9results about How to "Reliable manufacturing" patented technology

The present invention provides improved techniques for bonding devices with copper-to-copper or other types of bonding. The substrate is cleaned to remove surface oxides and contaminants, and then rinsed. The rinsed substrate is supplied to a coating unit, where a protective coating is applied to the substrate. The protective coating may be applied by immersing the substrate in a bath or by chemical vapor deposition. In one aspect, the protective coating may be copper selective such that the protective coating is applied only to the copper feature of the substrate. The protective coating minimizes the formation of oxides and other bond weakening forces that may be formed in a bonding process (e.g., a copper bond pad that bonds a copper wire to a substrate). In one aspect, an annealing process is used to cure the protective coating, removing small defects and other anomalies in the protective coating prior to the bonding process.

The invention relates to a contact element (100) having a plug-in section (200) which is deformed from a wire end (210) of an electrical conductor (220), in particular of an electrical stranded conductor, and having two opposite, in particular pointing away from one another, in particular flat plug-in section contact surfaces (201), and having a contact sheet clip (300) which is fastened at the plug-in section (200). The contact sheet clip (300) has a contact sheet clip back (301) and two contact sheet clip legs (302) which extend from the contact sheet clip back, wherein each of the two contact sheet clip legs (302) has a main extension plane (302a) and a plurality of, in particular elastic, contact sheets (303) which protrude from the main extension plane, wherein the contact sheets (303) of the two contact sheet clip legs (302) protrude outward, wherein one of the two contact sheet clip legs (302) is fastened on each of the two plug-in section contact surfaces (201).

The application relates to a rescuer protection device which comprises a connecting rod and two fixing mechanisms, the two fixing mechanisms are arranged at the two ends of the connecting rod respectively, the two fixing mechanisms each comprise a fixing base and a fixing suction cup, the two fixing bases are connected with the two ends of the connecting rod respectively, and the two fixing suction cups are fixedly arranged in the two fixing bases; when the protection device is used, the two fixing suction cups are adsorbed and fixed on the two side walls, and a safety rope is bound and fixed on the connecting rod; when a rescuer needs to quickly deploy emergency rescue, the two fixing bases are respectively opposite to the two side wall bodies of an elevator door, then the two fixing suction cups are adsorbed and fixed on the two side wall bodies of the elevator door, so that the manufacturing of a temporary binding position is completed. The application has the effect that the protection device can quickly manufacture reliable binding positions in various emergency rescue environments.

The invention discloses a manufacturing method of a large-size heterogeneous material hybrid frame, a front section beam and a mounting seat are made of high-strength steel or hot forming steel and are formed by combining electric arc additive materials with inserts in an embedded mode, and the rear end of the front section beam is machined to form an outer inserting end; the middle-rear section beam is made of aluminum alloy and is formed by electric arc additive forming, and the front end of the middle-rear section beam is machined to form an inner inserting end; the shape of the outer wall of the inner inserting end is matched with the shape of the inner wall of the outer inserting end, the inner inserting end and the outer inserting end are connected in an inserting mode, self-piercing riveting connection is adopted in the circumferential direction of the inserting connecting positions, epoxy glue is coated between the connecting faces of the inserting connecting positions to form a glue layer, and a longitudinal beam of the frame is formed. The mounting base is attached to the top face and the outer side face of the longitudinal beam through the inner side face of the L-shaped structure, and the mounting base is connected with the attaching face of the longitudinal beam through a high-strength bolt; reliable manufacturing of the steel-aluminum hybrid frame is achieved, light weight, high strength and low cost of the frame are achieved, and the steel-aluminum hybrid frame is particularly suitable for large-size frames, needing light weight and high strength, of automobiles, rail transit, special equipment and the like.

The invention discloses an antimicrobial peptide, an expression vector and an application thereof. Aiming at the problem that the current antimicrobial peptide gene family of Monochamus alternatus is incomplete, the scheme of the invention proposes four antimicrobial peptides MaltCec, MaltDef, MaltAtt-1 and MaltAtt-2 of Monochamus alternatus and their corresponding antimicrobial peptide genes and corresponding exogenous expression vectors and products, and also discloses corresponding induced expression and purification methods. The scheme enriches the antimicrobial peptide gene family of Monochamus alternatus and realizes the exogenous expression of the antimicrobial peptide genes MaltCec, MaltDef, MaltAtt-1 and MaltAtt-2 of Monochamus alternatus; the scheme of the invention also successfully uses Pichia pastoris to express the antimicrobial peptides MaltCec, MaltDef, MaltAtt-1 and MaltAtt-2 of Monochamus alternatus, and proves that they have antibacterial activity. The antimicrobial peptides of Monochamus alternatus in the scheme have good antibacterial effect, are reliably and stably prepared and have positive application prospects.

A cross-band multistage adjustable radar wave-absorbing structure, a design method and a preparation method belong to the technical field of electromagnetic wave regulation and control. The cross-band multistage adjustable radar wave-absorbing structure is prepared by using a photoetching process and a magnetron sputtering process, can realize absorption of a specific wave band under S / C / X wave bands, and sequentially comprises a patterned microwave absorbing layer, a chalcogenide phase change material layer, a heat bearing layer, a metal electrode layer and a flexible dielectric layer. The metal-insulating state conversion of the chalcogenide phase change material is realized by controlling the conductivity of the chalcogenide phase change material, the Fermi level of the chalcogenide phase change material is adjusted by controlling the chalcogenide phase change material, multi-band absorption adjustment is realized, perfect absorption is realized at multiple specific frequency points, and a certain angle insensitivity characteristic is possessed. Meanwhile, the structure of the chalcogenide phase change material layer is simple, mass production and processing requirements are met, the application of the phase change material in the GHz field is expanded, and the design is flexible, electrically adjustable, and widely applied.

A method for large-area fabrication of mushroom-shaped biomimetic dry adhesion structures involves first machining a set of upper and lower molds. The upper mold has a substrate cavity, an array of columnar cavities, and an upper cap-edge cavity, while the lower mold has an array of lower cap-edge cavities. After passivation, the molds are securely connected via pre-drilled positioning holes. Next, a high-molecular polymer material is completely filled into the cavities of the molds using molding and vacuum defoaming processes. Finally, after heat cross-linking curing and demolding, the integrated, controllable, and reliable fabrication of the mushroom-shaped biomimetic dry adhesion structure is completed. This method eliminates the reliance on micro / nano fabrication processes such as photolithography and etching in conventional mushroom-shaped biomimetic dry adhesion structure fabrication. Furthermore, the large-area machinability and reusability of the molds support large-scale continuous production of mushroom-shaped biomimetic dry adhesion structures, significantly reducing manufacturing barriers and costs.

The invention relates to a method for producing a semiconductor element, in particular a power semiconductor element, from a wafer, comprising the following steps:-providing a wafer substrate (101),-treating a structured wafer surface (102),-applying a carrier wafer (103) to the wafer substrate (101), and-reducing the thickness of the wafer substrate (101) by wafer thinning, characterized in that the wafer substrate (101) is provided with a substrate surface (102), and the substrate surface (102) is provided with a substrate surface (102). The carrier wafer (103) is applied to the wafer surface (102) by a cofferdam filling method step. The invention also relates to a corresponding semiconductor component.