27 results about "Transfer molding" patented technology

Provided is a semiconductor device that can prevent resin leakage during transfer molding and prevent poor appearance. The semiconductor device includes: semiconductor chips; a frame surrounding the semiconductor chips and covering the semiconductor chips from above; control terminals electrically connected to the semiconductor chips and projecting from a top surface side of the frame; and a sealing resin provided inside the frame and sealing the semiconductor chips.

The thermosetting resin composition contains an epoxy resin containing an epoxy compound represented by formula (1), a curing agent, and an inorganic filler. The glass transition temperature of a thermosetting resin composition in which m is 2 and n is 2 in formula (1), measured at a heating rate of 5°C / min using thermomechanical analysis (TMA), is 190°C or more, and the die shear strength of the thermosetting resin composition to copper at 230°C, measured by the following <Procedure>, is 3.0 MPa or more. <Procedure> The thermosetting resin composition is molded using a low-pressure transfer molding machine at a mold temperature of 175° C, an injection pressure of 10 MPa, and a curing time of 120 seconds, and four 10 mm2 test pieces per level are molded on a copper lead frame. Subsequently, the die shear strength between the test piece and the copper lead frame is measured at 230°C using an automatic die shear measuring device. The die shear strength of the four test pieces is adopted.

The application relates to the technical field of semiconductor structure failure analysis, and discloses a chip opening method and clamp for a double-sided heat dissipation device with transfer molding and encapsulation, which comprises the following steps: adopting plane grinding on an upper lining plate until epoxy molding compound in the double-sided heat dissipation device with transfer molding and encapsulation appears; removing the epoxy molding compound in the double-sided heat dissipation device with transfer molding and encapsulation by adopting a laser etching gasification principle until bonding leads in the double-sided heat dissipation device with transfer molding and encapsulation appear; adopting a first mixed acid solution to perform chemical wet etching on the double-sided heat dissipation device with transfer molding and encapsulation until the bonding leads in the double-sided heat dissipation device with transfer molding and encapsulation are completely exposed; heating and remelting solder between a chip and a pad block, and removing the pad block; adopting a second mixed acid solution to perform chemical wet etching on the double-sided heat dissipation device with the removed pad block until the chip completely appears. The chip of the double-sided heat dissipation device with transfer molding and encapsulation is nondestructively opened, so that subsequent chip-level microscopic analysis is facilitated.

This invention discloses a self-heating curing process for carbon fiber composite materials, belonging to the field of composite material curing and molding technology. Addressing the problems of uneven temperature field, easy damage to carbon fibers, and high energy consumption in existing processes, this invention includes: plasma-activated carbon fiber fabric followed by layup; during layup, flexible conductive interconnect nodes are embedded along the length, width, and thickness directions inside the preform to construct a three-dimensional uniform conductive network through carbon fiber bundle overlap; resin impregnation is completed using vacuum-assisted resin transfer molding; heating and curing are achieved using a low-voltage DC power supply with the carbon fibers themselves as the internal heat source; and a four-stage stepped curing scheme is adopted, combining a closed-loop temperature control system: low-temperature pre-curing and bubble removal—medium-temperature uniform curing—high-temperature post-curing and stress relief—gradient cooling and demolding. The components of this invention exhibit a temperature difference ≤ ±1.5℃, a degree of curing ≥ 98.8%, and energy consumption reduced by more than 70%, making it suitable for different carbon fiber and resin systems, as well as large-size and irregularly shaped components.

This invention presents a lightweight, durable, and affordable composite prosthetic socket material that utilizes false banana fiber as the main reinforcement and crystalline nanocellulose particles (CNCPs) 85 fillers in 8 polymer matrix. The material is fabricated through 8 vacuum-assisted resin transfer molding (VARTM) process that ensures uniform impregnation and minimal voids. The combination of treated false banana fibers and nanocellulose significantly improves load-bearing capacity and interfacial bonding, allowing the socket to withstand compressive forces above 15ር3 10328 requirements by 94.77 %. Compared to conventional glass-fiber acrylic resin sockets, the new composite exhil nearly equal ultimate strength but are lighter, biodegradable, and substantially lower in cost, making it highly suitable for prosthetic manufacturing in low-income settings.

