Epoxy resin composition, epoxy resin material and preparation method and application thereof

Abstract

The invention relates to the field of epoxy resin, and discloses an epoxy resin composition, an epoxy resin material and a preparation method and application of the epoxy resin composition and the epoxy resin material. The component A comprises 100 parts by weight of aminophenol epoxy resin, 5-15 parts by weight of polyenol acetal, 5-15 parts by weight of phenyl glycidyl ether with a benzene ring containing C8-18 substituent groups, 2-6 parts by weight of a silane coupling agent and 1-3 parts by weight of a release agent; the component B comprises 100 parts by weight of an anhydride curing agent, 5-10 parts by weight of polyether polyol and 1-5 parts by weight of a curing accelerator; the component A and the component B independently exist. Through synergistic toughening, the heat resistance of the epoxy resin is improved while the mechanical property of the epoxy resin is balanced. The contradiction between the curing speed and the pot life is further solved through the cooperation of the latent accelerator and the rapid accelerator.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of epoxy resin, in particular to an epoxy resin composition, an epoxy resin material and a preparation method and application thereof. BACKGROUND

[0002] Epoxy resin has excellent mechanical properties, good bonding properties and strong process adaptability, etc., and is the most widely used and the most widely applied resin in high-performance composite material resin matrix. Among them, high-temperature-resistant pultrusion epoxy resin, as a commonly used matrix for carbon fiber composite materials, can be applied to carbon fiber composite wires, military and other fields. However, high-T g The brittle epoxy resin system cannot effectively exert the performance of carbon fiber, thereby limiting the application of resin-based carbon fiber composite materials.

[0003] The most studied method for toughening modification of resin matrix in the prior art is to add synthetic rubber, thermoplastic resin, nanoparticles and the like to achieve the purpose of toughening. For example, CN201810108691.5 prepared a low-viscosity high-heat-resistant epoxy resin composition by using an alicyclic epoxy resin, an anhydride curing agent, and nano-silicon dioxide and silicone rubber core-shell particle toughening agent. The cured product has good heat resistance, with a glass transition temperature of 220-260℃, but the elongation at break is less than 1%, indicating that the toughness of the resin system is poor. CN201110183270.7 discloses a high-temperature-resistant epoxy resin composition for rapid pultrusion and a preparation method thereof. The use of a latent curing agent together with a mixed amine curing agent can make the pultrusion product have a low curing temperature and rapidly cure within a certain time, thereby shortening the curing time and improving the pultrusion speed and production efficiency. However, amine curing agents have a short pot life and low toughness. CN201910933400.0 uses a polyimide resin containing active reactive groups for toughening to ensure that the carbon fiber cable core pultrusion resin has high heat resistance, electrical insulation and the like. However, the interface between the thermoplastic resin and the carbon fiber is weak, and the load on the carbon fiber filament cannot be effectively transmitted to the resin to form an overall stress, resulting in poor performance.

[0004] In the above-mentioned carbon fiber composite material resin system toughened by a single method, it is difficult to effectively solve the contradiction between toughness and heat resistance, curing speed and pot life, and the overall performance is poor due to the compatibility problem of the toughening agent, and there are defects such as low elongation at break and poor processability or heat resistance. SUMMARY

[0005] In order to overcome the poor comprehensive performance of the epoxy resin in the prior art and the problem that toughness, strength and heat resistance cannot be effectively balanced, the present application provides an epoxy resin composition, an epoxy resin material and a preparation method and application thereof.

[0006] To achieve the above object, the present application provides an epoxy resin composition in one aspect, which comprises component A and component B;

[0007] Component A comprises 100 parts by weight of an aminophenol epoxy resin, 5-15 parts by weight of a polyalkenol acetal, 5-15 parts by weight of a phenyl glycidyl ether containing C 8-18 substituents on the benzene ring, 2-6 parts by weight of a silane coupling agent and 1-3 parts by weight of a release agent;

[0008] Component B comprises 100 parts by weight of an anhydride curing agent, 5-10 parts by weight of a polyether polyol and 1-5 parts by weight of a curing accelerator;

[0009] The component A and the component B are each independently present.

