115 results about "Transfer molding" patented technology

A stator for an electric motor, especially an axial flux motor, includes coils directly connected to one another, thus appreciably simplifying manufacturing and assembly by reducing or, in some instances, eliminating busbars from the stator and reducing the number of connection points to electrically connect the coils to an electrical power source. In one example, multiple coils may be formed from a single continuous conductor. In another example, multiple coils may be assembled from individually formed coils that are welded directly to one another. The stator may further include pole pieces with laminated structures to improve performance. A potting compound may also be applied to the stator in several ways, such as a trickle coating process or a transfer molding process.

The invention relates to the technical field of composite materials with textile structures, in particular to a preparation method of a three-dimensional warp-direction interlocking woven composite material with different reinforced structures, which comprises the following steps: firstly, carrying out straightening treatment on aramid fibers, and adopting the aramid fibers as warp and weft yarns, weaving a three-dimensional warp-direction interlocking woven fabric preform on a three-dimensional rapier loom controlled by a computer; preparing a resin matrix from epoxy resin, a reactive diluent and a polyether amine curing agent; carrying out vacuum-assisted resin transfer molding on the woven aramid fiber three-dimensional warp-direction interlocking woven fabric; and the three-dimensional warp-direction interlocking woven composite material with different reinforced structures is prepared by regulating and controlling a stacking mode. Through fiber low-damage weaving, structure regulation and control design and orthogonal interlocking lamination, the problems of layering sensitivity and anisotropy of the three-dimensional warp-direction interlocking woven composite material under the extreme load can be solved, and technical support is provided for achieving the excellent mechanical property, low-damage manufacturing, low cost and light weight of the three-dimensional woven composite material.

The invention discloses a product manufacturing process monitoring method and device based on a resin transfer molding process. The method comprises the following steps: monitoring a resin flowing front edge according to a first regression model and a second regression model when resin flows; inputting the monitored optical fiber signal into a pre-trained curing stage identification model to obtain a current curing stage when the resin is cured, and determining a current curing degree according to a fusion image obtained by the optical fiber signal and the ultrasonic guided wave signal; and determining a dry spot area according to the monitored optical fiber signal when the resin is cured, and determining the quantitative information of the dry spot according to the monitored ultrasonic guided wave signal in the dry spot area. In the resin injection process, the obtained ultrasonic guided wave signals and optical fiber signals are analyzed to monitor the flowing front edge, the curing degree and the dry spots of the resin, and through mutual verification of optical fiber monitoring results and ultrasonic monitoring results, the product manufacturing precision and the finished product quality are improved, and intelligent manufacturing of composite materials is achieved.

Provided is a semiconductor device that can prevent resin leakage during transfer molding and prevent poor appearance. The semiconductor device includes: semiconductor chips; a frame surrounding the semiconductor chips and covering the semiconductor chips from above; control terminals electrically connected to the semiconductor chips and projecting from a top surface side of the frame; and a sealing resin provided inside the frame and sealing the semiconductor chips.

The invention relates to a composite structural member for an aircraft, an aircraft component, an aircraft, a method of forming a composite structural member by resin transfer molding and a method of designing a composite structural member. The composite structural member has a ramp region and comprises a plurality of composite plies arranged one on another in a thickness direction; wherein, in the ramp region, the composite plies comprise at least a first subset of composite plies and a second subset of composite plies, each subset comprising a plurality of composite plies; and wherein the second subset of composite plies is staggered in a ramp direction relative to the first subset of composite plies, the staggering resulting in a flat surface region on the second subset of composite plies which is suitable for use in use to seat a fastener thereon.

