805 results about "Polyphenyl ether" patented technology

The invention relates to the field of copper-clad plates, and discloses a low-dielectric-constant high-performance copper-clad plate and a preparation method thereof.The preparation method comprises the specific steps that epoxy resin, phenolic resin, polyphenyl ether modified resin, modified nano silicon dioxide and the like are taken and mixed to obtain a resin glue solution; impregnating glass fabric in the resin glue solution to obtain a prepreg; laminating prepregs, and covering copper foil for hot pressing; the polyphenyl ether modified resin comprises epoxy resin, diallyl cyanate and fluorine-containing polyphenyl ether resin prepared by reaction of polyphenyl ether, bisphenol AF and benzoyl peroxide; the modified nano silicon dioxide is prepared by reacting allyl glycidyl ether, vinyltriethoxysilane and phenyltris (dimethylsiloxane) silane, then grafting with a phosphorus-containing intermediate to prepare a modified additive, and grafting with nano silicon dioxide, and the phosphorus-containing intermediate is prepared by reacting phenylphosphoryl dichloride and eugenol. The copper-clad plate with high flame retardance, high peel strength, heat resistance and low dielectric constant is prepared.

The invention discloses a polyphenyl ether-polyamide composition as well as a preparation method and application thereof. The polyphenyl ether-polyamide composition is prepared from the following components in parts by weight: 34.5 to 51 parts of PPE resin, 9 to 46 parts of aromatic PA resin, 0 to 31 parts of aliphatic PA resin, 6 to 12 parts of a zinc-containing flame retardant, 2 to 4 parts of a phosphazene flame retardant, 0.2 to 1 part of a compatilizer and 2 to 5 parts of a toughening agent, the mass fraction of the total amount of aromatic rings in the polyphenyl ether-polyamide composition is 29-40%. The polyphenyl ether-polyamide composition has relatively good low-temperature toughness, 0-grade CTI and excellent heat resistance on the premise of flame retardant requirements.

To provide a resin composition which comprises a polyphenylene ether having excellent solvent solubility and has excellent electrical properties, copper foil peeling strength and solvent resistance.SOLUTION: There is provided a resin composition which comprises (A) a polyphenylene ether A containing a repeating unit derived from the following phenol and having a molecular weight distribution (Mw / Mn) determined by gel permeation chromatography (GPC) of 2.0 to 6.0 and a number of OH groups per molecule of 0.8 to 3.0 pieces / molecule, (B) a polyphenylene ether B containing a repeating unit derived from the following phenol and at least one partial structure of the following structures in the molecular skeleton (excluding those corresponding to the polyphenylene ether A), (C) a triallyl isocyanurate and / or a triallyl cyanurate and a crosslinking agent other than (C') a triallyl isocyanurate and a triallyl cyanurate as optional components and (D) an organic peroxide.SELECTED DRAWING: None

A resin composition and an article made therefrom are provided. The resin composition includes: (A) 100 parts by weight of an unsaturated bond-containing polyphenylene ether resin; (B) 20 parts by weight to 150 parts by weight of a copolymer, the copolymer having a structural unit formed by a monomer of Formula (1) and a structural unit formed by a monomer of Formula (2), and the content of the structural unit formed by the monomer of Formula (2) in the copolymer is 55 wt % to 90 wt %; and (C) 10 parts by weight to 40 parts by weight of an unsaturated bond-containing crosslinking agent. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following properties can be improved, including glass transition temperature, Z-axis ratio of thermal expansion, multi-layer board heat resistance, interconnect stress test, dissipation factor aging rate, temperature coefficient of dielectric constant, temperature coefficient of dissipation factor and branch-like pattern at laminate edges.

The present invention relates to a resin composition characterized by a low degree of thermal expansion, a low degree of dielectricity, and a high degree of thermal resistance, and a prepreg, a metal foil laminate, a laminated sheet, and a printed circuit board comprising same. The resin composition comprises a polyphenylene oxide-based resin, a hollow inorganic filler having a porosity of 60-90%, a fluorine resin filler, and a dispersant.

