726 results about "Transfer molding" patented technology

A blend of a macrocyclic polyester oligomer and a polymerization catalyst as a one component ready-to-use material with a long shelf life enables production of parts from macrocyclic polyester oligomers without the modification of existing equipment, thereby reducing time and cost of manufacture while expanding the application of macrocyclic polyester oligomers. In this blend material, the macrocyclic polyester oligomer remains intact in solid state at ambient conditions. Upon melting, the blend material initially forms low viscosity fluid, and then rapidly polymerizes to form high molecular weight polyesters which subsequently solidify to form crystalline polymers. In the case of certain macrocyclic polyester oligomers, for example, poly(1,4-butylene terephthalate), demolding can take place at the polymerization temperature, e.g., at about 180° C. to 200° C., because the resulting polyester polymer solidifies fairly rapidly at that temperature without cooling. In one aspect, the invention generally features a blend material that includes a macrocyclic polyester oligomer, a polymerization catalyst, and optionally, a filler. In another aspect, the invention generally features a process for preparing a blend material. In yet another aspect, the invention features processes such as rotational molding, resin film infusion, pultrusion, resin transfer molding, filament winding, making and using powder-coated or hot melt prepreg, compression molding, and roll wrapping, which use the blend material.

Reusable vacuum bags are provided which include a fabric layer containing reinforcement fibers and a release surface disposed on at least the first side of the fabric layer. The vacuum bag is capable of withstanding multiple mold cycles of the vacuum of less than ambient pressure without significant leakage. In addition, the described vacuum bag can be used in resin transfer molding and standard bagging operations with commercial benefit.

The invention relates to an LED package having a metal reflective layer for focusing and emitting light through a side of the package, and a manufacturing method of the same. The LED package includes a substrate with an electrode formed thereon, a light emitting diode chip disposed on the substrate, and an encapsulant covering the LED chip and the substrate to protect the LED chip. The LED package also includes a metal reflective layer surrounding side surfaces of the encapsulant to form a light transmitting surface on a top surface of the encapsulant. The invention minimizes light loss, improves luminance, can be mass-produced as a PCB type, and adopts EMC transfer molding to minimize irregular color distribution, thereby improving optical quality.

(1) Alignment mark transfer portion(s) is/are formed on the transfer molding surface of a mold that is used for press-molding a optical element fixing member and having alignment marks; (2) alignment mark(s) is/are formed on the mold material by dry-etching, and the mold material is worked using the alignment mark(s) as a reference to form the transfer molding surface constituted by a plurality of transfer patterns, in order to obtain a mold for press-molding; and (3) the transfer patterns are formed by dry-etching, or a transfer molding bare surface for transfer patterns is formed by dry-etching and a mold release film is formed thereon to reflect the shape of the transfer molding base surface, in order to obtain a mold for press-molding.

Methods and structures of in-situ wafer scale polymer stud grid array (ISWS-PSGA) contact formation on integrated circuit devices, wherein a separate pre-manufactured PSGA substrate is not needed. The methods include injection molding of thermoplastics, transfer-molding of thermoset materials, lamination of polymer films with subsequent in-situ molding/embossing, and forming the PSGA structure directly on the semiconductor wafer. The ISWS-PSGA structure extends across the entire semiconductor wafer, with ISWS-PSGA metallized input/output studs disposed across each of the integrated circuit devices on the wafer. The polymer formed on the wafer surface to create the stud field is extended beyond the perimeter of the wafer, and the polymer film extension is used for temporary connection to an integrated circuit tester, or an integrated circuit test/burn-in system. The extension may further include studs for contacting the tester.

This invention provides a heat curable resin composition for light reflection, which, after curing, can realize high reflectance in a range of visible light to near ultraviolet light, has excellent heat deterioration resistance and tablet moldability, and is less likely to cause burrs during transfer molding, and a process for producing the resin composition, and an optical semiconductor element mounting substrate and an optical semiconductor device using the resin composition. The heat curable resin composition for light reflection comprises a heat curable component and a white pigment and is characterized in that the length of burrs caused upon transfer molding under conditions of molding temperature 100° C. to 200° C., molding pressure not more than 20 MPa, and molding time 60 to 120 sec is not more than 5 mm and the light reflectance after heat curing at a wavelength of 350 nm to 800 nm is not less than 80%. The resin composition can be used for constructing the optical semiconductor element mounting substrate and the optical semiconductor device.

