33 results about "Acid dissociation constant" patented technology

The present invention relates to an etching solution capable of forming a good etching surface on the surface of a copper-containing metal layer while controlling the etching amount, and a method for manufacturing a semiconductor device using the same. This etching solution is used to etch the surface of a copper-containing metal layer, and is characterized by containing, based on the total amount of the etching solution, (A) more than 0.1% by mass but not more than 0.5% by mass of hydrogen peroxide, (B) 0.01-20% by mass of an organic acid having a minimum acid dissociation constant pKa of 2.0 or more, (C) 0.010-0.3% by mass of a nitrogen-containing heterocyclic monocyclic compound, and (D) water, in the etching solution, the content of inorganic acid is less than 0.1% by mass.

The present invention relates to a trivalent chromium surface treatment agent for aluminum or aluminum alloy, and the preparation and use thereof. The present invention provides a trivalent chromium surface treatment agent for aluminum or aluminum alloy, starting materials thereof comprising: a) a hexavalent chromium compound; b) an organic reducing agent, containing a primary hydroxyl group, a secondary hydroxyl group and / or a phenolic hydroxyl group; c) hydrofluoric acid; d) an inorganic acid, having an acid dissociation constant pKa that is less than the pKa of hydrofluoric acid; wherein the ratio of Cr in the hexavalent chromium compound to the maximum number of moles of electrons theoretically provided by the organic reducing agent is 1.0: 3.0 -5.0; the trivalent chromium being obtained by in-situ reduction of the hexavalent chromium compound.

A photoresist developer includes a solvent having Hansen solubility parameters of 15<δd<25, 10<δp<25, and 6<δp<30; an acid having an acid dissociation constant, pKa, of −15<pKa<4, or a base having a pKa of 40>pKa>9.5; and a chelate.

The application provides a patterning material and substrate interlayer composition, application and device thereof, and the composition comprises a main resin A, a main resin B, a thermal acid generator and a solvent; the acid dissociation constant pKa of the conjugated acid corresponding to the anion in the thermal acid generator is lower than -3; the main resin A and the main resin B both contain crosslinkable groups and are crosslinked at 150-300 DEG C; and the molar ratio of the crosslinkable groups in the main resin A to the crosslinkable groups in the main resin B is 1:0.6-1.3. In the application, the main resin A and the main resin B control the molar ratio of the crosslinkable groups in the two resins under the thermal acid generator and at 150-300 DEG C, realize a high crosslinking state, avoid the falling phenomenon of the upper patterning material, and can form a strong crosslinking structure on various substrates and are suitable for use.

To provide a manufacturing method that enables the precise and rapid production of a component having a recessed structure that closely resembles a vertical structure. [Solution] A manufacturing method according to one embodiment of the present invention is a method for manufacturing a member having a recessed structure, comprising: a first step of preparing a workpiece containing an element whose fluoride boiling point is 550°C or lower; a second step of forming a catalyst material on a part of the surface of the workpiece; and a third step of exposing the workpiece to an etching gas in an environment of 80°C or higher to form a recessed structure on the portion of the workpiece where the catalyst material has been formed, wherein the etching gas includes a fluorine-containing gas and an acidic gas, and the acidic gas has a lower acid dissociation constant than hydrogen fluoride.

The present invention relates to lipid nanoparticles capable of delivering a target substance to hepatic stellate cells. The lipid nanoparticles are for delivering a target substance to hepatic stellate cells and comprise a pH-sensitive cationic lipid including a hydrophilic portion and two hydrophobic portions, wherein an acid dissociation constant pKa of a lipid membrane constituting the lipid nanoparticles is greater than or equal to 6.7 and less than 8.2.

