Glass-ceramic composition, glass-ceramic sintered body, and monolithic ceramic electronic component

Abstract

A glass-ceramic composition contains first ceramic particles principally containing forsterite; second ceramic particles principally containing at least one selected from the group consisting of calcium titanate, strontium titanate, and titanium oxide; and borosilicate glass particles containing about 3% to 15% lithium oxide, about 20% to 50% magnesium oxide, about 15% to 30% boron oxide, about 10% to 45% silicon oxide, about 6% to 20% zinc oxide, 0% to about 15% aluminum oxide, and at least one additive selected from the group consisting of calcium oxide, barium oxide, and strontium oxide on a weight basis. The content of the borosilicate glass particles is about 3% or more; the lower limit of the content of the additive is about 2%; and the upper limit of the additive content is about 15%, about 25%, or about 25% when the additive is calcium oxide, barium oxide, or strontium oxide, respectively, on a weight basis.

Description

[0001] This is a continuation-in-part of application Serial No. PCT / JP05 / 001463, deposited on Feb. 15, 2006.BACKGROUND OF THE INVENTION [0002] 1. Field of the Invention [0003] The present invention relates to a glass-ceramic composition containing a glass component sinterable at low temperature, a glass-ceramic sintered body prepared by firing the glass-ceramic composition, and a monolithic ceramic electronic component including the glass-ceramic sintered body. [0004] 2. Description of the Related Art [0005] In recent years, multifunctional electronic components have been used in order to manufacture compact electronic devices. Examples of such multifunctional electronic components include multilayer ceramic modules. [0006] The multilayer ceramic modules each include a multilayer ceramic substrate. The multilayer ceramic substrate includes wiring conductors, arranged therein, for electrical connection and / or for forming passive elements such as capacitors and inductors. The multilay...

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Benefits of technology

[0018] Accordingly, it is an object of the present invention to provide a glass-ceramic composition having electrical insulation reliability better than those of that glass-ceramic composition disclosed in Patent Document 1.

[0030] The glass-ceramic sintered body contains the Mg2SiO4 grains originating from the first ceramic particles and Mg—Si—B—Zn—Li glass grains. Present in the Mg—Si—B—Zn—Li glass grains are Li2(Mg, Zn) SiO4 grains. When the second ceramic particles contain TiO2, the glass-ceramic sintered body further contains MgTiO3 grains and / or MgTi2O5 grains. The MgTi2O5 grains, which are crystal grains with an AB2O5 formula, probably cause a decrease in insulation reliability. When the borosilicate glass particles contain at least one of calcium oxide, barium oxide, and strontium oxide, at least one of them reacts with TiO2 to produce CaTiO3, BaTiO3, or SrTiO3, which are crystal grains with an ABO3 formula. This prevents the formation of such crystal grains with an AB2O5 formula. That is, CaTiO3 grains, BaTiO3 grains, or SrTiO3 grains are formed prior to the formation of the MgTi2O5 grains. This prevents the decrease in insulation reliability.

[0032] In the glass-ceramic composition, the content of the borosilicate glass particles is small, about 20% by weight or less. Since the borosilicate glass particles are expensive, the reduction of the content of the borosilicate glass particles is advantageous in reducing manufacturing cost. Furthermore, the reduction of the content of the borosilicate glass particles allows the reaction of the borosilicate glass particles with the second ceramic particles to be readily controlled; hence, the temperature coefficient of the resonant frequency of the glass-ceramic sintered body can be readily controlled using the additive. The reduction of the content of the borosilicate glass particles leads to an increase in the plating resistance of the glass-ceramic sintered body and an increase in the production of the monolithic ceramic electronic component.

Problems solved by technology

However, such a metal has a low melting point.

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