PCT No. PCT/JP96/00350 Sec. 371 Date Nov. 6, 1996 Sec. 102(e) Date Nov. 6, 1996 PCT Filed Feb. 16, 1996 PCT Pub. No. WO96/25677 PCT Pub. Date Aug. 22, 1996The surface and/or interface of a lens or the like is formed with a convex-microgranular surface. For this purpose, a stamper 108 having a concave-micro-granular transfer-molding surface transfer-molded from a convex-microgranular surface comprised of SiO2 or the like and varying continuously in the index of refraction is used to reproduce the convex-microgranular surface.

A power semiconductor device in which transfer molding resin seals: a metallic circuit substrate; a power semiconductor element joined to a wiring pattern; and a side surface of a cylindrical external terminal communication section provided on the wiring pattern and to which an external terminal can be inserted and connected. The cylindrical external terminal communication section is substantially perpendicular to a surface on which the wiring pattern is formed. An outer surface of a metal plate of the metallic circuit substrate and a top portion of the cylindrical external terminal communication section are exposed from the transfer molding resin. The transfer molding resin is not present within the cylindrical external terminal communication section.

A disclosed method of manufacturing a camera module includes providing an optical assembly, providing an integrated circuit image capture device (ICD), fixing the optical assembly directly to the ICD, then forming a housing directly over the optical assembly. The method further includes forming the housing over the ICD and the optical assembly via transfer molding. The method further includes forming solder balls on the rear surface of the ICD so as to enable the camera module to be reflow soldered to a host device. In an alternative embodiment of the present invention, the method includes providing a second ICD, providing a second optical assembly, providing a housing substrate, fixing the first optical assembly over the first ICD, fixing the second optical assembly over the second ICD, and forming the housing substrate over both the first and second optical assemblies. The alternative method further includes separating the housing substrate in to a first portion formed over the first optical assembly and second portion formed over the second optical assembly, providing a second housing substrate, and forming the second housing substrate over the first and second portions.

A phosphor composition and light emitting device utilizing that composition is disclosed. The composition includes a suspension of phosphor particles that are uniformly distributed in a transparent medium that includes an epoxy, and a diffusive agent that includes diffusive particles of a transparent material. In one embodiment, the diffusive particles have a median particle size between 1 μm-5 μm. The diffusive agent can be made from both inorganic and organic material such as Barium Titanate, titanium Oxide, aluminum oxide, silicone oxide, calcium carbonate, melanin resin, CTU guanamine resin or benzoguanamine resin. Embodiments that further include adhesion promoters, hydrophobic agents, thixotropic agents and UV inhibitors are also disclosed. In one embodiment, the composition is in the form of a pellet suitable for transfer molding.

A molded composite structure and a method of manufacturing a molded composite structure are disclosed. In one embodiment, an aircraft wing panel and a method for manufacturing an aircraft wing panel are disclosed. In another embodiment, the method of manufacturing a molded composite structure uses a resin transfer molding process.

A semiconductor package has a die connected to a substrate with a transfer molding applied over the die. The transfer molding includes an electrically conductive material for forming an electromagnetic compatibility shield as an integral part thereof.

The invention discloses a prepreg/resin transfer molding co-curing process method for composite materials. The method comprises the following steps: step 1, tailoring prepregs and dry fibers; step 2, spreading the prepregs and sizing dry fiber preforms; step 3, packaging a mould; step 4, injecting resin and carrying out heat curing; and step 5, demolding a product. The method combines a prepreg process with a resin transfer molding process in the mould. According to the structure features and performance requirements of the product, a composite material blank is formed by the prepregs and the dry fibers, then the resin is injected to impregnate the dry fibers, and finally the composite material product is thermally cured. The co-curing of the prepreg part and the liquid forming part is realized, and therefore, the purpose of efficient low-cost manufacture of the composite material structure is achieved. The method can significantly improve the forming efficiency of the composite material structure, reduce the manufacture cost, improve the quality of products and increase the weight loss benefit and is of great significance to the efficient low-cost manufacture of the composite material structure.

