This invention relates to the field of resin technology, specifically to an
epoxy resin composition for
copper-clad laminates and its preparation method. The
epoxy resin composition comprises, by weight, 500-700 parts of
bisphenol A type
epoxy resin, 50-70 parts of phenyl
glycidyl ether, 30-50 parts of dodecyl
glycidyl ether, 20-40 parts of dicyandiamide, 3-7 parts of 2-ethyl-4-methylimidazole, 800-1000 parts of modified spherical silica filler, and a
solvent. The key lies in the partial end-capping of the silica surface, followed by the sequential construction of a bimodal
siloxane brush layer, a reactive layer with epoxy functional groups, and a fluorinated
brush layer. Then, an epoxy ring-opening anchoring aminopropyl isobutyl polysilsesquioxane cage and an aminopropyl-terminated
polydimethylsiloxane are used, followed by final end-capping. This composition effectively solves the problems of poor filler dispersibility and high interfacial polarity under high filler conditions, significantly reduces
dielectric loss, and improves
electrical performance stability and lamination density under humid and hot environments.