101results about How to "High curing temperature" patented technology

The present invention relates generally to forming a threaded neck in a metal bottle manufactured by a process known as impact extrusion. More specifically, the present invention relates to methods, apparatus and alloy compositions used in the impact extrusion manufacturing of containers and other articles with sufficient strength characteristics to allow threading the container necks to receive a threaded closure on the threaded neck.

The invention relates to a method for at least partially reworking or replacing a reinforcement element of a fibre composite structure. In a first method step, at least one fibre layer is arranged on a surface section of the reinforcement element and/or at least one replacement section of the reinforcement element of the same material and same layer structure is arranged on a surface reinforcement section of the fibre composite structure. In a second method step, at least a pressure mat adjusted to the contour of the reinforcement element is disposed above the at least one fibre layer and/or the at least one replacement section of the reinforcement element, wherein the at least one pressure mat is supported and fixed in a nominal position by a fixing frame adjusted to the contour of the reinforcement element. In a third method step, the at least one pressure mat is then acted upon by a pressure medium in order to press the same against the reinforcement element and the fixing frame. In a fourth method step, a hardening of the at least one fibre layer and/or the at least one replacement section of the reinforcement element is carried out. The invention further relates to a corresponding connecting device for carrying out the method.

A resin composition which has low stress, and good adhesive property in high temperature and high moisture environments and which is useful in adhesive applications in low stress, high moisture sensitivity level electronic packages. Preferably, a flexible epoxy anhydride adduct modified solid bismaleimide and solid benzoxazine resin composition that can survive high temperature and high moisture conditions and maintain good adhesion strength and minimize the stress resulting from a coefficient of thermal expansion mismatch between a silicon die and a substrate which is Ball Grid Array solder mask or a smart card polyethylene terephthalate or silver or copper metal lead frame.

An electrical conductor for transmission of electrical power, having a total cross-section equal to or above 10 mm² and comprising a plurality of stranded filamentary members, where at least one of the filamentary members is made from microalloyed copper or microalloyed aluminium having annealing temperatures higher than 250° C., and has the side surface thereof totally coated with a fluorinated polymer. The conductor has a better behavior relative to the skin effect and allows operation at high temperatures. Furthermore, if the electrical conductor is suspended, it has a smaller sag and prevents or reduces the accumulation of ice and/or snow.

The invention provides a high-strength high-permeability chemical sand prevention agent, and a preparation method and an application thereof. The high-strength high-permeability chemical sand prevention agent is composed of a proppant, a cementing agent, an accelerator, a curing agent and a coupling agent according to a certain ratio. The preparation method comprises the following steps: above raw materials are mixed at a specific temperature, and are stirred, and the obtained mixture is cured for a certain period of time to obtain the high curing strength sand prevention agent. The sand prevention agent has good tolerance to acid, water, salt and oil, has high stability in high temperature and high humidity environment, and is mainly used in chemical sand prevention well extract production, serious casing deformation well sand prevention, and sand prevention of wells without mechanical sand prevention and oil water wells with low reservoir temperature in order to increase liquid production of the oil well, prolong the period of validity of well sand prevention, increase the amount of oil and reduce the production cost.

The invention relates to a preparation method of room-temperature regenerated phenolic resin and a recycling technology and application thereof. The preparation method comprises the following steps of according to parts by mass, melting and blending 100 parts of thermoplastic phenolic resin and 18.4 to 55 parts of boric acid compound at the temperature of 60 to 100 DEG C, so as to obtain boron-containing thermoplastic phenolic resin; or, dissolving 100 parts of thermoplastic phenolic resin and 20 to 50 parts of boric acid compound into an organic solvent with low boiling point at the temperature of 40 to 60 DEG C, so as to obtain the boron-containing thermoplastic phenolic resin; curing, so as to obtain the room-temperature regenerated phenolic resin. The preparation method has the advantages that the preparation technology of the resin is simple; the resin is dissolved into the mixing solvent of ethyl alcohol and water at room temperature, so that the resin can be recycled; the resin can be used for preparing the recyclable fiber reinforced boron-containing thermoplastic phenolic resin-based composite material. The prepared boron-containing thermoplastic phenolic resin has the advantages that the function of arylboronic acid ester structure promoting the heat-resistant property of the thermoplastic phenolic resin is fully realized, and the technology of the resin and the mechanical property of the composite material can be simultaneously realized.

