1231 results about "Liquid resin" patented technology

Disclosed herein are free flowing coated particles and low temperature methods of making same. Each particle has a curable coating disposed upon a substrate. The substrate is a particulate substrate including an inorganic material, a particulate substrate including an organic material, a composite substantially homogeneous formed particle including a first portion of an at least partly cured binder and filler particles, or a hybrid particle having an inorganic particle as a core and a composite coating including at least partially cured resin and filler. The curable coating includes a continuous phase including a curable liquid resin and reactive powder particles embedded or adhered to the continuous phase. The reactive powder particles typically include one or more of a resole phenolic-formaldehyde resin, a novolak phenolic-formaldehyde resin, a polyester resin, an acrylic polymer resin, a urethane resin or an epoxy resin. A method including applying a coating including the continuous phase including the curable resin and reactive or non-reactive powder particles embedded or adhered to the continuous phase.

The invention relates to a composite material, a high-frequency circuit substrate therefrom and a manufacture method thereof. The composite material comprises thermoset mixture, glass fiber cloth, power filler, a fire retardant and a curing initiator, wherein the thermoset mixture comprises more than one kind of vinyl liquid resin and polyphenyl ether resin; the molecular weight of the vinyl liquid resin is below 10000, and the vinyl liquid resin is provided with a polar functional group; the molecular weight of the polyphenyl ether resin is less than 5000, and the molecular tail end of the polyphenyl ether resin is provided with unsaturated double bonds. The high-frequency circuit substrate manufactured with the composite material comprises multiple layers of semi-solidified sheets and copper foils, wherein the semi-solidified sheets are mutually overlaid, and the copper foils are respectively pressed on two sides. The composite material disclosed by the invention causes the semi-solidified sheets to be easily manufactured and have high adhesive bonding force with the copper foils. The high-frequency circuit substrate manufactured by the material has the advantages of low dielectric constant, low dielectric loss angle tangent, good heat resistance and simple technical operation. Thus, the composite material disclosed by the invention is suitable for manufacturing the circuit substrate of the high-frequency electronic equipment.

A mask used when a semiconductor wafer is diced into individual semiconductor chips by plasma etching is formed as follows. First, a pattern of a liquid-repellent film is formed by printing a liquid-repellent liquid on the area to be etched on the rear surface of the semiconductor wafer. Next, a resin film thicker than the liquid-repellent film is formed in the area not having the liquid-repellent film by supplying a liquid resin to the rear surface on which the liquid-repellent pattern has been formed. Then, the resin film is cured to form the mask covering the area other than the area to be removed by the etching. This method allows the formation of an etching mask without using a high-cost method such as photolithography.

The semiconductor device with which bonding wires cannot contact easily is offered.

In this semiconductor device, memory chips are stacked on the surface of a wiring substrate, a microcomputer chip and an interposer chip are arranged on the surface of the memory chip, and the pad of a microcomputer chip and the pad of an interposer chip arranged almost circularly are connected by a bonding wire. Therefore, since the transfer pressure of liquid resin for sealing can be weakened with a wire, contact of the wires by deformation of a wire can be prevented.

PCT No. PCT/JP97/01871 Sec. 371 Date Feb. 3, 1998 Sec. 102(e) Date Feb. 3, 1998 PCT Filed Jun. 2, 1997 PCT Pub. No. WO97/46601 PCT Pub. Date Dec. 11, 1997A curable liquid resin composition containing 100 parts by weight of the following (meth)acrylic liquid resin (A) and 1 to 1,000 parts by weight of a (meth)acrylic monomer (B) having an unsaturated double bond in its molecule and having a number average molecular weight of 1,000 or less, the (meth)acrylic liquid resin (A) being a liquid resin which is obtained by polymerizing monomers containing an alkyl (meth)acrylate monomer (a-1-1) of the formula (1),CH2 C(R1)COO-R2(1)wherein R1 is a hydrogen atom or CH3 and R2 is an alkyl group, and/or an alkylene glycol (meth)acrylate monomer (a-1-2) of the formula (2),CH2=C(R1)COO(CnH2nO)mR3(2)wherein R1 is a hydrogen atom or CH3, R3 is an alkyl group or a phenyl group, n is an integer of 1 to 3, and m is an integer of 3 to 25, and other polymerizable vinyl monomer (a-2), an average of molecular weights of all the monomers being 100 to 1,500, the liquid resin having a number average molecular weight of 10,000 to 200,000 and a viscosity of 1 to 10,000 poise (measured at 50 DEG C.), or a modified product of the above liquid resin, the curable liquid resin composition can form a film as a film-forming material or as a resin for an adhesive without using a solvent and give a cured film.