This invention discloses a gypsum-based lightweight flame-retardant board and its preparation method, relating to the field of building materials technology. The gypsum-based lightweight flame-retardant board prepared by this invention is made by foaming a gypsum substrate with a foaming agent and a composite stabilizer, then introducing a self-made flame retardant and other raw materials, casting it between two layers of facing paper, and drying it. The composite stabilizer includes a modified acrylamide copolymer and acrylamide hydrogel. The modified acrylamide copolymer is obtained by copolymerizing N-isopropylacrylamide with silane acrylic acid and then reacting it with hyperbranched polyphosphate. The acrylamide hydrogel is obtained by polymerizing acrylic acid and acrylamide through an aqueous solution. The self-made flame retardant is obtained by reacting ammonium polyphosphate with a hydroxy heterocyclic amino alcohol. The hydroxy heterocyclic amino alcohol is obtained by reacting a heterocyclic amino alcohol with a double-terminated hydroxyl polyphenylene ether. This process gives the gypsum-based lightweight flame-retardant board excellent flame retardancy, mechanical properties, and flame-retardant stability.

The present application relates to the technical field of current collectors, and specifically relates to a multilayer composite film and a current collector prepared from same. The present application provides a preparation method for the multilayer composite film. The multilayer composite film comprises a layer X, a layer Y and a layer Z from top to bottom; the layer X and the layer Z are made of polyimide, and the polyimide is a polycondensation reactant of carboxylic acid anhydride and diamine; and the material of the layer Y is any one or more of polypropylene, polyethylene, polyethylene terephthalate, polybutylene terephthalate, polyvinylidene fluoride, polytetrafluoroethylene, polyphenylene sulfide, polyphenyl ether, polyester, polystyrene and derivatives thereof. The polyimide prepared in the present application solves the problems of low solubility and poor processability of conventional fully aromatic polyimides, and a composite current collector is prepared by using heat resistance and improved surface polarity of polyimides, thereby improving the bonding force between a composite current collector film and a metal layer, and improving the tensile strength of a finished product.

The invention belongs to the technical field of copper-clad plate materials, and relates to a high-speed high-frequency low-CTE copper-clad plate glue solution as well as a preparation method and application thereof, the copper-clad plate glue solution comprises 55-135 parts of a resin composition, 2.5-21 parts of a cross-linking agent, 0.05-1.5 parts of a cross-linking accelerant, 11-54 parts of filler and 38-95 parts of a solvent; the resin composition is prepared from 25 to 45 parts of polyerylene resin, 15 to 35 parts of styrene-butadiene polymer, 15 to 30 parts of bismaleimide and 10 to 25 parts of allyl-terminated polyphenyl ether resin. According to the invention, Dk and Df meet the requirement of ultra-low loss and are greatly improved compared with the traditional PPO system, and meanwhile, the Z-axis CTE is reduced by more than 40%; the halogen-free flame-retardant design meets the environment-friendly requirement, and the high-frequency performance is not influenced; and a standard PCB processing technology is compatible, and the copper-clad plate suitable for 5G millimeter wave communication, automatic driving radar and satellite high-frequency circuits is prepared.

The invention relates to the technical field of coatings, in particular to an on-line spraying PPO / PA alloy material and a preparation method thereof.The on-line spraying PPO / PA alloy material is prepared from, by weight, 40-50 parts of PA66, 30-40 parts of PPO, 4-8 parts of compatilizer A, 0.2-1 part of compatilizer B, 10-20 parts of SBS, 1-3 parts of conductive agent and 0.2-1 part of auxiliaries. Compared with the prior art, the on-line spraying PPO / PA alloy material has the beneficial effects that the on-line spraying PPO / PA alloy material is obtained by blending the compatilizer A (maleic anhydride grafted polyphenyl ether), the compatilizer B, the SBS, the conductive agent and the assistant on the basis of PPO and PA, has good mechanical properties, conductivity and flowing properties, and can meet the use requirements of on-line spraying.

