70 results about "Dynamic viscoelasticity" patented technology

A heat-shrinkable polyester film is provided, in which the loss coefficient and the like are controlled in a plurality of temperature regions, and which has excellent wrinkle resistance characteristics. The heat-shrinkable polyester film is a heat-shrinkable polyester film derived from a polyester resin composition containing 30% to 90% by weight of an amorphous polyester resin and 10% to 70% by weight of a crystalline polyester resin with respect to the total amount, in which (a) a loss coefficient obtained using a dynamic viscoelasticity measuring apparatus has a first loss coefficient peak in a temperature region of below 100° C.; (b) a loss coefficient obtained in the same manner has a second loss coefficient peak in a temperature region of 100° C. or higher; and (c) a heat shrinkage ratio obtained when the film is immersed in hot water at 80° C. for 10 seconds is 30% or more.

The purpose of the present disclosure is to provide a coating composition that exhibits excellent discharge stability. A coating composition according to the present disclosure has the following features.　The coating composition contains a hydroxy group-containing resin (A) and a curing agent (B), and is to be applied to an object to be coated by an inkjet method. When a dynamic viscoelasticity measurement is performed thereon at a temperature of 23°C and a frequency of 0.5 Hz in a stress measurement range of 0.1-20 Pa, the stress σ2 as measured when the storage elastic modulus has decreased by 10% for the first time with respect to the storage elastic modulus G'1 when the stress is 0.1 Pa is in a range of 1.0-15 Pa.

The invention relates to the technical field of semiconductor manufacturing, and discloses a wafer polishing treatment system based on pressure regulation and control, which comprises a partition pressure regulation and control module, a micro-disturbance excitation injection module, an interface rheological state analysis module and a dynamic hysteresis inversion control module. The dynamic viscoelastic modulus is calculated in real time, an inverse dynamic model is constructed according to the dynamic viscoelastic modulus to generate an advanced compensation component aiming at the viscoelastic hysteresis effect, the transient ballistic overshoot phenomenon is effectively restrained through the strain rate hardening and hysteresis characteristics of the active hedging polishing pad under high-speed pressure switching, and therefore the transient ballistic overshoot phenomenon is effectively restrained. The problems of over-polishing and defects caused by pressure response dislocation are solved, and the wafer planarization quality under the advanced manufacturing process is improved.

The present invention provides a biodegradable polyester resin composition, a method for preparing the same, and a biodegradable polyester film prepared from the same, the composition comprising a resin including a residue of a dicarboxylic acid component and a residue of a diol component, and satisfying formula 1. By satisfying Formula 1, the productivity and processability of the biodegradable polyester resin composition are improved, thereby enhancing the tensile strength, elongation, and tear strength of the biodegradable polyester film. [Formula 1]: In Formula 1, G'is the storage modulus at a temperature of 190 DEG C and a frequency of 10 radian / sec to 100 radian / sec in dynamic viscoelasticity measurement, and G ''is the loss modulus at a temperature of 190 DEG C and a frequency of 10 radian / sec to 100 radian / sec in dynamic viscoelasticity measurement.

An electrostatic charge image developer contains a toner including toner particles that contain a binder resin and a carrier including magnetic particles and a resin layer that adheres to a surface of the magnetic particles, in which, in a dynamic viscoelasticity measurement of the toner, in a case where a loss tangent tanδ at a temperature of 90° C. and a strain of 1% is represented by D1 (90), a loss tangent tanδ at a temperature of 90° C. and a strain of 50% is represented by D50 (90), a loss tangent tanδ at a temperature of 150° C. and a strain of 1% is represented by D1 (150), and a loss tangent tanδ at a temperature of 150° C. and a strain of 50% is represented by D50 (150), each of D1 (90), D50 (90), D1 (150), and D50 (150) is 0.5 or more and 2.5 or less, a value of D50 (150)−D1 (150) is less than 1.5, and a value of D50 (90)−D1 (90) is less than 1.0, and in the surface of the magnetic particles, an average unevenness interval Sm and an arithmetic mean roughness Ra satisfy 0.5 μm≤ Sm≤2.5 μm and 0.3 μm≤ Ra≤1.2 μm.

