alloys. The melting point of the core paste alloy is different from the melting point of the outer layer of pure tin or tin alloy components. It cannot be alloyed and optimized by welding and melting. Solder joints or welds are still two kinds of materials with different properties, which are prone to a series of problems such as cracking and electrochemical corrosion

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] Embodiment 1: Preparation of tin-bismuth welding wire with a diameter of 0.5mm

[0026] The tin-bismuth alloy ingot whose composition is Sn-30Bi (wt.%) prepared by refining is processed into an extruded ingot with a diameter of 50 mm and a height of 100 mm according to the requirements of an equal-diameter corner extrusion die, and is processed by a muffle furnace Heating and heat preservation at 60°C, while controlling the temperature of the circulating water in the temperature-controllable circulating water device at 60°C, preheating the equal-diameter corner extrusion die, and then putting the equal-diameter corner extrusion billet after heating and heat preservation into the The extrusion billet was prepared by equal-diameter angular extrusion in the radial-rotary extrusion die. The speed of equal-diameter angular extrusion was controlled at 10min / pass, the pressure was controlled at 200MPa-250MPa, and the extrusion pass was 1 time. The extruded billet prepared by e...

Embodiment 2

[0027] Embodiment 2: Preparation of tin-bismuth welding wire with a diameter of 0.8mm

[0028] The tin-bismuth alloy ingot whose composition is Sn-58Bi (wt.%) prepared by refining is processed into an extruded ingot with a diameter of 60 mm and a height of 60 mm according to the requirements of an equal-diameter corner extrusion die, and is processed by a muffle furnace Heating and heat preservation at 75°C, while controlling the temperature of the constant temperature circulating water at 75°C, and preheating the equal-diameter corner extrusion die, and then putting the equal-diameter corner extrusion billet after heating and heat preservation into the equal-diameter corner extrusion die Equal-diameter angular extrusion is carried out inside, the speed of equal-diameter angular extrusion is controlled at 30min / pass, the pressure is controlled at 200MPa-250MPa, and the extrusion pass is 2 times. Extrude with an extruder, the pressure is controlled at 150MPa-180MPa, and a drawn...

Embodiment 3

[0029] Embodiment 3: Preparation of tin-bismuth welding wire with a diameter of 1.2mm

[0030] The tin-bismuth alloy ingot whose composition is Sn-70Bi (wt.%) prepared by refining is processed into an extruded ingot with a diameter of 40 mm and a height of 60 mm according to the requirements of an equal-diameter corner extrusion die, and is processed by a muffle furnace Heating and heat preservation at 85°C, and then putting it into the equal-diameter angular extrusion mold, controlling the temperature of the constant temperature circulating water at 85°C, and preheating the equal-diameter angular extrusion mold, and then putting the equal-diameter angular extrusion after heating and heat preservation The pressed billet is put into the equal-diameter angular extrusion die for equal-diameter angular extrusion. The equal-diameter angular extrusion speed is controlled at 60min / pass, the pressure is controlled at 250MPa-300MPa, and the extrusion pass is 3 times. Extrude with an ex...

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Abstract

The invention discloses a method for preparing high-plasticity welding wire by use of brittle Sn-Bi alloy. The method is characterized in that the method comprises processing a Sn-Bi alloy ingot into an equal channel angular extrusion billet, preheating and keeping the temperature; subjecting the equal channel angular extrusion billet to isothermal extrusion in an equal channel angular extrusion mold to prepare an extrusion blank; extruding to obtain a drawing blank meeting the requirement for drawing formation; conducting isothermal drawing by use of a water-cooled temperature-control wire drawing machine to obtain the Sn-Bi welding wire; and coiling and packaging. The method can prepare all specifications of high-strength and high-plasticity continuous welding wires having a diameter less than 1.5mm from the high-brittleness Sn-Bi alloy that is difficult to deform and process. The prepared wire has fine grains, uniform components and, excellent welding performance, and can meet the various requirements for packaging and welding packaging. The method has the advantages of simple process and high operability, and is an ideal method for preparing Sn-Bi alloy welding wire.

Description

technical field [0001] The invention relates to a method for preparing lead-free welding materials, in particular to a method for preparing high-plasticity welding wire materials by using brittle tin-bismuth alloys. Background technique [0002] The electronics industry requires lead-free packaging. At present, lead-free solders such as tin-silver-copper, tin-copper or tin-antimony are mainly used. However, the melting point of lead-free solder is 20°C to 60°C higher than that of traditional tin-lead solder, and the packaging temperature is as high as about 250°C. High assembly temperature will affect the reliability of electronic components, bring inconvenience to the operation of electronic packaging equipment, high energy consumption, and do not meet the requirements of energy saving and emission reduction. Tin-bismuth alloy solder has a low melting point (the lowest is only 139°C), and is comparable to the elastic modulus of traditional tin-lead solder in a wide tempera...

Claims

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Application Information

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IPC IPC(8): B23K35/40B21C23/08B21C1/02
Inventor 龙郑易顾小龙刘祖铭杨倡进潘洪亮
Owner 浙江亚通新材料股份有限公司
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