Composite material, high-frequency circuit substrate therefrom and manufacture method thereof

Abstract

The invention relates to a composite material, a high-frequency circuit substrate therefrom and a manufacture method thereof. The composite material comprises thermoset mixture, glass fiber cloth, power filler, a fire retardant and a curing initiator, wherein the thermoset mixture comprises more than one kind of vinyl liquid resin and polyphenyl ether resin; the molecular weight of the vinyl liquid resin is below 10000, and the vinyl liquid resin is provided with a polar functional group; the molecular weight of the polyphenyl ether resin is less than 5000, and the molecular tail end of the polyphenyl ether resin is provided with unsaturated double bonds. The high-frequency circuit substrate manufactured with the composite material comprises multiple layers of semi-solidified sheets and copper foils, wherein the semi-solidified sheets are mutually overlaid, and the copper foils are respectively pressed on two sides. The composite material disclosed by the invention causes the semi-solidified sheets to be easily manufactured and have high adhesive bonding force with the copper foils. The high-frequency circuit substrate manufactured by the material has the advantages of low dielectric constant, low dielectric loss angle tangent, good heat resistance and simple technical operation. Thus, the composite material disclosed by the invention is suitable for manufacturing the circuit substrate of the high-frequency electronic equipment.

Description

technical field [0001] The invention relates to a composite material, a high-frequency circuit substrate made with it and a manufacturing method thereof, in particular to a thermosetting dielectric composite material, a high-frequency circuit substrate made with it and a manufacturing method thereof. Background technique [0002] In recent years, with the development of high-performance, high-functionality and networking of computers and information communication equipment, in order to transmit and process large-capacity information at a high speed, the operating signal tends to be high-frequency, so the material of the circuit board is required. [0003] Among the existing materials for printed circuit boards, epoxy resins with excellent adhesive properties are widely used. However, epoxy resin circuit boards generally have high dielectric constants and dielectric loss tangents (dielectric constants greater than 4, dielectric The loss tangent is about 0.02), the high-freque...

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Problems solved by technology

[0004] PCT patent (WO97 / 38564) uses a non-polar tetrapolymer of styrene, butadiene and divinylbenzene to add magnesium aluminosilicate filler, and a circuit substrate made of glass fiber cloth as a reinforcing material, although the dielectric Excellent performance, but the heat resistance of the substrate is poor, the glass transition temperature is only about 100°C, and the thermal expansion coefficient is very large, it is difficult to meet the high temperature (above 240°C) requirements of the lead-free process in the PCB manufacturing process

[0005] U.S. Patent (US5571609) adopts low molecular weight 1,2-polybutadiene resin or polyisobutadiene with molecular weight less than 5000, and high molecular weight butadiene and styrene copolymer, and adds a large amount of silicon micropowder As a filler, the circuit substrate made of glass fiber cloth as a reinforcing material has excellent dielectric properties, but because high molecular weight components are used in this patent to improve the stickiness of the prepreg, the process performance of the process of making the prepreg is deteriorated. ; and because the proportion of rigid benzene rings in the resin molecules of the entire resin system is very small, and most of the chain segments after crosslinking are composed of methylene groups with very low rigidity, the rigidity of the plate made is not good, and the bending strength is very low. Low

[0006] U.S. Patent (US6569943) uses amino-modified liquid polybutadiene resin with vinyl groups at the end of the molecule, adds a large amount of low-molecular-weight monomer (dibromostyrene) as curing agent and diluent, and impregnates glass fiber cloth Although the produced circuit substrate has good dielectric properties, because the resin system is liquid at room temperature, it cannot be made into a non-sticky prepreg. Therefore, it is difficult to use the general prepreg stacking process when pressing the board. Process operation is more difficult

[0007] Chinese patent CN1280337C uses polyphenylene ether resin with unsaturated double bonds at the end of the molecule, and adopts low-molecular-weight vinyl monomers (such as dibromostyrene) as curing agent, but because these low-molecular-weight monomers have low boiling point , it will volatilize during the drying process of impregnated glass fiber cloth to make prepreg, so it is difficult to ensure sufficient curing agent dosage

In addition, although this patent mentions that polybutadiene resins can be used to modify the viscosity of the system, it does not clearly propose the use of polybutadiene resins with polar groups and the use of polybutadiene resins with polar groups. Diene resin to improve peel strength

[0008] The above-mentioned patents also have a prominent problem, that is, the peel strength of the produced copper clad sheet is low (less than 0.8N / mm), which makes the produced copper clad sheet in the process of PCB circuit processing And the risk of wire falling off during equipment use

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