5results about How to "Long application period" patented technology

The present invention addresses the problem of providing: a substrate; provided are: a curable resin composition which is capable of achieving rapid curing at low temperatures (for example, curing at 70-80 DEG C for 30 minutes), exhibits high adhesive strength during curing at low temperatures for a short period of time, and has a long pot life; a method for producing the curable resin composition; an adhesive or sealing material containing the curable resin composition; a cured product of the adhesive or sealing material; a semiconductor device including the cured product; and an electronic component. Provided is a curable resin composition containing (A) a radical polymerizable curable compound, (B) a radical polymerization initiator, (C) a polymerization inhibitor, and (D) inorganic particles, the content of the (C) polymerization inhibitor in the curable resin composition being in the range of 0.1-3.0 parts by mass per 100 parts by mass of the (B) radical polymerization initiator, and the content of the (D) inorganic particles being in the range of 0.1-3.0 parts by mass per 100 parts by mass of the (B) radical polymerization initiator. Also provided are a method for producing the curable resin composition, an adhesive or sealing material containing the curable resin composition, a cured product thereof, and a semiconductor device and an electronic component containing the cured product.

This invention provides an environmentally friendly, moisture-resistant epoxy coating for substrates, its preparation method, and its application. The epoxy coating is obtained by mixing and curing a mixture of component A and component B. Component A includes a resin matrix, a solvent, and additives, including dispersants, defoamers, thixotropic agents, and fluorosilane coupling agents. Component B includes a curing agent. The resin matrix includes bisphenol F type epoxy resin, and the curing agent includes a ketimine curing agent. This invention utilizes the synergistic effect of bisphenol F type epoxy resin, fluorosilane coupling agent, and ketimine curing agent to actively displace interfacial water films and achieve controllable crosslinking upon contact with moisture, fundamentally solving the problem of moisture interference. This imparts excellent wet adhesion and permeability to the coating, effectively avoiding defects such as whitening of the paint film and incomplete crosslinking.

The present application relates to the technical field of epoxy resin adhesive, in particular to a long applicable period dual-curing interpenetrating network type one-component epoxy resin adhesive, a preparation method and application, the adhesive is composed of 100 parts of E-51 epoxy resin, 15-35 parts of modified imidazole curing agent, 10-40 parts of active diluent, 0.2-2.0 parts of free radical polymerization initiator by weight fraction; The modified imidazole curing agent has the functions of latency and toughening. The one-component epoxy adhesive of the present application has a long room temperature storage period, which can reach 570-632 hours; only heating is needed to simultaneously realize free radical polymerization curing and thermal curing, forming an interpenetrating network type resin material with high strength and high toughness; there is no strict requirement for raw materials and packaging substrates, overcoming many defects existing in traditional dual-curing epoxy adhesives.

The invention discloses anacardol modified polymerized MDI, which is prepared by the following method: carrying out hydrolysis reaction on anacardol glycidyl ether under an acidic condition to generate anacardol derived diol; and then reacting the cardanol-derived diol with the polymerized MDI at the temperature of 75-80 DEG C. The invention further discloses polyurethane floor paint based on cardanol modified polymerized MDI. The polyurethane floor paint is prepared from a component A and a component B, the component A is hydroxyl-containing resin or polyol, and the component B comprises cardanol modified polymerized MDI. The floor paint is prepared by reacting cardanol modified polymerized MDI with a hydroxyl-containing substance, a cardanol side chain introduced by the cardanol modified polymerized MDI plays roles of'molecular diluent 'and'space shielding', and the reaction speed and system viscosity of the floor paint are reduced, so that the floor paint has excellent construction performance and low bubble characteristic. The invention further discloses a preparation method of the polyurethane floor paint based on the cardanol modified polymerized MDI.

The invention discloses a room-temperature-cured epoxy resin raw material composition, room-temperature-cured epoxy resin and a preparation method and application of the room-temperature-cured epoxy resin raw material composition. The room-temperature curing epoxy resin raw material composition comprises a component A and a component B, wherein the component A comprises epoxy resin and an optional diluent; the component B comprises a curing agent and an accelerant, wherein the curing agent comprises an aliphatic amine curing agent and a polyether amine curing agent; the accelerant comprises alkylphenol. The component A and the component B are mixed and subjected to vacuum defoaming, and the room-temperature curing epoxy resin is obtained; the epoxy resin provided by the invention is relatively low in viscosity, relatively long in pot life, relatively high in flexibility and excellent in comprehensive performance, the bonding strength of the epoxy resin is equivalent to that of the existing epoxy resin, and the problems that the existing room-temperature curing resin is low in flexibility, short in operation time and relatively high in viscosity are effectively solved.