Provided is a reagent system for acridinium ester chemiluminescence, and a method of detecting a target antigen using the same. The reagent system for eliciting an acridinium ester chemiluminescence includes: a wash buffer including a first surfactant in one or more of a phosphate-buffered saline (PBS) and a tris-buffered saline (TBS); a first reagent including hydrogen peroxide and an acid, and optionally a first alkali metal salt; and a second reagent including a base and a second surfactant, and optionally a second alkali metal salt, where the first surfactant and the second surfactant are independently one or more of a cationic surfactant, a neutral surfactant and an anionic surfactant, where the acid having an acid dissociation constant (pKa) of −1.0 to 5.0, and where the base comprises one or more of sodium hydroxide (NaOH), potassium hydroxide (KOH), ammonium hydroxide, tetra-n-ethylammonium hydroxide (TEA), tetra-n-propylammonium hydroxide (TPA), and tetra-n-butylammonium hydroxide (TBA).

The invention provides a patterned material and substrate intermediate coating composition as well as application and a device thereof. The composition comprises matrix resin A, matrix resin B, a thermally induced acid generator and a solvent, the acid dissociation constant pKa of conjugated acid corresponding to anions in the thermally induced acid generator is lower than-3; the matrix resin A and the matrix resin B both contain cross-linkable groups and are cross-linked at 150-300 DEG C; the molar ratio of the cross-linking groups in the matrix resin A to the cross-linking groups in the matrix resin B is 1: (0.6-1.3). The molar ratio of cross-linking groups in the matrix resin A and the matrix resin B is controlled at 150-300 DEG C in the presence of the thermally induced acid generator, so that a high cross-linking state is realized, and the phenomenon that an upper-layer patterned material falls off is avoided; strong cross-linked structures can be formed on various substrates, and the applicability is high.

The present invention addresses the problem of providing a photosensitive composition with which it is possible to form a pattern having a small LCDU. A photosensitive composition according to the present invention contains a resin that has a repeating unit which is derived from a monomer containing an onium base that is composed of an anionic group and a cation. The resin has an organometallic structure, or the photosensitive composition comprises an organometallic compound that is different from the resin. The acid dissociation constant of a compound that is obtained by replacing the cation with a proton in the monomer is -1.0 or less. The cation has a structure that is changeable by the action of an acid. When the cation before the structure is changed by the action of an acid is defined as a cation X, and the cation after the structure is changed by the action of the acid is defined as a cation Y, the integrated value of the molar absorption coefficients of the cation Y at wavelengths of 200-450 nm is larger than the integrated value of the molar absorption coefficients of the cation X at wavelengths of 200-450 nm, and the onium base that is composed of the anionic group and the cation Y generates an acid when irradiated with light having a wavelength of 200-450 nm.

An object of the present invention is to provide an aqueous coating material composition that has excellent storage stability and that demonstrates high coating film performance and strong glass adhesiveness even when cured at a relatively low temperature. The present invention discloses an aqueous coating material composition including (A) a hydroxyl group- and carboxyl group-containing resin, (B) a blocked polyisocyanate compound, (C) a polycarbodiimide compound, and (D) a basic compound. The basic compound (D) includes (D1) a basic compound having an acid dissociation constant (PKa) in a range from 7.0 to 8.5 and a boiling point in a range from 100 to 200° C. A content ratio of the basic compound (D1) is in a range from 30 to 100 mass % based on the mass of the basic compound (D). The aqueous coating material composition has a pH in a range from 8.0 to 11.5.

The present invention provides a negative photosensitive resin composition which is high in sensitivity, excellent in half-tone characteristics, capable of obtaining a pattern shape with low taper, and alkali developable. A negative photosensitive resin composition comprising at least (A1) a resin containing a weak acid group and (A2) a resin containing an unsaturated group as (A) an alkali-soluble resin, the (A1) resin containing a weak acid group having an acid dissociation constant in dimethyl sulfoxide in the range of 13.0 to 23.0, and the (A2) resin containing an unsaturated group having an ethylenic unsaturated double bond group.