[0010] The present application provides a method for preparing an epoxy resin material using the composition provided by the first aspect of the present application, comprising the following steps:

[0011] S1, mixing an aminophenol epoxy resin, a polyalkenol acetal, a phenyl glycidyl ether containing C 8-18 substituents on the benzene ring, a silane coupling agent and a release agent, and obtaining component A after cooling;

[0012] S2, mixing an anhydride curing agent, a polyether polyol and a curing accelerator to obtain component B;

[0013] S3, mixing component A and component B according to a weight ratio of 1:1-2 to obtain an epoxy resin system;

[0014] S4, curing the epoxy resin system obtained in S3 to obtain an epoxy resin material.

[0015] The present application provides an epoxy resin material prepared according to the method provided by the second aspect of the present application.

[0016] The present application provides an application of the epoxy resin material provided by the third aspect of the present application in high-voltage overhead transmission conductors.

[0017] Through the above technical solution, the epoxy resin composition, the epoxy resin material and the preparation method and application thereof provided by the present application have the following beneficial effects:

[0018] The present application uses a base resin with certain heat resistance, adds a polyalkenol acetal and a phenyl glycidyl ether containing C 8-18 substituents on the benzene ring. The polyalkenol acetal and the phenyl glycidyl ether containing C 8-18The phenyl glycidyl ether with a substituted group has a long flexible branched structure, and the two can synergistically toughen to improve the toughness of the epoxy resin and solve the contradiction between high toughness and high strength. In addition, the two have acetal or glycidyl structures, which can better compatibilize with the epoxy resin, and at the same time, can introduce a heat-resistant heterocycle to further improve the heat resistance of the epoxy resin.

[0019] The present application ensures that the epoxy resin material can be pultruded and can infiltrate carbon fibers by selecting appropriate components and controlling the amount ratio of each component.

[0020] Further, the present application uses the combination of latent accelerators and fast accelerators. The latent accelerator can ensure that the epoxy resin has sufficient use time at room temperature, while improving the curing speed at high temperature; the fast accelerator can reduce the temperature required for curing and improve the curing speed. The latent accelerator and the fast accelerator cooperate to solve the contradiction between the curing speed and the pot life. DETAILED DESCRIPTION

[0021] The endpoints of the ranges and any values disclosed herein are not limited to the precise values recited as the exact dimensions are not critical to the present application. The endpoints of the ranges and any values are provided as approximations only, and are understood to be open-ended. Thus, the endpoints of the ranges and any values are not to be understood as being limited to the precise values recited as essentially any value up to and including the recited value can be considered to be the end point of the range or value, unless otherwise indicated. For values which are less than one, or contain an exponent, the recited values are to be interpreted as prefixed by the word "sub-". For values which are greater than one or contain an exponent, the recited values are to be interpreted as prefixed by the word "super-". Ranges can be expressed herein with endpoints characterized as being open-ended or closed-ended. When used in the context of a range, the endpoints are provided as a separate value from the range. For example, the range "5-10" is a range of values, which is distinct from the range "5 to 10", which includes the values from 5 through 10. The range of values 5-10, therefore, is "open", whereas the range of values 5 to 10 is "closed". Any numerical values include all values from the lower numerical value and up to and including the upper numerical value, and are understood to include each numerical value between the lower and upper value, unless indicated otherwise.