The invention relates to a flame-retardant composition, a flame-retardant layer and a new energy automobile power battery comprising the flame-retardant layer. The flame-retardant composition comprises the following components in percentage by weight: 50-68% of matrix resin which is a mixture of polycarbonate and polyphenyl ether in a weight ratio of (1: 1)-(3: 1); the composite flame retardant comprises a phosphate flame retardant, a cyanamide flame retardant and an inorganic flame retardant according to the weight ratio of 1: (0.5-0.8): (2-2.5), and the inorganic flame retardant is selected from one or more of aluminum hydroxide, antimony trioxide, magnesium hydroxide and zinc borate; 10-20% by weight of a thermally conductive agent; 5 to 10 wt% of a silane coupling agent; and 1-3 wt% of a lubricant. A flame-retardant layer formed by the flame-retardant composition is arranged between a power battery module and an aluminum shell of the new energy automobile power battery, has good flame retardance, heat conduction and mechanical properties, and can meet the use requirements of the new energy automobile power battery.

The invention discloses a foamed polyphenyl ether bead and a preparation method thereof. The material is prepared by compounding polyphenyl ether, a styrene polymer, a three-dimensional fiber microsphere reinforcement, a CNTs coated SiO2 core-shell nucleating agent, modified resin, a flame retardant and an antioxidant according to a specific ratio. The innovation of the invention lies in that a three-dimensional reinforcement with glass beads as a core and carbon fibers as a network and a composite foaming agent with silicon dioxide coated with carbon nanotubes are introduced to synergistically improve the cellular structure and mechanical properties. The preparation process comprises the key steps of component drying, melt blending granulation, carbon dioxide physical foaming under an autoclave aqueous dispersion system and the like. Through component design and surface modification, the foamed bead has the advantages of light weight, high strength, flame retardance and uniform foam structure, and is suitable for the fields of high-end heat insulation and bearing.

This application relates to the technical field of PE pipe processing, and specifically discloses a PE pipe and a preparation method thereof. A PE pipe is made of the following raw materials in parts by mass: 60-80 parts by mass of high-density polyethylene, 20-35 parts by mass of polyphenylene ether, 10-20 parts by mass of ethylene propylene diene monomer rubber, 3-8 parts by mass of polyurethane prepolymer, 2-4 parts by mass of maleic anhydride grafted polyethylene, 0.5-1.5 parts by mass of 4,5-diamino-2-thiouracil, 5-12 parts by mass of silicon-based microcapsule-coated basalt particles, 0.5-2 parts by mass of antioxidant, 0.1-1 part by mass of light stabilizer, and 1.5-2.5 parts by mass of glyceryl stearate. The PE pipe prepared by this application has good mechanical properties and anti-aging properties.

The present invention relates to the field of copper clad laminates, and discloses a copper clad laminate with low dielectric constant and high performance and a preparation method thereof. The specific steps are as follows: taking epoxy resin, phenolic resin, polyphenylene ether modified resin, modified nano-silica, etc. and mixing them to obtain a resin glue solution; impregnating glass fiber cloth in the resin glue solution to obtain a prepreg; taking the prepregs and laminating them and hot pressing them with copper foil; the polyphenylene ether modified resin includes epoxy resin, diallyl cyanate, and a fluorinated polyphenylene ether resin prepared by reacting polyphenylene ether, bisphenol AF, and benzoyl peroxide; the modified nano-silica is prepared by reacting allyl glycidyl ether and vinyltriethoxysilane with phenyltris(dimethylsilyl)silane, and then grafting it with a phosphorus-containing intermediate to form a modified additive, and grafting the modified additive with nano-silica. The phosphorus-containing intermediate is prepared by reacting phenylphosphoryl dichloride and eugenol. A copper clad laminate with high flame retardancy, high peel strength, and heat-resistant low dielectric constant is prepared.

