122 results about "Bare surface" patented technology

(1) Alignment mark transfer portion(s) is/are formed on the transfer molding surface of a mold that is used for press-molding a optical element fixing member and having alignment marks; (2) alignment mark(s) is/are formed on the mold material by dry-etching, and the mold material is worked using the alignment mark(s) as a reference to form the transfer molding surface constituted by a plurality of transfer patterns, in order to obtain a mold for press-molding; and (3) the transfer patterns are formed by dry-etching, or a transfer molding bare surface for transfer patterns is formed by dry-etching and a mold release film is formed thereon to reflect the shape of the transfer molding base surface, in order to obtain a mold for press-molding.

The invention discloses a method for planting lawn in saline-alkali soil and relates to the fields of the saline-alkali soil control and planting technology. The method comprises the steps of: 1, soil arrangement; 2, establishment of a drainage canal; 3, straw application; 4, sand covering on a surface; 5, selection of grass seeds; 6, planting technology; 7, fertilizer application according to formulas; and 8, cultivation management. In the method, the bare surface of the saline-alkali soil can be covered effectively in short time, the water evaporation of the ground is reduced, and the saltness of the surface soil is reduced; the saline-alkali soil can be utilized comprehensively in a large area, and the vegetation structure of the saline-alkali soil can be adjusted; and the vegetation cover area of the saline-alkali soil is enlarged, and the ecological environment is protected and improved.

A method for flip chip package and structure thereof is disclosed. The present invention is using an eutectic bonding process to connect a chip and a heatsink for enhancing thermal dissipation capability from the chip to the heatsink and ensuring the chip working well. The method for flip chip package at least includes the steps of providing a heatsink having a surface plated with a gold film and a bare surface, providing a chip having a join surface and an active surface with a plurality of contacts, eutectic bonding the join surface of the chip to the gold film of the heatsink by gold-silicon diffusion for connecting the chip to the heatsink, connecting the active surface of the chip to a substrate by flip chip technology; and dispensing an underfill into the gap between the chip and the substrate.

The invention discloses a longitudinally-conductive GaN (gallium nitride) normally-closed MISFET (metal integrated semiconductor field effect transistor) device and a manufacturing method thereof. The device successively comprises a substrate (1), an n-type GaN layer (2), an electronic barrier layer (3), a non-doped GaN layer (4) and a heterostructure potential barrier layer (5) from bottom to top, wherein a groove is etched in the n-type GaN layer from the surface of the heterostructure potential barrier layer; a p-type GaN layer is formed on the groove by secondary growth so as to realize a grid conducting channel (7); two ends of the heterostructure potential barrier layer form source electrodes (9); an insulating layer (8) is covered on the grid conducting channel and the exposed surface of the heterostructure potential barrier layer; a grid electrode (11) is covered at a channel position on the insulating layer; and drain electrodes (10) are covered on the underside of the substrate. In the invention, a two-dimensional electron gas heterostructure with high concentration is taken as an access area, thus effectively reducing the on resistance; and the thin p-type GaN layer is formed in the etching groove by secondary growth, thus being easy to improve the threshold voltage and channel mobility of the longitudinally-conductive normally-closed MISFET.

The invention aims to provide an industrial planting facility realized by using an external nutrient source. The industrial planting facility is a facility which can realize agricultural plantation in large-scale, intelligent, modular, newly energetic and industrial modes, and energy sources and nutrient of the facility are directly derived from an external supply system. The direct control of the temperature in the planting process is realized by arranging a temperature control device inside a planting box body, so that the accurate, dynamic, partitioned, intelligent and energy-saving control of plant temperature is realized; planted species are planted on an internal planting dish of a heat preservation box body, and a nonopaque or bare surface is arranged on the top surface, so that the photosynthesis of plants is realized; and the electric energy, heat energy and nutrition are directly conveyed into the heat preservation box body to realize the intellectualization of the planting process, so that the industrial and low-cost large-scale plantation of plants with external nutrient sources is realized.

