The invention relates to a method for sealing a substrate, comprising at least steps 1) and 3), by applying at least part of a
solvent-based composition to a surface of the substrate to at least part form a film (1) on said surface, applying at least part of a
sealant composition to the film obtained after step 1) to form a
sealant film (3), wherein the
sealant composition is obtainable by mixing at least two components A) and B) of a sealing
system, which are present separately, with one another, the
solvent-borne composition applied in step 1) comprising at least one
aliphatic hydrocarbon as an
organic solvent component a1) in an amount of at least 70.0 wt.-%, based on the total weight of the composition, at least one organometallate as component a2) in an amount of at least 70.0 wt.-%, based on the total weight of the composition, the present invention relates to a method for preparing a
solvent-borne composition comprising at least one
metal acid salt, the
metal of which is selected from Ti and Zr, and at least one organosilane as component a3), sealing substrates obtainable by this method, the use of this solvent-borne composition as an adhesion promoting composition, the solvent-borne composition itself, and a kit comprising said solvent-borne composition.