This invention provides a refractory metal skeleton-reinforced hybrid resin-based ablation heat-resistant composite material and its preparation method. The method involves additive manufacturing of the refractory metal skeleton; adding siloxane to phenolic resin, and mixing the siloxane-modified phenolic resin with ceramic powder to obtain a ceramic-resin mixture slurry; placing a vacuum bag containing the refractory metal skeleton into an RTM (Resin Transfer Molding) device, and injecting the ceramic-resin mixture slurry into the refractory metal skeleton using a vacuum-assisted resin transfer molding (VARTM) process; after the VARTM process, placing the entire vacuum bag into a cold isostatic pressing (COP) device for COP treatment; after COP treatment, curing the composite resin; after curing the composite material, removing the vacuum bag, and machining the surface to obtain the refractory metal skeleton-reinforced hybrid resin-based ablation heat-resistant composite material.

This utility model discloses a transfer molding mold for rubber overmolding parts, comprising: an upper mold, a transfer mold, a mold core, and a bottom mold. The bottom mold has multiple parallel and evenly arranged mold core mounting positions, each housing a mold core. The mold core's dimensions match the mold core mounting positions, and a workpiece placement groove is provided in the center. Multiple parallel workpiece positioning seats are evenly arranged within the workpiece placement groove. The transfer mold is mounted on the bottom mold, and multiple guide protrusions with dimensions matching the corresponding workpiece placement grooves are arranged parallel to each other on its bottom. Workpiece mounting seats, corresponding one-to-one with the workpiece positioning seats on the mold core, are provided on the guide protrusions. A glue injection groove is provided on the upper surface of the transfer mold directly above each guide protrusion, and multiple glue injection holes penetrating the bottom of the groove are provided. Glue injection blocks, corresponding one-to-one with the glue injection grooves, are arranged parallel to each other on the bottom of the upper mold. Through the above method, this utility model can improve the quality and efficiency of overmolding parts and reduce the probability of mold damage.

A die-casting forming mold for vulcanized rubber boots, comprising: a combined shaft mold provided with an inner cavity corresponding to a shaft of a rubber boot; a last mold 21 provided with partition elements, comprising a body substantially corresponding to the shaft of the rubber boot in shape, and two or more partition elements disposed on the body, the last mold 21 being adapted to be mounted in the inner cavity of the shaft mold to form a die-casting forming cavity between the wall of the inner cavity of the shaft mold and the outer surface of the last mold 21, and the die-casting forming cavity being divided into two or more portions by the last mold 21 and the shaft mold, wherein the last mold 21 further comprises: a longitudinally extending rubber injection channel extending longitudinally downward from the upper surface of the last mold 21, and a transversely extending rubber injection channel extending transversely from the longitudinally extending rubber injection channel to a rubber outlet in the surface of the last mold 21; and a rubber injection plate 5 adapted to be mounted to the top of the shaft mold to guide the injection of an unvulcanized mixed rubber material, the rubber injection plate 5 being provided with: a rubber injection hole 11 adapted to be connected to an external injection head to inject the unvulcanized mixed rubber material, and a rubber injection channel for communicating the rubber injection hole 11 with the longitudinally extending rubber injection channel.

This utility model discloses a silicon carbide wear-resistant and corrosion-resistant brick pressing and molding device, belonging to the technical field of brick production equipment. It includes an operating table, a pressing unit located on the side wall of the operating table, and a transfer molding unit located on the operating table. A rotary motor drives the mounting vertical rod to rotate, causing transfer discs located at various positions to rotate sequentially to the lower end of the pressing horizontal plate. Each brick blank is then pressed by an extrusion block. After the extrusion block finishes pressing the brick blank, an external robotic arm can easily remove the transfer disc, achieving efficient transfer of the brick blank and further improving production efficiency. During the transfer process, the first sliding reinforcing block at the bottom of each transfer disc slides within a first annular sliding groove, better resisting deformation and shaking caused by the pressure applied by the extrusion block. The second sliding reinforcing block at the bottom of the reinforcing connecting rod slides within a corresponding second annular sliding groove, providing a support point and further enhancing the stability of the equipment during operation.

To provide a pre-molded case including a combination of multiple components that can prevent leakage of the molding material during transfer molding. [Solution] A pre-molded case comprising a first member having a first through-hole, a second member having a second through-hole, a thermoplastic material interposed between the first member and the second member, and a third member inserted through the first and second through-holes, wherein the thermoplastic material seals at least a portion of the gap formed by the first and second through-holes and the third member.

