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4554 results about "Phthalic acid" patented technology

Phthalic acid is an aromatic dicarboxylic acid, with formula C₆H₄(CO₂H)₂. It is an isomer of isophthalic acid and terephthalic acid. Although phthalic acid is of modest commercial importance, the closely related derivative phthalic anhydride is a commodity chemical produced on a large scale.

Oleochemical Plasticizers with Thermal and Ultraviolet Radiation Stabilizing Activity for PVC Molding Resins and Process for Obtaining Thereof

The present invention is related with bioplasticizers or primary oleochemical plasticizers and the improved process for obtaining thereof. It refers primarily to epoxydized oleochemical plasticizers produced from vegetable oils, as substitute of traditional petrochemical plasticizers. The process starts with the epoxydized product of natural oils, such as sunflower, linseed, Jatropha curcas, soybean, etc., which are transesterified with an alcohol such as ethylic or methylic, in the presence of a catalyst such as sodium methoxide or sodium hydroxide in order to produce an alkylic esters mixture of the fatty acids that were present in the oil or oil mixture used as raw material in the epoxydized oil production. When the plasticizer obtained by the process already mentioned is used for the formulation of moldable poly(vinyl chloride), PVC, resins; the resulting plastic films get adequate hardness, static and dynamic thermal stability, and plasticizer extractability by solvents, such as n-hexane, gasoline and oil. Besides, when the PVC resin is formulated with a phthalic or terephthalic plasticizers mixture and the bioplasticizer, the bioplasticizer presents a full range solubility and or compatibility with the remainder of the resin compounds. The oxyrane chemical ring of the bioplasticizer is an excellent chemical neutralizer of the HCL that might be formed from the PVC, due to the action or interference of thermal or UV radiation.
Owner:RESINAS & MATERIALES

Polishing fluid and polishing method

ActiveUS20050181609A1Increase chanceSuperior in dimensional accuracy and electric characteristicOther chemical processesSemiconductor/solid-state device manufacturingDevice materialSlurry
A polishing slurry including an oxidant, a metal oxide dissolver, a metal inhibitor and water and having a pH from 2 to 5. The metal oxide dissolver contains one or more types selected from one or more acids (A-group) selected from acids of which the dissociation constant (pKa) of a first dissociable acid group is less than 3.7 and from which five acids of lactic acid, phthalic acid, fumaric acid, maleic acid and aminoacetic acid are excluded, ammonium salts of the A-group and esters of the A-group, and one or more types selected from one or more acids (B-group) selected from acids of which the dissociation constant (pKa) of a first dissociable acid group is 3.7 or more and the five acids, ammonium salts of the B-group and esters of the B-group. The metal inhibitor contains one or more types selected from the group consisting of aromatic compounds having a triazole skeleton and one or more types selected from the group consisting of aliphatic compounds having a triazole skeleton and compounds having any one of pyrimidine skeleton, imidazole skeleton, guanidine skeleton, thiazole skeleton and pyrazole skeleton. The polishing slurry having a high metal-polishing rate, reducing etching rate and polishing friction, results in the production, with high productivity, of semiconductor devices reduced in dishing and erosion in metal wiring.
Owner:HITACHI CHEM CO LTD

Temperature-resistant, corrosion-resistant and high-adhesion adhesive and preparation method thereof

The invention discloses a temperature-resistant, corrosion-resistant and high-adhesion adhesive and a preparation method thereof, and belongs to the technical field of adhesives. The temperature-resistant, corrosion-resistant and high-adhesion adhesive consists of two components, i. e., an adhesive A and an adhesive B, in the weight ratio of 100:1-10, wherein the adhesive A consists of chemical plasticizing vinyl ester resin, a polymerization inhibitor, a low shrinkage agent, a free radical curing solvent, gas-phase silicon dioxide, inorganic filler, a coupling agent, a defoaming agent, color paste or paint, a promoter and a promotion additive; and the adhesive B consists of phthalic ester, peroxide and inertial powder filler. The adhesive provided by the invention has the performance of heat resistance, corrosion resistance, penetration resistance, adhesion, positioning, impact resistance and the like, can be formed into different types at normal temperature, and medium and high temperature, is easy and convenient to operate, can bring the unique advantage of the adhesive into full play on some occasions requiring to paying attention to corrosion resistance, adhesion, heat resistance and the like, and is suitable for mutual adhesion among a continuous cellulose material, a concrete material, a metal material, stone, FRP (Fiber Reinforce Plastic), thermoplastic plastic and the like.
Owner:浙江天和树脂有限公司 +1
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