[0022] The present application provides an epoxy resin composition, the composition comprising component A and component B;

[0023] Component A comprises 100 parts by weight of an aminophenol epoxy resin, 5-15 parts by weight of a polyalkenol acetal, 5-15 parts by weight of a phenyl glycidyl ether having a C 8-18 a substituted group on the benzene ring, 2-6 parts by weight of a silane coupling agent, and 1-3 parts by weight of a release agent;

[0024] Component B comprises 100 parts by weight of an acid anhydride curing agent, 5-10 parts by weight of a polyether polyol, and 1-5 parts by weight of a curing accelerator;

[0025] The component A and the component B are each independently present.

[0026] The present application provides an epoxy resin composition, the composition comprising component A and component B;

[0027] The present application provides an epoxy resin composition, the composition comprising component A and component B; 8-18The phenyl glycidyl ether with substituent has good toughness and can participate in the polymerization of the epoxy resin and is easy to be melt mixed with the epoxy resin. 8-18 The phenyl glycidyl ether with substituent is a flexible chain segment added to the epoxy resin and has a toughening effect on the epoxy resin. 8-18 The phenyl glycidyl ether with substituent has a synergistic toughening effect, thereby solving the contradiction between high toughness and high strength.

[0028] In the present application, the epoxy resin material prepared from the composition with the weight ratio of the components within the above range has good mechanical properties, pultrusion forming property and heat resistance.

[0029] According to a preferred embodiment of the present application, component A comprises 100 parts by weight of the aminophenol epoxy resin, 8-12 parts by weight of the polyvinyl acetal, 8-12 parts by weight of the phenyl glycidyl ether with substituent on the benzene ring, 3-5 parts by weight of the silane coupling agent and 2-4 parts by weight of the release agent. 8-18 The phenyl glycidyl ether with substituent, 3-5 parts by weight of the silane coupling agent and 2-4 parts by weight of the release agent.

[0030] According to the present application, preferably, the polyvinyl acetal and the phenyl glycidyl ether with substituent on the benzene ring have a weight ratio of 1:0.5-2. 8-18 The phenyl glycidyl ether with substituent on the benzene ring has a weight ratio of 1:0.5-2.

[0031] According to a preferred embodiment of the present application, the aminophenol epoxy resin has a dynamic viscosity of 500-5000 cP at 25℃.

[0032] In the present application, the epoxy resin has poor wettability to carbon fibers when the viscosity is too high and cannot be attached to the carbon fibers when the viscosity is too low.

[0033] According to the present application, preferably, the polyvinyl butyral has a weight average molecular weight of 3000-4500 g / mol.

[0034] According to a preferred embodiment of the present application, the aminophenol epoxy resin has a structure as shown in formula I,

[0035]

[0036] wherein R1-R3 are each independently selected from one of C2-C6 epoxy groups.

[0037] According to the present application, preferably, R1-R3 are epoxy propyl groups.

[0038] In the present application, the aminophenol epoxy resin as shown in formula I has high heat resistance and reactivity and can further improve the mechanical properties of the epoxy resin material, especially the pultrusion forming property.

[0039] The specific type of the polyvinyl alcohol acetal is not particularly limited in the present application and can be routinely selected by those skilled in the art. According to a preferred embodiment of the present application, the polyvinyl alcohol acetal is polyvinyl butyral (PVB).

[0040] The specific type of the phenyl glycidyl ether containing C 8-18 The specific type of the phenyl glycidyl ether containing C 8-18 The specific type of the phenyl glycidyl ether containing C

[0041] The specific type of the acid anhydride curing agent is not particularly limited in the present application and can be routinely selected by those skilled in the art, as long as it can cure the epoxy resin system. According to a preferred embodiment of the present application, the acid anhydride curing agent is methylhexahydrophthalic anhydride (MHHPA) and / or methyl nadic anhydride (MNA).

[0042] The specific type of the polyether polyol is not particularly limited in the present application and can be routinely selected by those skilled in the art. According to a preferred embodiment of the present application, the polyether polyol is polyethylene glycol and / or polypropylene glycol.

[0043] According to the present application, preferably, the weight average molecular weight of the polyether polyol is 400-2000 g / mol.

