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97 results about "Liquid resin" patented technology

Ingredient mixing device for producing CIPP-ultraviolet curing repair material

The invention discloses an ingredient mixing device for CIPP-ultraviolet light curing repair material production, and particularly relates to the technical field of CIPP-ultraviolet light curing repair material.The ingredient mixing device comprises a shell, supporting frames are fixedly connected to the four corners of the lower end of the shell, and a stirring mechanism is arranged on the lower portion of the inner surface of the shell; the inner surfaces of the two circular cavities are jointly provided with a pretreatment assembly, and a premixing assembly is arranged above the stirring mechanism. According to the ingredient mixing device for production of the CIPP-ultraviolet curing repair material, the pretreatment assembly is arranged, a liquid resin material is subjected to layered swinging, scraping, runner conveying and converging mixing, and the problem that local aggregation or layered precipitation is prone to occurring due to viscosity and density differences caused by different types of liquid resin is solved; different types of liquid resins can firstly form independent thin layers, and then are gradually contacted and fused along a flowing path, so that full shearing and permeation among the liquid resins are realized, and the mixing uniformity of the liquid resins is improved.
Owner:HONGSHENGXIN NEW MATERIALS (HUBEI) CO LTD

Porous graphite, preparation method thereof, electrode and battery

The invention discloses porous graphite and a preparation method thereof, an electrode and a battery, and relates to the technical field of new energy. The preparation method of the porous graphite comprises the following steps: providing liquid resin and a liquid aromatic polymer, mixing, and sequentially carrying out heat treatment, carbonization treatment, graphitization treatment and activation treatment to obtain the porous graphite. According to the preparation method of the porous graphite provided by the embodiment of the invention, the porous graphite is prepared by taking the liquid resin and the liquid aromatic polymer as raw materials, multiple reactions of curing and aging of the resin and combination of the resin and the aromatic polymer occur in the heat treatment process, and the porous graphite is prepared in the carbonization process. Aromatic polymer molecules are rearranged into an ordered carbon layer, and resin cross-linked molecules form a hard carbon skeleton; in the graphitization process, the ordered carbon layer forms a graphite-like carbon layer, and the order degree of the hard carbon skeleton is not changed; in the activation process, the graphite-like carbon layer is difficult to etch, the hard carbon skeleton participates in the reaction to form a pore structure, and finally the porous graphite is prepared.
Owner:HUNAN SHINZOOM TECH

Aviation composite material paddle and preparation method thereof

The invention discloses an aviation composite material paddle and a preparation method thereof, and the preparation method comprises the following steps: curing a carbon fiber prepreg by using a mold pressing process to prepare a carbon beam as a main bearing structure; a carbon beam and a light core material are used as internal supports through a three-dimensional weaving technology, a skin is formed through wrapping and weaving, and an integrated fiber prefabricated body is obtained; preparing a toughened resin system for RTM (resin transfer molding), wherein the toughened resin system comprises liquid resin capable of being thermally cured, a curing agent and a carbon nanotube subjected to surface chemical modification; and placing the fiber preform in a mold, closing the mold, injecting the toughened resin system into a mold cavity, curing, and demolding to obtain the aviation composite material paddle. According to the invention, the preparation of the composite material paddle with high surface precision, light overall weight and excellent impact toughness is realized, and the preparation method is good in process repeatability and suitable for batch production.
Owner:JIANGSU AOSHENG AVIATION COMPOSITE MATERIALS CO LTD

Quantum-dot light conversion film, preparation method and application thereof and Anti-ultraviolet blue-free yellow light for chip process

A quantum-dot light conversion film, a preparation method and an application thereof and an anti-ultraviolet blue-free yellow light for chip manufacturing are provided. The preparation method includes: (1) mixing a quantum-dot concentrate with an acrylic monomer, then adding high polymer for secondary mixing, to obtain a polymer; (2) after mixing the polymer and nanoparticles, adding additives for dispersion to obtain a light conversion liquid resin; and (3) coating and curing the light conversion liquid resin to obtain a quantum-dot light conversion film. The light conversion film has high light conversion efficiency, adjustable emission peak position and narrow half peak width. Its surface forms a tightly arranged high refractive index microlens structure. When the light reaches the microlens array, as the light output surface is a lens structure and the refractive index is improved, more light is emitted in the positive direction, thereby effectively improving the light output rate.
Owner:TAIJIA CORP

