Glass-ceramic composition, glass-ceramic sintered body, and monolithic ceramic electronic component

a technology of glass-ceramic and electronic components, applied in the direction of printed circuits, electrical devices, natural mineral layered products, etc., can solve the problem of low melting point of metal, and achieve the effect of reducing manufacturing costs, easy control, and easy control

a technology of glass-ceramic and electronic components, applied in the direction of printed circuits, electrical devices, natural mineral layered products, etc., can solve the problem of low melting point of metal, and achieve the effect of reducing manufacturing costs, easy control, and easy control

US20060287184A1Inactive Publication Date: 2006-12-21MURATA MFG CO LTD
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  • Glass-ceramic composition, glass-ceramic sintered body, and monolithic ceramic electronic component
  • Glass-ceramic composition, glass-ceramic sintered body, and monolithic ceramic electronic component
  • Glass-ceramic composition, glass-ceramic sintered body, and monolithic ceramic electronic component

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Embodiment Construction

[0042] A glass-ceramic composition according to an embodiment of the present invention contains first ceramic particles principally containing forsterite (Mg2SiO4); second ceramic particles principally containing at least one selected from the group consisting of calcium titanate (CaTiO3), strontium titanate (SrTiO3), and titanium oxide (TiO2); and borosilicate glass particles. The composition of the borosilicate glass particles is particularly notable.

[0043] The borosilicate glass particles preferably contain about 3% to 15% lithium oxide (Li2O), about 20% to 50% magnesium oxide (MgO), about 15% to 30% boron oxide (B2O3), about 10% to 45% silicon oxide (SiO2), about 6% to 20% zinc oxide (ZnO), and 0% to about 15% aluminum oxide (Al2O3) on a weight basis. Since the composition of the borosilicate glass particles is suitable for forming Li2(Mg, Zn)SiO4 grains, there is an advantage in that a sintered body made of the glass-ceramic composition has a high Q value and high reliability ...

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Abstract

A glass-ceramic composition contains first ceramic particles principally containing forsterite; second ceramic particles principally containing at least one selected from the group consisting of calcium titanate, strontium titanate, and titanium oxide; and borosilicate glass particles containing about 3% to 15% lithium oxide, about 20% to 50% magnesium oxide, about 15% to 30% boron oxide, about 10% to 45% silicon oxide, about 6% to 20% zinc oxide, 0% to about 15% aluminum oxide, and at least one additive selected from the group consisting of calcium oxide, barium oxide, and strontium oxide on a weight basis. The content of the borosilicate glass particles is about 3% or more; the lower limit of the content of the additive is about 2%; and the upper limit of the additive content is about 15%, about 25%, or about 25% when the additive is calcium oxide, barium oxide, or strontium oxide, respectively, on a weight basis.

Description

[0001] This is a continuation-in-part of application Serial No. PCT / JP05 / 001463, deposited on Feb. 15, 2006.BACKGROUND OF THE INVENTION [0002] 1. Field of the Invention [0003] The present invention relates to a glass-ceramic composition containing a glass component sinterable at low temperature, a glass-ceramic sintered body prepared by firing the glass-ceramic composition, and a monolithic ceramic electronic component including the glass-ceramic sintered body. [0004] 2. Description of the Related Art [0005] In recent years, multifunctional electronic components have been used in order to manufacture compact electronic devices. Examples of such multifunctional electronic components include multilayer ceramic modules. [0006] The multilayer ceramic modules each include a multilayer ceramic substrate. The multilayer ceramic substrate includes wiring conductors, arranged therein, for electrical connection and / or for forming passive elements such as capacitors and inductors. The multilay...

Claims

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Application Information

Patent Timeline
21 Dec 2006
Publication
US20060287184A1
IPC
C03C10/04; C03C14/00
CPC
C03C3/066; Y10T428/24926; C04B35/20; C04B2235/3203; C04B2235/3206; C04B2235/3208; C04B2235/3213; C04B2235/3215
Inventors
MORI, NAOYA; MORIYA, YOICHI