A method for fabricating an image sensor, which includes the following steps, is provided. A semiconductor substrate including a sensor array, a pad and a passivation layer is provided, and the passivation layer covers the sensor array and the pad. An opening, which comprises tapered sidewalls not perpendicular to a bared surface of the pad, is formed in the semiconductor substrate to expose the pad. An under layer is formed on the semiconductor substrate, and covers the pad and the passivation layer. A color filter array is formed on the under layer and over the corresponding sensor array. A planar layer is formed on the color filter array. A portion of the under layer is removed to expose the pad. A plurality of U-lenses is formed on the planar layer.

The invention provides a method for controlling weeds in a tea plantation. In the method, bare surface soil between tea rows and on the altar in tea plantations is covered by straw or weed preventing cloth after weeding in spring and summer or after plowing and fertilizing in winter. The weed preventing cloth is made of cloth-like material which is woven by adhering non-woven fabrics to propene polymer (PP) filaments. Weeds in tea plantations are prevented and controlled by a physical method, the growth of weeds can be suppressed obviously, chemical herbicide is reduced or even avoided, and artificial and mechanical weeding cost is reduced. Adverse influence of weeds on the growth of tea trees is reduced, soil fertility in tea plantations is improved, water and soil are maintained, and ecology in tea plantations is improved. The method is easy to operate and can be easily accepted by tea growers and has an excellent popularization and application prospect.

An image forming apparatus has a structure in which a toner image formed in an electrophotographic process is transferred from an intermediate transfer belt to a member to be transferred. The apparatus includes a secondary transfer roller that becomes a pressure contact state with respect to the intermediate transfer belt to make it perform a transfer process and can move between the pressure contact state and a separated state, and a press and separation driving device for driving the secondary transfer roller to become the pressure contact state and the separated state. The pressure contact state or the separated state of the secondary transfer roller is detected in accordance with a variation of an output of an IDC sensor for detecting a state of a bare surface of the intermediate transfer belt.

A floor care appliance is provided for cleaning bare surfaces such as tile, marble, linoleum and wood. The floor care appliance is comprised of a base portion having a suction nozzle and a brush block having a plurality of vertical axis rotary agitators for cleaning bare floors. The rotary agitators are driven by an independent motor for agitating the floor surface. With the addition of an accessory hose and tools, the cleaning utility can be expanded to areas wherein the suction nozzle cannot normally reach such as behind the toilet, shower walls, and the grout between tile. While used in the capacity for cleaning bare floors, the floor care appliance can be moved between three modes by a rotating a member located on the upper housing. The first mode is dry mode, the second mode is wet scrub mode and the third mode is wet pickup mode. The accessory tools are stored in an accessory caddy that is placed freestanding over the suction nozzle and in front of the housing.

The present invention relates to an intelligent tag, its glue-coating method and device, belonging to a solid device. The intelligent tag includes silicon wafer and antenna which are connected into one body by means of conducting glue, in which on the bare surface of said silicon wafer is coated a protective glue. Its glue-coating method adopts a glue-dropping method, and its glue-coating device includes the following several portions: drive motor, three screw rods or three cylinders, sensor, special-purpose controller, high-speed drawing system, automatic glue-dropping table and solidifying device, etc.

An exercise Swiss ball cover with the capability of performing integrated resistance exercises and temporarily store personal belongings. The cover is a fabric rectangle secured at its shortest sides, or a fabric tube, into which the exercise Swiss ball is inserted and covered at the centermost, widest circumference. There are two perimeters, each having a small ring or grommet to attach and detach exercise accessories and personal belongings. The cover is cinched at its two perimeters to secure the cover to the exercise Swiss ball. It provides a 360 degree forward and backward rotation capability and a variable lateral rotation of up to 180 degrees without interference from excess material or the bare surface of the exercise Swiss ball. Variable side coverage depends upon stretch and width of fabric used. The cover can be folded into a flat rectangle, making it suitable to neatly drape over a workout bench.

The invention relates to a micro-nano photonic device and the field of laser technology. The invention provides a plasma excimer nanometer laser, comprising a first medium layer, a first isolated layer and a gain medium cavity. The first isolated layer is placed on the bare surface of the first medium layer. The gain medium cavity is placed on the bare surface of the first isolated layer. The laser is characterized in that the specific value scope between the thickness of the first isolated layer and the vertical thickness of the gain medium cavity body is less than 0.5. The plasma excimer nanometer laser provided by the invention has an advantage of decreasing the threshold value of laser.