The invention belongs to the technical field of electronic materials, and relates to a low-dielectric resin glue solution for a high-frequency high-speed copper-clad plate as well as a preparation method and application thereof, and the low-dielectric resin glue solution for the high-frequency high-speed copper-clad plate comprises the following components in parts by weight: 100 parts of a resin component, 2-4 parts of a compatibilizer, 2.5-4.5 parts of a curing system, 0.6-1.3 parts of an initiator, 55-80 parts of a filler and 1.1-2.3 parts of an auxiliary agent. By introducing a ternary interpenetrating network of the polybutylbenzene resin, the polyimide and the allyl-terminated modified polyphenyl ether, a resin compounding system is optimized; the copper-clad plate with the comprehensive performance of ultralow dielectric constant, ultralow dielectric loss, high peel strength and low Z-axis thermal expansion coefficient is realized by adopting double-initiator gradient curing, filler compounding dispersion and low-dielectric glass fabric-HVLP copper foil synergistic interface treatment; the method is suitable for high-frequency scenes such as 5G communication base stations and millimeter wave radars.

The invention discloses a halogen-free flame-retardant polyphenyl ether composite material as well as a preparation method and application thereof, and belongs to the technical field of high polymer materials. The composite material is prepared from the following components in parts by weight: 40-70 parts of polyphenyl ether resin, 10-30 parts of high impact polystyrene resin, 4-8 parts of SEBS (Styrene-Ethylene-Butylene-Styrene) resin, 5-10 parts of organic and inorganic composite flame retardant, 3-8 parts of phosphate flame retardant, 1-5 parts of polyborosiloxane and auxiliaries. The core of the organic-inorganic composite flame retardant is that the organic-inorganic composite flame retardant is a core-shell structure particle which takes magnesium-aluminum hydrotalcite and nano silicon dioxide as a core and melamine cyanurate as a shell according to a specific proportion. Through the synergistic effect of all the components, especially the core-shell structure, the dispersity and interfacial compatibility are effectively improved, so that the material achieves excellent flame retardance while maintaining high impact strength and heat resistance, and the UL-94 V-0 grade can still be met even under the condition of a 0.8 mm thin wall. The material is particularly suitable for preparing thin-wall electronic and electrical appliance shells and new energy automobile parts with harsh performance requirements.

The invention belongs to the technical field of functional composite materials, and particularly relates to an all-organic epoxy resin composite material as well as a preparation method and application thereof. The method comprises the following steps: S1, heating, melting and blending epoxy resin and phenolic hydroxyl polyphenyl ether to obtain a composite system; s2, adding a curing agent and a catalyst into the composite system, heating, stirring, reacting, vacuumizing, defoaming, casting the obtained mixed solution into a mold, curing, cooling and demolding to obtain the all-organic epoxy resin composite material. The heat conductivity coefficient of the obtained composite material is improved by 44.2% compared with that of pure epoxy resin, and the thermal expansion coefficient is reduced by 32.8%. The method is mild in condition, short in technological process, low in energy consumption and suitable for large-scale production, an innovative thought and an effective strategy are provided for development of a high-performance all-organic electronic packaging material, and silicon-free and ceramic-free all-organic upgrading of the packaging field is expected to be promoted.

The invention relates to the technical field of electronic materials, in particular to a copper-clad plate resin composition with an ultralow-loss medium and a preparation method of the copper-clad plate resin composition. The composition comprises the following components: modified polyphenyl ether, dicyclopentadiene epoxy resin, trifunctional epoxy resin, active ester, cyanate ester, DMAP, spherical silicon dioxide and a POSS-silicon dioxide compound, the preparation method comprises the following steps: carrying out surface norbornenylation modification on bimodal spherical silicon dioxide, and carrying out click reaction on the bimodal spherical silicon dioxide and octa-aminophenyl polysilsesquioxane with tetrazinyl at the tail end to prepare a POSS-silicon dioxide compound, so as to construct an interface transition layer with gradient modulus. According to the invention, collaborative optimization of dielectric loss, thermal mechanical properties and interface bonding strength is realized, and the material has excellent properties of low dielectric loss, high thermal stability, high peel strength and the like, and is suitable for the fields of 5G communication, high-frequency electronic equipment and the like.