[0044] In the present application, the polyether polyol can play the roles of defoaming, viscosity adjustment and toughening in the epoxy resin composition.

[0045] According to the present application, further, the curing accelerator is a mixture of modified imidazole, tetraethylammonium chloride and at least one methyl-substituted imidazole. The modification of the modified imidazole is organic acid neutralization. Tetraethylammonium chloride can promote curing as a phase transfer catalyst and ion pair catalyst, and also improve the compatibility between components as a surfactant.

[0046] In the present application, on the basis of balancing mechanical properties, the combination of latent accelerator and fast accelerator can further solve the contradiction between curing speed and pot life. The latent accelerator can ensure that the epoxy resin has sufficient use time under normal temperature conditions, while improving the curing speed under high temperature conditions; the fast accelerator can reduce the temperature required for curing and improve the curing speed.

[0047] In the present application, the latent accelerator is preferably modified imidazole, and the fast accelerator is preferably at least one methyl-substituted imidazole.

[0048] According to the present application, preferably, the weight ratio of the modified imidazole, tetraethylammonium chloride and the at least one methyl-substituted imidazole is 1:1-2:1-2.

[0049] According to the present application, further preferably, the weight ratio of the modified imidazole, tetraethylammonium chloride and the at least one methyl-substituted imidazole is 1:1-2:1-1.5.

[0050] According to the present application, preferably, the at least one methyl-substituted imidazole is 1-methylimidazole and / or 2,4-dimethylimidazole.

[0051] The present application does not particularly limit the specific type of the silane coupling agent, which can be routinely selected by those skilled in the art. According to one preferred embodiment of the present application, the silane coupling agent is at least one of KH550, KH560 and KH591.

[0052] In the present application, the silane coupling agent can build a "molecular bridge" between the inorganic and organic interfaces, connecting the two materials with different properties together to form a combined layer of organic matrix-silane coupling agent-inorganic matrix, thereby improving the performance of the composite material and increasing the bonding strength.

[0053] The present application does not particularly limit the specific type of the release agent, which can be routinely selected by those skilled in the art. According to one preferred embodiment of the present application, the release agent is a stearic acid release agent and / or a silicone resin.

[0054] The present application provides a method for preparing an epoxy resin material using the composition provided in the first aspect of the present application, comprising the following steps:

[0055] S1, mixing an aminophenol epoxy resin, a polyalkenol acetal, a phenyl glycidyl ether containing a C 8-18 substituent on the benzene ring, a silane coupling agent and a release agent, and obtaining component A after cooling;

[0056] S2, mixing an anhydride curing agent, a polyether polyol and a curing accelerator to obtain component B;

[0057] S3, mixing component A and component B according to a weight ratio of 1:1-2 to obtain an epoxy resin system;

[0058] S4, curing the epoxy resin system obtained in S3 to obtain an epoxy resin material.

[0059] According to one preferred embodiment of the present application, the curing temperature of the epoxy resin system is 140-200℃, preferably 160-180℃; and the curing time is 1-6h, preferably 2-4h.

[0060] The weight ratio of component A and component B is not particularly limited in the present application, and can be routinely selected by those skilled in the art. According to the present application, preferably, the weight ratio of component A and component B is 1:1.1-1.5, more preferably 1:1.2-1.4.

[0061] The cooling temperature in S1 is not particularly limited in the present application, and can be routinely selected by those skilled in the art. According to the present application, preferably, the cooling temperature is 20-40℃.

[0062] The mixing manner in S1-S3 is not particularly limited in the present application, and can be routinely selected by those skilled in the art. According to the present application, preferably, the mixing manner in S1-S3 is stirring mixing.

[0063] According to the present application, preferably, the stirring temperature in S1 is 100-160℃, and the time is 60-120min;

[0064] According to the present application, preferably, the stirring temperature in S2 is 30-60℃, and the time is 30-90min;

[0065] According to the present application, preferably, the stirring temperature in S3 is 30-60℃, and the time is 30-60min.