The purpose of the present invention is to provide a technique capable of suppressing cracking of an insulating substrate even when warpage of a product occurs after transfer molding. The semiconductor device includes: an insulating substrate having an insulating layer, a front surface pattern, and a back surface pattern; a semiconductor element mounted on the surface pattern; and a molding resin that seals the insulating substrate and the semiconductor element in a state in which a surface of the rear surface pattern on the opposite side from a surface facing the insulating layer is exposed. The rear surface pattern is bonded to the heat sink by solder, the surface of the rear surface pattern bonded to the heat sink and the surface of the molded resin facing the heat sink are at the same height position, and the front surface pattern is provided with first slits for dividing the front surface pattern into a plurality of regions. The back pattern is provided with a second slit for dividing the back pattern into a plurality of regions, and when viewed from the thickness direction of the insulating substrate, the first slit and the second slit do not overlap or only partially overlap.

The invention discloses a multi-mold simultaneous injection RTM (Resin Transfer Molding) glue injection device and method, and aims to solve the problems of low productivity and poor metering precision of an existing RTM glue injection machine. The multi-mold simultaneous injection RTM glue injection device comprises a feeding unit, a multi-mold shunting unit, a cleaning unit, a full-process monitoring unit and a cross validation module, wherein the feeding unit comprises a stirring tank with a weighing sensor, a feeding barrel and a vacuum defoaming assembly; the multimode shunting unit is provided with N branch glue injection loops, and branch pressure is independently adjusted through a gear metering pump; the cleaning unit comprises a liquid pump and a spraying head; the whole-process monitoring unit covers the whole stage of glue injection and comprises weighing calibration before glue injection, flow monitoring during glue injection and weighing of a residual glue collecting tank after glue injection; the cross validation module adopts an upper computer to be matched with an adaptive weighting algorithm, and linkage adjustment and alarm are performed when the deviation exceeds 3%. Multi-mode synchronous glue injection is achieved, the glue injection amount error is smaller than or equal to + / -2%, and whole-process data tracing is supported.

The invention provides a die-casting forming method of a graphene heat-conducting film, the graphene heat-conducting film and application of the graphene heat-conducting film, and relates to the technical field of graphene films.The die-casting forming method of the graphene heat-conducting film comprises the following steps that graphene oxide powder is scraped to be flat on a graphene oxide film of a first metal plate to be subjected to rewetting treatment; pressing the powder subjected to the rewetting treatment through a graphene oxide film of a second metal plate, and then performing die-casting shaping and high-temperature heat treatment to enable graphene oxide sheet layers to be subjected to self-assembly and demolding, so as to obtain a graphene oxide film with a high-entropy system structure; removing sulfate radicals from the graphene oxide film to obtain the graphene heat-conducting film. According to the preparation method, the disordered and unsystematic sorting characteristic of the graphene oxide powder is utilized, direct die-casting shaping is conducted, a high-entropy system structure is constructed, after the film is formed through high-heat-moisture treatment, sulfate radicals are removed, the graphene heat conduction film with the high Z-axis direction heat conduction performance is obtained, and the problem that the graphene film prepared through a traditional coating technology is low in Z-axis direction performance is solved.

Provided is an in-mold transfer molding film, which has excellent moldability, post-molding electroconductivity and electromagnetic wave shielding properties and that features good productivity. Also provided is a method for manufacturing a molded article. The in-mold transfer molding film comprises a substrate film, a release layer, and an electroconductive layer, in this order. The electroconductive layer contains, with respect to the electroconductive layer which is 100 mass%, particles at 60-91 mass%, and contains a resin at 9-40 mass%. The weight average molecular weight of the resin is at least 5,000 but less than 10,000. The particles include at least one type selected from the group consisting of non-valent carbon, silver, gold, copper, nickel, chrome, palladium, indium, aluminum, zinc and platinum.