Process for preparing the compound of Formula (I) in the form of a base or a salt thereof, said process comprising: a) reacting the compound of Formula (II) with 4-toluenesulfonyl chloride in the presence of a base in an organic solvent, water or a combination thereof, to obtain a compound of Formula (III), b) reacting the compound of Formula (IV) with zinc and iodine in an aprotic polar solvent to obtain a complex between zinc and the compound of Formula (IV); c) reacting the compound of Formula (III) obtained in step a) with the complex zinc-compound of Formula (IV) obtained in step b) in the presence of a catalyst comprising palladium and a phosphine ligand in an aprotic polar solvent to obtain a suspension comprising the compound of Formula (V) d) reacting the compound of Formula (V) in suspension obtained in step c) with a carboxylic acid to obtain a solution of the compound of Formula (VI) e) reacting the compound of Formula (VI) in solution obtained in step d) with an acid having an acid dissociation constant Ka≥1 (also referred to in this text as "strong acid") to obtain the compound of Formula (I).

Provided is an optical film that can be molded with low stretching stress, that has appropriate retardation development, and that also has excellent durability under severe environmental conditions.　This optical film contains diacetyl cellulose and is characterized by: containing a nitrogen-containing heterocyclic compound; the nitrogen-containing heterocyclic compound having an aromatic ring containing 1-3 nitrogen atoms; a hydrogen atom being bonded to at least one of the nitrogen atoms contained in the aromatic ring; the acid dissociation constant when the hydrogen atom bonded to the nitrogen atom dissociates as a hydrogen ion being 14 or greater; and the nitrogen-containing heterocyclic compound being represented by general formula 1.

An electrolytic capacitor includes a capacitor element, and a liquid component. The capacitor element includes an anode body having a dielectric layer at a surface of the anode body, and a conductive polymer component covering part of the dielectric layer. The liquid component contains a first solvent, a base component, and an acid component. The first solvent is at least one selected from the group consisting of a polyol and a derivative thereof. The base component contains a first base which has no boiling point or a boiling point of 100° C. or higher. A conjugate acid of the first base has an acid dissociation constant of 5 or more and 10 or less.

A composition for absorbing carbon dioxide including an ionic liquid (A) containing a cation and an anion, and a protic compound (B) having a relative permittivity at 25° C. of 20 or more, wherein the cation at least includes a cation represented by the formula (1), the anion includes an anion where an acid dissociation constant (pKa) at 25° C. of its conjugate acid in water is 4.5 or more, and the ratio of a value obtained by multiplying the number of hydroxyl groups of the protic compound (B) by the number of moles of the protic compound (B) to the number of moles of the ionic liquid (A) [number of moles of protic compound (B) / number of moles of ionic liquid (A)] is 0.2 to 1.0:wherein R1 and R2 each independently represent a hydrogen or a C1-C6 linear alkyl group.

A cleaning solution includes a solvent having Hansen solubility parameters: 25>δd>13, 25>δp>3, 30>δh>4; an acid having an acid dissociation constant pKa: −11<pKa<4, or a base having pKa of 40>pKa>9.5; and a surfactant. The surfactant is an ionic or non-ionic surfactant, selected fromR is substituted or unsubstituted aliphatic, alicyclic, or aromatic group, and non-ionic surfactant has A-X or A-X-A-X structure, where A is unsubstituted or substituted with oxygen or halogen, branched or unbranched, cyclic or non-cyclic, saturated C2-C100 aliphatic or aromatic group, X includes polar functional groups selected from —OH, ═O, —S—, —P—, —P(O2), —C(═O)SH, —C(═O)OH, —C(═O)OR—, —O—, —N—, —C(═O) NH, —SO2OH, —SO2SH, —SOH, —SO2—, —CO—, —CN—, —SO—, —CON—, —NH—, —SO3NH—, and SO2NH.