The utility model relates to the technical field of plastic equipment, and disclose a kind of anti-static sheet transfer forming device, including extrusion molding machine, the bottom side of extrusion molding machine is fixedly installed with mounting ring, detachable guide cylinder is equidistantly installed in the inside of mounting ring, the outside of guide cylinder is slidably installed with adaptive cylinder, two adjacent adaptive cylinders are fixedly connected by second connecting block, the side of mounting ring is provided with telescopic structure that drive adaptive cylinder to slide.The utility model in the present application, through the equidistant distribution of guide cylinder in mounting ring and the trapezoidal expansion cylinder design above it, expand material receiving range and directional flow guide, ensure that sheet is accurately dropped into the sliding plate of moving box along adaptive cylinder.Adopt the nesting structure of first limiting rod, second limiting rod and limiting slot between adaptive cylinder and moving box, form four-way constraint when material accumulation, avoid interlayer slippage or dumping due to shaking in the process of transportation, significantly improve the neatness of stacking and transfer safety.

The present disclosure refers to a temperature sensor with encapsulation and to a method of manufacturing a temperature sensor (1), comprising the steps: providing the temperature sensor (1) comprising the thermistor element (2) and two electrical lead elements (3,6) connected to the thermistor element (2), arranging the sensor head in a transfer mold, encapsulating the sensor head by transfer molding.

A current sensor integrated circuit (IC) package includes an insulation structure disposed between a semiconductor die and a lead frame to control gap height and prevent the die from tilting and dropping the magnetic field coupling between the die the primary conductor. An insulation structure is disposed between the die and the lead frame such that the die remains level and magnetic coupling remains intact. An insulation structure may control the gap height between the lead frame and the die evenly during transfer molding, by supporting the die across its length and / or width. Epoxy dots are also or instead used to control the gap height and eliminate die tilt.

To provide a method for manufacturing a molded body that can prevent leakage of the molding material when performing transfer molding on an insert made of multiple components. [Solution] A method for manufacturing a molded article comprising: preparing a pre-molded case comprising a first member having a first through-hole, a second member having a second through-hole, a thermoplastic material interposed between the first member and the second member, and a third member inserted through the first and second through-holes, wherein the thermoplastic material seals at least a portion of the gap formed by the first and second through-holes and the third member; and transferring a resin onto the pre-molded case.

This application provides an automatic RTM mesh generation method based on implicit distance mapping and normal growth, comprising: acquiring a triangular mesh on the surface of a composite material part; obtaining a local normal field on the part surface by calculating the unit normal vector of each triangular facet; using the implicit distance field as the geometric representation basis, converting the layup thickness into a distance offset value according to the thickness mapping relationship to generate an enhanced initial reference surface; projecting points on the part surface onto the implicit distance field through the thickness mapping relationship, calculating the signed distance value of each point, determining the nested region affiliation, and obtaining supplementary nested space affiliation labels; using the optimized material region as boundary constraint conditions, performing voxel growth operations layer by layer along the local normal field of each layer to generate an initial volume mesh corresponding to each layup; and outputting the final solid mesh for simulation analysis of resin transfer molding process flow and curing.

The application discloses a preparation method of a combined containment cartridge preform RTM injection molding in the technical field of composite material forming, and comprises the following steps: S1, preparing a metal cartridge as a structural framework, wherein the shape and mounting structure of the metal cartridge are adapted to subsequent composite material assembly; S2, preparing a fiber preform which is adapted to the shape of the metal cartridge by using a three-dimensional weaving process; and S3, assembling the fiber preform which has been subjected to preforming treatment together with the metal cartridge in a combined RTM mold, and performing one-time injection molding and curing by using a vacuum-assisted resin transfer molding process to form a metal-composite integrated containment ring. By using precision machining of the titanium alloy cartridge through a numerical control vertical lathe and a vertical gantry milling machine, and by using fluorescent flaw detection full-range defect investigation and surface cleanliness control, the application effectively reduces the overall structural failure risk caused by metal matrix defects or poor adhesion, and builds a foundation for metal-composite integrated forming.

A method of manufacturing a rotor blade for a wind turbine including the steps of a) providing plies and stacking the plies in a first mold for a first half rotor blade shell and in a second mold for a second half rotor blade shell for use in a high-pressure resin transfer molding process; b) injecting a resin by high-pressure resin transfer molding process; c) providing a plurality of bushings each formed as a solid cylindrical sleeve having a wall protrusion extending radially outwards; d) manufacturing a spacer, the spacer including a rotor blade root including the plurality of bushings; and e) positioning and bonding the first half rotor blade shell, the second half rotor blade shell and the spacer; f) providing a plurality of washers to mount a washer at each end of the bushings.

