608 results about "Polyphenyl ether" patented technology

This invention discloses a gypsum-based lightweight flame-retardant board and its preparation method, relating to the field of building materials technology. The gypsum-based lightweight flame-retardant board prepared by this invention is made by foaming a gypsum substrate with a foaming agent and a composite stabilizer, then introducing a self-made flame retardant and other raw materials, casting it between two layers of facing paper, and drying it. The composite stabilizer includes a modified acrylamide copolymer and acrylamide hydrogel. The modified acrylamide copolymer is obtained by copolymerizing N-isopropylacrylamide with silane acrylic acid and then reacting it with hyperbranched polyphosphate. The acrylamide hydrogel is obtained by polymerizing acrylic acid and acrylamide through an aqueous solution. The self-made flame retardant is obtained by reacting ammonium polyphosphate with a hydroxy heterocyclic amino alcohol. The hydroxy heterocyclic amino alcohol is obtained by reacting a heterocyclic amino alcohol with a double-terminated hydroxyl polyphenylene ether. This process gives the gypsum-based lightweight flame-retardant board excellent flame retardancy, mechanical properties, and flame-retardant stability.

The present application relates to the technical field of current collectors, and specifically relates to a multilayer composite film and a current collector prepared from same. The present application provides a preparation method for the multilayer composite film. The multilayer composite film comprises a layer X, a layer Y and a layer Z from top to bottom; the layer X and the layer Z are made of polyimide, and the polyimide is a polycondensation reactant of carboxylic acid anhydride and diamine; and the material of the layer Y is any one or more of polypropylene, polyethylene, polyethylene terephthalate, polybutylene terephthalate, polyvinylidene fluoride, polytetrafluoroethylene, polyphenylene sulfide, polyphenyl ether, polyester, polystyrene and derivatives thereof. The polyimide prepared in the present application solves the problems of low solubility and poor processability of conventional fully aromatic polyimides, and a composite current collector is prepared by using heat resistance and improved surface polarity of polyimides, thereby improving the bonding force between a composite current collector film and a metal layer, and improving the tensile strength of a finished product.

The invention discloses a foamed polyphenyl ether bead and a preparation method thereof. The material is prepared by compounding polyphenyl ether, a styrene polymer, a three-dimensional fiber microsphere reinforcement, a CNTs coated SiO2 core-shell nucleating agent, modified resin, a flame retardant and an antioxidant according to a specific ratio. The innovation of the invention lies in that a three-dimensional reinforcement with glass beads as a core and carbon fibers as a network and a composite foaming agent with silicon dioxide coated with carbon nanotubes are introduced to synergistically improve the cellular structure and mechanical properties. The preparation process comprises the key steps of component drying, melt blending granulation, carbon dioxide physical foaming under an autoclave aqueous dispersion system and the like. Through component design and surface modification, the foamed bead has the advantages of light weight, high strength, flame retardance and uniform foam structure, and is suitable for the fields of high-end heat insulation and bearing.

The invention discloses a halogen-free flame-retardant polyphenyl ether composite material as well as a preparation method and application thereof, and belongs to the technical field of high polymer materials. The composite material is prepared from the following components in parts by weight: 40-70 parts of polyphenyl ether resin, 10-30 parts of high impact polystyrene resin, 4-8 parts of SEBS (Styrene-Ethylene-Butylene-Styrene) resin, 5-10 parts of organic and inorganic composite flame retardant, 3-8 parts of phosphate flame retardant, 1-5 parts of polyborosiloxane and auxiliaries. The core of the organic-inorganic composite flame retardant is that the organic-inorganic composite flame retardant is a core-shell structure particle which takes magnesium-aluminum hydrotalcite and nano silicon dioxide as a core and melamine cyanurate as a shell according to a specific proportion. Through the synergistic effect of all the components, especially the core-shell structure, the dispersity and interfacial compatibility are effectively improved, so that the material achieves excellent flame retardance while maintaining high impact strength and heat resistance, and the UL-94 V-0 grade can still be met even under the condition of a 0.8 mm thin wall. The material is particularly suitable for preparing thin-wall electronic and electrical appliance shells and new energy automobile parts with harsh performance requirements.