A floor care appliance is provided for cleaning bare surfaces such as tile, marble, linoleum and wood. The floor care appliance includes a port for the connection of an accessory hose and wand for off the floor cleaning. A variety of cleaning implements can be attached to the wand for cleaning hard to reach bare surfaces such as tile and grout. The port includes a suction inlet, cleaning solution outlet, and an air turbine inlet for an air turbine pump which pressurizes the cleaning solution. A pivoting door seals the suction inlet, cleaning solution outlet, and air turbine inlet when the accessory hose and wand are not in use.

A floor care appliance is provided for cleaning bare surfaces such as tile, marble, linoleum and wood. The floor care appliance includes an accessory hose, telescoping wand and accessory tools for cleaning bare surfaces. A latch having a latch cover is provided for connecting the telescoping wand to the handgrip portion of the accessory hose. The latch and latch cover arrangement could also be utilized for connecting the accessory tools such as a accessory suction nozzle and grout tool to the telescoping wand.

The invention relates to a humic acid incrusting dust suppressant for barren greening and a preparation method thereof. The humic acid incrusting dust suppressant for barren greening comprises the following components in parts by weight: 4-8 parts of humic acid, 2-6 parts of galactomannan gum or sodium carboxymethyl cellulose (CMC) and 1000 parts of water. The humic acid incrusting dust suppressant also comprises a preservative which accounts for 0.4-0.8% of the total weight except water, and moss seeds which account for 0.5-2% of the total weight of the humic acid incrusting dust suppressant. The humic acid incrusting dust suppressant can be used in various barrens in need of greening and dust suppression, can obviously reduce the flying dust pollution on various bare surfaces after being sprayed, and utilizes bryophytes to green the barren. The bryophytes and humic acid supplement each other; the humic acid provides necessary organic nutrients for the bryophytes; and the bryophytes can effectively increase the water retention property of soil on the premise of greening the bare surface, thereby performing the function of reducing the flying dust pollution on the ground surface.

An expansion joint has an elongated flat sheet of flexible and resilient polymeric material. The flat sheet has having a width and a length; upper and lower surfaces; and first and second edges. The sheet has selvage edges and a central gland. The selvage edges have a pair of parallel elongate first and second scrims. The scrims may be formed or embedded on each of the opposite surfaces along the length of the sheet. The rough strips on each surface bracket the elongated strip of bare surface of the gland. The sheet has an array of apertures located in one of the selvage edges. An additional array of apertures may be formed in the opposite selvage edge. The apertures pass through, but are not limited to passing through, the sheet and the strips.

The symbolization of a semiconductor device (100) is incorporated in a thin sheet (130) attached to the top of the device, facing outwardly with its bare surface. The material of the sheet (about 1 to 10 μm thick) includes regions of a first optical reflectivity and a first color, and regions (133) of a second optical reflectivity and a second color, which differ from, and contrast with, the first reflectivity and color. Preferred choices for the sheet material include the compound o-cresol novolac epoxy and the compound bisphenol-A, more preferably with the chemical imidazole added to the film material. A preferred embodiment of the invention is a packaged device with a semiconductor chip a (101) connected to a substrate (102); the connection is achieved by bonding wires (111) forming an arch with a top 111a. The chip, the wire arches, and the substrate are embedded in an encapsulation material (120), which borders on the attached top sheet so that the arch tops touch the border (131).

The invention provides a device for thinning a multi-layer material and a method for thinning a to-be-detected sample, belonging to the field of testing of semiconductors. The device comprises a reaction chamber, an atomic force microscope, an electron microscope and a sample table. The sample table, the atomic force microscope and the electron microscope are positioned in the reaction chamber. The method for thinning the to-be-detected sample comprises the following steps of: putting a sample in the reaction chamber; measuring first contact potential difference V1 of a first bared surface of the to-be-detected sample; moving away a conducting probe of the atomic force microscope; etching the first bared surface at the depth X to expose a second surface; measuring first contact potential difference V2 of a second bared surface of the to-be-detected sample; and comparing the V1 with the V2 to judge whether to etch continuously. The device and the method disclosed by the invention are used for solving the problem of being incapable of precisely dissecting in the prior art. The device and the method are capable of precisely dissecting hetero-junction devices and have important meanings on preparation and property research of semiconductor devices.