49results about How to "Achieving Low Temperature Curing" patented technology

The invention discloses a preparation method of porous geological polymer microspheres. The porous geological polymer microspheres are prepared by a dispersion suspension solidification method. Compared with the prior art, low-temperature curing and one-shot molding granulation are realized without requirements of high-temperature calcination and curing and addition of other auxiliaries; and at the same time, large-scale use of solid wastes is realized, and raw materials are widely available, cost is low, process is simple, and the whole process is non-toxic and pollution-free; in addition, the preparation efficiency is high with a ball-forming degree exceeding 90%; the size of the particles can be adjusted, and the pore size distribution is uniform; the pore volume is large, and can be regulated, and a specific surface area of the microspheres reaches 110m2/g, thus, the porous geological polymer microspheres can be directly used for packed columns for column separation. Experiments show that the porous geological polymer microspheres have a good adsorption effect on heavy metals, and can be used as adsorbents for heavy metals, and have a broad application prospect in the aspect ofremoving heavy metals and radioactive elements in water.

The invention discloses a preparation method for a thermosetting hybrid polyester resin. The method comprises a synthesis step, a cooling step and a vacuum-pumping and curing step. Compared to the prior art, the invention has the following advantages: considerable long-chain monomers in the fatty group are introduced to improve the toughness of resin; the viscosity of the resin is controlled, andthe amount of auxiliary agents in a later stage is controlled, thereby enabling a plate surface to have high leveling performance and enabling better balance between mechanical performance and glass transition temperature to be obtained. Compared to conventional products, the product prepared in the invention has the following advantages: low temperature curing is realized; the plate surface has good leveling performance and has horizontal fluidity up to more than 30 mm in a horizontal fluidity experiment under the conditions of a temperature of 140 DEG C and a time of 30 min.

The invention discloses low-temperature ultraviolet curing equipment which comprises a transformer, a capacitor and a frame, wherein the frame is coiled by a mirror finished stainless steel plate and sequentially provided with a downwards opened lampshade, a light reflecting plate, an ultraviolet lamp and a stand from top to bottom; an air inlet pipe and an air outlet pipe are installed on the lampshade; fans are respectively arranged on the air inlet pipe and the air outlet pipe; and one end of the ultraviolet lamp is connected with one end of the secondary side of the transformer by the capacitor, and the other end of the ultraviolet lamp is connected with the other end of the secondary side of the transformer. The curing equipment is particularly suitable for the surface ultraviolet coating and printing of thin base materials without heat resistance, such as plastics, paper, and the like; when in use, the surface temperature of a cured material can be reduced below 45 DEG C, and the problem of deformation of the base materials at high temperature is effectively prevented.

The invention discloses a low-temperature curing polyether sulfone coating composition and a preparation method thereof, as well as a coating process, and belongs to the technical field of coatings. The low-temperature polyether sulfone coating composition is prepared from polyether sulfone resin, epoxy resin, polytetrafluoroethylene, a curing agent and a diluent. The preparation process comprises the following steps: dissolving the polyether sulfone resin in a composite solvent prepared from dimethylacetamide, methylbenzene and butanone at the stirring speed of 3,200 to 3,800 r/min, then adding the polytetrafluoroethylene and the epoxy resin in sequence, grinding the materials in a grinding machine for 2 to 6 hours, adding the curing agent before spraying, stirring for 0.2 to 0.5 hour for curing, spraying a sandblast metal base material with the cured coating through an air spraying gun and an air compressor, and drying at 150 to 170 DEG C for 2 to 6 hours. According to the preparation method disclosed by the invention, low-temperature curing of the polyether sulfone coating is realized; a prepared coating layer is high in adhesion force, impact resistance, wear resistance, hydrophobicity, corrosion resistance and the like; the preparation and coating process is easy to operate; production equipment is easy to realize and the application range is wide.

The invention relates to a method for preparing low-temperature cured polyester resin. The method comprises the following steps: heating for esterifying, cooling, vacuumizing and curing. By adopting the method provided by the invention, the reaction activity of the resin is greatly improved, the storage stability is relatively good, and when the resin is used in a powder coating, low-temperature curing is well achieved, the coating is relatively good in adhesion to a substrate, and meanwhile relatively good leveling and chemical resistance properties are achieved.