The invention belongs to the technical field of functional composite materials, and particularly relates to an all-organic epoxy resin composite material as well as a preparation method and application thereof. The method comprises the following steps: S1, heating, melting and blending epoxy resin and phenolic hydroxyl polyphenyl ether to obtain a composite system; s2, adding a curing agent and a catalyst into the composite system, heating, stirring, reacting, vacuumizing, defoaming, casting the obtained mixed solution into a mold, curing, cooling and demolding to obtain the all-organic epoxy resin composite material. The heat conductivity coefficient of the obtained composite material is improved by 44.2% compared with that of pure epoxy resin, and the thermal expansion coefficient is reduced by 32.8%. The method is mild in condition, short in technological process, low in energy consumption and suitable for large-scale production, an innovative thought and an effective strategy are provided for development of a high-performance all-organic electronic packaging material, and silicon-free and ceramic-free all-organic upgrading of the packaging field is expected to be promoted.

The invention relates to the technical field of electronic materials, in particular to a copper-clad plate resin composition with an ultralow-loss medium and a preparation method of the copper-clad plate resin composition. The composition comprises the following components: modified polyphenyl ether, dicyclopentadiene epoxy resin, trifunctional epoxy resin, active ester, cyanate ester, DMAP, spherical silicon dioxide and a POSS-silicon dioxide compound, the preparation method comprises the following steps: carrying out surface norbornenylation modification on bimodal spherical silicon dioxide, and carrying out click reaction on the bimodal spherical silicon dioxide and octa-aminophenyl polysilsesquioxane with tetrazinyl at the tail end to prepare a POSS-silicon dioxide compound, so as to construct an interface transition layer with gradient modulus. According to the invention, collaborative optimization of dielectric loss, thermal mechanical properties and interface bonding strength is realized, and the material has excellent properties of low dielectric loss, high thermal stability, high peel strength and the like, and is suitable for the fields of 5G communication, high-frequency electronic equipment and the like.

The invention discloses a polyphenyl ether modified epoxy resin-based copper-clad plate, and particularly relates to the technical field of copper-clad plates, the polyphenyl ether modified epoxy resin-based copper-clad plate comprises a glue solution, an electronic glass fabric and a copper foil, and the glue solution comprises the following raw materials: modified polyphenyl ether, an inorganic filler, a curing agent, a flame retardant and the balance of epoxy resin. The bisphenol A epoxy resin, toluene and benzoyl peroxide are utilized to treat polyphenyl ether, the molecular weight of the polyphenyl ether can be reduced, the crosslinking property of the polyphenyl ether and the epoxy resin is better, then paraformaldehyde is utilized to catalyze and modify the polyphenyl ether, the terminal of the polyphenyl ether is grafted with hydroxymethyl, and the polyphenyl ether is grafted with polyphenyl ether. The compatibility and interface bonding force of the obtained hydroxymethylated polyphenyl ether and epoxy resin are good, the dielectric loss performance and toughness of the copper-clad plate can be effectively improved, and anhydrous aluminum silicate of an amorphous layered gap structure formed through specific activation treatment can be formed during temperature-controlled calcination of kaolin. The dielectric constant and the dielectric loss of the copper-clad plate can be obviously reduced.

The invention belongs to the technical field of copper-clad plate materials, and particularly relates to a low-dielectric low-loss resin composition and a product and a preparation method thereof. The low-dielectric low-loss resin composition comprises the following components in parts by weight: 30-70 parts of polyphenyl ether; 10 to 50 parts of modified bismaleimide; 30 to 70 parts of a poly (1, 2-butadiene styrene) copolymer; 5 to 20 parts of partially hydrogenated poly (1, 2-butadiene); 1-10 parts of a cross-linking agent; 40 to 300 parts of an inorganic filler; 10 to 50 parts of a flame retardant; and 1-5 parts of a catalyst. The low-dielectric and low-loss resin composition provided by the invention maintains a low dielectric constant and low dielectric loss and also has a low thermal expansion coefficient, and a product prepared from the resin composition can meet the processing and application requirements of high-density, miniaturized and high-frequency and high-speed electronic devices.

