23results about How to "Long application period" patented technology

The invention relates to the field of phenolic resin adhesives, and particularly discloses a preparation method of a phenolic resin adhesive for a bamboo oriented strand board, which comprises the following steps: (1) phenol activation: adding phenol and a basic catalyst aqueous solution into a reaction kettle, and activating to form an intermediate state of phenate negative ions; (2) addition stage: adding a high-concentration formaldehyde reactant into the reaction kettle, and carrying out heat preservation reaction to generate hydroxymethyl phenol; (3) heating and replenishing: heating to 80 + / -2 DEG C, keeping the temperature, replenishing the formaldehyde aqueous solution into the reaction kettle, and keeping the temperature for 20-25 minutes; (4) polycondensation stage: adding a basic catalyst aqueous solution, heating to 90 + / -2 DEG C, and carrying out heat preservation reaction; and (5) terminating the reaction: after the heat preservation reaction, detecting the viscosity, cooling, and discharging to obtain the adhesive. The phenolic resin with the solid content of 60% or above can be prepared, the adhesive has excellent bonding performance, and the prepared shaving board is excellent in mechanical strength.

The invention discloses PCB (printed circuit board) through hole plugging resin which is prepared from the following raw materials in parts by weight: 35-100 parts of epoxy resin composition, 5-15 parts of curing agent, 1-10 parts of curing accelerator and 0.1-5 parts of assistant. By adopting the combination of the bisphenol A epoxy resin, the bisphenol F epoxy resin and the trifunctional epoxy resin, the prepared hole plugging resin is easy to plug holes, not easy to sag and excellent in hole plugging performance. The thermosetting resin composition is used for permanently filling the through hole in the printed circuit board, has the properties of low viscosity, easiness in hole filling, good sagging resistance and high glass transition temperature, not only can meet the requirements of an existing vacuum hole filling machine, but also can meet the hole filling requirements on high efficiency and high cost performance in a complex printed circuit board.

The invention discloses a waterborne epoxy micaceous iron coating and a preparation method and application thereof, and relates to the technical field of anticorrosive paints.The waterborne epoxy micaceous iron coating comprises a component A and a component B. The component A and the component B are prepared from raw materials including the following components: the component A comprises waterborne epoxy emulsion, micaceous iron ash, an anti-settling agent, pigment filler and an auxiliary A; the component B comprises a waterborne epoxy curing agent; the component A is prepared from the following components in parts by weight: 100 parts of waterborne epoxy emulsion; 20-170 parts by weight of micaceous iron ash; 0.5-6 parts by weight of an anti-settling agent; 20-80 parts by weight of pigment and filler; 1-8 parts by weight of an auxiliary agent A; the component B comprises the following components in parts by weight: 100 parts of a waterborne epoxy curing agent; the weight ratio of the component A to the component B is (8-12): 1. The waterborne epoxy micaceous iron coating disclosed by the invention has the advantages of low VOC (Volatile Organic Compounds), relatively good sealing property, sagging prevention, sedimentation prevention, high adhesive force and the like.

The present invention relates to a composition for an electrostatic dissipation coating, a polarizing plate, and an optical display device. A composition for a static dissipative coating includes a curable resin having carboxylic acid groups, a bifunctional aziridine curing agent, and a conductive polymer.

The present invention addresses the problem of providing: a substrate; provided are: a curable resin composition which is capable of achieving rapid curing at low temperatures (for example, curing at 70-80 DEG C for 30 minutes), exhibits high adhesive strength during curing at low temperatures for a short period of time, and has a long pot life; a method for producing the curable resin composition; an adhesive or sealing material containing the curable resin composition; a cured product of the adhesive or sealing material; a semiconductor device including the cured product; and an electronic component. Provided is a curable resin composition containing (A) a radical polymerizable curable compound, (B) a radical polymerization initiator, (C) a polymerization inhibitor, and (D) inorganic particles, the content of the (C) polymerization inhibitor in the curable resin composition being in the range of 0.1-3.0 parts by mass per 100 parts by mass of the (B) radical polymerization initiator, and the content of the (D) inorganic particles being in the range of 0.1-3.0 parts by mass per 100 parts by mass of the (B) radical polymerization initiator. Also provided are a method for producing the curable resin composition, an adhesive or sealing material containing the curable resin composition, a cured product thereof, and a semiconductor device and an electronic component containing the cured product.

An epoxy resin composition containing an epoxy resin (A) and an epoxy resin curing agent (B), the epoxy resin (A) containing an epoxy resin (A1) having a glycidyl group derived from resorcinol and an epoxy resin (A2), which is an epoxy resin having a glycidyl group derived from bisphenol F, or the like, and the epoxy resin curing agent (B) containing resorcinol (B1) or the like, the content of the epoxy resin curing agent (B) is 7-60 mass%.

