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836 results about "Strontium titanate" patented technology

Strontium titanate is an oxide of strontium and titanium with the chemical formula SrTiO₃. At room temperature, it is a centrosymmetric paraelectric material with a perovskite structure. At low temperatures it approaches a ferroelectric phase transition with a very large dielectric constant ~10⁴ but remains paraelectric down to the lowest temperatures measured as a result of quantum fluctuations, making it a quantum paraelectric. It was long thought to be a wholly artificial material, until 1982 when its natural counterpart—discovered in Siberia and named tausonite—was recognised by the IMA. Tausonite remains an extremely rare mineral in nature, occurring as very tiny crystals. Its most important application has been in its synthesized form wherein it is occasionally encountered as a diamond simulant, in precision optics, in varistors, and in advanced ceramics.

Method of patterning lead zirconium titanate and barium strontium titanate

In an embodiment of the present invention, a method is provided of patterning PZT layers or BST layers. For example, a PZT layer or a BST layer is plasma etched through a high-temperature-compatible mask such as a titanium nitride (TiN) mask, using a plasma feed gas comprising as a primary etchant boron trichloride (BCl3) or silicon tetrachloride (SiCi4). Although BCl3 or SiCl4 may be used alone as the etchant plasma source gas, it is typically used in combination with an essentially inert gas. Preferably the essentially inert gas is argon. Other potential essentially inert gases which may be used include xenon, krypton, and helium. In some instances O2 or N2, or Cl2, or a combination thereof may be added to the primary etchant to increase the etch rate of PZT or BST relative to adjacent materials, such as the high-temperature-compatible masking material. A TiN masking material can easily be removed without damaging underlying oxides. The selectivity of PZT or BST relative to TiN is very good, with the ratio of the etch rate of the PZT film to the etch rate of the TiN mask typically being better than 20:1. In addition, the etch rate for PZT using a BCl3-comprising plasma source gas is typically in excess of 2,000 Å per minute. A substrate bias power is applied to direct ions produced from the BCl3 or SiCl4 toward the surface to be etched. The bias power is controlled to avoid sputtering of a conductive layer or layers in contact with the PZT layer, so that the surface of the etched PZT is not contaminated by a conductive material, which can cause the semiconductor device which includes the patterned PZT to short out.
Owner:APPLIED MATERIALS INC

La doped SrTiO3 base oxide pyroelectric material and preparation method

A La-doped strontium titanate (SrTiO3)-based oxide thermoelectric material and a preparation method thereof, belonging to the technical field of energy materials. The method is divided into two parts of powder synthesis and forming of bulk materials. The powder synthesis adopts the sol-gel method, takes tetrabutyl titanate, strontium nitrate and lanthanum nitrate as raw materials, takes deionized water and ethanol as solvents and takes acetic acid and glycerol as a catalyst and a chelating agent to prepare SrTiO3 gel with different La doping amount, and the temperature is kept at the temperature of 500-560 DEG C for 1-2 hours to obtain precursor powder. The bulk forming adopts the spark plasma sintering method, and the sintering conditions are as follows: the vacuum degree is 2-10Pa, the pressure is 40-50MPa, the heating rate is 100 DEG C/min, the sintering temperature is 900-1000 DEG C, and the holding time is 5-10min. The method synthesizes the La-doped SrTiO3-based bulk thermoelectric material with high chemical homogeneity, uniform and fine grains and single-phase perovskite structure under the conditions of lower reaction temperature and shorter reaction time. The preparation method has the advantages of simple and convenient process, short synthesis and forming time, and the like.
Owner:UNIV OF SCI & TECH BEIJING

Preparation method of rare earth nickel-based oxide polycrystalline film material

The invention discloses a preparation method of a rare earth nickel-based oxide polycrystalline film material, and belongs to the field of inorganic nonmetal film materials. The preparation method comprises the steps that an oxide material buffer layer with lattice parameters similar with that of a rare earth nickel-based perovskite oxide material grows on the surface of a substrate material; and a rare earth nickel-based perovskite oxide film is further deposited on the surface of the buffer layer through a vacuum deposition method. The crystal structure of the rare earth nickel-based perovskite oxide material is the perovskite structure ReNiO3 of ABO3, and the Re position is one rare earth element or the combination of various rare earth elements. The materials of the buffer layer preferentially comprise strontium rubidium oxygen, strontium titanate, lanthanum doped strontium titanate, neodymium doped strontium titanate, barium titanate and calcium titanate. The preparation method of the rare earth nickel-based oxide polycrystalline film material is easy, convenient and efficient. The prepared film material has excellent temperature dependent and hydrogen-induced performance and can be further applied in the fields of functional electronic devices, fuel cells, infrared detectors and the like.
Owner:UNIV OF SCI & TECH BEIJING
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