The invention discloses a preparation method of a tourmalinite fuel oil activator. The tourmalinite fuel oil activator comprises tourmalinite nano-powder as a main functional component. The preparation method comprises the following steps of compounding the tourmalinite nano-powder and spinel ferrite, mixing the compound and an additive according to a mass ratio of the tourmalinite nano-powder, the spinel ferrite to the additive of 87-93: 5-9: 2-4, carrying out sintering to obtain a solid mixture, and adding water and a surfactant into the mixture, wherein the amount of the used mixture is 1-5% the total amount of the solid-liquid mixture, a water use ratio is in a range of 5-98% and a surfactant use ratio is in a range of 2-30%. The tourmalinite fuel oil activator obtained by the preparation method can improve fuel oil quality, promote full combustion of fuel oil, improve combustion efficiency, save fuel oil, improve fuel oil atomization quality, and realize full combustion of fuel oil thereby reducing discharge of harmful gas so that energy saving and emission reduction are realized.

The invention relates to a waterborne epoxy curing agent for waterborne epoxy resin as well as a preparation method and an application method of the waterborne epoxy curing agent. Mercapto and amino groups are taken as curing reaction groups of the waterborne epoxy curing agent, a curing agent structure comprises a tertiary amine structure which can be dispersed or dissolved in water. Compared with a polyamine curing agent, the prepared quick-drying curing agent is faster in curing and better in impact resistance and can realize low-temperature curing; compared with a thiol curing agent, the prepared quick-drying curing agent is faster in curing, and hardness, bending performance and impact resistance of a film are improved remarkably.

The invention provides low-temperature curing epoxy resin. The epoxy resin is epoxy resin of which an epoxy group is modified, and the modified group is a primary amine group or an isocyanate group. The invention also provides a coating containing the epoxy resin. According to the epoxy resin provided by the invention, a chemical modification method is used to convert all epoxy groups on a molecular chain of the epoxy resin into terminal amino-NH2 or isocyanate groups; and when the epoxy resin is applied, modified amino-containing epoxy resin and an isocyanate group-containing curing agent aremixed, or modified isocyanate group-containing epoxy resin and an amino-containing epoxy curing agent are mixed, rapid curing can be performed at the temperature of 0 DEG C or less, and a coating film is stable, and has high strength and wide application prospects.

The application provides high solid content polyimide coating glue for chip passivation protection and a preparation method and use thereof, and relates to the technical field of chip passivation protection. The coating glue has high solid content and low viscosity and can be cured at a low temperature. The cured organic soluble polyimide glue coating has excellent dielectric properties, heat resistance and mechanical properties. The coating glue solves the problem that the existing polyamide acid coating glue has low solid content, high viscosity, a high curing temperature, poor heat resistance, poor transparency and high dielectric constant. The high solid content polyimide coating glue has wide application prospects in advanced microelectronics and optoelectronic devices.

The invention discloses a preparation method of low-temperature curing type waterborne amino acrylic resin. The preparation method comprises the following steps of performing esterification reaction on melamine formaldehyde resin and acrylic acid to obtain an amino acrylic ester macromonomer; mixing the amino acrylic ester macromonomer into an acrylic monomer emulsion, and polymerizing to obtain a polyamino acrylic ester emulsion; mixing the polyamino acrylic ester emulsion and water-soluble blocked isocyanate, so as to prepare the low-temperature curing type waterborne amino acrylic resin. The preparation method has the advantages that the melamine formaldehyde resin is mixed into the acrylic acid to prepare the amino acrylic ester, and multiple types of acrylic ester are mixed into the amino acrylic ester, so that the properties of the emulsion and a rubber film are improved, the anti-scratching and anti-corrosive properties of a coating film are improved, and the service life of the coating film is prolonged; after the isocyanate which is blocked by sodium bisulfite is used, the self disadvantages are overcome by the advantages of the isocyanate and the acrylic ester, and the coating film has the water-proof, anti-aging and anti-corrosive properties of the amino acrylic ester, and also has the property of low curing temperature of the isocyanate.