A decorative architectural glass panel comprises a two or more glass sheets separated by a resin in which one or more decorative objects are suspended. A method of making the glass panel comprises positioning one or more spacers and one or more decorative objects on a first glass sheet, placing a second glass sheet about the first glass sheet, sealing the edges of the first glass sheet and second glass sheet, and filling the space between the first and second glass sheets with a curable liquid resin. The resin can be poured using a substantially horizontal pour in order to keep the decorative objects from substantially shifting when pouring the liquid resin. The resin can also be poured in combination with a vacuum force. In some implementations, the glass panel may also be substituted with a resin panel using polymeric resin sheets.

A method of producing an optical disc of bonded type includes the processes of: (A) forming a first reflection film, which is half transparent for partially reflecting and partially transmitting an incident light, on a first information record surface of a first transparent substrate; (B) forming a second reflection film, which has a reflective index higher than that of the first reflection film, on a second information record surface of a second transparent substrate; (C) dripping a liquid resin of ultraviolet hardening type onto one of the first and second reflection films by a spin coating method to form a first resin layer in a non-hardened condition; (D) dripping a liquid resin of ultraviolet hardening type onto the other of the first and second reflection films by a spin coating method; (E) emitting ultraviolet onto the liquid resin dripped by the process (D) to form a second resin layer of ultraviolet hardening type in a hardened condition; (F) provisionally bonding the first and second transparent substrates together in a pressure reduced environment; and (G) hardening the first resin layer by emitting ultraviolet from a side of the first transparent substrate.

Improved performance in the phase separation of aqueous brines from hydrocarbons within an electrostatic desalter operation is obtained by the addition to the crude oil emulsions entering the desalter of an effective asphaltene dispersing amount of an alkyl phenol-formaldehyde liquid resin polymer, optionally in the presence of a lipophilic/hydrophilic vinylic polymer. The preferred resin is a nonyl phenol-formaldehyde resin having a molecular weight of from 1,000-20,000, and the preferred vinylic polymer is a copolymer of lauryl (meth)acrylate and hydroxyethyl (meth)acrylate. Best results from the electrostatic desalter are obtained when also using a demulsifier chemical treatment along with the asphaltene dispersing treatments. Desalter efficiency is increased and desalter brine effluent quality is greatly increased.

A bismuth compound composite having a polymer matrix and a bismuth compound therein. The bismuth compound may be bismuth oxide, or other bismuth compounds. The polymer may be any of a very wide range of materials or combinations thereof. Binder, secondary fillers or other third components may be added. By means of use of various bismuth compounds, polymers, and third components, the physical, radiological and electrical properties of the finished products may be tailored to achieve desired properties. In addition, the invention teaches that radiation shielding, insulators, and combined radiation shield/insulators may be fashioned from the composite. A wide range of production methods may be employed, including but not limited to liquid resin casting.

A non-woven, unidirectional, multi-axial layered fabric for reinforcement of composite structures provides for holding the non-woven yarns as laid-out by adhesion of polymeric adhesive applied to the non-woven yarns. The adhesive layer on the yarns, dissolves as liquid resin is applied to form a composite structure, the polymeric coating dissolving in the liquid resin. The polymeric adhesive dissolves to allow liquid resin to wet the yarns. Curing creates the desired composite structure. Filament yarns useful in the present invention include but are not limited to those made of aramid, boron, carbon, fiberglass, nylon, PBO, PEN, polyester, and polyethylene. A preferred adhesive is low molecular weight polyester and a preferred liquid resin is polyester resin. A web of netting material is applied in a similar manner for added physical stability of the inventive reinforcement fabric.

A method includes: mounting a plurality of semiconductor elements on a substrate having wirings; connecting electrically electrodes of the semiconductor elements and the wirings; sealing the semiconductor elements with a resin, which is carried out by bringing a thermal conductor having a concavity and the substrate to be in contact with each other so that the semiconductor elements are positioned within the concavity and by filling the concavity with the resin; and separating respective semiconductor elements 1. In the resin-sealing step, in a state where the thermal conductor is arranged with its concavity facing up and the concavity of the thermal conductor is filled with a liquid resin, the semiconductor elements are dipped in the liquid resin in the concavity and the liquid resin is solidified. Due to these steps, a semiconductor device can be manufactured without experiencing troubles such as short circuit of the metal thin wires or imperfect filling of resin during the manufacturing steps, and thus semiconductor devices with stable quality can be manufactured.