The invention relates to thermosetting resin able to realize high temperature heating and curing in high frequency magnetic field and a preparation method thereof. The method of the invention is technically characterized by: adopting thermosetting resin as the matrix and special Fe3O4 magnetic particles as filler, placing the resin system in a high frequency magnetic field generated by alternating current, making use of the heat generated from the Neel relaxation effect of the special Fe3O4 magnetic particles to cure thermosetting resin. The heating and curing technology in a high frequency magnetic field of in the invention realizes high efficiency curing of thermosetting resin. In the invention, by adjusting the mass ratio of special Fe3O4 magnetic particles in a thermosetting resin system, an optimum proportion of a heat production rule and the thermosetting resin curing system of the technology can be determined.

The invention relates to a formula of water dispersing compounding sand consolidation agent. It is made up from modified phenol-formaldehyde resin 5-8%, organic silicon resin 0.02-0.25%, furfural compounding 5-15%, alcohol compounding 0.5-5%, phosphoric acid series compounding 0.05-0.15% and water 89.43-81.6%. The benefit is that the sand consolidation agent has low viscosity, low usage quantity, low cost, etc.

The invention relates to a halogen-free flame-retardant coating composition which comprises the components: 10-80% of film-forming polymer and 5-70% of inorganic flame-retardant material, and is characterized in that the flame-retardant material comprises flame-retardant filler microparticles and metallic tin benzoate and/or basic metallic tin benzoate, wherein the total PVC (polyvinyl chloride) content in the composition is 75-97%, and the film-forming polymer contains organic silicon resin.

The invention discloses liquid crystal epoxy resin as well as a preparation method and an application thereof. The preparation method comprises the following steps: reacting 3,5'-di-tert-butyl-5,3'-dimethyl biphenol with excessive epichlorohydrin in the presence of a phase transfer catalyst, thereby obtaining 3,5'-di-tert-butyl-5,3'-dimethyl diphenyl diglycidyl ether, wherein the softening point of 3,5'-di-tert-butyl-5,3'-dimethyl diphenyl diglycidyl ether is measured to be 10 DEG C through DSC, and the 3,5'-di-tert-butyl-5,3'-dimethyl diphenyl diglycidyl ether is a thick non-solid product at the room temperature; then, selecting a proper curing agent to pre-cure at a low temperature, enabling a biphenyl rid-rod-shaped structure to orientate and arrange with enough time, curing and cross-linking at a high temperature, thereby obtaining a liquid crystal structure. Compared with the conventional preparation method for the rigid-rod-shaped epoxy resin, the preparation method disclosed by the invention is low in curing cost.

The invention relates to the technical field of high molecular materials, and particularly relates to copolymerized polyimide thermosetting resin comprising a carborane structure and a preparation method and an application thereof. The copolymerized polyimide resin is prepared by thermally cross-linking and solidifying polyimide oligomers represented by a formula I as a raw material. The oligomersintroduce the carborane of a certain composition into a conventional thermosetting polyimide resin system by means of a copolymerization method, so that the conventional thermosetting polyimide resinhas relatively low hot melt viscosity and a higher glass-transition temperature (higher than 500 DEG C) and also has more excellent thermal oxidation resistance and heat stability resistance. Therefore, the thermosetting resin has the extremely low hot melt viscosity. The resin is more easily prepared into a composite material part of a complex structure through a conventional processing technology, can improve the thermal oxidation resistance of the material to a great extent, and has very high application value and innovation to prepare a light high strength high-temperature-resistant easily processed polyimide composite material for a structural material in the aerospace field.

The invention provides modified graphene oxide, slurry and a composite film, and preparation methods and applications thereof. The modified graphene oxide is graphene oxide modified by a curing accelerator; the slurry comprises modified graphene oxide, polyimide and/or a polyimide precursor, and an organic solvent; the composite film is formed by solidifying the slurry; the composite film has a high imidization rate, a low dielectric constant and a low curing temperature, so that the composite film can be used as a special functional plastic to be applied to advanced packaging of semiconductors, warping of ultrathin wafers and reconstructed wafers can be well avoided, and damage to heat-labile elements can be effectively avoided.

The invention discloses smoke-free micro-expansive anhydrous stemming, comprising the following components in parts by weight: 10-30 parts of corundum, 15-25 parts of alumina, 10-20 parts of silicon carbide, 10-25 parts of coke, 15-25 parts of clay, 5-10 parts of expanding agent and 15-18 parts of phenolic resin binder. The invention has the advantages that: in the stemming using process, yellow smoke is not generated, pungent smell is less, and the used phenolic resin binder has higher curing temperature and can meet the use requirements of the stemming. Because the expanding agent is added, the stemming can generate micro-expansion at the high temperature so as to fill cracks generated due to inside and outside stresses and modify the high temperature using performance of the stemming.