The invention relates to a resin composition and a product thereof, the resin composition at least comprises modified polyphenyl ether resin, modified hydrocarbon resin and a crosslinking agent containing unsaturated bonds, a modified group of the modified polyphenyl ether resin has unsaturated double bonds, the modified hydrocarbon resin does not contain unsaturated bonds, and the tensile strength is more than 10 MPa. In the resin composition provided by the invention, the crosslinking agent containing unsaturated bonds can react with the modified polyphenyl ether resin with unsaturated double bonds, and forms an interpenetrating network with the saturated modified hydrocarbon resin with high tensile strength at the same time to obtain a polymer layer with high binding force, so that the aging resistance and humidity and heat resistance of the circuit substrate can be improved at the same time.

The invention discloses a polyphenyl ether modified epoxy resin-based copper-clad plate, and particularly relates to the technical field of copper-clad plates, the polyphenyl ether modified epoxy resin-based copper-clad plate comprises a glue solution, an electronic glass fabric and a copper foil, and the glue solution comprises the following raw materials: modified polyphenyl ether, an inorganic filler, a curing agent, a flame retardant and the balance of epoxy resin. The bisphenol A epoxy resin, toluene and benzoyl peroxide are utilized to treat polyphenyl ether, the molecular weight of the polyphenyl ether can be reduced, the crosslinking property of the polyphenyl ether and the epoxy resin is better, then paraformaldehyde is utilized to catalyze and modify the polyphenyl ether, the terminal of the polyphenyl ether is grafted with hydroxymethyl, and the polyphenyl ether is grafted with polyphenyl ether. The compatibility and interface bonding force of the obtained hydroxymethylated polyphenyl ether and epoxy resin are good, the dielectric loss performance and toughness of the copper-clad plate can be effectively improved, and anhydrous aluminum silicate of an amorphous layered gap structure formed through specific activation treatment can be formed during temperature-controlled calcination of kaolin. The dielectric constant and the dielectric loss of the copper-clad plate can be obviously reduced.

The invention relates to the technical field of cable materials, and particularly discloses a low-smoke halogen-free flame-retardant cable material and a preparation method thereof. The low-smoke halogen-free flame-retardant cable material is prepared from 100 parts of polyolefin blended resin, 10 to 20 parts of polyphenyl ether, 3 to 8 parts of glycidyl methacrylate grafted POE, 1 to 3 parts of hyperbranched polyesteramide, 50 to 80 parts of a flame retardant, 5 to 15 parts of silicone powder, 0.5 to 1.5 parts of an antioxidant and 0.05 to 0.2 part of an organic zirconium compound. The preparation method comprises the following steps: uniformly mixing the raw materials to obtain a mixture; and adding the mixture into a twin-screw extruder, carrying out melt extrusion by the twin-screw extruder, cooling, granulating, and drying to obtain the low-smoke halogen-free flame-retardant cable material. The mechanical property and temperature resistance of the low-smoke halogen-free flame-retardant cable material can be improved.

The invention belongs to the technical field of copper-clad plate materials, and particularly relates to a low-dielectric low-loss resin composition and a product and a preparation method thereof. The low-dielectric low-loss resin composition comprises the following components in parts by weight: 30-70 parts of polyphenyl ether; 10 to 50 parts of modified bismaleimide; 30 to 70 parts of a poly (1, 2-butadiene styrene) copolymer; 5 to 20 parts of partially hydrogenated poly (1, 2-butadiene); 1-10 parts of a cross-linking agent; 40 to 300 parts of an inorganic filler; 10 to 50 parts of a flame retardant; and 1-5 parts of a catalyst. The low-dielectric and low-loss resin composition provided by the invention maintains a low dielectric constant and low dielectric loss and also has a low thermal expansion coefficient, and a product prepared from the resin composition can meet the processing and application requirements of high-density, miniaturized and high-frequency and high-speed electronic devices.