To provide a method for producing high-purity N-substituted aspartic acid from which impurities such as long-chain aliphatic amines have been sufficiently removed. [Solution] A method for producing N-substituted aspartic acid (1), comprising: (A) an acid decomposition step in which crude N-substituted aspartate obtained by an addition reaction of maleate and / or fumarate with a long-chain aliphatic amine is acid-decomposed in an aqueous solution with an inorganic acid having an acid dissociation constant smaller than that of N-substituted aspartic acid at a temperature range of 40 to 100°C to precipitate N-substituted aspartic acid; (B) a separation step to separate the precipitated N-substituted aspartic acid; and (C) a washing step to wash the N-substituted aspartic acid after the separation step with water and a lower alcohol. JPEG2026115080000014.jpg42159

A method for reducing resist consumption (RRC) is provided. The method includes treating a surface of a substrate using a RRC composition and forming a photoresist layer comprising a metal-containing material on the RRC composition treated surface. The RRC composition includes a solvent and an acid or a base. The solvent has a dispersion parameter between 10 and 25. The acid has an acid dissociation constant between −20 and 6.8. The base having an acid dissociation constant between 7.2 and 45.

The invention relates to the technical field of component design, in particular to a benzene ring acid group substitution type screening method based on isoamyl cinnamate and application of the benzene ring acid group substitution type screening method based on isoamyl cinnamate. The screening method comprises the steps that a virtual substituent library is established, acid group substituents are introduced to an isoamyl cinnamate benzene ring, and a plurality of substitution combinations are generated; predicting a minimum value pKai of an acid dissociation constant and a polar atom ratio PAR for each structure, and screening less than or equal to 50 candidate structures according to the minimum value pKai and the polar atom ratio PAR; measuring the fluorescence polarization anisotropy r of each candidate structure, and screening the first 50% of samples according to the sequence of r values from small to large; sequentially measuring the quantum dot fluorescence intensity retention rate Fret and the coating UVB retention rate RAUVB of the screened samples; and outputting the acid group substitution type corresponding to the maximum value according to the product sequence of the two. The self anti-ultraviolet attenuation capability and the photosensitive component protection effect are reflected, and the optimal structure is ensured to have self stability and synergistic protection performance in a real compound system.

A photoresist developer includes a solvent having Hansen solubility parameters of 15<δd<25, 10<δp<25, and 6<δp<30; an acid having an acid dissociation constant, pKa, of −15<pKa<4, or a base having a pKa of 40>pKa>9.5; and a chelate.

A composition containing 1,1-dicyanethylene, containing 1,1-dicyanethylene, water, and an acidic compound (A), wherein the content of the above-mentioned acidic compound (A) and the content of the above-mentioned water in the composition satisfy a specific relationship formula (Ia): -4.00 ≤ α ≤ 0 (α is represented by pKa + Log(C H2O / C a ), pKa is the logarithmic acid dissociation constant of the above-mentioned acidic compound (A), C H2O is the molar concentration of the above-mentioned water in the above-mentioned composition, and C a is the molar concentration of the above-mentioned acidic compound (A) in the above-mentioned composition).

Provided is an oil regeneration device comprising: an addition unit that adds an additive to an oil containing copper and an organic acid; and an adsorbent contact unit that brings the oil containing the additive into contact with an adsorbent, wherein the additive has, in a molecule, a polar group and a functional group having an acid dissociation constant pKa of 5 or more, the functional group of the additive is bonded to copper contained in the oil, and the adsorbent adsorbs the additive bonded to copper and the organic acid contained in the oil. Due to said feature, the organic acid and copper contained in a degraded oil can be efficiently removed by simple constituent elements.

An electrolytic capacitor including a capacitor element, and a liquid component. The capacitor element includes an anode body having a dielectric layer at a surface of the anode body, and a conductive polymer component covering part of the dielectric layer. The liquid component contains a first solvent, a base component, and an acid component. The first solvent is at least one selected from the group consisting of a polyol and a derivative thereof. The base component contains a first base a conjugate acid of which has an acid dissociation constant of 5 or more and 10 or less and which has no boiling point or a boiling point of 100° C. or higher.

