The present application relates to the field of
chip encapsulation, and particularly relates to a
chip encapsulation and a preparation of an embedded
chip conveying belt, wherein
natural rubber and butadiene rubber are put into a torque
rheometer, then an activator, a composite wave-transparent agent, modified rice
husk and paraffin oil are sequentially added, mixing is carried out, standing is performed,
sulfur, a scorch
retarder and an accelerator are added, mixing is carried out, a mill is used to press a sheet, cooling is performed, and a chip encapsulation is obtained;
lignin and
silicon dioxide are extracted and precipitated from the rice
husk by using an alkali extraction and an acid co-
precipitation method, a nano-sized spherical
lignin-silica
hybrid material is obtained by self-
assembly through intermolecular
hydrogen bonds as a pretreated rice
husk, the
aldehyde group of the pretreated rice husk is modified, and then a
phosphorus-amine
ionic liquid is grafted;
silicon nitride,
glass fiber and
aramid fiber are compounded as a wave-transparent agent, the wave-transparent agent is epoxidized first, and then the
phosphorus-amine
ionic liquid is grafted.