4 results about "Dodecanedioic acid" patented technology

The application discloses a modified mixed solution suitable for cement construction waste material regeneration, a cement construction waste material regeneration product and a preparation method thereof, and belongs to the technical field of solid waste utilization. The modified mixed solution for regeneration in the application comprises the following components in parts by weight: 5-8 parts of dodecanedioic acid solution and 15-20 parts of Lewis acid catalyst solution. Through the synergistic effect of "chemical grafting modification-catalytic strengthening bonding-physical compaction forming", the regenerated product with high compactness and excellent compressive strength can be prepared without additional traditional cementing materials such as cement and lime.

The application provides a hot melt adhesive for low-pressure injection molding and a preparation method thereof, and belongs to the technical field of hot melt adhesive materials for electronic components and circuit packaging. The hot melt adhesive for low-pressure injection molding is prepared from the following raw materials in parts by weight: adipic acid: 0.1-60 parts; dodecanedioic acid: 0.1-60 parts; 2-methylpentanediamine: 0.1-50 parts; dodecanediamine: 0.1-50 parts; caprolactam: 0.5-200 parts; plasticizer: 0.1-20 parts; antioxidant: 0.01-1 part; modifier: 0-10 parts; and flame retardant: 0-20 parts. The hot melt adhesive for low-pressure injection molding has high softening point and high fluidity, and can meet the high requirements of electronic components and battery circuit packaging.

The present application belongs to the solder paste material field of surface assembly technology, and relates to a low-temperature solder paste and a preparation method thereof. The low-temperature solder paste contains a tin-bismuth-based alloy powder and a soldering paste. The soldering paste contains rosin, an active agent, a thixotropic agent, a surfactant, a corrosion inhibitor and an organic solvent. The active agent is a composite of an organic amine and an organic acid. The organic amine is at least one selected from ethylenediamine, monoethanolamine, triethanolamine and ethylamine. The organic acid is at least one selected from 2-pyridine carboxylic acid, oxalic acid, succinic acid, glutaric acid, malonic acid, phthalic acid and dodecanedioic acid. The boiling point of the organic solvent is 190-280 DEG C. The solder paste provided by the present application not only has low-temperature property and is suitable for applications with more low-temperature welding requirements, solves the problem that the medium and high-temperature solder paste is not widely used, but also has the characteristics of less solder beads after welding and low residue.

The present application relates to a kind of full synthesis easy-to-clean copper cutting fluid and its preparation method.The raw material of the full synthesis copper cutting fluid includes composite rust inhibitor, chelating agent, special amine, aluminum copper corrosion inhibitor, lubricant, defoaming agent and solvent, and the composite rust inhibitor is composed of sebacic acid and dodecanedioic acid.The composite rust inhibitor can overcome discoloration corrosion well, has obvious cost advantage, and will not produce obvious color residue, can meet the existing user demand.Sebacic acid and dodecanedioic acid are not long carbon chain (C10 / C12) can be embedded in the gap of lubricating film, improve boundary lubrication performance, make friction coefficient reduce 5~8%, adapt to medium-low speed heavy load processing, not easy to break in long-term cyclic use (>6 months), especially suitable for the processing of nickel-containing copper alloy, can reduce the risk of pitting.