Liquid resin composition

A liquid resin composition includes: (a) a resin making up 20-80 wt % of the liquid resin composition, wherein the resin is selected from the group consisting of a self-crosslinking acrylic resin and a polyurethane resin, and the glass transition temperature (Tg) of the resin is in the range from −20° C. to 25° C.; (b) thermal shielding particles making up 1-10 wt % of the liquid resin composition; and (c) a water-based solvent making up 5-25 wt % of the liquid resin composition. The film is formed by coating the substrate with the liquid resin composition and drying the liquid resin composition on the substrate. A film formed of the liquid resin composition of the present invention can block out IR and UV radiation while remaining highly permeable to visible light, meaning the film can ward off the radiant heat and UV radiation of sunlight but is still visually transparent.
Owner:SWANSON TECH CORP

Method for forming a decorative furniture panel

ActiveFR3153560B1PolishingAdhesive glue
The invention relates to a method for forming a decorative panel (10) for furniture, comprising the following steps: Providing (100) a base plate (1) defined by a lower wall (11) and an upper wall (12) and having several lateral faces (13); Providing (200) a frame (2), said frame (2) defining a central opening (21) of a shape substantially complementary to that of the base plate (1); Arranging (300) the base plate (1) inside the central opening (21) of the frame (2), so that the frame (2) surrounds the lateral faces (13) of the base plate (1) and defines a filling cavity (22) above the upper wall (12) of the base plate (1); Fixing the frame (2) to the base plate (1); Applying glue or an adhesive to the upper wall (12) of the base plate. base (1), the glue or adhesive being suitable for ensuring the adhesion of a layer of terrazzo (3) to the base plate (1);Deposition (400) of a terrazzo layer (3) formed from a mixture of liquid cement or liquid resin and aggregates of materials inside the filling cavity (22) until the terrazzo layer (3) is flush with an upper edge (23) of the frame (2); Drying (500) of the terrazzo layer (3) so as to solidify the cement or resin; Sanding (600) of the terrazzo layer (3) and the frame (2) until a smooth upper surface and a predetermined thickness are obtained; Polishing and then preferably application of a waterproof protective layer on the upper surface of the terrazzo layer (3). Figure 1;
Owner:REY-IVAN YASHA

High-shear-strength conductive silver adhesive and preparation method thereof

The invention relates to the technical field of conductive silver adhesives, in particular to a high-shear-strength conductive silver adhesive and a preparation method thereof.The high-shear-strength conductive silver adhesive is prepared from, by weight, 40-70 parts of conductive silver powder, 10-30 parts of epoxy resin, 2-10 parts of modified liquid resin, 3-10 parts of reactive diluent and 4-8 parts of curing agent. The liquid resin is modified by introducing the silallyl compound containing Schiff base, and the proportion of each component is accurately regulated and controlled, so that the conductive silver adhesive with high shear strength and excellent conductivity is successfully prepared, and the conductive silver adhesive has a wide application prospect in the field of high-end electronic packaging.
Owner:HENGHE MATERIALS & SCI TECH CO LTD

Decorative article having metallic texture

ActiveJP2026013492AArtificial flowers and garlandsBroochesPolymer scienceGel nails
To provide a decorative article having a metallic texture which can be hand-made in particular SOLUTION: The ornament is characterized in that a fiber material such as a patterned cloth is used as a base material, and a plurality of kinds of liquid materials for nail art are recoated so as to cover the base material and finished into a metallic texture. The liquid material for nail art includes a nail polish for undercoating, a plurality of kinds of gel nails for recoating, and a resin liquid, which are applied to the surface of the base material and cured by irradiation with ultraviolet rays to impart a metallic texture to the base material.SELECTED DRAWING: Figure 1
Owner:金益 装子

Device and method for measuring mining-induced stress, temperature and water pressure of mine

The invention relates to the technical field of mine safety monitoring, and discloses a device and method for measuring mining-induced stress, temperature and water pressure of a mine, the device comprises a high-strength metal shell, a hollow connecting rod, a water pressure measuring unit, a strain measuring unit, a temperature measuring unit and a single through optical fiber, and the surface of the shell is provided with a spiral resin grouting channel; a mechanical occlusion structure is constructed through a solid resin entity, and rock mass displacement is equivalently transmitted to a shell. The temperature compensation fiber bragg grating is coated with a heat insulation coating, in-situ rigid coupling is achieved by injecting liquid resin into a grouting channel, the central wavelength peak value of each grating is obtained through the wavelength division multiplexing technology, the environment temperature variable quantity is extracted based on the temperature compensation fiber bragg grating, and therefore the thermally induced drift distance of the strain grating is deducted, and the compensated strain value is obtained. And inverting and outputting the in-situ three-dimensional mining-induced stress state by mapping the constitutive equation set. According to the invention, synchronous high-fidelity acquisition of multi-physics field parameters is realized, and the intrinsic safety characteristic and the electromagnetic immunocompetence are realized.
Owner:CHINA COAL RES INST