To provide a narrow and large-diameter tire capable of improving noise performance at high speeds without compromising handling performance at low temperatures.The tire has a tread portion formed of an elastomer composition. A relationship between a tire outer diameter (Dt) and a tire cross-sectional width (Wt) satisfy a following expression (1). The tread portion includes at least one circumferential groove extending in a tire circumferential direction. A rubber thickness at a groove bottom of the circumferential groove is 0.05 to 0.25 times a maximum thickness of the tread portion. The elastomer composition has a phase difference δ of 5.0×10−2π [rad] or less between a maximum value of strain and a maximum value of stress when repeatedly deformed at a temperature of 30 degrees Celsius and a frequency of 10 Hz in a dynamic viscoelasticity test;1963.4≤(Dt2×π / 4) / Wt≤2827.4  (1).

This adhesive composition is for forming an adhesive layer provided between a support substrate and a semiconductor substrate having bumps, the adhesive composition containing an adhesive component (A) that is cured by a hydrosilylation reaction, the Young's modulus of the adhesive layer as measured by dynamic viscoelasticity measurement being 5 MPa or more.

The purpose of the present invention is to provide an adhesive tape capable of achieving both excellent bending resistance and excellent impact absorption. Another purpose of the present invention is to provide an electronic device including the adhesive tape. The present invention is an adhesive tape having a foam layer. The foam layer has a shear storage modulus of 0.3 MPa or more at 23°C as measured by dynamic viscoelasticity measurement at a measurement frequency of 1 Hz, and the foam layer has a loss tangent of 0.50 or more at 23°C as measured by dynamic viscoelasticity measurement at a measurement frequency of 100 Hz.

A shoe member consisting of a material comprising a thermoplastic elastomer, wherein the material has a glass transition temperature Tg of no more than 10° C., a loss tangent tan δ of no less than 0.4 in a test of dynamic viscoelasticity, and a Δ tan δ, which is the amount of change of tan δ, of no less than 0.15 when strain is changed from 5% to 100%.

An electrostatic charge image developing toner contains toner particles that contain a binder resin, in which each of a loss modulus G″5 (150) of the electrostatic charge image developing toner determined by measuring dynamic viscoelasticity of the electrostatic charge image developing toner at a temperature of 150° C. and a strain of 5% and a loss modulus G″50 (180) of the electrostatic charge image developing toner determined by measuring dynamic viscoelasticity of the electrostatic charge image developing toner at a temperature of 180° C. and a strain of 50% is 1×103 Pa or more and 1×104 Pa or less, and a relationship between a loss modulus G″5 (t1) of the electrostatic charge image developing toner at a first temperature t1 in a temperature range of 150° C. or higher and 180° C. or lower and a strain of 5% and a loss modulus G″50 (t2) of the electrostatic charge image developing toner at a second temperature t2 higher than the first temperature t1 in the temperature range of 150° C. or higher and 180° C. or lower and a strain of 50% satisfies the following Formula (1) in a case of a temperature difference (t2−t1) between the first temperature t1 and the second temperature t2 is 15° C. or higher.1<G″5(t1) / G″50(t2)<3.0  Formula (1)

An object of the present invention is to find a useful means for removing an intraocular membrane. The present invention relates to an agent for use in intraocular membrane peeling surgery, which contains a solution containing a hydrogel-forming material and satisfies the following formula 1 with respect to the dynamic viscoelasticity measured at a temperature of 25 to 40° C. and a frequency of 1 Hz.0<Vmax≤3  (Formula 1)Provided that in the formula 1, Vmax (Pa / sec) is the maximum change rate of the storage elastic modulus after the initiation of gelation.

The present invention addresses the problem of providing a rubber composition having low haze and a method for producing the rubber composition. This rubber composition contains a crosslinked product of a fluorine-containing copolymer, and the temperature (T) at which the minimum storage modulus (E ') is exhibited is 55 DEG C or more in a dynamic viscoelasticity measurement at a measurement temperature of 23-200 DEG C and a measurement frequency of 1 Hz.

