The invention discloses a full-automatic packaging
assembly line for
semiconductor material trays, which comprises a material taking and feeding mechanism, a material tray
label tearing and pasting mechanism, a
moisture-proof monitoring mechanism, a bagging and packaging
helium detection mechanism and a boxing and packaging redetection mechanism which are arranged in sequence, and the
assembly line realizes material tray grabbing,
visual detection and overturning, old
label tearing and new
label pasting; the full-process automatic operation comprises the following steps of: automatically placing a
humidity card and a
drying agent, bagging an
aluminum foil bag, vacuumizing, filling
helium, carrying out heat sealing, carrying out
helium detection, and finally automatically boxing, sealing, rechecking, labeling and stacking. By integrating multi-stage
visual positioning and detection, double-path parallel heat sealing and closed-loop
quality control, the packaging efficiency and precision are remarkably improved, the sealing performance,
moisture resistance and
traceability of product packaging are ensured, and the automatic
packaging machine is particularly suitable for automatic packaging of precise electronic components such as semiconductors.