Blast furnace stemming and preparation method thereof

The invention discloses blast furnace stemming and a preparation method thereof. The invention discloses a high-temperature-resistant wear-resistant coating which is characterized by comprising the following components in parts by weight: 380-420 parts of brown aluminum oxide, 70-90 parts of a carburant, 50-70 parts of Guangxi white mud, 110-150 parts of silicon carbide, 15-30 parts of asphalt powder, 5-30 parts of vanadium carbide or chromium carbide or a mixture of vanadium carbide and chromium carbide or pore-forming vanadium chromium carbide and 50-100 parts of liquid resin. The blast furnace stemming disclosed by the invention has relatively high high-temperature breaking strength, normal-temperature compression strength and normal-temperature breaking strength, and excellent slag and molten iron erosion resistance and molten iron scouring resistance.
Owner:PUYANG REFRACTORIES GRP CO LTD

WAFER PROCESSING PROCESS

ActiveDE102018206483B4WaferingAdhesive
Wafer processing method comprising: a protective film provisioning step with a provision of a protective film (21) on the front face (11a) of a wafer (11) having a component area (11d) where a plurality of components (15) are formed, each having a bump, and a circumferential edge area (11e) surrounding the component area (11d) in the state in which the component area (11d) is covered with the protective film (21), and then bringing the protective film (21) into close contact without adhesive with the front face (11a) of the wafer (11) in order to follow the shape of the bump;a wafer unit formation step comprising applying a liquid resin (25), which is curable by an external stimulus, to the front side (11a) of the wafer (11) and then curing the liquid resin (25) by applying the external stimulus to form a protective element (27) that covers the protective film (21) and the peripheral edge region (11e) of the wafer (11), thereby forming a wafer unit constructed with the wafer (11), the protective film (21) and the protective element (27) in the state in which the front side (11a) of the wafer (11) is covered with the protective element (27); a grinding step comprising holding the protective element (27) of the wafer unit against a holding surface (44a) of a clamping table (44) and then grinding the rear side (11b) of the wafer (11) of the wafer unit to thereby to reduce the thickness of the wafer (11);and a peeling step involving peeling the protective element (27) and the protective film (21) from the wafer (11), which is reduced in thickness.;
Owner:DISCO CORP

Liquid resin composition and resin-encapsulated power module

PendingJP2026075792AEpoxyPolymer science
This invention provides a liquid resin composition for use in encapsulating power modules by casting, which offers an excellent balance between high-temperature storage characteristics and flame retardancy. [Solution] A liquid resin composition used for sealing a power module by casting, comprising a power module substrate on which a circuit layer is formed, and a power semiconductor element mounted on the circuit layer of the power module substrate, The liquid resin composition, epoxy resin, inorganic fillers, and Contains flame retardant, The flame retardant is a halogenated compound having a melting point of 250°C or higher and 600°C or lower. Liquid resin composition.
Owner:SUMITOMO BAKELITE CO LTD

Insulating tape, insulating coil, rotating machine, and insulating coil manufacturing method

An insulating tape (100) is impregnated with a liquid resin containing at least one of a bisphenol A-type epoxy compound having a repeating number of zero and a bisphenol F-type epoxy compound having a repeating number of zero. A microcapsule (130) includes an outer shell body and an inclusion material having a property of promoting curing of the liquid resin. A binder layer (120) is composed of a crystalline epoxy resin having a molecular structure in which two phenyl groups are linked by a single bond, a molecular structure in which two phenyl groups are linked by an ether bond, or a molecular structure in which two phenyl groups are linked by a methylene group.
Owner:MITSUBISHI ELECTRIC CORP