A method of encapsulating an article having first and second surfaces, includes positioning a first molding section in a sealing relationship with the first surface of the article and positioning a second molding section adjacent the second surface of the article. The first molding section is filled first thereby forcing the second surface of the article into a sealing engagement with the second molding section. The second molding section is then filled.

A semiconductor device includes a semiconductor chip that generates heat in operation, a pair of heat sinks for cooling the chip, and a mold resin, in which the chip and the heat sinks are embedded. The thickness t1 of the chip and the thickness t2 of one of heat sinks that is joined to the chip using a solder satisfy the equation of t2/t1≧5. Furthermore, the thermal expansion coefficient α1 of the heat sinks and the thermal expansion coefficient α2 of the mold resin satisfy the equation of 0.5≦α2/α1≦1.5. In addition, the surface of the chip that faces the solder has a roughness Ra that satisfies the equation of Ra≦500 nm. Moreover, the solder is a Sn-based solder to suppress relaxation of a compressive stress in the chip, which is caused by the creeping of the solder.

A less-deformable resin-sealed electronic apparatus of high reliability capable of increasing the robustness (long life-time) of soldered portions of a power semiconductor device for use in internal combustion engines while increasing the physical stiffness of an overall apparatus structure for achieving enhanced resistance to flexure or bending stresses is provided. A hybrid IC substrate 2 and power semiconductor device 3 are mounted on a metallic heat sink 1. The power semiconductor device 3 is coupled and contacted with the heat sink 1 by use of an Sn-Sb alloy-based solder material 4. The power semiconductor device 3 and hybrid IC substrate 2 plus heat sink 1 as well as input/output terminals 6-1 to 6-3 are embedded in a package 7 except for part of the input/output terminals, which package is made of epoxy at 70 to 90 weight percent (%) of an inorganic loading or filler material as machined by transfer mold techniques.

A power semiconductor device includes a power semiconductor module having cylindrical conductors which are joined to a wiring pattern so as to be substantially perpendicular to the wiring pattern and whose openings are exposed at a surface of transfer molding resin, and an insert case having a ceiling portion and peripheral walls, the ceiling portion being provided with external terminals that are fitted into, and passed through, the ceiling portion, the external terminals having outer-surface-side connecting portions at the outer surface side of the ceiling portion and inner-surface-side connecting portions at the inner surface side of the ceiling portion. The power semiconductor module is set within the insert case such that the inner-surface-side connecting portions of the external terminals are inserted into the cylindrical conductors.

A dry fiber preform having a plurality of fiber layers held together via one or more non-woven, thermoplastic veils. The thermoplastic veils are heated and slightly melted during manufacture of the preform, and serve to hold the various woven fiber layers of the preform adjacent one another without stitching, clamping or tackifiers that could otherwise disrupt the flow of resin when the preform is subjected to a subsequently performed resin transfer molding process. The thermoplastic veils also serve to significantly improve the post-impact strength of the preform. The use of the thermoplastic veils allows the woven fiber layers to be secured to one another on the fly as the fiber layers are placed over a mold or tool and heated.

A power semiconductor apparatus has: plural power semiconductor units, sealed by a transfer mold resin so that insertion holes of conductive tubular sockets in which plural external terminals can be insertion-connected are exposed in one surface thereof and a metal heat dissipation surface is exposed in another surface thereof; and a conductive connecting member having the plural external terminals. The surfaces of the power semiconductor units that have the insertion holes of tubular sockets are arrayed in the same direction in the plural power semiconductor units. Electrical wiring connection between the plural power semiconductor units is effected by inserting the external terminals of the conductive connecting member into the respective insertion holes of the tubular sockets of the plural power semiconductor units.