The invention relates to the technical field of engineering plastics, and provides allyl functionalized polyphenyl ether as well as a preparation method and application thereof. The preparation method comprises the following steps: mixing dihydroxy-terminated polyphenyl ether, chloropropene, alkali, a catalyst, a polymerization inhibitor and an organic solvent for reaction to obtain allyl functionalized polyphenyl ether; the catalyst is prepared from a combination of p-toluenesulfonate, iodide and a 1, 3, 2-diazaphosphoropentene substance; the organic solvent is a mixed solvent of a polar solvent and a non-polar solvent. Under the synergistic action of various catalysts, the reaction of chloropropene and the terminal hydroxyl of the dihydroxyl-terminated polyphenyl ether is realized, and the obtained allyl functionalized polyphenyl ether is high in unsaturation degree and high in crosslinking density after curing, so that the allyl functionalized polyphenyl ether shows more excellent performance. The allyl functionalized polyphenyl ether prepared by the invention is an ideal matrix resin material for high-frequency and high-speed electronic products, and has a wide application prospect.

The invention belongs to the field of low-dielectric high polymer materials, and discloses a low-dielectric thermosetting polyphenyl ether-hydrocarbon resin polymer as well as a preparation method and application thereof. The structural formula of the thermosetting low-dielectric polyphenyl ether-hydrocarbon resin polymer is as shown in formula I in the specification. According to the invention, the polyphenyl ether is modified through a redistribution reaction, so that the molecular weight of the polyphenyl ether is reduced, the allyl is grafted at the tail end, and a cross-linking reaction is carried out through double bonds on the allyl and double bonds on hydrocarbon resin, so that the problem of system compatibility is fundamentally solved. Meanwhile, the balance between the flexibility of the hydrocarbon resin and the rigidity of the polyphenyl ether is realized, and the mechanical property and the heat resistance of the material are improved.

The invention discloses a kind of polyphenylene ether composite material and preparation method thereof, the polyphenylene ether composite material is prepared by weight by the following components:1000 parts of polyphenylene ether, 100 200 parts of high-impact polystyrene, 60 100 parts of polytetrafluoroethylene wax, 200 800 parts of soda lime borosilicate hollow glass microspheres, 2 10 parts of antioxidants.The present invention, by adding polytetrafluoroethylene wax in polyphenylene ether composite material, can not only enhance composition fluidity and plasticizing effect, improve its processing and mechanical property, the dielectric constant of composite material can also be further reduced.Compared with talcum powder, calcium carbonate, borosilicate hollow glass microspheres, soda lime borosilicate hollow glass microspheres are added in the present invention, the tensile strength, shock resistance of composite material can be further improved, the dielectric constant of composite material can also be significantly reduced.

A thermoplastic composition includes specific amounts of a poly (phenylene ether), an impact modifier (including a hydrogenated block copolymer of an alkenyl arene and a conjugated diene), an organophosphate flame retardant, a flame retardant synergist (including phosphazene), and optionally, tricalcium phosphate. The thermoplastic composition can be used to make various articles, particularly suitable for thin wall applications.

The invention relates to a wide-temperature-range optical cable for a ship and a preparation method thereof, and belongs to the technical field of communication optical cables. An outer sheath material is prepared by compounding polyethylene and modified polyphenyl ether, the use temperature range of the optical cable sheath material is remarkably improved, a compatible flame retardant is further prepared, the flame retardant has grafted double bonds and can be grafted on a polyethylene molecular chain under the action of an initiator, and after grafting modification, the flame retardant can be grafted on the polyethylene molecular chain, so that the use temperature range of the optical cable sheath material is greatly improved. The biphenyl structure in the flame-retardant compatilizer and the biphenyl structure in the modified polyphenyl ether can generate pi-pi conjugate to enhance the intermolecular force between the polyethylene and the modified polyphenyl ether, so that the interface bonding force between the polyethylene and the modified polyphenyl ether is remarkably improved, and the phase separation problem caused by the polarity difference between the flame retardant and the polyethylene is reduced; the dispersing effect of the flame retardant in a polymer is improved, the flame retardance of the material is improved, migration of the flame retardant is inhibited, and the mechanical property of the sheath material can be effectively improved.