[0066] The third aspect of the present application provides an epoxy resin material prepared according to the method provided in the second aspect of the present application.

[0067] According to the present application, preferably, the glass transition temperature of the epoxy resin material is ≥210℃, more preferably 210-230℃.

[0068] The fourth aspect of the present application provides the use of the epoxy resin material provided in the third aspect of the present application in high-voltage overhead transmission conductors.

[0069] According to a particularly preferred embodiment of the present application, component A comprises 100 parts by weight of an aminophenol-based epoxy resin, 8-12 parts by weight of a polyvinyl acetal, 8-12 parts by weight of a phenyl glycidyl ether containing C 8-18 substituents on the benzene ring, 3-5 parts by weight of a silane coupling agent, and 2-4 parts by weight of a release agent.

[0070] Component B comprises 100 parts by weight of an acid anhydride curing agent, 5-10 parts by weight of a polyether polyol, and 1-5 parts by weight of a curing accelerator.

[0071] The weight ratio of the polyvinyl acetal and the phenyl glycidyl ether containing C 8-18 substituents on the benzene ring is 1:0.5-2.

[0072] The structure of the aminophenol-based epoxy resin is shown in formula I,

[0073]

[0074] Among them, R1-R3 are glycidyl oxide.

[0075] The polyenol acetal is polyvinyl butyral.

[0076] The benzene ring contains C 8-18 The phenyl glycidyl ether with the substituent is cashew phenol glycidyl ether.

[0077] The anhydride curing agent is methylhexahydrophthalic anhydride (MHHPA) and / or methylnadic anhydride (MNA).

[0078] The polyether polyol is polyethylene glycol and / or polypropylene glycol.

[0079] The curing accelerator is a mixture of modified imidazole, tetraethylammonium chloride and at least one methyl-substituted imidazole.

[0080] The weight ratio of modified imidazole, tetraethylammonium chloride and at least one methyl-substituted imidazole is 1:1-2:1-1.5.

[0081] The at least one methyl-substituted imidazole is 1-methylimidazole and / or 2,4-dimethylimidazole.

[0082] The epoxy resin material is prepared by combining components A and B as follows:

[0083] S1. Aminophenol epoxy resin, polyenol acetal, and benzene ring containing C 8-18 Substituent phenyl glycidyl ether, silane coupling agent and release agent are mixed and cooled to obtain component A;

[0084] S2. Mix the acid anhydride curing agent, polyether polyol and curing accelerator to obtain component B;

[0085] S3. Mix component A and component B in a weight ratio of 1:1-2 to obtain an epoxy resin system;

[0086] S4. Curing the epoxy resin system obtained in S3 to obtain epoxy resin material.

[0087] The curing temperature of the epoxy resin system is 140-200℃, preferably 160-180℃; the curing time is 1-6h, preferably 2-4h.

[0088] The weight ratio of component A to component B is 1:1.1-1.5, preferably 1:1.2-1.4.

[0089] The present invention will be described in detail below through embodiments:

[0090] In the following embodiments, the glass transition temperature Tg Measured using differential scanning calorimetry (DSC);

[0091] Mechanical properties were measured using an electronic universal testing machine, with the tensile test conducted in accordance with GB / T 1447-2005 at a test rate of 2 mm / min.

[0092] The bending test was conducted in accordance with GB / T 1449-2005, with a test rate of 2 mm / min.

[0093] The gelation time was measured according to GB5259-85;

[0094] The pot life is defined as the time it takes for the dynamic viscosity of the epoxy resin system after mixing components A and B at 25°C to increase to 3000 cP, as measured with reference to GB5206.5-91.

[0095] All reagents were commercially available, specifically:

[0096] The aminophenol epoxy resins were purchased from Hubei Zhenzhengfeng New Materials Co., Ltd., with grades MF3101 and MF3102.

