Halogen-free fire-retardant high heat conducting insulating resin composition and heat dissipation metal-base copper clad plate

Abstract

The invention discloses a halogen-free fire-retardant high heat conducting insulating resin composition and a heat dissipation metal-base copper clad plate (CCL). The composition comprises the following components in parts by weight: 10-45 parts of halogen-free epoxy resin, 0-15 parts of thermoplastic resin and/or synthetic rubber, 0.1-5 parts of curing agent, 0.02-1 parts of accelerator, 0.5-1 parts of antioxidant and 25-80 parts of heat conducting filler. The halogen-free fire-retardant high heat conducting insulating resin composition of the invention adopts high heat conducting filler, and the cured composition shows good thermal conductivity, electric insulativity and welding heat resistance as well as high adhesive force. The invention also discloses a heat dissipation metal-base CCL prepared by using the above halogen-free fire-retardant high heat conducting insulating resin composition, which has high thermal conductivity and high peel strength, does not have the problems of peel-off and deterioration even being subjected to thermal cycle of quick heating and quick cooling, and also has high electrical breakdown resistance, good heat resistance and soldering resistance and the like, and the flame retardant rating of the heat dissipation metal-base CCL reaches UL-94V0.

Description

technical field [0001] The invention relates to a halogen-free flame-retardant high-thermal-conduction insulating resin composition, and the invention also relates to a heat-dissipating metal-based copper-clad board made of the halogen-free flame-retardant high-thermal-conduction insulating resin composition. Background technique [0002] With the rapid development of the electronics industry, the size of electronic products is getting smaller and smaller, and the power density is getting higher and higher. Solving the problem of heat dissipation is a huge challenge for the design of the electronics industry. Metal-based copper clad laminate is undoubtedly one of the effective means to solve the problem of heat dissipation. Metal-based copper clad laminate is a copper clad laminate with good heat dissipation function. It is composed of a unique three-layer structure, which are circuit layer, thermal insulation layer and metal base layer. The working principle of the metal-b...

AI Technical Summary

Problems solved by technology

At present, due to the constraints of various factors such as their own technology, equipment, materials and funds, many metal substrate manufacturers use commercialized FR-4 prepreg or FR-4 based copper clad laminates (the thermal conductivity is only 0.3) for their insulating layers. w / m K), there is no thermal conductive filler added to the insulating layer, therefore, the thermal conductivity of this metal-based copper clad laminate is very poor, and it does not have high-strength electrical insulation properties

Ceramic-based copper-clad laminates with high thermal conductivity have high manufacturing costs and difficulty in production, and it is difficult to popularize them for special materials.

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