The invention provides a low-loss high-dielectric constant polyphenyl ether composite material and a preparation method thereof. The polyphenyl ether composite material comprises the following components in parts by weight: 15-40 parts of polyphenyl ether, 5-20 parts of polystyrene, 2-10 parts of a compatilizer, 2-10 parts of a flexibilizer, 0.5-1 part of an antioxidant, 1-3 parts of a lubricant and 20-62 parts of a dielectric modifier, the dielectric modifier is needle-shaped titanium dioxide subjected to surface modification treatment, the dielectric constant of the composite material is close to 20 and the dielectric loss can be as low as 0.002 under the high frequency of 1.1 GHz under the same action of all the components, and the comprehensive dielectric property is remarkably superior to that of an existing product; meanwhile, the prepared composite material also keeps excellent mechanical properties and heat resistance, and the stability of the dielectric constant of the material in a humid environment is also improved.

The invention discloses a polyamide / polyphenyl ether alloy material and a manufacturing method thereof, and is used for solving the problems that an existing polyamide / polyphenyl ether alloy material cannot meet UL94 V-0-level flame retardance, high insulativity of CTI greater than or equal to 700V and low precipitation (lt) after long-term damp-heat aging at the same time under the ultra-thin thickness of 0.6 mm; 0.1%) and a high performance retention rate (gt; 90%). The polyamide / polyphenyl ether alloy material comprises the following components in parts by mass: 55-75 parts of polyamide 66 resin; 25 to 45 parts of polyphenyl ether resin pre-irradiated by gamma rays; 10 to 20 parts of a silicone-coated diethyl aluminum phosphinate flame retardant with a core-shell structure; 5-10 parts of a maleic anhydride grafted high impact polystyrene compatilizer pre-irradiated by gamma rays; 20-30 parts of hydrolysis-resistant glass fiber of which the surface is treated by a silane coupling agent; 3-8 parts of tetrapod-like zinc oxide whiskers; 2 to 5 parts of a CTI synergist; and 1-2 parts of an anti-precipitation agent.

To provide a thermosetting adhesive composition which has, after thermally cured, a low dielectric constant, a low dielectric loss tangent, a low temperature change rate of the dielectric loss tangent, and good bending resistance.SOLUTION: A thermosetting adhesive composition for bonding between substrates is provided, containing with respect to 100 pts.mass of the total of the thermosetting adhesive composition, 65 to 90 pts.mass of a styrenic elastomer, as crosslinking components, 5 to 20 pts.mass of (A) a modified polyphenylene ether resin having a radical polymerizable group at a molecular terminal, 4 to 10 pts.mass of (B) polybutadiene and / or polyisoprene having a weight average molecular weight of 10,000 to 50,000, a radical polymerization initiator, and an epoxy resin, wherein the total of the contents of the radical polymerization initiator, the epoxy resin and the epoxy resin curing agent is 10 pts.mass or less, a styrenic elastomer having a styrene ratio of less than 67% is contained as the styrenic elastomer, and the total of the content of the component (A) and the content of the component (B) is 25 pts.mass or less.SELECTED DRAWING: Figure 1

The invention provides a method for determining the migration volume of octyl glycidyl ether in a food contact material by using a solid food simulant, which comprises the following steps: carrying out a migration experiment on modified polyphenyl ether (MPPO) serving as the food simulant and the food contact material, and then efficiently extracting a migrated target object by using an ultrasonic-assisted supramolecular mixed solvent. According to the method, the migration volume of the octyl glycidyl ether is detected through GC-MS after filtration and extraction, the method is small in interference and high in sensitivity, the problem that a method for detecting the octyl glycidyl ether in the dry food simulant is lacked is solved, and a basis is provided for safety evaluation of the octyl glycidyl ether in a packaging material.