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Hydrazide latency improving curing agent and preparation method thereof

A technology of latent curing agent and hydrazide compound, which is applied in coatings, epoxy resin coatings, etc., can solve problems such as poor compatibility of epoxy resins, low curing temperature, and brittle coating films, and achieve good compatibility , Moderate curing temperature and long pot life

Active Publication Date: 2009-11-25
ZHEJIANG RONGTAI TECH ENTERPRISE +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] An object of the present invention is to provide a modified hydrazide curing agent, utilizing its relatively low curing temperature to solve the problems of poor compatibility with epoxy resin and the brittleness of the formed coating film

Method used

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  • Hydrazide latency improving curing agent and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0046] In a 500ml three-neck flask equipped with an electric stirrer, a spherical condenser and a thermometer, add 250g of isophthalic acid hydrazide, 0.15g of 2-methylimidazole and 150ml of ethylene glycol butyl ether, and heat to dissolve at 120°C , add 150g of butyl glycidyl ether in batches, and then continuously stir and react at this temperature for 8-10 hours, vacuumize to remove the solvent, and the obtained colorless or light yellow sticky substance is the latent curing agent.

[0047] Add 10 grams of alkoxyphenol polyoxyethylene ether surfactant (NP-40), and use the phase inversion method to prepare a latent curing agent emulsion with a solid content of 50% (w / w).

[0048] Get commodity model and be that 100 grams of epoxy resin emulsions of IE-7008W (UPPC company product) and this curing agent emulsion 95 grams evenly mix, add 1.5 grams of leveling agent BYK381 (Munzing company of Germany), 1.3 grams of defoamer EGTAN760 (Germany The one-component water-based epoxy ...

Embodiment 2

[0050] In a 500ml there-necked flask equipped with an electric stirrer, a spherical condenser and a thermometer, add 230g of sebacic acid hydrazide, 0.2g of 2,4,6-tris(dimethylaminomethyl)phenol and 100ml of diacetone alcohol , after heating and dissolving at 120°C, add 180g of phenylglycidyl ether in batches, then continuously stir and react at this temperature for 8-10 hours, vacuumize to remove the solvent, and the obtained colorless or light yellow sticky substance is latent Sexual curing agent.

[0051] Add 15 grams of alkoxyphenol polyoxyethylene ether surfactant (NP-40), and use the phase inversion method to prepare a latent curing agent emulsion with a solid content of 50% (w / w).

[0052] Get commodity model and be that 100 grams of epoxy resin emulsions of IE-7008W (UPPC company) and this curing agent emulsion 95 grams evenly mix, add 1.5 grams of leveling agent BYK381 (Munzing company of Germany), 1.3 grams of defoamer EGTAN 760 (Germany Munzing Company), dubbed one...

Embodiment 3

[0054] In a 500ml three-necked flask equipped with an electric stirrer, a spherical condenser and a thermometer, add 230g of sebacic acid hydrazide, 0.05g of 2,4,6-tris(dimethylaminomethyl)phenol and 100ml of ethylene glycol Diethyl ether acetate, after heating and dissolving at 120°C, add 100 grams of DER332 epoxy resin (Dow company) and 100 grams of butyl glycidyl ether in batches, then continuously stir and react at this temperature for 8-10 hours, and vacuumize to remove the solvent , the obtained colorless or light yellow viscous substance is the latent curing agent.

[0055] Add 20 grams of alkoxyphenol polyoxyethylene ether surfactant (NP-40), and use the phase inversion method to prepare a latent curing agent emulsion with a solid content of 50% (w / w).

[0056] Get commodity model and be that 100 grams of epoxy resin emulsion 100 grams of IE-7008W (UPPC company) and this curing agent emulsion 130 grams evenly mix, add 1.5 grams of leveling agent BYK348 (Germany Munzing...

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Abstract

The invention discloses a hydrazide latency improving curing agent comprising hydrazide compound and epoxy compound, wherein mol ratio between hydrazide radical and epoxy radical is 1: 0.5 to 2.5. The curing agent is prepared by mixing and dissolving the hydrazide compound and epoxy compound into a solvent, reacting for 1 to 24 hours at 60 to 150 DEG C, lastly depressurizing and removing the solvent. The prepared curing agent has good compatibility with liquid epoxy resin. The prepared single-component aqueous epoxy dope has six months storage period at room temperature, is stable below 40 DEG C, is cured at 100 to 150 DEG C to form a coat having flat and smooth surface and flexibility, and is applied to insulating coats of electronic elements and insulating coats of electric device coils.

Description

technical field [0001] The invention relates to a latent curing agent, in particular to a modified hydrazide latent curing agent, and a preparation method thereof. Background technique [0002] Water-based epoxy coatings are green and environmentally friendly products. Compared with solvent-based coatings, they have the characteristics of less odor, safe use and water cleaning. They are widely used in decoration, anti-corrosion and special industrial coatings and other fields. [0003] At present, there have been many studies on room temperature curing two-component waterborne epoxy coating products, which have been used in various fields in the market, such as: high-performance architectural coatings, industrial plant floor paints, automotive maintenance primers and Industrial maintenance topcoat, etc. Heating is conducive to the complete escape of moisture in the coating during the curing process of the water-based epoxy coating, thereby obtaining a high-quality coating. ...

Claims

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Application Information

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IPC IPC(8): C08K5/25C08K5/24C08K5/15C08G73/06C09D163/00C09D7/12
Inventor 曹万荣傅万里狄宁宇
Owner ZHEJIANG RONGTAI TECH ENTERPRISE
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