A dispersion of a cellulose nanofiber (CNF) and a cellulose nanocrystal (CNC) that maintains a physical property even after drying and redispersing and has a long pot life is provided. A composite of the CNF and the CNC having a higher rupture strength and a higher oxygen gas barrier property is also provided. The dispersion contains a CNF having a sulfate ester group and a CNC having a sulfate ester group. The composite contains the CNF having a sulfate ester group and the CNC having a sulfate ester group.

This polishing material slurry comprises: manganese oxide abrasive grains containing manganese oxide particles; permanganate ions; a phosphoric acid; and a polymer additive containing one or more water-soluble organic polymers selected from the group consisting of polycarboxylic acids, polycarboxylate salts, salts of naphthalene sulfonic acid formaldehyde condensates, polyvinyl alcohol, polyethylene glycol, polyvinylpyrrolidone, and copolymers thereof. The method for polishing the polishing material slurry according to the present invention comprises polishing an object to be polished using the polishing material slurry according to the present invention.

The invention relates to the technical field of coatings, in particular to a bi-component high-solid low-viscosity quick-drying high-fullness varnish and a preparation method thereof.The bi-component high-solid low-viscosity quick-drying high-fullness varnish is composed of a component A, a component B and a diluent, the component A is a main agent, and the component B is a curing agent; the component A at least comprises the following raw materials in percentage by mass: 60%-75% of hydroxy acrylic resin, 10%-20% of polyester polyol resin, 8%-20% of polyaspartic acid resin, 0.1%-0.3% of a dehydrating agent, 0.1%-0.4% of a defoaming agent, 0.2%-0.5% of an anti-sagging auxiliary agent, 0.5%-1.0% of a flatting agent, 0.05%-0.15% of a drier, 0.4%-0.8% of an ultraviolet light absorber, 0.2%-0.4% of an ultraviolet light stabilizer and the balance of an organic solvent; the preparation of the varnish which is high in construction solid content, low in VOC, quick to dry, long in pot life and good in fullness is achieved, the construction rhythm is met, and the appearance requirement of the varnish is met.

The invention relates to the technical field of pressure-sensitive adhesives, in particular to a single-component acrylate pressure-sensitive adhesive and a preparation method thereof.The single-component acrylate pressure-sensitive adhesive is prepared from, by mass, 138-161 parts of monomers, 190-210 parts of a first solvent, 10-50 parts of a second solvent, 0.1-0.5 part of an initiator and 6-9 parts of a curing agent; the monomer comprises at least one of a soft monomer, a hard monomer and a functional monomer. The specific soft monomer and the curing agent are introduced, and the mass ratio of the soft monomer to the hard monomer to the functional monomer in the monomers is controlled to be (100-110): (30-40): (8-11), so that the oil resistance of the pressure-sensitive adhesive is greatly improved while the high-temperature resistance of the acrylate pressure-sensitive adhesive is improved, and meanwhile, the pressure-sensitive adhesive has good storage stability at room temperature, and is suitable for industrial production. And the application requirements of special occasions such as high temperature and high oil can be met, and important practical value and wide market prospect are achieved.

This invention provides an environmentally friendly, moisture-resistant epoxy coating for substrates, its preparation method, and its application. The epoxy coating is obtained by mixing and curing a mixture of component A and component B. Component A includes a resin matrix, a solvent, and additives, including dispersants, defoamers, thixotropic agents, and fluorosilane coupling agents. Component B includes a curing agent. The resin matrix includes bisphenol F type epoxy resin, and the curing agent includes a ketimine curing agent. This invention utilizes the synergistic effect of bisphenol F type epoxy resin, fluorosilane coupling agent, and ketimine curing agent to actively displace interfacial water films and achieve controllable crosslinking upon contact with moisture, fundamentally solving the problem of moisture interference. This imparts excellent wet adhesion and permeability to the coating, effectively avoiding defects such as whitening of the paint film and incomplete crosslinking.

The invention provides a formaldehyde-free adhesive for single-component plywood and application of the formaldehyde-free adhesive, and relates to the field of high polymer materials. The formaldehyde-free adhesive comprises water-soluble acrylic resin, a filling agent, a thickening agent, a polyol curing agent and water, the polyol curing agent is a compound containing at least two hydroxyl groups. The formaldehyde-free adhesive for the single-component plywood does not contain isocyanate and other curing agents with high activity, the single-component adhesive prepared by adding the polyol curing agent is long in pot life and lasting in performance, the pot life is larger than or equal to 6 months, the bonding strength is larger than or equal to 0.7 MPa after hot water boiling, the opening time is larger than or equal to 6 h, and the transfer rate is larger than or equal to 90%; the adhesive is far better than an emulsion type formaldehyde-free adhesive and a double-component adhesive in the prior art.

