Epoxy resin-based low-temperature conductive silver paste and preparation method thereof

A technology of epoxy resin and conductive silver paste, which is applied in the manufacture of cables/conductors, conductive materials dispersed in non-conductive inorganic materials, circuits, etc., can solve the problems of complex preparation process, difficult use of substrates, and high process requirements. Achieve the effect of simple preparation process, high conductivity and low curing temperature

Inactive Publication Date: 2020-06-09
常州烯奇新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the above-mentioned polymer paste usually has a complicated preparation process and needs to be heated at a temperature of about 150 degrees Celsius. Difficult to use materials

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] Embodiment 1: An epoxy resin-based low-temperature conductive silver paste, comprising the following components by weight: 60 parts by weight of silver powder, 11 parts by weight of epoxy resin, 6 parts by weight of curing agent, 3 parts by weight of curing accelerator, diluent 15 parts by weight, 0.5 parts by weight of inhibitor, 1.5 parts by weight of rheology additive, and 3 parts by weight of additive.

[0024] Among them, the silver powder adopts spherical silver powder with a particle size of 0.5 μm, the epoxy resin is a mixture of bisphenol A epoxy resin E44 and aliphatic epoxy resin UVR-6110, the curing agent is polysebacic anhydride, and the curing accelerator is DMP- 30. The diluent is 1.4-butanediol diglycidyl ether, the inhibitor is maleic acid, the rheological modifier is hydrogenated castor oil, and the additives are defoamer and polyethylene glycol.

[0025] Optimized and adjusted the formula of conductive silver paste to achieve low-temperature curing un...

Embodiment 2

[0032] Embodiment 2: An epoxy resin-based low-temperature conductive silver paste, comprising the following components by weight: 65 parts by weight of silver powder, 12 parts by weight of epoxy resin, 4 parts by weight of curing agent, 2 parts by weight of curing accelerator, diluent 13 parts by weight, 0.4 parts by weight of inhibitor, 1.6 parts by weight of rheology additive, and 2 parts by weight of additive.

[0033] Among them, the silver powder adopts flake silver powder with a particle size of 5 μm, the epoxy resin is a mixture of bisphenol F epoxy resin NPEF-170 and aliphatic epoxy resin UVR-6110, and the curing agent is dodecenyl succinic anhydride. The accelerator is triethanolamine, the diluent is a mixture of propylene oxide butyl ether and propylene oxide phenyl ether, the inhibitor is ethyl borate, the rheology additive is polyamide wax, and the additive is polyethylene glycol.

[0034] The preparation method of above-mentioned epoxy resin base low-temperature c...

Embodiment 3

[0039]Embodiment 3: An epoxy resin-based low-temperature conductive silver paste, comprising the following components by weight: 70 parts by weight of silver powder, 9 parts by weight of epoxy resin, 3 parts by weight of curing agent, 1 part by weight of curing accelerator, diluent 12 parts by weight, 0.3 parts by weight of an inhibitor, 0.7 parts by weight of a rheological additive, and 4 parts by weight of an additive.

[0040] Among them, the silver powder is a mixture of flake silver powder with a particle size of 5 μm and spherical silver powder with a particle size of 0.5 μm at a weight ratio of 5:1, and the epoxy resin is bisphenol A epoxy resin E51 and bisphenol F epoxy resin NPEF- 170 mixture, the curing agent is dicyandiamide, the curing accelerator is DMP-30, the diluent is allyl glycidyl ether, the inhibitor is a mixture of maleic acid and ethyl borate, and the rheology additive is gas phase Silica, additives are defoamers and polyethylene glycols.

[0041] The pr...

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PUM

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Abstract

The invention belongs to the technical field of conductive silver paste and relates to epoxy resin-based low-temperature conductive silver paste and a preparation method thereof. The paste is preparedfrom the following components in parts by weight: 20-40 parts of starch; 55 to 75 parts by weight of silver powder; 5 to 15 parts of epoxy resin; 0.3 to 10 parts of curing agent; 0.05 to 5 parts of curing accelerator; 2 to 18 parts of diluents; 0.01 to 1 part of inhibitor; 0.1 to 3 parts of rheological additive; and 0.5 to 5 parts of additive. The paste has relatively low curing temperature and relatively low viscosity, and is suitable for a silk-screen printing process.

Description

technical field [0001] The invention belongs to the technical field of conductive silver paste, and in particular relates to an epoxy resin-based low-temperature conductive silver paste and a preparation method thereof. Background technique [0002] As a conductive material, conductive paste is generally a dispersion of conductive metal particles in resin or resin analogues. The main function of conductive paste is to connect electronic components to the conductors of printed circuit boards. The conductive paste mainly includes binder and conductive filler. Among them, common adhesives include polyimide resin and epoxy resin, and common conductive fillers include nickel and silver. Among adhesives, epoxy resins are superior in heat resistance and flexibility, so epoxy adhesives are mainly used. The conductive filler mainly uses silver powder with high conductivity and not easily oxidized. [0003] In the conductive paste, the paste used for high-temperature calcination c...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B1/22H01B13/00
CPCH01B1/22H01B13/00
Inventor 喻金星徐晓翔李红元汪永彬刘记林杨军
Owner 常州烯奇新材料有限公司
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