The invention relates to an ink-jetting ink, in particular to a sublimation ink-jetting ink used for an industrial nozzle and a manufacturing method thereof. The sublimation ink-jetting ink comprises, by weight, 1-6% of disperse dyes, 10-14% of wetting agents, 5-20% of viscosity adjusting agents, 0.1-2% of bactericides, 0.01-1% of pH buffering agent, 1-10% of liquid resin, 0.1-40% of disperse agents, 0.01-5% of antifoaming agents, 0.1-5% of surface active agents, 0.01-2% of metal ion chelating agents and 10-80% of purified water. The manufacturing method of the sublimation ink-jetting ink used for the industrial nozzle includes color paste manufacturing and finished product manufacturing. The sublimation ink-jetting ink used for the industrial nozzle is simple in manufacturing method, smooth in ink jetting, free of blocking the nozzle, good in dispersion stability, free of going bad or denaturing even if being stored for a long time and low in cost, and diameters of dispersed ink points are even.

The invention discloses a DLP principle based 3D printer. The 3D printer includes: a resin tank, the bottom plate of which is light-transmitting; a vertical lifting mechanism, which is in fixed connection with a forming platform and is used for adjusting the distance between the resin tank and the forming platform; a computer, which is used for processing a three-dimensional model and segmenting the three-dimensional model into several profile graphs with certain thickness sequentially, and is connected to an electrical control device for controlling automatic lifting of the forming platform by the vertical lifting mechanism and controlling irradiation of a DLP projector on the liquid level of light-cured resin in the resin tank; and the DLP projector, which is arranged below the resin tank and is connected to the computer, and makes the graph light path of the profile graphs transmit the bottom plate of the resin tank so as to irradiate the light-cured liquid resin. According to the invention, the DLP projection technology is adopted and the light cured material forming technology is combined to form a set for system. The system has the characteristics of simple components and compact whole structure, the formed products have improved precision, the manufacturing cost is low, and the product forming speed is faster.

A thermally-conductive interface interposable intermediate a first heat transfer surface and an opposing second heat transfer surface to provide a thermal pathway therebetween. The interface includes a thermally-conductive compound formed into a layer which is conformable between the first and second heat transfer surface. The compound is an admixture of: (a) a liquid resin constituent; and (b) a particulate filler constituent. The liquid resin constituent may be an ethylene-propylene copolymer (EPM) or a terpolymer (EPDM) of ethylene and propylene and a diene which may be ethylidene norbornene (ENB) or dicyclopentadiene (DCPD).

This invention relates to rapid prototyping systems, specifically, a continuous moving surface liquid resin system (CMSL) and fast printing method for making any 3D objects, such as dental devices, including but not limited to artificial teeth, dentures, orthodontic appliances, aligners, splints, veneers, inlays, onlays, copings, frame patterns, crowns and bridges and the like. 3D printers, such as DLP or stereolithography printer, are used to cure polymerizable material in a layer-by-layer manner to build-up the object rapidly and continuously.

A method of compression-molding light emitting elements is provided, which can efficiently prevent the formation of a resin burr on a frame on which LED chips (light-emitting elements) are mounted. A tape for resin burr prevention is adhered to a surface of the frame, i.e. the surface on which no light-emitting element is mounted, to form a tape-applied frame. The tape-applied frame is supplied and set onto a setting section of an upper die, with the LED chips directed downwards. A required amount of transparent liquid resin material is dripped by a dispenser into a large cavity including small cavities. Then, both the upper and lower dies are clamped with a required clamping pressure, whereby the LED chips are individually immersed in the resin contained in the small cavities inside the large cavity and compression-molded to form a molded frame (light emitters).

The present invention relates to a method for making nitrogenous and complex fertilizers, in granule form, suitable for slowly releasing nitrogen, comprising the steps of preparing an aqueous urea/formaldehyde dispersion with a molar ratio from 0.8:1 to 2:1, adding an aqueous catalyzer solution in a weight ratio from 0.1 to 4%, controlling the pH of the aqueous dispersion to hold it within a range from 4.0 to 7.0, and supplying the aqueous dispersion to a recirculating granulating device, as a growth seed.

A composition for use as a thermal interface material in a heat-generating electronic device is provided. The composition comprises a blend of acrylic polymer, one or more liquid resins, conductive filler particles and optionally one or more solid resins.

A method of manufacturing a ceramic discharge vessel for a lamp application is described. The method uses a low viscosity suspension of ceramic powder in a liquid resin. The discharge vessel is formed layer by layer using a stereolithography system. Preferably, the layers are formed by locally exposing the ceramic-resin mixture to a UV light source that solidifies and cures the resin only in the areas which correspond to the particular cross-sectional profile of the discharge vessel for a respective layer.