The application belongs to the technical field of advanced composite materials and structure engineering, and particularly relates to a lightweight anti-seismic composite material and a preparation method thereof. The material is a sandwich structure, comprising upper and lower panels and an intermediate core layer. The upper and lower panels are composed of a resin matrix and carbon fibers in which metal nanoparticles are in-situ compounded. The intermediate core layer is prepared by laser selective melting or precise sheet metal folding to obtain a negative Poisson's ratio metal lattice core layer and then subjected to surface roughening treatment. A core-shell damping emulsion is prepared on the surface of the core layer by a step-by-step emulsion polymerization method, and a functional damping coating is formed by coating and solidification. The panels and the core layer are compounded and solidified by a vacuum-assisted resin transfer molding process. Through multi-scale collaborative design, the lightweight, high strength, high damping and excellent impact resistance are synergistically optimized, the structure has high integrity and high designability, and is suitable for building seismic mitigation, lightweight transportation and high-end equipment protection.

This invention provides a method and system for controlling the curing reaction window of epoxy molding compound, belonging to the field of molding process control technology. The method includes: acquiring mold cavity temperature data, plunger displacement data, and plunger pressure data during the transfer molding process of the epoxy molding compound; determining the reaction acceleration time based on the mold cavity temperature data, and determining the mold filling completion time based on the plunger displacement and plunger pressure data; calculating a time difference parameter based on the reaction acceleration time and the mold filling completion time; generating curing control parameters based on the deviation between the time difference parameter and a preset target time difference; adjusting process parameters in subsequent molding cycles based on the curing control parameters, and updating the time difference parameter based on the adjusted process data. This invention achieves cross-cycle closed-loop control of the curing reaction window under multi-cavity conditions, ensuring stable convergence and consistent spatial distribution of the time difference between the reaction acceleration time and the mold filling completion time.

The application discloses a kind of porous core material, composite material and the forming method of porous core material, porous core material includes porous core plate, first film and second film, porous core plate has first board face and second board face, first board face and second board face both have the aperture connected in the internal space of porous core plate;First film covers first board face and is connected with porous core plate, second film covers second board face and is connected with porous core plate, to seal the aperture on first board face and second board face using first film and second film.The porous core material of the embodiment of the application is used in high-pressure resin transfer molding process to form composite material product, its first film and second film can form closed layer, and then block resin from seeping into the interior of porous core material from the root, so as to prevent the problem of composite material product overweight, realize the lightweight of composite material product, improve product performance.

This utility model relates to the field of solid flat vulcanizing machines, and particularly to a solid rubber compound transfer molding mechanism and a solid flat vulcanizing machine. The solid rubber compound transfer molding mechanism includes an upper hot press plate, a mold, a transfer plate with a hollow material groove, a pressure plate, and a driving component. The mold is detachably mounted on the upper hot press plate for holding the solid rubber compound. The transfer plate is located on the side of the mold away from the upper hot press plate, and is initially spaced at a preset distance from the mold. The pressure plate is movable relative to the transfer plate and is inserted into the hollow material groove at the end away from the mold. The driving component is driven by the upper hot press plate, driving the upper hot press plate and the mold to move towards the transfer plate, allowing the solid rubber compound to enter the material groove. This causes the transfer plate to move towards the pressure plate, allowing the pressure plate to press the solid rubber compound in the material groove into the mold. The solid rubber compound transfer molding mechanism provided by this utility model eliminates the need for precise cutting and weighing based on the capacity of each cavity in the mold, reducing operational difficulty.

This invention relates to the field of diode packaging technology, and discloses a wafer-level CLIP packaging method and apparatus for silicon carbide Schottky diodes. The method involves: performing magnetron sputtering and Schottky anode region photolithography on a silicon carbide wafer, reserving CLIP connection areas during electrode evaporation, and performing mask windowing and pulse current adjustment to obtain an electroplated boss wafer; after spin-coating and curing a polyimide passivation layer on the electroplated boss wafer, ablation openings are made in the top and back pad areas of the boss; copper-based CLIP clips are positioned above the selected windowed wafer bosses; the clamping force in each area is adjusted, and reflow soldering is performed to obtain a clip-interconnected wafer; the clip-interconnected wafer is subjected to epoxy resin transfer molding and laser scribing to obtain a double-sided interconnected packaged chip. This invention achieves wafer-level batch double-sided metallized interconnection, reduces package parasitic inductance and double-sided thermal resistance, and improves the electrical performance and thermal management capabilities of silicon carbide Schottky diodes in high-frequency, high-power applications.