[0097] The dynamic viscosity of MF3101 at 25℃ is 1500-3000 cP, and the dynamic viscosity of MF3102 at 25℃ is 550-1000 cP.

[0098] PVB was purchased from Shanghai Yuanye Biotechnology Co., Ltd., with a weight-average molecular weight of 3500 g / mol.

[0099] The modified imidazole was purchased from Complex High-Tech Materials (Shanghai) Co., Ltd., brand name LepcuHD2004.

[0100] Examples 1-8

[0101] The specific steps for preparing epoxy resin materials are as follows:

[0102] S1. Mix the multifunctional epoxy resin, polyvinyl butyral (PVB), cashew phenol glycidyl ether, silane coupling agent and release agent, and cool to 20°C to obtain component A.

[0103] S2. Mix MNA, polyether polyol, LepcuHD2004, 1-methylimidazole (or 2,4-dimethylimidazole) and tetraethylammonium chloride to obtain component B;

[0104] S3. Mix component A and component B to obtain an epoxy resin system;

[0105] S4. Curing the epoxy resin system obtained in step S3 to obtain epoxy resin material.

[0106] Example 9

[0107] The epoxy resin material was prepared in accordance with the method of Example 1, except that a different curing accelerator was added.

[0108] Comparative Example 1

[0109] The epoxy resin material was prepared according to the method of Example 1, except that the general-purpose epoxy resin E51 was used instead of the aminophenol epoxy resin.

[0110] Comparative Example 2

[0111] The epoxy resin material was prepared in accordance with the method of Example 1, except that PVB was not added.

[0112] Comparative Example 3

[0113] The epoxy resin material was prepared in accordance with the method of Example 1, except that cashew phenol glycidyl ether was not added.

[0114] Comparative Example 4-5

[0115] The epoxy resin material was prepared in accordance with the method of Example 1, except that the weight ratio of PVB and cashew phenol glycidyl ether was different.

[0116] Comparative Example 6

[0117] The epoxy resin material was prepared in accordance with the method of Example 1, except that the amount of polyether polyol added was different.

[0118] Comparative Examples 7-8

[0119] The epoxy resin material was prepared in accordance with the method of Example 1, except that the weight ratio of components A and B was different.

[0120] The proportions and mixing conditions of component A in the above embodiments and comparative examples are shown in Table 1, the proportions and mixing conditions of component B are shown in Table 2, and the mixing and curing conditions of components A and B are shown in Table 3.

[0121] Table 1

[0122]

[0123]

[0124] Table 2

[0125]

[0126]

[0127] Table 3

[0128]

[0129] Test case

[0130] The mechanical properties and glass transition temperature of the epoxy resin materials in the above examples and comparative examples, as well as the pot life, gel time, and dynamic viscosity of the epoxy resin system, were determined according to the method described in the Specific Embodiments section of this invention. The results are shown in Table 4.

[0131] Table 4

[0132]

[0133] As can be seen from the above embodiments and comparative examples, the epoxy resin material obtained by using the technical solution of the present invention has good strength, toughness, and heat resistance. The epoxy resin material obtained by the preferred embodiment has high comprehensive performance, and can better balance tensile strength, flexural strength, elongation at break, and glass transition temperature. Compared with Example 1, Comparative Examples 1-8 either lack suitable additives leading to poor compatibility, or use a single toughening agent or accelerator, resulting in a lack of synergy, leading to lower tensile strength, flexural strength, elongation at break, or glass transition temperature of the epoxy resin material.

[0134] The preferred embodiments of the present invention have been described in detail above; however, the present invention is not limited thereto. Within the scope of the inventive concept, various simple modifications can be made to the technical solutions of the present invention, including combinations of various technical features in any other suitable manner. These simple modifications and combinations should also be considered as the content disclosed in the present invention and are all within the protection scope of the present invention.

