The invention discloses a method for manufacturing a high-efficiency heat dissipation thermoelectric separation
metal substrate based on
insulation layer optimization, and relates to the technical field of heat dissipation substrate manufacturing, which comprises the following steps of: cleaning the top surface of a
copper base material heat dissipation disc and pasting a peelable protective layer before pressing, forming a
peripheral sealing structure on the periphery of the
copper base material heat dissipation disc, and sealing the heat dissipation disc with a sealing layer; a capillary fracture step and a glue storage groove / cavity are arranged on the periphery of the hole
fishing window so as to preset the glue overflowing direction; then the laminated blank plate is subjected to vacuum preheating exhausting, segmented pressurizing filling and curing shaping, and overflowing glue is guided into a
peripheral glue
storage area; after curing, stripping the protective layer in a stripping temperature window according to a controlled stripping angle and a stripping speed, obtaining a residual glue coverage rate through
machine vision and performing threshold judgment, and if the residual glue coverage rate exceeds the threshold, exiting if the residual glue coverage rate still exceeds the threshold through low-damage cleaning / activation reinspection; and judgment, vacuum degree, temperature,
pressure curve and batch binding are subjected to feedback adjustment, so that dependence on
laser /
grinding / strong acid
photoresist removal is reduced, stability and
traceability of
mass production are improved, and the interface
pollution risk is more controllable.