Intelligent label and its glueing method and device

A smart label and glue-covering technology, which is applied to the device for coating liquid on the surface, the record carrier used by the machine, and the instrument, etc., can solve the problems of unstable performance, damage, low product yield, etc., and achieve high production yield , stable quality and high economic benefits

Inactive Publication Date: 2007-10-10
BEIJING GOLDEN SPRING TECH DEV
View PDF0 Cites 15 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The use of smart labels as information products is becoming more and more extensive. It includes a silicon chip that records information. One side of the silicon chip is connected to the antenna through conductive glue, while the other side is completely exposed and is susceptible to moisture and radiation such as X-rays. Affected, it is easy to be damaged by external force during the production process, resulting in low product yield and unstable performance

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Intelligent label and its glueing method and device
  • Intelligent label and its glueing method and device
  • Intelligent label and its glueing method and device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0030] As can be seen from FIG. 1 , the smart label of the present invention includes a silicon chip 30 and an antenna 33 connected together by conductive glue 32 , wherein the exposed surface of the silicon chip 30 is coated with UV protective glue 31 . In addition, the thickness of the thickest part of the protective glue 31 from the upper surface of the antenna is 0.10 mm to 1.7 mm, and the outer diameter is 0.3 mm to 15.0 mm. And the optimum value is that the thickness is 0.15mm-0.7mm, and the outer diameter is 1.0mm-5.0mm.

[0031] It can be seen from Fig. 2 to Fig. 4 that the first embodiment of the glue coating device of the smart label of the present invention includes a frame 27 and a coiled material tape 5, on which a number of silicone rubbers connected by conductive glue 32 are accurately arranged and pasted. Sheet 30 and antenna 33, wherein the automatic dispensing platform is housed on the frame 27, this dispensing platform includes the platen 4 that is fixedly c...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The present invention relates to an intelligent tag, its glue-coating method and device, belonging to a solid device. The intelligent tag includes silicon wafer and antenna which are connected into one body by means of conducting glue, in which on the bare surface of said silicon wafer is coated a protective glue. Its glue-coating method adopts a glue-dropping method, and its glue-coating device includes the following several portions: drive motor, three screw rods or three cylinders, sensor, special-purpose controller, high-speed drawing system, automatic glue-dropping table and solidifying device, etc.

Description

technical field [0001] The invention relates to an intelligent label and its glue-covering method and device, in particular to an intelligent label with protective glue on a silicon chip, a method for making the protective glue and a device thereof; it belongs to a solid device. Background technique [0002] The use of smart labels as information products is becoming more and more extensive. It includes a silicon chip that records information. One side of the silicon chip is connected to the antenna through conductive glue, while the other side is completely exposed and is susceptible to moisture and radiation such as X-rays. Influenced, it is easy to be damaged by external force during the production process, resulting in low product yield and unstable performance. Contents of the invention [0003] The technical problem to be solved by the present invention is to provide a smart label that can be directly laminated into a card, is moisture-proof, anti-corrosion and radia...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): G06K19/07B05D1/26B05D3/00B05D7/24B05C5/02B05C13/02
CPCH01L2224/32225H01L24/743H01L2924/0002G06K19/07745G06K19/07749
Inventor 张晓冬
Owner BEIJING GOLDEN SPRING TECH DEV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products