Fiber band and preparation method thereof

The invention provides a fiber belt and a preparation method thereof. The fiber band comprises a carbon fiber layer, wherein an emulsion setting agent is filled in a gap in the carbon fiber layer; the toughening layer is bonded to the surface of at least one side of the carbon fiber layer through a setting agent; the setting agent comprises an irregular flaky powder setting agent. According to the fiber belt provided by the invention, the fiber belt is shaped from the interior / interlayer of the fiber belt, so that the fiber belt has moderate viscosity, flexibility, dimensional precision, cutting property and strength, can keep a stable shape in the conveying process, and resists excessive sagging caused by self gravity and distortion caused by external disturbance. And when the carbon fiber composite material preform is prepared, the low-viscosity liquid resin can quickly and uniformly permeate into the whole preform from the flow channel in the fiber belt, so that the glue injection and curing time is shortened, and the production efficiency is improved.
Owner:ZHONGFU SHENYING (SHANGHAI) TECH CO LTD

Method for determining the curing of liquid resin, apparatus for forming protective member, and method for forming protective member

To provide a liquid resin curing determination method capable of surely determining that a liquid resin has been cured.SOLUTION: When determining whether a liquid resin has been cured by applying an external stimulus to the liquid resin (31, 33) spread over the entire surface of one side (Wb) of a wafer (W), a vertical load (Q) on one side of the wafer is detected so as to be capable of detecting shrinkage of the liquid resin when the liquid resin is cured, and when the load becomes smaller than a preset threshold value (Qe), it is determined that the liquid resin has been cured.SELECTED DRAWING: Figure 9
Owner:DISCO CORP

Sample holder for carbon fiber monofilament sample

The invention discloses a sample rack for a carbon fiber monofilament sample. The sample rack comprises a support composed of a rack body, a plurality of fixing grooves formed in the rack body, a marking part and a measuring part. The fixing groove comprises a first groove body and a second groove body which are formed in the first side wall and the second side wall of the frame body respectively, and the depth of the first groove body is smaller than that of the second groove body. The depth of the first groove body is set to be smaller than that of the second groove body, so that the fibers can generate a certain inclination after being put into the fixing groove, and after liquid resin is dropped onto the fibers, the liquid resin can be agglomerated into balls under the action of gravity. And the marking part is arranged, so that the middle position of the fiber can be prompted, and the liquid resin can be dropped at the middle position of the fiber. Meanwhile, by limiting the measuring part, the size of the formed liquid resin ball can be directly measured so as to check whether the manufactured carbon fiber monofilament sample is qualified or not. The purpose of integrating the functions of carbon fiber monofilament sample manufacturing, inspection and collection on the same equipment is achieved.
Owner:ZHONGFU SHENYING CARBON FIBER

Liquid resin composition and semiconductor device

PCT designated stageWO2026014339A1EpoxyPolymer science
The present disclosure provides a liquid resin composition with which it is possible to achieve high photo-curability and a reduction in the linear expansion coefficient of a cured product. The liquid resin composition contains a cationically polymerizable component (A), a photocationic polymerization initiator (B), and an inorganic filler (C). The cationically polymerizable component (A) includes a polyfunctional cationically polymerizable compound (A1) and a monofunctional cationically polymerizable compound (A2). The polyfunctional cationically polymerizable compound (A1) comprises at least one selected from the group consisting of a polyfunctional oxetane compound (A11) and a polyfunctional alicyclic epoxy compound (A12).
Owner:PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD

Low-speed wire-feeding working fluid resin filter

The utility model discloses a low-speed wire-feeding processing liquid resin filter which comprises an outer cylinder body, a bottom support, a tray, a resin carrying frame, a water injection pipe, an upper carrying plate, a lower carrying plate, a telescopic corrugated pipe, a plugging plate, a connector, a guide rod and a flow dividing head, the resin carrying frame is arranged in the outer cylinder body, and the bottom support is fixedly installed at the bottom of the outer cylinder body in a sealing mode through a flange structure; and the lower part of the resin carrying frame is arranged on the tray. According to the filter, the water injection pipe and the flow dividing head are controlled to reciprocate up and down, so that processing liquid sprayed by the flow dividing head can be in circulating contact with resin with different heights in the annular resin accommodating area, the resin with the different heights can be fully used, and the utilization rate of the resin is increased; by arranging the telescopic corrugated pipe, the requirement for the sliding sealing performance of the water injection pipe and the top of the outer barrel can be lowered, and normal use of the filter is not affected even if linear leakage occurs between the water injection pipe and the top of the outer barrel.
Owner:SUZHOU LONGKAI ELECTROMECHANICAL TECH CO LTD

Liquid resin composition, semiconductor sealing material, underfill material, and semiconductor device