Manufacturing system (1) for the manufacture of a stator (2) and / or a rotor (3) of an electric machine (4), comprising: wherein a holding tool (5) for receiving a plurality of stacked annular disc-shaped electrical steel sheets (6), wherein the holding tool (6) has a clamping mandrel (7) for fixing the electrical steel sheets (6) to the inner diameter (8) of the clamping mandrel (7), and a base plate (10) at a first axial end (9) of the clamping mandrel (7) and a cover plate (12) at a second axial end (11), wherein an axial stress can be introduced into the electrical steel sheets (6) arranged on the clamping mandrel (7) via the base plate (10) and / or the cover plate (11); a baking lacquer tool (20) into which the holding tool (5) equipped with the electrical steel sheets (6) can be inserted and adjusted to a baking lacquer temperature; a transfer molding tool (30) into which the holding tool (5) equipped with the electrical steel sheets (6) can be inserted and adjusted to a molding temperature, characterized in that the holding tool (5) comprises a injection geometry which, in a state inserted into the transfer molding tool (30), influences the shaping and / or the flow of the plastic during the transfer molding process.

To provide a resin molding apparatus capable of shortening a molding time while preventing a product defect.SOLUTION: The resin molding apparatus includes an ejector pin that protrudes from the lower mold and pushes up the resin molded product disposed in the lower mold, and a conveying mechanism that holds the resin molded product and carries out the resin molded product from the lower mold, wherein the ejector pin pushes up the resin molded product from the lower mold in a state where the conveying mechanism holds the resin molded product.SELECTED DRAWING: Figure 6

The thermosetting resin composition contains an epoxy resin containing an epoxy compound represented by formula (1), a curing agent, and an inorganic filler. The glass transition temperature of a thermosetting resin composition in which m is 2 and n is 2 in formula (1), measured at a heating rate of 5°C / min using thermomechanical analysis (TMA), is 190°C or more, and the die shear strength of the thermosetting resin composition to copper at 230°C, measured by the following <Procedure>, is 3.0 MPa or more. <Procedure> The thermosetting resin composition is molded using a low-pressure transfer molding machine at a mold temperature of 175° C, an injection pressure of 10 MPa, and a curing time of 120 seconds, and four 10 mm2 test pieces per level are molded on a copper lead frame. Subsequently, the die shear strength between the test piece and the copper lead frame is measured at 230°C using an automatic die shear measuring device. The die shear strength of the four test pieces is adopted.

This disclosure describes methods for manufacturing hybrid metal / composite battery shells. The hybrid shells, which can be deep, can consist of a metallic (e.g., steel or aluminum alloy), cross-shaped sub-shell with four rounded polymer / fiber composite corner inserts attached to recessed corners of the sub-shell. Overlapping connection points can be co-molded. Overlapping metallic connection surfaces can be pre-treated by laser ablation and / or plasma irradiation to increase the bond strength between the overlapping metal and polymer / fiber composite surfaces. Mechanical locking features can be used to increase the bond strength. Hybrid metal / composite shells can be manufactured by compression molding of different parts using a mold and a press.Resin Transfer Molding (RTM) with thermosetting resin can be used for co-molding four fiber preform corner inserts onto the cross-shaped partial shell. Alternatively, thermoplastic polymer / fiber composite prepreg corner inserts can be attached to the cross-shaped partial shell by compression molding and curing.

To provide a manufacturing method of a molded body that can improve the voltage resistance of the molded body and suppress the occurrence of leakage current.SOLUTION: A manufacturing method of a molded body includes a step of molding a compound containing a resin and a magnetic powder by compression molding or transfer molding using a release film to obtain a molded body.SELECTED DRAWING: Figure 1

An epoxy resin composition for transfer molding, that includes an epoxy resin, an inorganic filler, and a curing agent including a compound represented by general formula (B); a production method therefor; and an epoxy resin composition for compression molding. In general formula (B), R1–R5 each independently represent a C1–6 monovalent organic group, X1–X3 each independently represent an integer 0–4, X4 and X5 each independently represent an integer 0–3, n1 represents a number 1–10, and n2 represents a number 1–10.