The invention belongs to the field of low-dielectric high polymer materials, and discloses a low-dielectric thermosetting polyphenyl ether-hydrocarbon resin polymer as well as a preparation method and application thereof. The structural formula of the thermosetting low-dielectric polyphenyl ether-hydrocarbon resin polymer is as shown in formula I in the specification. According to the invention, the polyphenyl ether is modified through a redistribution reaction, so that the molecular weight of the polyphenyl ether is reduced, the allyl is grafted at the tail end, and a cross-linking reaction is carried out through double bonds on the allyl and double bonds on hydrocarbon resin, so that the problem of system compatibility is fundamentally solved. Meanwhile, the balance between the flexibility of the hydrocarbon resin and the rigidity of the polyphenyl ether is realized, and the mechanical property and the heat resistance of the material are improved.

The invention provides a low-loss high-dielectric constant polyphenyl ether composite material and a preparation method thereof. The polyphenyl ether composite material comprises the following components in parts by weight: 15-40 parts of polyphenyl ether, 5-20 parts of polystyrene, 2-10 parts of a compatilizer, 2-10 parts of a flexibilizer, 0.5-1 part of an antioxidant, 1-3 parts of a lubricant and 20-62 parts of a dielectric modifier, the dielectric modifier is needle-shaped titanium dioxide subjected to surface modification treatment, the dielectric constant of the composite material is close to 20 and the dielectric loss can be as low as 0.002 under the high frequency of 1.1 GHz under the same action of all the components, and the comprehensive dielectric property is remarkably superior to that of an existing product; meanwhile, the prepared composite material also keeps excellent mechanical properties and heat resistance, and the stability of the dielectric constant of the material in a humid environment is also improved.

The invention discloses a polyamide / polyphenyl ether alloy material and a manufacturing method thereof, and is used for solving the problems that an existing polyamide / polyphenyl ether alloy material cannot meet UL94 V-0-level flame retardance, high insulativity of CTI greater than or equal to 700V and low precipitation (lt) after long-term damp-heat aging at the same time under the ultra-thin thickness of 0.6 mm; 0.1%) and a high performance retention rate (gt; 90%). The polyamide / polyphenyl ether alloy material comprises the following components in parts by mass: 55-75 parts of polyamide 66 resin; 25 to 45 parts of polyphenyl ether resin pre-irradiated by gamma rays; 10 to 20 parts of a silicone-coated diethyl aluminum phosphinate flame retardant with a core-shell structure; 5-10 parts of a maleic anhydride grafted high impact polystyrene compatilizer pre-irradiated by gamma rays; 20-30 parts of hydrolysis-resistant glass fiber of which the surface is treated by a silane coupling agent; 3-8 parts of tetrapod-like zinc oxide whiskers; 2 to 5 parts of a CTI synergist; and 1-2 parts of an anti-precipitation agent.

To provide a thermosetting adhesive composition which has, after thermally cured, a low dielectric constant, a low dielectric loss tangent, a low temperature change rate of the dielectric loss tangent, and good bending resistance.SOLUTION: A thermosetting adhesive composition for bonding between substrates is provided, containing with respect to 100 pts.mass of the total of the thermosetting adhesive composition, 65 to 90 pts.mass of a styrenic elastomer, as crosslinking components, 5 to 20 pts.mass of (A) a modified polyphenylene ether resin having a radical polymerizable group at a molecular terminal, 4 to 10 pts.mass of (B) polybutadiene and / or polyisoprene having a weight average molecular weight of 10,000 to 50,000, a radical polymerization initiator, and an epoxy resin, wherein the total of the contents of the radical polymerization initiator, the epoxy resin and the epoxy resin curing agent is 10 pts.mass or less, a styrenic elastomer having a styrene ratio of less than 67% is contained as the styrenic elastomer, and the total of the content of the component (A) and the content of the component (B) is 25 pts.mass or less.SELECTED DRAWING: Figure 1

The purpose of the present invention is to provide a copper-based material having excellent adhesion and heat resistance, a method for producing a copper-based material, and a laminate. The copper-based material according to the present invention has a first surface-treated layer on or on the surface of the copper-based material, and a second surface-treated layer between the copper-based material and the first surface-treated layer, the first surface-treated layer being a layer formed from a first agent, and the second surface-treated layer being a layer formed from a second agent. The first agent contains: a copolymer (A) of a polyphenylene ether resin having a hydroxyl group at one terminal and / or both terminals of the molecule and a silane compound having an acyloxyalkyl group, a hydrolysate thereof, or a condensate thereof; and water, the second surface treatment layer being formed from a second agent containing: a metal compound (B) containing at least one metal element selected from the group consisting of zirconium, titanium, and trivalent chromium; and a compound (D) containing elemental vanadium.