The present application relates to the technical field of epoxy resin adhesive, in particular to a long applicable period dual-curing interpenetrating network type one-component epoxy resin adhesive, a preparation method and application, the adhesive is composed of 100 parts of E-51 epoxy resin, 15-35 parts of modified imidazole curing agent, 10-40 parts of active diluent, 0.2-2.0 parts of free radical polymerization initiator by weight fraction; The modified imidazole curing agent has the functions of latency and toughening. The one-component epoxy adhesive of the present application has a long room temperature storage period, which can reach 570-632 hours; only heating is needed to simultaneously realize free radical polymerization curing and thermal curing, forming an interpenetrating network type resin material with high strength and high toughness; there is no strict requirement for raw materials and packaging substrates, overcoming many defects existing in traditional dual-curing epoxy adhesives.

The invention discloses a fiber-reinforced thermoplastic composite in-situ impregnation molding method, belonging to the technical field of resin-based composite material preparation. The present invention solves the problems that the existing methacrylate resin has a large volume shrinkage, the fiber volume content of the molded thermoplastic composite is low, and the fiber impregnation effect is poor. The present invention first adopts a prepolymerization method to prepare a prepolymer resin with a viscosity of 100-900mPa·S, realizes the regulation of the viscosity of the resin system, and then mixes the prepolymer resin, initiator, internal mold release agent, filler and dispersant uniformly, pours into a glue injection device and impregnates the fiber in the molding mold, heats up and polymerizes, and obtains a fiber-reinforced thermoplastic composite. The thermoplastic methacrylate resin system for in-situ impregnation molding of fiber-reinforced thermoplastic composite provided by the present invention has a simple preparation method, a greatly shortened molding cycle, a significantly improved economic benefit, and a product with good mechanical properties, weather resistance, etc., is suitable for industrial production.

There is provided an epoxy resin composition comprising an epoxy resin (A), a curing agent (B), an imidazole adduct-type curing accelerator (C), and a Lewis acid compound (D) having a boron atom or an aluminum atom, wherein the curing agent (B) comprises a compound (B-1) represented by a formula (B-1)[R1 denotes a hydrogen atom, a halogen atom, a methoxy group or a hydrocarbon group having 1 to 12 carbon atoms]; and the content of a compound (B-2) represented by a formula (B-2)[R2 denotes a hydrogen atom, a halogen atom, a methyl group or a methoxy group] in the curing agent (B) is 0 parts by mass or higher and lower than 2.0 parts by mass based on 100 parts by mass of the epoxy resin (A).

The invention discloses anacardol modified polymerized MDI, which is prepared by the following method: carrying out hydrolysis reaction on anacardol glycidyl ether under an acidic condition to generate anacardol derived diol; and then reacting the cardanol-derived diol with the polymerized MDI at the temperature of 75-80 DEG C. The invention further discloses polyurethane floor paint based on cardanol modified polymerized MDI. The polyurethane floor paint is prepared from a component A and a component B, the component A is hydroxyl-containing resin or polyol, and the component B comprises cardanol modified polymerized MDI. The floor paint is prepared by reacting cardanol modified polymerized MDI with a hydroxyl-containing substance, a cardanol side chain introduced by the cardanol modified polymerized MDI plays roles of'molecular diluent 'and'space shielding', and the reaction speed and system viscosity of the floor paint are reduced, so that the floor paint has excellent construction performance and low bubble characteristic. The invention further discloses a preparation method of the polyurethane floor paint based on the cardanol modified polymerized MDI.

The present invention discloses a low-temperature curing conductive adhesive for perovskite-silicon heterojunction stacked solar cells, which comprises, by weight percentage: 85-95wt.% conductive powder, 1-10wt.% flexible thermosetting compound, 1-10wt.% epoxy resin, 0.1-10wt.% compound curing agent, 1-5wt.% diluent, 0.1-1wt.% auxiliary agent. The compound curing agent comprises two or more of boron trifluoride complex, acetylacetone metal salt, organic titanate, borofluoride metal salt, phenol, organic sulfonic acid, boric acid, and tertiary amine compound; the compound curing agent also comprises one or two of benzyl alcohol and polyethylene glycol. The curing temperature of the conductive adhesive is less than 150°C, the curing time is less than 15min, the printing screen opening is less than 30μm, the fine line printing performance is excellent, the photoelectric conversion efficiency is high, the application period is long, the cost is low, and batch industrial production can be carried out.