Provided is a binder composition for a power storage device, which has excellent adhesion, is capable of producing a power storage device electrode in which expansion of the electrode accompanying repeated charging and discharging is suppressed, and is capable of improving the cycle life characteristics of the power storage device. This binder composition for an electricity storage device contains a polymer (A) and a liquid medium (B), and when the total of the repeating units contained in the polymer (A) is taken as 100 parts by mass, the content of the repeating units contained in the polymer (A) is less than or equal to 100 parts by mass. The polymer (A) contains 50-80 parts by mass of a repeating unit (a1) derived from a conjugated diene compound, 15-49 parts by mass of a repeating unit (a2) derived from an aromatic vinyl compound, and 0.1-10 parts by mass of a repeating unit (a3) derived from an unsaturated carboxylic acid, and the peak top of the dynamic viscoelasticity tan [delta] (loss elastic modulus / storage elastic modulus) is 1 in the range of-50 DEG C to 10 DEG C; the present invention is characterized in that there is one in the range of 150 DEG C to 250 DEG C, and when the tan [delta] at the peak top in the range of-50 DEG C to 10 DEG C is represented by tan [delta] (Tp1) and the tan [delta] at the peak top in the range of 150 DEG C to 250 DEG C is represented by tan [delta] (Tp2), the relationship represented by formula (1) is satisfied. (1) tan [delta] (Tp2) / tan [delta] (Tp1) < 0.5.

The present invention provides a stretched film having a high dielectric breakdown strength even under a high temperature environment of 120°C or higher, and having little change in the dielectric breakdown strength under the high temperature environment with respect to the dielectric breakdown strength at room temperature (for example, 25°C).　The present invention is a stretched film containing a polypropylene resin, wherein the loss tangent tan δ at 100°C is 0.15 or less in temperature dispersion data in the TD direction at a frequency of 1 Hz obtained from dynamic viscoelasticity measurement, or the loss tangent tan δ has a peak in a region of 140°C or higher in temperature dispersion data in the TD direction at a frequency of 1 Hz obtained from dynamic viscoelasticity measurement.

By adjusting the dynamic viscoelasticity before and after shrinkage to a specific range, the polyester thermal shrinkage film can have more excellent shrinkage rate and shrinkage uniformity at high temperature. Therefore, the heat shrink film can be used for packaging and labeling containers or bottles so as to improve the quality.

The electronic device sealing composition of the present invention is an electronic device sealing composition for inkjet containing a photopolymerizable monomer and a photopolymerization initiator, wherein, as the photopolymerizable monomer, a (meth)acrylate is contained, with respect to the dynamic viscoelasticity after curing of the electronic device sealing composition, the peak value of the loss coefficient (tan δ) is in the range of 0.3 to 1.0, and the storage modulus (G') is in the range of 1.0 to 3.0 GPa.

The present application relates to a polishing pad having a polishing layer and a cushion layer, wherein the ratio E' (40°C) / E' (40°C) of the storage modulus E' (40°C) at 40°C in a dynamic viscoelasticity measurement under a bending mode condition at a frequency of 10 rad / s and at a temperature of 20 to 100°C in a dry state B40 the storage modulus E' (40°C) at 40°C in a dynamic viscoelasticity measurement under a compression mode condition at a frequency of 10 rad / s and at a temperature of 20 to 100°C in a dry state C40 B40 C40 is 3.0 or more and 15.0 or less, and the loss factor tan δ in the dynamic viscoelasticity measurement under the aforementioned bending mode condition is 0.10 or more and 0.30 or less in a range of 40°C or more and 70°C or less.​​

A method for manufacturing a connection structure, including: a step of laminating an adhesive film on a surface of a first circuit member having a first electrode, the surface being formed with the first electrode; and a step of disposing a second circuit member having a second electrode on the first circuit member on which the adhesive film is laminated, so that the first electrode and the second electrode face each other, and thermocompression bonding them, thereby electrically connecting the first electrode and the second electrode to each other, the adhesive film having a film-shaped adhesive containing a thermoplastic resin and a radical polymerizable compound, a waveform of a loss tangent (tan δ) obtained by dynamic viscoelasticity measurement after heating the film-shaped adhesive at 170°C for 5 seconds having a plurality of maximum values.

