The core comprises a pressure-sensitive
chip, sintered glass is arranged on the back face of the pressure-sensitive
chip, a groove is formed in the side, close to the pressure-sensitive
chip, of the pressure-sensitive chip, a pressure cavity is formed through the groove, a plurality of through holes are formed in the sintered glass,
metal columns are arranged in the through holes,
metal seed
layers are arranged on the peripheries of the
metal columns, and the metal seed
layers are arranged on the periphery of the pressure-sensitive chip.
Metal contact is formed between the metal seed layer and the pressure-sensitive chip, and the other end of the metal seed layer is connected with a metal bump. The preparation process comprises the following steps: bonding to form the pressure cavity, preparing the metal seed layer and the metal column in the through hole, and preparing the metal ball to form the metal bump. The lead-free packaging pressure-sensitive core has the characteristics of high reliability, high
temperature resistance, short
interconnection, high
temperature resistance and high response rate, can effectively improve the
working temperature and response rate of the sensor, can meet the requirement scene of high temperature and high reliability, and can expand the application range of the piezoresistive
pressure sensor.