The invention discloses an adhesive with an anti-line-explosion function for corrugated paperboard production and a preparation method of the adhesive. The adhesive comprises the following components in parts by weight: 1,000 parts of water, 300-400 parts of corn starch, 5-10 parts of sodium hydroxide, 2-4 parts of borax, 7-9 parts of a stabilizer, 2-3 parts of a reinforcing agent and 1-3 parts of sodium chloride. The preparation method adopts a two-step method. Due to the use of the adhesive, the problem of line explosion and breakage of paperboards in a dry climate is effectively solved without adding a spraying system, the production cost of the paperboards is scarcely increased, and the paperboard uniformity is improved.

An adhesive composition containing an aqueous butadiene polymer latex, and an acid scavenging compound, wherein the adhesive comprises essentially no phenolic resin or methylene donor compounds. The aqueous covercoat adhesive is particularly well suited for rubber to metal bonding applications. The adhesive have shown excellent adhesion to a number of compounds but perform best on natural rubber compounds and prefer higher cure temperatures to lower cure temperatures. Further, the formulation has been developed without the need for a methylene donor such as 2-polyoxymethylene dimethylether (gamma POM).

The present invention provides fora silicone epoxy resin, its preparation, and the use in corrosion-inhibiting, heat-stable coatings. The inventive resins are obtained by a process which comprises reacting: I) siloxanes of the general formula<paragraph lvl="0"><in-line-formula>RaSi(OR')bO(4-a-b)/2</in-line-formula>in which OR' is an alkoxy group with primary or secondary aliphatic alcohols, R is identical or different and is an alkyl group or an aromatic group, a is from 0.1 to 2.0, and b is from 0.1 to 1.0, with II) one or more low molecular mass polyhydric alcohols/polyols and III) one or more resins containing epoxide groups, containing at least two 1,2-epoxide groups per molecule, at temperatures in the range from about 100 to about 160° C. with removal of the alcohol HOR' to a degree of conversion of from 20 to 80% and terminating the reaction by cooling to a temperature < about 100° C.

The invention relates to the use of alkylphenol disulfide accelerators in butyl and halobutyl compounds.

A method is described for producing an improved addition-crosslinked silicone rubber which is used as a damping material in hermetically sealed housings having a semiconductor.

The invention discloses alloy for casting a space shuttle liquid hydrogen fuel tank. The alloy is prepared from the following raw materials in parts by weight: 85-90 parts of Al, 2.0-3.0 parts of Li, 2.0-3.0 parts of Cu, 0.1-0.25 parts of Zr and 0.1-0.2 parts of Sr. The alloy has the advantages as follows: with adoption of electron beams for smelting the alloy, harmful impurity elements such as O, N, S and the like can be greatly reduced in the alloy smelting process, purity and content of Al, Ni and Cu in the alloy are increased, low temperature resistance of the alloy is guaranteed, and as the temperature decreases, strength, ductility and toughness of the alloy are greatly improved; the aluminum ingot with the grade of Al99.85 is used as a raw material, purity of Al in the alloy is further improved; an ultra-low-temperature-resistant pressure-sensitive adhesive is solvent-free, the curing temperature is low, curing time is short, the ultra-low-temperature-resistant pressure-sensitive adhesive is used for bonding flexible foam plastic and a pipe rapidly, the on-site construction process is good, the ultra-low-temperature-resistant pressure-sensitive adhesive still realizes a better adhesion effect under the condition of ultra-low temperature; and transmission of low temperature can be better insulated by the soft foam plastic layer.

The present invention relates to a method for manufacturing a battery comprising a casing provided with a cup and a closure part for said cup, the method comprising the successive steps consisting in:

• • providing at least three parts with a first part defining one pole, and a second part and a third part defining the other pole and intended to form together the cup, the first and second parts respectively comprising a first surface and a second surface (6a) of matching shape, at least one adhesive portion of each of said surfaces extending in a geometric surface non-parallel to the general axis of the battery;
  • bonding the aforementioned first and second surfaces to provide a structure with an adhesive joint between the first and second parts;
  • welding the third part to the second part;

the adhesive joint being arranged against an inner face of the cup, the aforementioned adhesive portion of the second part forming a stop, along the general axis, for the first part, which is located inside the cup.