The electromagnetic wave shielding material includes one or more magnetic layers containing magnetic particles and a resin, in which a cross-linking degree of the magnetic layer is 20% or more, and a storage elastic modulus E′ of the magnetic layer at 23° C. in a dynamic viscoelasticity measurement at 1 Hz is 1.00 GPa or less.

A binder composition for an electrical storage device includes a polymer (A) and a liquid medium (B), where with respect to 100 mass % in total of repeating units contained in the polymer (A), the polymer (A) contains 15 mass % to 60 mass % of a repeating unit (a1) derived from a conjugated diene compound and 1 mass % to 10 mass % of a repeating unit (a2) derived from an unsaturated carboxylic acid. In the binder composition, the following characteristics are satisfied: tan δ (loss elastic modulus / storage elastic modulus) in dynamic viscoelasticity of the polymer (A) has one peak top in a range of from −40° C. to less than 50° C. (tan δ(Tp1)), and has one peak top in a range of from 50° C. to 150° C. (tan δ(Tp2)), and the following relationship is satisfied tan δ(Tp2) / tan δ(Tp1)≥0.5.

Provided is a biaxially stretched polyester film for metal sheet lamination molding. With reference to can lid production by thermocompression bonding in a lamination process, this biaxially stretched polyester film exhibits an excellent adhesiveness and an excellent openability free of feathering during opening. This film can also prevent corrosion even for contents that readily cause metal corrosion. The laminated film for metal sheet lamination molding has a layer containing an amorphous polyester resin B provided on one surface of a biaxially stretched polyester film that contains a polyester resin A. In measurement of the laminated film using a dynamic viscoelasticity measurement instrument, the maximum temperature peak temperature Te1 (°C) of the loss elastic modulus of the film and the temperature Te2 (°C) of the peak at the next highest temperature after Te1 satisfy 15 ≤ Te1 (°C) - Te2 (°C) ≤ 90.

To provide a nonwoven fabric composed of ultrafine fibers and exhibiting stretchability.SOLUTION: The nonwoven fabric satisfies the following physical properties (a) and (b): (a) a viscosity in a molten state at 200 °C. is 1s·s or less at a shear rate of 0. 15Pa - 1; and (b) in a dynamic viscoelasticity curve obtained at a temperature decrease rate of 4 °C. / min from a molten state at 200 °C., a storage rigidity modulus is lower than a loss rigidity modulus in the entire temperature range of 200 °C. or lower and 80 °C. or higher, and the storage rigidity modulus is higher than the loss rigidity modulus in the entire temperature range of 70 °C. or lower and 20 °C. or higher.SELECTED DRAWING: None

To provide a sheet-like sealing material curable at a low temperature in a short time.SOLUTION: A sheet-like sealing material that solves the above problem is a sheet-like sealing material containing an epoxy compound and a thiol-based curing agent containing one or more thiol groups in molecules, wherein a storage modulus E ' at 25 °C. of a cured product obtained by heating the sheet-like sealing material at 100 °C. for 30 minutes is 0. 1Hz or more and 5. 01GPa or less, the storage modulus E ' being obtained by dynamic viscoelasticity measurement at a temperature increase rate of 5 °C. / min and a frequency of 0GPa.SELECTED DRAWING: None

An object of the present disclosure is to provide a grip rubber composition from which a crosslinked rubber having a great frictional coefficient can be obtained. The present disclosure provides a grip rubber composition containing a base rubber and a vulcanizing agent, wherein the base rubber contains a solid rubber that is a solid at a temperature of 25° C. and a liquid rubber that is a liquid at a temperature of 25° C., and a ratio (tan δ / E*) of a loss tangent (tan δ) to a complex elastic modulus (E*) (MPa) of a cured product of the grip rubber composition at a temperature of 25° C. ranges from 0.030 to 0.045, wherein the loss tangent (tan δ) and the complex elastic modulus (E*) (MPa) are measured with a dynamic viscoelastic spectrometer under measuring conditions of an oscillation frequency: 10 Hz, a strain amplitude: 0.05% and a tensile mode.