The invention provides a waveband-selective low-emissivity temperature-resistant environment-friendly infrared stealth material and a preparation method thereof.The material comprises an infrared stealth coating and an infrared stealth film which are alternately arranged on a base material, the refractive index of the infrared stealth coating ranges from 3.55 to 3.74, sheet-shaped aluminum powder is modified through a liquid phase deposition surface coating technology, and the infrared stealth film is prepared. The prepared Al/Cr2O3 composite filler effectively improves the temperature resistance of the infrared coating. The refractive index of the infrared stealth film ranges from 1.12 to 1.25. The material has low infrared emissivity in infrared detection windows (3-5 microns and 8-14 microns) and has high infrared emissivity in a non-infrared detection window. The infrared stealth material disclosed by the invention can resist high temperature of 600 DEG C or above.

The invention discloses copper-based composite conductive paste and a preparation method and an application thereof. The copper-based composite conductive paste comprises a binder, an organic carrierand metal conductive fillers. In the low-temperature curing of the copper-based composite conductive paste under the temperature of 180 DEG C-250 DEG C, SnAgCu alloy powders in the metal conductive fillers melt and chemically reacts with the surface of copper powders to produce an intermetallic compound, wherein the intermetallic compound comprises a Cu6Sn5 phase and a Cu3Sn phase; and the copperpowders in the cured copper-based composite conductive paste are connected with the SnAgCu alloy powders through the Cu6Sn5 phase and the Cu3Sn phase. Compared with the prior art, the copper-based composite conductive paste adopts the SnAgCu alloy powders and micrometer copper powders to improve the conductivity of a copper film, has a large tap density and a relatively low curing temperature, andis convenient for practical use; the low-cost copper powders are used to replace silver paste prepared by more expensive silver powders in some respects, so that the cost is greatly reduced; and meanwhile, the copper-based composite conductive paste does not cause pollution to the environment, accords with the environmental protection concept, and has a broad application prospect.

The invention discloses a synthesis method of silver nanowire printing ink, which is specifically implemented according to the following steps: step 1, dissolving a certain amount of polycarbonate fibers, silver nitrate and polyvinylpyrrolidone (PVP) in an ethylene glycol solution, and then adding a ferric trichloride aqueous solution to obtain a mixed solution; step 2, magnetically stirring the mixed solution at 70 DEG C for 40 min, after the color of the solution becomes dark red brown, raising the temperature to 160 DEG C, and magnetically stirring at a constant temperature for 80 min to obtain a mother solution; 3, centrifugally cleaning the mother liquor obtained by the reaction in the step 2 with absolute ethyl alcohol for multiple times to obtain a precipitate; and 4, dispersing theprecipitate obtained in the step 3 in a solvent to obtain the silver nanowire ink. The problem that in the prior art, the nano-silver conductive ink needs to be sintered and cured at high temperatureafter being coated is solved. The invention also discloses a preparation method of the flexible conductive film.

The invention discloses a method for solidifying radioactive nuclide fission product cesium by perovskite structure oxide. The method comprises the steps that Ba(NO3)2, CsNO3 and Zr(NO3)2.5H2O are taken and added into water for stirring, and a chelating agent is added into the stirred solution for stirring; after a gel is added into the stirred chelated solution for stirring, the temperature is risen slowly until sol becomes gel; the gel is dried, then is placed in a resistance furnace for pre-sintering and is taken out, and after grinding is carried out, a black powder precursor is obtained;the black powder precursor is taken for heat treatment, a nano-powder sample is prepared, the nano powder sample is pressed into blocks, pressure maintaining is carried out, calcination is carried out, and a solidified body is prepared. According to the method for solidifying the radioactive nuclide fission product cesium by the perovskite structure oxide, the perovskite structure oxide with highself-adjusting capability and capable of containing a wide range of elements is adopted as a solidified parent structure, low-temperature phase formation is carried out by a Sol-Ge method, a pressed block sintering process is combined, and low-temperature solidification of Cs is realized by preparing the solidified body; and after Cs is solidified by adopting the solidified matrix structure, the stability is high, and the leaching rate is low.

