The application relates to the technical field of piezoelectric materials, in particular to a
lead zirconate titanate film and a low-temperature preparation method and application thereof, the preparation method comprising the following steps: Ti
metal is taken as a
radio frequency target material to perform first
sputter deposition treatment on a substrate to form a Ti adhesion layer; a bottom
electrode is formed on the Ti adhesion layer; Pb x Zr 0.52 Ti 0.48 O3
ceramic is taken as a
radio frequency target material to perform second
sputter deposition treatment on the bottom
electrode, rapid heat treatment is performed, a PZT seed layer is formed; Pb x Zr 0.52 Ti 0.48 O3
ceramic is taken as a
radio frequency target material to perform third
sputter deposition treatment on the PZT seed layer, rapid heat treatment is performed, the step is repeated, and a
lead zirconate titanate film is formed. In the process of sputter deposition of the PZT
film material, the substrate tray is not additionally heated, the loss and volatilization of PbO are reduced, the film component stability can be effectively maintained; more
crystal nuclei are provided by the PZT seed layer, the uniform
crystallization of the PZT film is promoted, the
crystallization quality and electrical properties of the PZT film are improved, the
crystal boundary defects are reduced, and the adhesion and stability of the film and the substrate are enhanced.