A power storage device is constituted by a laminate including, in the stated order, at least a substrate layer, a barrier layer, and an inside layer. The inside layer is provided with an adhesive layer and a heat-sealing resin layer from the barrier layer side; and if dynamic viscoelasticity is measured by tension with respect to the inside layer, the growth rate at 80° C. is 8.0% or lower.

The resin composition includes a urethane (meth) acrylate, a monofunctional (meth) acrylate, and a photo-radical polymerization initiator. The urethane (meth) acrylate is a reaction product of a polyol component containing a predetermined polypropylene glycol, a polyisocyanate component containing at least one of an alicyclic polyisocyanate and an aliphatic polyisocyanate, and a hydroxyl group-containing (meth) acrylate. In a dynamic viscoelasticity measurement of a cured product of the resin composition, two or more specific peaks of the loss factor tan [delta] exist.

A polishing pad having a polyurethane sheet as a polishing layer and a terminal point detection window provided at an opening of the polyurethane sheet, wherein in dynamic viscoelasticity measurement of the terminal point detection window under a tensile mode, a frequency of 1.0 Hz, and a temperature of 10 to 100°C, a storage elastic modulus E' of the terminal point detection window at 90°C is 1.0 x 104 Pa or more, a D hardness (D W90 ) of the terminal point detection window at 80°C is 40 or more, and a D hardness (D 7 ) of the terminal point detection window at 20°C is 40 to 90. W80 W20 ​​

The present invention provides a method for manufacturing a positive electrode active material layer that can efficiently produce a suitable coating film. [Solution] The method includes the steps of: preparing a positive electrode slurry by mixing a positive electrode active material, a solid electrolyte, a conductive additive, a binder, and a solvent; obtaining parameters of the positive electrode slurry using a dynamic viscoelastic device; determining the quality of the coating film from the obtained parameters; and coating the positive electrode slurry that was determined to be good in the determination step.

The first objective of this invention is to provide a transfer film in which, during film transport, the photosensitive composition layer does not easily adhere to the guide roller at the contact surface between the composition layer and the guide roller, and when heat-laminated onto a substrate with a stepped difference, such as a wiring substrate, it exhibits excellent step difference tracking performance over a wide range of lamination temperatures. Furthermore, the second objective of this invention is to provide a method for manufacturing a laminate using the above-described transfer film and a method for manufacturing circuit wiring. The transfer film of this invention comprises a temporary support and a composition layer disposed on the temporary support. The composition layer includes a photosensitive composition layer. When the dynamic viscoelasticity of the composition layer at 25–150°C is measured under conditions of a frequency of 1 Hz and a heating rate of 5°C / min, it satisfies all the requirements of the following formulas (1A) to (3A): Formula (1A) tanδ T25 ≤1.5, Equation (2A)tanδ T120 ≥0.80, Equation (3A) 0.50≤tanδ T120 / tanδ T80 ≤10, and in addition, in the above equations (1A) to (3A), tanδ T25 tanδ represents the value of tanδ at 25℃. T120 tanδ represents the value at 120℃. T80 This represents tanδ at 80℃.

In measuring dynamic viscoelasticity, a problem that a viscous fluid sample such as polymer melt index, thermosetting resin, adhesive, or paint cannot be measured for dynamic viscoelasticity can be solved. Disclosed is a sample container 1 used to measure dynamic viscoelasticity according to temperature changes occurring when heating or cooling a sample. The sample container 1 includes a lower-end-closed sample cup with an opening at an upper end, and an insertion jig 5 having a cross section smaller in area than the opening of the sample cup 2, being insertable into the sample cup 2 through the opening, and being capable of transferring vibration to a sample contained in the sample cup 2.