The application relates to the technical field of semiconductor structure failure analysis, and discloses a chip opening method and clamp for a double-sided heat dissipation device with transfer molding and encapsulation, which comprises the following steps: adopting plane grinding on an upper lining plate until epoxy molding compound in the double-sided heat dissipation device with transfer molding and encapsulation appears; removing the epoxy molding compound in the double-sided heat dissipation device with transfer molding and encapsulation by adopting a laser etching gasification principle until bonding leads in the double-sided heat dissipation device with transfer molding and encapsulation appear; adopting a first mixed acid solution to perform chemical wet etching on the double-sided heat dissipation device with transfer molding and encapsulation until the bonding leads in the double-sided heat dissipation device with transfer molding and encapsulation are completely exposed; heating and remelting solder between a chip and a pad block, and removing the pad block; adopting a second mixed acid solution to perform chemical wet etching on the double-sided heat dissipation device with the removed pad block until the chip completely appears. The chip of the double-sided heat dissipation device with transfer molding and encapsulation is nondestructively opened, so that subsequent chip-level microscopic analysis is facilitated.

The present invention provides a method for preparing polyurethane composites by transfer molding process, comprising the following steps: spraying, injecting or pouring a polyurethane composition onto at least one surface of at least one fiber layer by means of spraying, injecting or pouring, to obtain a prefabricated component; placing the prefabricated component into a mold with a mold temperature of 50-180°C, closing the mold for hot pressing, applying a mold clamping pressure of 0.5-10MPa on the mold during hot pressing, and demolding. The composites of the present invention are suitable for use in shells for electric vehicle batteries, especially for the upper cover and bottom cover, and can be used to produce parts with the same performance at a lower cost.

The present application relates to chip packaging technical field, especially a kind of semiconductor package injection mold, semiconductor package injection device and semiconductor package injection method, the semiconductor package injection mold includes bottom die and top die, the upper surface of the bottom die is used to be consistent with the lower surface of the substrate to be formed semiconductor package structure, the top die is matched with the bottom die, the top die has plastic package cavity, the plastic package cavity is towards substrate upper surface and is used to accommodate the plastic encapsulation layer formed on the substrate upper surface, the bottom die has through hole corresponding to the position of substrate and penetrating the bottom die, the through hole is used to be connected with the pressure source of external connection.The present application balances the pressure on the upper surface of substrate during transfer molding when forming plastic encapsulation layer by using the pressure on the lower surface of substrate generated by pressure source, so that the stress received by substrate is reduced, and substrate will not be warped.

Transfer molding process (TMV) for overmolding an electronic component (EC), comprising the following steps: - Providing a pipe (RO) that has at least one opening (OE); - Filling the pipe (RO) through the opening (OE) with pellets (PE) made of a plastic material; - Preheating of the pellets (PE) arranged in the pipe (RO) via a high-frequency preheating device (HVG); - Removal of the preheated pellets (PE) from the pipe (RO); - Inserting the preheated pellets (PE) into a transfer mold device (TM) containing an electronic component (EB); - Relocation of a punch (ST) arranged in the transfer mold device (TM) so that the plastic material of the pellets (PE) surrounds the electronic component (EB) at least sectionally and / or partially.

This invention discloses a self-heating curing process for carbon fiber composite materials, belonging to the field of composite material curing and molding technology. Addressing the problems of uneven temperature field, easy damage to carbon fibers, and high energy consumption in existing processes, this invention includes: plasma-activated carbon fiber fabric followed by layup; during layup, flexible conductive interconnect nodes are embedded along the length, width, and thickness directions inside the preform to construct a three-dimensional uniform conductive network through carbon fiber bundle overlap; resin impregnation is completed using vacuum-assisted resin transfer molding; heating and curing are achieved using a low-voltage DC power supply with the carbon fibers themselves as the internal heat source; and a four-stage stepped curing scheme is adopted, combining a closed-loop temperature control system: low-temperature pre-curing and bubble removal—medium-temperature uniform curing—high-temperature post-curing and stress relief—gradient cooling and demolding. The components of this invention exhibit a temperature difference ≤ ±1.5℃, a degree of curing ≥ 98.8%, and energy consumption reduced by more than 70%, making it suitable for different carbon fiber and resin systems, as well as large-size and irregularly shaped components.

