The present invention relates to novel hot-melt
adhesive formulations which comprise, as their main or even sole polymeric component, in an amount
ranging from 5% by weight to 100% by weight, at least one
copolymer, comprising
butene-1 and at least another olefin selected from the group of ethene,
propene and the olefins from C5 to C12, exhibiting the following features: - a Number Average Molecular Weight Mn greater than 3,000 g / mole; - a
butene-1 content not lower than 30% by weight and preferably not lower than 38% by weight; - a Brookfield
viscosity at 190°C from 500 mPa.s to 100,000 mPa.s; - a tensile stress at break at 45°C and after five days of aging under room conditions, measured using EVF (
Extensional Viscosity Fixture) and according to the method described herein, that is greater than 7 MPa; - an elongation at break at 45°C and after five days of aging under room conditions, measured using EVF and according to the method described herein, that is greater than 800 %.