A system for carrying out a Resin Transfer Molding process including a molding tool having an upper mold half and a lower mold half which form a mold cavity configured for placement of a preform, a main control unit, more than one injection units configured to supply a resin mixture into the mold cavity, more than one injection points fluidly connecting the more than one injection units to the molding tool, one or more venting hoses configured to expel an excess of the resin mixture, more than one resin outlets fluidly connecting the one or more venting hoses to the molding tool and one or more flow direction sensors connected to the main control unit, wherein the main control unit is configured to monitor a behavior of the resin mixture from the more than one injection points to the mold cavity using the one or more flow direction sensors.

The application discloses a kind of impact-resistant composite material plate and its preparation method, the matrix of composite material plate is polyurea resin, reinforcing phase is continuous fiber material with filament length ≥1cm, and polyurea resin is wrapped around the continuous fiber material.The preparation method is: when the polyurea resin is slow reaction polyurea resin, the resin transfer molding method is used to form the composite material plate;When the polyurea resin is fast reaction polyurea resin, the reaction injection molding method is used to form the composite material plate.The application uses polyurea as matrix resin material, and uses continuous high-performance fiber as reinforcing material, and the composite material formed by the combination has excellent impact resistance, and can be used in impact resistance, bullet resistance and explosion-proof field.

This application discloses a powder cleaning device for 3D printed parts, comprising: a base, including a cleaning table and a cleaning chamber, the cleaning chamber including a feeding area and a powder cleaning area, the feeding area for receiving transferred molding powder packets; a powder cleaning mechanism, including a spray gun assembly for outputting an airflow carrying powder towards the 3D printed part in the powder cleaning area to clean the powder adhering to the 3D printed part by means of powder collision; a powder receiving mechanism, disposed on the base and connected to the powder cleaning area to recover the cleaned powder; and a powder supply mechanism, disposed on the base and connected to the powder cleaning mechanism and the powder receiving mechanism through an air passage, for supplying the powder recovered by the powder receiving mechanism to the powder cleaning mechanism through the air passage. This application utilizes the spray gun assembly to output an airflow carrying powder towards the 3D printed part to clean the 3D printed part by means of powder collision. While ensuring the cleaning effect, the powder in the powder cleaning operation can be reused for cleaning the 3D printed part through the powder receiving mechanism and the powder supply mechanism, and the powder can continue to be recycled after the powder cleaning operation is completed.

This invention discloses a method and apparatus for monitoring the product manufacturing process based on resin transfer molding, comprising: monitoring the resin flow front according to a first regression model and a second regression model during resin flow; inputting the monitored fiber optic signal into a pre-trained curing stage recognition model to obtain the current curing stage during resin curing, and determining the current degree of curing based on the fused image obtained from the fiber optic signal and the ultrasonic guided wave signal; determining the dry spot region based on the monitored fiber optic signal when resin curing is complete, and determining the quantitative information of the dry spot based on the ultrasonic guided wave signal monitored in the dry spot region. During resin injection, the acquired ultrasonic guided wave signal and fiber optic signal are analyzed to monitor the resin flow front, degree of curing, and dry spot. The fiber optic monitoring results are cross-validated with the ultrasonic monitoring results to improve the precision of product manufacturing and the quality of finished products, thereby realizing intelligent manufacturing of composite materials.

The present application belongs to the technical field of composite material forming, and particularly relates to a resin transfer molding-mold pressing combined forming method based on resin reaction state, which determines a preliminary transfer window according to the reaction state of a thermosetting resin system in a curing cross-linking reaction process; places a fiber preform in a resin transfer molding tool, injects the thermosetting resin system into the fiber preform and makes the fiber preform impregnated; pre-cures and heats under the preliminary transfer window, has a first pre-curing cross-linking reaction, and obtains a transfer window; within the transfer window, transfers the impregnated fiber preform to a mold pressing station or an integrated mold switched to a mold pressing working condition, makes the fiber preform contact, compact, solidify, cross-link and pressure-keeping cool, and obtains a product after demolding. The present application can consider full impregnation and efficient compaction, reduce defects such as dry spots, resin enrichment, interlayer separation, porosity and fiber disturbance, improve product thickness consistency and interface bonding state, and improve comprehensive performance.