The invention belongs to the technical field of resin-based composite materials, and particularly relates to a liquid oxygen compatible prepreg epoxy resin composition, a preparation method thereof, a prepreg and application. The liquid oxygen compatible prepreg epoxy resin composition comprises the following raw materials: phosphorus-containing epoxy resin, solid epoxy resin, liquid epoxy resin, a curing agent and an accelerant. The phosphorus-containing epoxy resin similar to the solid epoxy resin and the liquid epoxy resin in structure is introduced into the solid epoxy resin and the liquid epoxy resin in a simple physical blending mode, the raw material ratio is reasonably controlled, dicyandiamide serves as a curing agent, organic urea or derivatives of the organic urea serve as an accelerant, liquid oxygen compatibility and prepreg forming process requirements are met, and the preparation method is suitable for large-scale production. The requirement for actually manufacturing the composite material liquid oxygen storage tank is met, the working life is long, and it is guaranteed that the prepreg can be prepared in a high-quality mode; and in a freezer at the temperature of-18 DEG C, the storage life can reach more than 4 months. The operation is simple and convenient, and the problems of precipitation caused by physical blending of a modifier and complicated process caused by chemical modification are solved.

The invention discloses a quick-drying high-performance waterborne epoxy curing agent in the technical field of coatings, the curing agent is prepared from a compound, and the compound is prepared by introducing a polyether chain segment and a bisphenol A chain segment to primary amine positions of R groups at two ends in ketimine modified amine; the ketimine modified amine is synthesized by carrying out Micheal addition on diacetone acrylamide carbon-carbon double bonds and carrying out condensation dehydration on the diacetone acrylamide carbon-carbon double bonds and primary amine; the ketimine modified amine waterborne epoxy curing agent is good in water solubility, high in crosslinking reaction degree with waterborne epoxy emulsion and short in surface drying time, and meanwhile, an obtained coating has excellent mechanical performance and weather resistance.

The invention discloses an epoxy resin for long-term carbon fiber winding and a preparation method thereof, comprising: component A and component B, wherein the mass ratio of component A to component B is 100:90-110, wherein component A is an epoxy resin component, and component B is a modified anhydride curing agent component. The invention uses biguanide compounds in the modified anhydride curing agent to greatly extend the service life of the epoxy resin, and can meet the requirement that the mixed viscosity is kept within 1000mPa.s for 30 hours at 40°C during the carbon fiber winding process, greatly ensuring the uniformity of the performance of the winding epoxy resin during use, and at the same time, the invention uses an additive BYK‑9920 for increasing wettability, which greatly increases the wettability of the epoxy resin to the carbon fiber.

The invention discloses a room-temperature-cured epoxy resin raw material composition, room-temperature-cured epoxy resin and a preparation method and application of the room-temperature-cured epoxy resin raw material composition. The room-temperature curing epoxy resin raw material composition comprises a component A and a component B, wherein the component A comprises epoxy resin and an optional diluent; the component B comprises a curing agent and an accelerant, wherein the curing agent comprises an aliphatic amine curing agent and a polyether amine curing agent; the accelerant comprises alkylphenol. The component A and the component B are mixed and subjected to vacuum defoaming, and the room-temperature curing epoxy resin is obtained; the epoxy resin provided by the invention is relatively low in viscosity, relatively long in pot life, relatively high in flexibility and excellent in comprehensive performance, the bonding strength of the epoxy resin is equivalent to that of the existing epoxy resin, and the problems that the existing room-temperature curing resin is low in flexibility, short in operation time and relatively high in viscosity are effectively solved.

The invention discloses a latent alicyclic amide curing agent as well as a preparation method and application thereof. The latent alicyclic amide curing agent is obtained by carrying out amidation reaction on an alicyclic amine compound and a formyl carboxylic acid compound. The secondary amine group in the latent curing agent does not react with the epoxy resin at medium and low temperatures due to the influence of steric hindrance, and has latency. The latent modified alicyclic amine curing agent prepared by the invention is a flowable liquid at normal temperature, and can be mixed with a traditional solid powder type latent curing agent for use, so that the problem that the solid powder type latent curing agent is poor in miscibility with epoxy resin is solved.

The invention relates to a method for producing a hardener for aqueous epoxy coating formulations, said method comprising a step of carbonating an aqueous dispersion of a water-insoluble hardener comprising amine and / or amide functional groups, and the use of said hardener for applying an aqueous epoxy coating on a substrate.