The present disclosure relates to a method of reducing resist consumption (RRC) and a method of forming a semiconductor structure. The method of reducing RRC includes treating a surface of a substrate with an RRC composition; and forming a resist layer including a metal-containing material on the surface treated with the RRC composition. The RRC composition includes a solvent, and an acid or a base. The solvent has a dispersion parameter of 10 to 25. The acid has an acid dissociation constant of -20 to 6.8, and the base has an acid dissociation constant of 7.2 to 45.

To provide a composition that maintains viscosity with a minimum amount of thickening agent. [Solution] A composition comprising the following components (A), (B), and (C): Component (A): Modified cellulose fiber having a modifying group; Component (B): An organic acid or its salt having an acid dissociation constant pKa of -5 or more and 6 or less in aqueous solution; Component (C): A non-aqueous liquid that is liquid at 25°C and 1 atm and has a dielectric constant of 30 or less at 25°C.

A 1,1-dicyanoethylene-containing composition comprising 1,1-dicyanoethylene, water, and an acidic compound (A), wherein the content of the acidic compound (A) and the content of the water in the composition satisfy a specific relationship (Ia) : -4.00≤α≤0 (α is represented as pKa + Log(CH2O / Ca), pKa is the logarithmic acid dissociation constant of the acidic compound (A), CH2O is the molar concentration of the water in the composition, and Ca is the molar concentration of the acidic compound (A) in the composition).

To provide a light-emitting element in which an organic compound layer can be processed at once by a photolithography technique. A first electrode and an organic compound layer including an electron-injection layer are formed over an insulating surface. The electron-injection layer is the outermost layer of the organic compound layer and contains an organic compound having a basic skeleton and an acid dissociation constant pKa of greater than or equal to 1. A sacrificial layer and a mask are formed over the electron-injection layer and the sacrificial layer is processed into an island shape using the mask. With use of the island-shaped sacrificial layer as a mask, the organic compound layer is processed into an island shape to cover the first electrode. Part of the island-shaped sacrificial layer is removed with an acidic chemical solution to expose the electron-injection layer. A second electrode is formed to cover the electron-injection layer.

A cleaning solution includes a solvent having Hansen solubility parameters: 25>δd>13, 25>δp>3, 30>δh>4; an acid having an acid dissociation constant pKa: −11<pKa<4, or a base having pKa of 40>pKa>9.5; and a surfactant.

The invention provides an immersed photoresist and a preparation method thereof. The preparation method comprises the following steps: carrying out esterification reaction on an acrylic acid compound and a first compound to obtain a second compound; wherein the first compound comprises cyclodextrin with an acidic group; carrying out free radical polymerization reaction on the second compound to prepare a third compound, and forming the immersed photoresist by the third compound. According to the immersed photoresist and the preparation method thereof provided by the invention, the acid dissociation constant of the photoresist can be reduced by grafting the cyclodextrin side group with the acidic group on the acrylic acid compound, so that the alkali dissolution rate of the photoresist can be improved; moreover, by utilizing the cracking characteristic of cyclodextrin molecules in the exposure area under photoacid, the alkali dissolution rate of the photoresist can also be improved, so that the developing difficulty can be reduced, the production efficiency can be improved, and the defect risk can be reduced. In addition, a complex organic synthesis route is not needed, and the production cost can be reduced.

The invention provides an actinic-ray-sensitive or radiation-sensitive resin composition, an actinic-ray-sensitive or radiation-sensitive resin film formed by the composition, a pattern forming method using the composition, and a method for manufacturing an electronic device. The composition contains an acid-decomposable resin (A) and a compound (B) that generates an acid by irradiation with actinic rays or radiation rays. Compound (B): a compound which has structural moieties X and Y described in the description, and which generates an acid containing a first acidic moiety derived from the structural moiety X and a second acidic moiety derived from the structural moiety Y by irradiation with actinic rays or radiation. Wherein, in the compound (B), a compound PI obtained by substituting a cation site with H + has acid dissociation constants a1 and a2 derived from an acidic site, a2 is greater than a1, and the anion site in the structural site Y is represented by formula (1) described in the specification.