The invention provides a wafer-level transfer molding sealing method suitable for a vertical device, and the method comprises the specific steps: scribing and taking a wafer, and obtaining a vertical device; connecting the drain electrode of the vertical device with the copper frame to form a power subunit semi-finished product; respectively arranging copper sheets on a source electrode and a grid electrode of the vertical device so as to lead out each electrode of the vertical device and provide a welding interface for a user side; arranging the semi-finished products of the power subunits on a carrier in the form of wafers; carrying out rotary molding packaging on the carrier with the power subunit semi-finished product, and forming a plastic packaging EMC shell on the power subunit semi-finished product; and cutting the carrier based on the power subunit semi-finished product to obtain a plastic package device finished product. By means of the method, large-scale subunit integration can be achieved, and wafer-level transfer molding sealing is achieved. Each power subunit can be independently arranged by means of the EMC housing and does not interfere with each other.

According to the preparation method of the gypsum mold core, in the process of preparing the gypsum mold core, firstly, a metal mold is placed in a constant-temperature water bath at the temperature of 60-85 DEG C to be evenly heated, then the heated metal mold is soaked in molten wax liquid, a wax film is formed on the surface of a mold cavity of the metal mold, natural cooling is conducted till the wax film is solidified, and the gypsum mold core is obtained. Injecting the gypsum slurry subjected to vacuum degassing operation into a metal mold, performing constant-temperature water bath on the surface of a cavity of the metal mold based on a wax mold transfer molding technology to form a wax mold, and forming a separation interface between the gypsum slurry for preparing the mold core and the metal mold through the formed wax mold, and the situation that the gypsum mold core is damaged due to clamping stagnation of the metal mold caused by gypsum expansion in the slip casting process is thoroughly avoided.

This invention presents a lightweight, durable, and affordable composite prosthetic socket material that utilizes false banana fiber as the main reinforcement and crystalline nanocellulose particles (CNCPs) 85 fillers in 8 polymer matrix. The material is fabricated through 8 vacuum-assisted resin transfer molding (VARTM) process that ensures uniform impregnation and minimal voids. The combination of treated false banana fibers and nanocellulose significantly improves load-bearing capacity and interfacial bonding, allowing the socket to withstand compressive forces above 15ር3 10328 requirements by 94.77 %. Compared to conventional glass-fiber acrylic resin sockets, the new composite exhil nearly equal ultimate strength but are lighter, biodegradable, and substantially lower in cost, making it highly suitable for prosthetic manufacturing in low-income settings.

The invention relates to the technical field of electronic component manufacturing and semiconductor packaging, and discloses an integrally-formed inductor packaging process for preventing coil deformation. According to the process, a composition containing magnetic powder, crystalline epoxy resin, an epoxy-terminated hyperbranched polymer and a urea-based thixotropic agent is adopted, and transfer molding is carried out under the low pressure of 5-15 MPa by utilizing a semiconductor injection molding machine. According to the invention, through synergistic viscosity reduction of resin phase change and hyperbranched molecular lubrication and cooperation of the thixotropic agent to prevent magnetic powder sedimentation, the bottleneck that a high filling material is difficult to flow under low pressure is solved. According to the process, traditional dry powder high-pressure pressing is replaced, the risks of coil disordering and deformation are thoroughly eliminated, single-mode multi-cavity high-flux precision manufacturing is achieved, and it is ensured that product resistors are stably arranged and the magnetic performance is highly consistent.

