10results about How to "Long application period" patented technology

The invention relates to the field of phenolic resin adhesives, and particularly discloses a preparation method of a phenolic resin adhesive for a bamboo oriented strand board, which comprises the following steps: (1) phenol activation: adding phenol and a basic catalyst aqueous solution into a reaction kettle, and activating to form an intermediate state of phenate negative ions; (2) addition stage: adding a high-concentration formaldehyde reactant into the reaction kettle, and carrying out heat preservation reaction to generate hydroxymethyl phenol; (3) heating and replenishing: heating to 80 + / -2 DEG C, keeping the temperature, replenishing the formaldehyde aqueous solution into the reaction kettle, and keeping the temperature for 20-25 minutes; (4) polycondensation stage: adding a basic catalyst aqueous solution, heating to 90 + / -2 DEG C, and carrying out heat preservation reaction; and (5) terminating the reaction: after the heat preservation reaction, detecting the viscosity, cooling, and discharging to obtain the adhesive. The phenolic resin with the solid content of 60% or above can be prepared, the adhesive has excellent bonding performance, and the prepared shaving board is excellent in mechanical strength.

The present invention addresses the problem of providing: a substrate; provided are: a curable resin composition which is capable of achieving rapid curing at low temperatures (for example, curing at 70-80 DEG C for 30 minutes), exhibits high adhesive strength during curing at low temperatures for a short period of time, and has a long pot life; a method for producing the curable resin composition; an adhesive or sealing material containing the curable resin composition; a cured product of the adhesive or sealing material; a semiconductor device including the cured product; and an electronic component. Provided is a curable resin composition containing (A) a radical polymerizable curable compound, (B) a radical polymerization initiator, (C) a polymerization inhibitor, and (D) inorganic particles, the content of the (C) polymerization inhibitor in the curable resin composition being in the range of 0.1-3.0 parts by mass per 100 parts by mass of the (B) radical polymerization initiator, and the content of the (D) inorganic particles being in the range of 0.1-3.0 parts by mass per 100 parts by mass of the (B) radical polymerization initiator. Also provided are a method for producing the curable resin composition, an adhesive or sealing material containing the curable resin composition, a cured product thereof, and a semiconductor device and an electronic component containing the cured product.

A dispersion of a cellulose nanofiber (CNF) and a cellulose nanocrystal (CNC) that maintains a physical property even after drying and redispersing and has a long pot life is provided. A composite of the CNF and the CNC having a higher rupture strength and a higher oxygen gas barrier property is also provided. The dispersion contains a CNF having a sulfate ester group and a CNC having a sulfate ester group. The composite contains the CNF having a sulfate ester group and the CNC having a sulfate ester group.

The invention relates to the technical field of pressure-sensitive adhesives, in particular to a single-component acrylate pressure-sensitive adhesive and a preparation method thereof.The single-component acrylate pressure-sensitive adhesive is prepared from, by mass, 138-161 parts of monomers, 190-210 parts of a first solvent, 10-50 parts of a second solvent, 0.1-0.5 part of an initiator and 6-9 parts of a curing agent; the monomer comprises at least one of a soft monomer, a hard monomer and a functional monomer. The specific soft monomer and the curing agent are introduced, and the mass ratio of the soft monomer to the hard monomer to the functional monomer in the monomers is controlled to be (100-110): (30-40): (8-11), so that the oil resistance of the pressure-sensitive adhesive is greatly improved while the high-temperature resistance of the acrylate pressure-sensitive adhesive is improved, and meanwhile, the pressure-sensitive adhesive has good storage stability at room temperature, and is suitable for industrial production. And the application requirements of special occasions such as high temperature and high oil can be met, and important practical value and wide market prospect are achieved.

This invention provides an environmentally friendly, moisture-resistant epoxy coating for substrates, its preparation method, and its application. The epoxy coating is obtained by mixing and curing a mixture of component A and component B. Component A includes a resin matrix, a solvent, and additives, including dispersants, defoamers, thixotropic agents, and fluorosilane coupling agents. Component B includes a curing agent. The resin matrix includes bisphenol F type epoxy resin, and the curing agent includes a ketimine curing agent. This invention utilizes the synergistic effect of bisphenol F type epoxy resin, fluorosilane coupling agent, and ketimine curing agent to actively displace interfacial water films and achieve controllable crosslinking upon contact with moisture, fundamentally solving the problem of moisture interference. This imparts excellent wet adhesion and permeability to the coating, effectively avoiding defects such as whitening of the paint film and incomplete crosslinking.