The present disclosure provides a liquid resin composition that has high fluidity at high temperature and can suppress abnormalities of appearance and breakage of a cured product when exposed to high temperature. A liquid resin composition contains a liquid epoxy compound (A), a liquid aromatic amine compound (B), an inorganic filler (C), a stress-lowering agent (D), and a fluidity-increasing agent (E). The stress-lowering agent (D) contains an epoxidized fatty acid ester compound (D-1). The fluidity-increasing agent (E) contains at least one selected from the group consisting of compounds (E-1) that have a quaternary phosphonium cation structure and compounds (E-2) that have a silicate anion structure.
Owner:PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD

Resin-recoverable photocuring 3D printer

The invention relates to the field of photocuring 3D printing, and discloses a resin recoverable photocuring 3D printer which comprises a printing mechanism comprising an equipment body, a frame body, a lifting screw rod, a fixing rod and a forming platform, a scraping and collecting mechanism comprising a cleaning motor, a cleaning screw rod, a sliding ring, a scraper, an extension rod and a collecting tank, and a recovery filtering mechanism comprising a filter screen and a filter screen handle. Through bidirectional arrangement of a scraper, liquid and solid resin attached to the bottom of a forming platform can be scraped back and forth under rotation of a cleaning lead screw, the cleaning efficiency and effect are improved, through arrangement of a fixed supporting rod, a collecting tank can be supported to be flat, the liquid and solid resin can be collected, and when a sliding ring drives the collecting tank to reach the tail end of the fixed supporting rod, the liquid and solid resin can be collected. Through the arrangement of an extension rod and a rotary connecting block, the collecting tank is changed into a vertical state under the action of gravity, the collected liquid resin and solid resin are poured into a filter screen, the liquid resin flows into the resin tank through the side wall of the filter screen, and the solid resin is left in the filter screen to be collected.
Owner:HANGZHOU HIMALAYA INFORMATION TECH

Preparation method of sealing ring, groove milling device and sealing ring

The invention discloses a preparation method of a sealing ring, a groove milling device and the sealing ring, and relates to the technical field of sealing element treatment, and the preparation method comprises the following steps: uniformly mixing raw materials prepared according to the proportion; the mixed materials are injected into a mold, and the mold is placed in a high-temperature shaping device to be formed; the formed mold is subjected to demolding treatment, and a blank is obtained; the top face of the blank is subjected to groove milling treatment, and the sealing ring is obtained; wherein the raw materials adopt a liquid resin material and an additive. The sealing element is prepared by directly mixing the raw materials and then performing high-temperature shaping, the whole process is relatively simple, and the working efficiency is relatively high.
Owner:XUZHOU TELIYOU NEW MATERIAL TECH CO LTD

Silicone release coatings using liquid resins

PCT designated stageWO2026096100A1CoatingsPolymer sciencePtru catalyst
An article includes a substrate and a curable silicone release coating composition; wherein the curable silicone release coating composition is a film that has a thickness of 2 micrometers or less and coats at least part of at least one surface of the substrate; and wherein the curable silicone release coating composition contains the following components: (a) an alkenyl-functional organopolysiloxane; (b) a silylhydride-functional organopolysiloxane; (c) a hydrosilylation catalyst; (d) a hydrosilylation inhibitor; and (e) a liquid silicone resin having an average chemical structure (I): [R3SiO1 / 2]a[R2R'SiO1 / 2]b[R2SiO2 / 2]c[R'SiO3 / 2]d[RSiO3 / 2]eXz with a weight-average molecular weight that is 10,000 grams per mole or less.
Owner:DOW SILICONES CORP

Resin material supply device, resin material supply method, resin material supply program, device for manufacturing resin molded article, and method for manufacturing resin molded article

The present invention relates to a resin material supply device for discharging a liquid resin material along a predetermined path with respect to an object, the resin material supply device being provided with: a housing unit for housing the resin material and having a discharge unit for discharging the resin; an extrusion member disposed in the accommodating portion and configured to extrude the resin material from the discharge portion; a moving mechanism for relatively moving the accommodating part in the in-plane direction of the surface of the object; and a control unit for controlling the extrusion member and the movement mechanism, the control unit being configured to discharge the resin material remaining in the accommodating part while moving the accommodating part along the path after the extrusion member has completed a movement of a predetermined extrusion distance.
Owner:TOWA