The utility model discloses two-component HP-RTM (high pressure-resin transfer molding) equipment which comprises an equipment mounting frame, and a cleaning agent tank body, an A component stirring tank body and a B component stirring tank body are respectively mounted in three assembly holes in the equipment frame; two metering pumping assemblies and two vacuum pumps are arranged on the transverse plate, the two vacuum pumps are connected with the top inlet ends of the A component stirring tank body and the B component stirring tank body through pipelines respectively, and the two metering pumping assemblies are connected with the bottom outlet ends of the A component stirring tank body and the B component stirring tank body through pipelines respectively; the lifting assembly is arranged on one side of the equipment mounting frame, and the action end of the lifting assembly is connected with a mixed glue injection head; the mixed glue injection head is provided with two feed ports, two return ports and a discharge port, and the two feed ports are respectively connected with the two metering pumping assemblies through pipelines; the two material return ports are respectively connected with the component A stirring tank body and the component B stirring tank body through pipelines; and a control valve is arranged in the mixed glue injection head, so that equipment construction is completed.

A fiber composite material and a preparation method therefor, a protective structural member, and a vehicle. The fiber composite material comprises: a plurality of fiber layers; and a resin matrix, wherein the resin matrix infiltrates the plurality of fiber layers by undergoing high-pressure resin transfer molding together with the plurality of fiber layers.

In a method for resin transfer molding (RTM) a composite part, a fiber preform is formed on a transfer plate while the transfer plate is supported on a preforming base outside an RTM mold. The RTM mold can be closed for molding another composite part during forming. The transfer plate and the fiber preform are transferred together from the preforming base to an RTM base of the RTM mold. The RTM mold is closed to enclose the fiber preform in the RTM mold. While the RTM mold is closed, the composite part is formed on the transfer plate in the RTM mold by infusing the fiber preform with resin and curing the infused resin to form the composite part. The RTM mold is then opened, and the transfer plate and composite part are removed together from the mold. The RTM molding process can be isothermal.

The invention discloses a variable-rigidity battery pack upper cover and an RTM integral forming method and system, and the method comprises the steps: dividing a rigidity demand region according to the stress characteristics of the battery pack upper cover, and generating a material-structure matching parameter set of the regions; according to the material-structure matching parameter set, an RTM mold with a gradient thickness mold cavity and a partition fiber guiding structure is designed, and a forming mold matched with the parameter set is formed; laying the long glass fiber preform in a forming mold according to the parameter set, and controlling the fiber orientation through a guide structure to obtain a preliminarily formed upper cover blank; structural performance detection is conducted on the upper cover blank, a fiber orientation and thickness deviation area is recognized, deviation is corrected through a local correction technology, and finally a battery pack upper cover finished product with the variable rigidity characteristic is formed. By utilizing the embodiment of the invention, the variable stiffness characteristic and integral forming of the upper cover of the battery pack can be realized, and the comprehensive efficiency of a battery system is improved.

The invention discloses a transfer molding machine, belongs to the technical field of transfer molding, and solves the problems that internal cracks are hidden in a traditional transfer molding injection molding valve due to curing gradient, static pressure cannot be detected, cracking and communication are promoted by stress in service, and a valve body suddenly leaks and is brittle failure. Comprising a rack and a heating die cavity arranged in the rack, the sectional area of a top inlet of the heating die cavity is larger than that of a bottom outlet of the heating die cavity, an electric heating wire is arranged in the heating die cavity, and a connecting pipe which is communicated with the heating die cavity and allows materials to enter is arranged in the rack. A material pushing rod which is located above the heating die cavity and moves vertically is arranged in the machine frame. According to the method, a microwave energy field and an acoustic resonance field are constructed in the workpiece, in-situ, real-time and uniform intervention and balance are carried out on the molecular thermal motion and curing reaction process in a three-dimensional space in a material attached to the inner wall of the workpiece, and the root cause of a non-uniform thermal process causing the formation of a shell core curing gradient and a weakening layer is eliminated.