The present invention relates to the field of
electronic packaging, and proposes a packaging method and
system for realizing memory chips, the method comprising: first obtaining a
chip to be packaged, performing an appearance inspection to select a
chip with qualified appearance, then conducting an
electrical performance test on the
chip, classifying the chips according to the
storage type to obtain a classified chip group, querying the packaging material, using a substrate to build a packaging infrastructure, installing the chip, bonding and fixing it, and sealing it to obtain a preliminary
package, monitoring the packaging state after
drying it, detecting potential defects and marking it to obtain a marked
package, detecting performance indicators after repair, grading it to obtain a graded
package, querying the grading process and generating a packaging report for the chip to be packaged, and realizing a complete process from chip detection to packaging, repair and
report generation. The present invention can improve the packaging level of
memory chip packaging.