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36 results about "Hildebrand solubility parameter" patented technology

The Hildebrand solubility parameter (δ) provides a numerical estimate of the degree of interaction between materials and can be a good indication of solubility, particularly for nonpolar materials such as many polymers. Materials with similar values of δ are likely to be miscible.

Solution Based Enhancements of Fuel Cell Components and Other Electrochemical Systems and Devices

This invention relates in general to components of electrochemical devices, and to methods of preparing the components. The components and methods include the use of a composition comprising an ionically conductive polymer and at least one solvent, where the polymer and the solvent are selected based on the thermodynamics of the combination. In one embodiment, the invention relates to a component for an electrochemical device which is prepared from a composition comprising a true solution of an ionically conductive polymer and at least one solvent, the polymer and the at least one solvent being selected such that |δ solvent−δ solute|<1, where δ solvent is the Hildebrand solubility parameter of the at least one solvent and where δ solute is the Hildebrand solubility parameter of the polymer. In another embodiment, the invention relates to a method of improving at least one property of a component for an electrochemical device or at least one property of the electrochemical device, the method comprising preparing the component from a composition comprising a true solution of an ionically conductive polymer and at least one solvent, the polymer and the at least one solvent being selected such that |δ solvent−δ solute|<1, where δ solvent is the Hildebrand solubility parameter of the at least one solvent and where δ solute is the Hildebrand solubility parameter of the polymer.
Owner:BATTELLE MEMORIAL INST

Thermosettable pressure sensitive adhesive

The invention refers to a photopolymerizable precursor of a pressure-sensitive thermosettable adhesive, said precursor comprising: (i) from about 30% to about 80% by weight with respect to the mass of the precursor of a photopolymerizable component, comprising a monomeric or prepolymeric syrup, said component exhibiting an overall solubility parameter of between 10 and 11 and comprising (A) at least 30% by weight with respect to the mass of the photopolymerizable component (i) of one or more ethylenically unsaturated monomers with a solubility parameter of between 10 and 11.5 and less than 10% by weight with respect to the mass of component (i) of one or more ethylenically unsaturated compounds with a solubility parameter of more than 11.5, or (B) at least 50% by weight with respect to the mass of the photopolymerizable compound (i) of one or more ethylenically unsaturated monomers with a solubility parameter of between 9.5 and 11.5 and 10-30% by weight with respect to the mass of the photopolymerizable component (i) of one or more ethylenically unsaturated compounds with a solubility parameter of between 11.5 and 12.5 provided that in case (B) the precursor comprises between 3-15% by weight with respect to the mass of the precursor of one or more polymers with a solubility parameter of 10-12.5; (ii) from about 20 to about 70% by weight with respect to the mass of the precursor of one or more epoxy resins and / or monomers; (iii) an effective amount of a photoinitiator; and (iv) an effective amount of one or more nucleophilic latent hardeners for the epoxy resins and / or epoxy-containing monomers which are selected to provide an onset temperature of the epoxy curing reaction of between 40-100° C. when subjecting the adhesive to a DSC scan at a rate of 20° C. / min. The invention furthermore refers to thermosettable adhesives which are obtainable by photopolymerization of said precursor and to thermoset adhesives which are obtainable by thermal curing of said thermosettable adhesives. The thermosettable adhesive of the invention is particularly useful for bonding a plastic substrate to other substrates such as metal, glass, ceramic, wood and plastics.
Owner:MINNESOTA MINING & MANUACTURING

Solution based enhancements of fuel cell components and other electrochemical systems and devices

This invention relates in general to components of electrochemical devices, and to methods of preparing the components. The components and methods include the use of a composition comprising an ionically conductive polymer and at least one solvent, where the polymer and the solvent are selected based on the thermodynamics of the combination. In one embodiment, the invention relates to a component for an electrochemical device which is prepared from a composition comprising a true solution of an ionically conductive polymer and at least one solvent, the polymer and the at least one solvent being selected such that |δ solvent−δ solute|<1, where δ solvent is the Hildebrand solubility parameter of the at least one solvent and where δ solute is the Hildebrand solubility parameter of the polymer. In another embodiment, the invention relates to a method of improving at least one property of a component for an electrochemical device or at least one property of the electrochemical device, the method comprising preparing the component from a composition comprising a true solution of an ionically conductive polymer and at least one solvent, the polymer and the at least one solvent being selected such that |δ solvent−δ solute|<1, where δ solvent is the Hildebrand solubility parameter of the at least one solvent and where δ solute is the Hildebrand solubility parameter of the polymer.
Owner:BATTELLE MEMORIAL INST
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