The invention belongs to the technical field of
chip processing, and particularly discloses a method for keeping concentricity of a pressure film and a steel ring in the pressure film, which comprises the following steps: carrying out dust and oil removal treatment on the steel ring, carrying out
sand blasting treatment on the surface of the steel ring, carrying out ultrasonic cleaning, taking out, blowing clean, baking with an oven, and removing
moisture; the surface of the steel ring is pretreated, and the steel ring is soaked in a
silicon adhesive solution, taken out and dried; vacuum hot
compression molding: after mold
assembly is completed on a flat plate molding vulcanizing
machine, a jig is put into a mold, a steel ring is put into the jig, and then five strip-shaped
silica gel materials are put into the surface of the steel ring for vacuum hot
compression molding; and quality detection. According to the method for keeping the concentricity of the pressure film and the steel ring in the pressure film, the steel ring does not deform and keeps the concentricity by changing a material placing mode and equipment parameters,
wafer grinding is prevented from being affected, meanwhile, a mold does not need to be opened or modified again, and the purpose of reducing the research and development cost of new products is achieved.