49results about How to "Achieving Low Temperature Curing" patented technology

The invention discloses a modified bismaleimide resin as well as a preparation method and an application thereof. The preparation method comprises the steps of carrying out high-temperature melting or solution prepolymerization on ethynylaniline, a thermoplastic toughener and a bismaleimide monomer which are mixed according to a certain ratio to obtain a homogeneous and transparent resin. The novel modified bismaleimide resin not only has the characteristics of good forming process properties such as small resin melting viscosity, good solvent solubility, low curing temperature and the like, but also has excellent resistance to high temperature in the form of cured resin. The resin system not only can be used for the matrix resin of the high temperature resistant composite material, and but also can be used in the fields of high temperature resistant adhesives and insulation materials for electronic / electric appliances.

The invention discloses copper-based composite conductive paste and a preparation method and an application thereof. The copper-based composite conductive paste comprises a binder, an organic carrierand metal conductive fillers. In the low-temperature curing of the copper-based composite conductive paste under the temperature of 180 DEG C-250 DEG C, SnAgCu alloy powders in the metal conductive fillers melt and chemically reacts with the surface of copper powders to produce an intermetallic compound, wherein the intermetallic compound comprises a Cu6Sn5 phase and a Cu3Sn phase; and the copperpowders in the cured copper-based composite conductive paste are connected with the SnAgCu alloy powders through the Cu6Sn5 phase and the Cu3Sn phase. Compared with the prior art, the copper-based composite conductive paste adopts the SnAgCu alloy powders and micrometer copper powders to improve the conductivity of a copper film, has a large tap density and a relatively low curing temperature, andis convenient for practical use; the low-cost copper powders are used to replace silver paste prepared by more expensive silver powders in some respects, so that the cost is greatly reduced; and meanwhile, the copper-based composite conductive paste does not cause pollution to the environment, accords with the environmental protection concept, and has a broad application prospect.

The invention discloses a preparation method of porous geological polymer microspheres. The porous geological polymer microspheres are prepared by a dispersion suspension solidification method. Compared with the prior art, low-temperature curing and one-shot molding granulation are realized without requirements of high-temperature calcination and curing and addition of other auxiliaries; and at the same time, large-scale use of solid wastes is realized, and raw materials are widely available, cost is low, process is simple, and the whole process is non-toxic and pollution-free; in addition, the preparation efficiency is high with a ball-forming degree exceeding 90%; the size of the particles can be adjusted, and the pore size distribution is uniform; the pore volume is large, and can be regulated, and a specific surface area of the microspheres reaches 110m2 / g, thus, the porous geological polymer microspheres can be directly used for packed columns for column separation. Experiments show that the porous geological polymer microspheres have a good adsorption effect on heavy metals, and can be used as adsorbents for heavy metals, and have a broad application prospect in the aspect ofremoving heavy metals and radioactive elements in water.

The invention discloses a low-temperature curing type epoxy group acrylic acid transparent powder coating. The low-temperature curing type epoxy group acrylic acid transparent powder coating is mainly prepared from high-epoxide-equivalent acrylic resin, low-epoxide-equivalent acrylic resin, dodecanedioic acid, an ultraviolet light absorber, a light stabilizer, a flatting agent and other auxiliaries. The high-epoxide-equivalent acrylic resin is modified by ultrafine titanium dioxide, and the low-epoxide-equivalent acrylic resin is in a GMA type. By the adoption of the high-epoxide-equivalent acrylic resin, the low-epoxide-equivalent acrylic resin and the dodecanedioic acid, the initial reaction temperature of the powder coating is decreased, and low-temperature curing is achieved; due to the auxiliary curing of the low-epoxide-equivalent acrylic resin, the enough compactness of the powder coating is improved, and then the corrosion resistance of the coating is improved; by the adoption of the high-epoxide-equivalent acrylic resin modified by the ultrafine titanium dioxide, the best ultraviolet absorption effect is obtained, and the weather resistance of the coating is improved.