The application relates to the technical field of
wafer testing, in particular to a
wafer feeding and discharging device and a
wafer aging test system; the wafer feeding and discharging device comprises a
heat sink carrying
assembly, a
heat sink carrying slide rail and a
heat sink loading platform for carrying a heat sink, the heat sink loading platform is in sliding connection with the heat sink carrying slide rail, one end of the heat sink carrying slide rail is a wafer loading end for wafer feeding, the other end of the heat sink carrying slide rail is a loading feeding end for conveying the wafer after wafer feeding to a next process and for recycling the empty heat sink; the wafer material taking
assembly comprises a wafer material taking slide rail and a wafer adsorption device for adsorbing a wafer, the wafer adsorption device is in sliding connection with the wafer material taking slide rail, and the wafer adsorption device is arranged above the heat sink carrying
assembly; the wafer adsorption device is arranged in the wafer feeding and discharging device, and the wafer is placed on the heat sink from top to bottom, so that the number of through holes on the surface of the heat sink is reduced, and then the back of the wafer is prevented from whitening.