Protective member forming apparatus and method of forming protective member

A protective member forming apparatus includes a resin film adhering unit which causes a resin film to adhere to a front surface of a substrate so as to conform to recesses and projections on the front surface of the substrate, a support table which supports the substrate, a liquid resin supplying unit which supplies a curable liquid resin, a pressing unit which covers the liquid resin supplied to the resin film with a cover film and presses the cover film by a pressing surface to spread the liquid resin over the resin film, and a curing unit which cures the liquid resin being spread. The support table includes an annular bank region having a height not exceeding a thickness of the substrate and housing the substrate therein, and the bank region prevents the liquid resin to be spread by the pressing unit from flowing out from the substrate.
Owner:DISCO CORP

Method for improving interlayer bonding strength of 3d printed parts based on dynamic crosslinking, shaped parts and applications

PendingCN122353919APolymer sciencePolyolefin
This invention relates to the field of additive manufacturing materials technology, and in particular to a method for improving the interlayer bonding strength of 3D printed materials based on dynamic crosslinking, as well as the resulting molded components and applications. The raw material composition includes 100 parts of thermoplastic polymer, 1-10 parts of epoxy-grafted monomer, 0.05-0.5 parts of initiator, 1-8 parts of crosslinking agent, and 0.1-3 parts of transesterification catalyst. This invention solves the problems of low Z-axis strength, severe anisotropy, difficulty in maintaining the molded morphology during post-processing, and severe warping deformation in thermoplastic 3D printed products. It overcomes the current situation where existing dynamic covalent bond (glass-like) modification technologies mostly rely on UV curing or liquid resin precursors. Simultaneously, it overcomes the technical challenge of extending dynamic crosslinking technology to the melt deposition and molten particle manufacturing processes of thermoplastic polymers such as polyolefins and thermoplastic polyurethanes.
Owner:BEIJING UNIV OF CHEM TECH

Liquid forming vari process resin flow optical fiber monitoring method

ActiveCN117207555BFiberPhysical chemistry
The application discloses a liquid forming VARI process resin flow optical fiber monitoring method, which comprises the following steps: step 1, calculating the strain sensitivity coefficient of each grating in the optical fiber; step 2, in the process of laminating and pasting to form the fiber preform, selecting two adjacent fibers in each layer of fiber woven cloth to be monitored, and inserting an optical fiber between the two selected adjacent fibers; step 3, performing the liquid forming VARI process, under the action of vacuum negative pressure, the liquid resin and the curing agent mixture infiltrate the fiber preform, the real-time strain of the position of each grating is obtained according to the position information of each grating and the strain sensitivity coefficient of each grating, and the real-time three-dimensional resin flow front inside the fiber preform is determined. The application realizes real-time monitoring of internal flow field information under the condition that the influence on the fiber preform is minimum, so as to perform feedback control on process parameters such as injection pressure and injection port position, ensure the product quality, and further realize intelligent manufacturing of the composite material.
Owner:WUHAN UNIV OF TECH

Preparation method of C5 alkylene high-viscosity low-molecular-weight liquid resin

The invention relates to a preparation method of C5 alkylene high-viscosity low-molecular-weight liquid resin, which comprises the following steps: (1) mixing petroleum cracked C5 monoolefine, m-pentadiene and a dechlorination solvent, adding the mixture into a continuous kettle, synchronously introducing boron trifluoride gas as a catalyst, reacting at 0-30 DEG C, and collecting the discharged material to obtain a pre-product; and (2) adding organic alcohol, stirring, separating out an organic phase, and carrying out reduced pressure distillation to obtain the liquid resin. By optimizing raw material selection, adopting a proper solvent, utilizing boron trifluoride gas for continuous catalysis and improving a catalyst quenching mode, many problems in liquid resin synthesis in the prior art are solved, a liquid resin product with excellent performance is prepared, the requirement of the market for high-quality liquid resin is met, and the method is suitable for industrial production. And the market competitiveness of the product in related fields is improved.
Owner:HENGHE MATERIALS & SCI TECH CO LTD

Semiconductor package structure and method for producing the same

A semiconductor package structure and a method for producing the same are provided. The package structure includes a support substrate, a chip body disposed on the support substrate, a metal lead connected between the support substrate and the chip body, a spacer element disposed on the chip body, and a light-transmitting plate disposed on the chip body through the spacer element. The chip body, the spacer element, and the light-transmitting plate jointly define a closed space. The package structure further includes an encapsulation colloid formed on outsides of the closed space. The encapsulation colloid is formed by curing a liquid resin encapsulant and includes a plurality of first fillers and a plurality of second fillers dispersed therein. Before the liquid resin encapsulant is cured, a sinking rate of each of the second fillers in the liquid resin encapsulant is less than that of each of the first fillers.
Owner:TONG HSING ELECTRONICS IND LTD