The invention provides polyester resin for the self-leveling powder coating and a preparation method. Pentaerythritol, adipic acid, glycerol, terephthalic acid, isocaprylic acid, n-butyric acid, diethylene glycol diglycidyl ether and methylmalonic acid are used as main raw materials; the polyester resin for the disposable low-temperature curable self-leveling powder coating is obtained by adopting a segmented polymerization mode. The polyester structure has a proper amount of ester groups with low surface tension, so that the softening point of the product is reduced, low-temperature curing is realized, the problem of insufficient leveling property of a low-temperature curing coating film is solved due to excellent self-leveling property, and the ultrahigh-leveling coating film is obtained. According to the preparation process, special raw materials do not need to be prepared in advance, the 70/30 self-leveling polyester resin product is directly prepared by adopting a single-kettle synthesis process, the process is simple, and the cost is relatively low.

The invention discloses ultralow-temperature epoxy cured polyester resin and a preparation method thereof. The formula comprises the components in parts by mass: 1-5 parts of core monomer dipentaerythritol, 0.08-0.12 part of a catalyst, 30-55 parts of polybasic acid, 30-42 parts of polyhydric alcohol, 10-25 parts of end-capping acid, 0.01-0.12 part of an antioxidant and 1-5 parts of a curing accelerator. The product obtained by adopting the formula provided by the invention has a hyperbranched structure and relatively low viscosity, is beneficial to melt flow curing, realizes low-temperature curing, and has excellent impact property and high leveling grade; according to the preparation method disclosed by the invention, alcohol with six functional groups is firstly introduced as a core monomer, a part of polyatomic acid is firstly added, and then the polyatomic alcohol and the rest of polyatomic acid are added, so that the product obtained by the method has a certain hyperbranched structure, and is good in impact resistance and high in leveling grade.

The invention discloses a preparation method for copper slag-based porous geopolymer spheres. According to the method, sodium hydroxide is dissolved in a sodium silicate solution, then copper slag powder is added and is stirred uniformly; a foaming agent aqueous solution is added into the mixture and is stirred uniformly to obtain geopolymer slurry; under the condition of heating in a water bath,the uniformly stirred slurry is dropwise added into polyethylene glycol with a syringe, and liquid drops are quickly solidified into small spheres at 40-70 DEG C and are dispersed and float in the polyethylene glycol to prepare geopolymer spheres; the geopolymer spheres are fished out, are washed with distilled water, are dried, and are cured and solidified at room temperature to obtain the copperslag-based porous geopolymer spheres. The sphere formation rate of the method of the invention is greater than 80%; the method realizes low-temperature solidification and waste recycling; the copperslag-based porous geopolymer spheres are applied to adsorption of heavy metal ions in wastewater, so that the adsorption rate is high; an adsorbent is easy to recycle; secondary pollution of a water body cannot be caused, and the preparation method is more friendly to the environment.

The invention relates to the technical field of surface mounting, in particular to an SMT surface mounting process. The SMT surface mounting process comprises the following steps of: (1) pretreatment:cleaning and drying a PCB; (2) dispensing: coating the preset dispensing position on the PCB with a patch adhesive by using a dispensing machine; (3) chip mounting: mounting the component on the PCBby using a chip mounter; (4) curing: feeding the PCB into curing equipment for curing; (5) reflow soldering: feeding the PCB into a reflow soldering furnace for reflow soldering; and (6) checking: checking the yield of the finished product, wherein the patch adhesive comprises the following raw materials in parts by weight: bisphenol F epoxy resin, a diluent, a curing agent, a filler and a pigment. The chip mounting adhesive adopted in the SMT chip mounting process has the characteristics of the high bonding strength and the high curing speed, low-temperature curing can be achieved at a temperature of 110-130 DEG C, the curing time is only 1-2 minutes, the packaging speed is high, and the production efficiency can be effectively improved.