The present application relates to the technical field of epoxy resin adhesive, in particular to a long applicable period dual-curing interpenetrating network type one-component epoxy resin adhesive, a preparation method and application, the adhesive is composed of 100 parts of E-51 epoxy resin, 15-35 parts of modified imidazole curing agent, 10-40 parts of active diluent, 0.2-2.0 parts of free radical polymerization initiator by weight fraction; The modified imidazole curing agent has the functions of latency and toughening. The one-component epoxy adhesive of the present application has a long room temperature storage period, which can reach 570-632 hours; only heating is needed to simultaneously realize free radical polymerization curing and thermal curing, forming an interpenetrating network type resin material with high strength and high toughness; there is no strict requirement for raw materials and packaging substrates, overcoming many defects existing in traditional dual-curing epoxy adhesives.

There is provided an epoxy resin composition comprising an epoxy resin (A), a curing agent (B), an imidazole adduct-type curing accelerator (C), and a Lewis acid compound (D) having a boron atom or an aluminum atom, wherein the curing agent (B) comprises a compound (B-1) represented by a formula (B-1)[R1 denotes a hydrogen atom, a halogen atom, a methoxy group or a hydrocarbon group having 1 to 12 carbon atoms]; and the content of a compound (B-2) represented by a formula (B-2)[R2 denotes a hydrogen atom, a halogen atom, a methyl group or a methoxy group] in the curing agent (B) is 0 parts by mass or higher and lower than 2.0 parts by mass based on 100 parts by mass of the epoxy resin (A).

The invention discloses anacardol modified polymerized MDI, which is prepared by the following method: carrying out hydrolysis reaction on anacardol glycidyl ether under an acidic condition to generate anacardol derived diol; and then reacting the cardanol-derived diol with the polymerized MDI at the temperature of 75-80 DEG C. The invention further discloses polyurethane floor paint based on cardanol modified polymerized MDI. The polyurethane floor paint is prepared from a component A and a component B, the component A is hydroxyl-containing resin or polyol, and the component B comprises cardanol modified polymerized MDI. The floor paint is prepared by reacting cardanol modified polymerized MDI with a hydroxyl-containing substance, a cardanol side chain introduced by the cardanol modified polymerized MDI plays roles of'molecular diluent 'and'space shielding', and the reaction speed and system viscosity of the floor paint are reduced, so that the floor paint has excellent construction performance and low bubble characteristic. The invention further discloses a preparation method of the polyurethane floor paint based on the cardanol modified polymerized MDI.

The present invention discloses a low-temperature curing conductive adhesive for perovskite-silicon heterojunction stacked solar cells, which comprises, by weight percentage: 85-95wt.% conductive powder, 1-10wt.% flexible thermosetting compound, 1-10wt.% epoxy resin, 0.1-10wt.% compound curing agent, 1-5wt.% diluent, 0.1-1wt.% auxiliary agent. The compound curing agent comprises two or more of boron trifluoride complex, acetylacetone metal salt, organic titanate, borofluoride metal salt, phenol, organic sulfonic acid, boric acid, and tertiary amine compound; the compound curing agent also comprises one or two of benzyl alcohol and polyethylene glycol. The curing temperature of the conductive adhesive is less than 150°C, the curing time is less than 15min, the printing screen opening is less than 30μm, the fine line printing performance is excellent, the photoelectric conversion efficiency is high, the application period is long, the cost is low, and batch industrial production can be carried out.

The invention discloses a room-temperature-cured epoxy resin raw material composition, room-temperature-cured epoxy resin and a preparation method and application of the room-temperature-cured epoxy resin raw material composition. The room-temperature curing epoxy resin raw material composition comprises a component A and a component B, wherein the component A comprises epoxy resin and an optional diluent; the component B comprises a curing agent and an accelerant, wherein the curing agent comprises an aliphatic amine curing agent and a polyether amine curing agent; the accelerant comprises alkylphenol. The component A and the component B are mixed and subjected to vacuum defoaming, and the room-temperature curing epoxy resin is obtained; the epoxy resin provided by the invention is relatively low in viscosity, relatively long in pot life, relatively high in flexibility and excellent in comprehensive performance, the bonding strength of the epoxy resin is equivalent to that of the existing epoxy resin, and the problems that the existing room-temperature curing resin is low in flexibility, short in operation time and relatively high in viscosity are effectively solved.