Claims

1. An epoxy resin composition, characterized in that, The composition comprises component A and component B; Component A contains 100 parts by weight of aminophenolic epoxy resin, 5-15 parts by weight of polyenol acetal, and 5-15 parts by weight of benzene ring containing C. 8-18 Substituent phenyl glycidyl ether, 2-6 parts by weight of silane coupling agent and 1-3 parts by weight of mold release agent; Component B contains 100 parts by weight of anhydride curing agent, 5-10 parts by weight of polyether polyol and 1-5 parts by weight of curing accelerator; Component A and component B exist independently of each other.

2. The composition according to claim 1, characterized in that, Component A contains 100 parts by weight of aminophenolic epoxy resin, 8-12 parts by weight of polyenol acetal, and 8-12 parts by weight of benzene ring containing C. 8-18 Substituent phenyl glycidyl ether, 3-5 parts by weight of silane coupling agent and 2-4 parts by weight of release agent; Preferably, the polyenol acetal and the benzene ring contain C 8-18 The weight ratio of the substituents to phenyl glycidyl ethers is 1:0.5-2.

3. The composition according to claim 1 or 2, characterized in that, The aminophenolic epoxy resin has a dynamic viscosity of 500-5000 CP at 25°C. And / or, the weight-average molecular weight of polyenol acetal is 3000-4500 g / mol.

4. The composition according to any one of claims 1-3, characterized in that, The structure of the aminophenol epoxy resin is shown in Formula I. R1-R3 are each independently selected from one of the C2-C6 epoxy groups.

5. The composition according to any one of claims 1-4, characterized in that, The polyenol acetal is polyvinyl butyral; And / or, the benzene ring contains C 8-18 The phenyl glycidyl ether with the substituent is cashew phenol glycidyl ether.

6. The composition according to any one of claims 1-5, characterized in that, The anhydride curing agent is methylhexahydrophthalic anhydride and / or methylnadic anhydride; And / or, the polyether polyol is polyethylene glycol and / or polypropylene glycol; Preferably, the weight-average molecular weight of the polyether polyol is 400-2000 g / mol.

7. The composition according to any one of claims 1-6, characterized in that, The curing accelerator is a mixture of modified imidazole, tetraethylammonium chloride and at least one methyl-substituted imidazole; Preferably, the weight ratio of modified imidazole, tetraethylammonium chloride and at least one methyl-substituted imidazole is 1:1-2:1-2; Preferably, the at least one methyl-substituted imidazole is 1-methylimidazole and / or 2,4-dimethylimidazole.

8. The composition according to any one of claims 1-7, characterized in that, The silane coupling agent is at least one of KH550, KH560 and KH591; And / or, the release agent is a stearic acid release agent and / or an organosilicon resin.

9. A method for preparing epoxy resin materials using the composition according to any one of claims 1-8, characterized in that, Includes the following steps: S1. Aminophenol epoxy resin, polyenol acetal, and benzene ring containing C 8-18 Substituent phenyl glycidyl ether, silane coupling agent and release agent are mixed and cooled to obtain component A; S2. Mix the acid anhydride curing agent, polyether polyol and curing accelerator to obtain component B; S3. Mix component A and component B in a weight ratio of 1:1-2 to obtain an epoxy resin system; S4. Curing the epoxy resin system obtained in S3 to obtain epoxy resin material.

10. The method according to claim 9, characterized in that, The curing temperature of the epoxy resin system is 140-200℃, preferably 160-180℃; the curing time is 1-6h, preferably 2-4h. And / or, the weight ratio of component A to component B is 1:1.1-1.5, preferably 1:1.2-1.

4.

11. An epoxy resin material prepared according to the method of claim 9 or 10; Preferably, the glass transition temperature of the epoxy resin material is ≥210℃, more preferably 210-230℃.

12. The application of the epoxy resin material according to claim 11 in high-voltage overhead transmission lines.

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