The invention discloses a polyamide composite material, a preparation method thereof and a connector. The polyamide composite material comprises the following components in parts by weight: 25-65 parts of polyamide resin, 25-55 parts of polyphenyl ether resin, 3-15 parts of an organic phosphorus halogen-free flame retardant and 0.3-4 parts of a stabilizer. The stabilizer is prepared from hydroxyapatite and wollastonite; the polyamide resin comprises aliphatic polyamide resin and semi-aromatic polyamide resin. The polyamide composite material disclosed by the invention has high insulation and pressure resistance in a high-salt-concentration application environment.

The invention relates to a resin composition, a prepreg, a circuit substrate and a printed circuit board. The resin composition at least comprises: (1) functionalized modified polyphenyl ether resin; (2) hydrocarbon resin, wherein the Vicat softening point of the hydrocarbon resin is 80 DEG C to 240 DEG C; the structural formula of the silicon-nitrogen resin is shown in the formula (1), n is a natural number ranging from 10 to 200, R1, R2, R3, R4 and R5 are independently selected from-H,-OH, amino, C1-C6 alkyl, C1-C6 alkenyl, C6-C12 aryl, C1-C6 alkyl substituted C6-C12 aryl, acrylate or C1-C6 alkyl substituted acrylate, and a molecular chain of the silicon-nitrogen resin at least comprises Si-H groups and Si-vinyl groups. The circuit substrate prepared from the resin composition has high peel strength, high modulus strength, excellent electrical properties and high heat resistance, and has a wide application prospect.

The invention relates to the technical field of high-performance polypropylene, and discloses a corrosion-resistant polypropylene-based composite material, a preparation method thereof and application of the corrosion-resistant polypropylene-based composite material in an automobile fuel tank. The polypropylene-based composite material comprises the following components in parts by weight: 60-90 parts of polypropylene resin, 10-40 parts of a polyphenyl ether copolymer and 0.1-0.3 part of an antioxidant, after the alkyl chain is introduced into the polyphenyl ether copolymer material, the compatibility between the polyphenyl ether copolymer material and polypropylene becomes good, the phase separation defect between the polyphenyl ether copolymer material and polypropylene is reduced, the tensile strength, bending strength and the like of the composite material can be enhanced, and the side chain of the polyphenyl ether copolymer contains a benzene ring with high structural stability, so that the strength of the composite material can be further improved. Meanwhile, the composite material is low in oil absorption rate and excellent in oil corrosion resistance.

The present application relates to a kind of methyl methacryl-terminated polyphenyl ether and its preparation method, the preparation method includes the following steps: (1) aromatic phenolic monomer is prepared by homogeneous method prepolymer;(2) the prepolymer prepared in step (1) is mixed with redistribution monomer and redistribution catalyst, reaction, obtain terminal hydroxyl polyphenyl ether solution;(3) the terminal hydroxyl polyphenyl ether solution prepared in step (2), double bond-containing acyl chloride end-capping agent, nucleophilic catalyst and stabilizer are reacted in microchannel reactor, obtain the methyl methacryl-terminated polyphenyl ether.The preparation method provided by the present application simultaneously has the characteristics of narrow molecular weight distribution, high unsaturation and high whiteness for the terminal vinyl polyphenyl ether prepared by the preparation method.

The invention discloses a polyphenyl ether resin composition, a polyphenyl ether composite material and a preparation method and application thereof. The polyphenyl ether resin composition is obtained by reacting polyphenyl ether and naphthoic acid compounds in a melt, the polyphenyl ether has a repeating unit with the following structure: R1, R2, R3 and R4 are respectively and independently hydrogen, halogen, primary or secondary lower alkyl, phenyl, halogenated alkyl, alkoxy or halogenated alkoxy; the naphthoic acid compound is at least one of naphthoic acid or hydroxyl naphthoic acid. Compared with polyphenyl ether resin, the polyphenyl ether resin not only can improve the gas barrier property of the polyphenyl ether composite material in a melt, but also can improve the high-temperature injection molding processing stability of the polyphenyl ether composite material.

[Problem] To provide a resin composition, a dry film, and a cured product which have excellent film-forming properties and are capable of suppressing plating expansion while maintaining low dielectric characteristics and a low coefficient of thermal expansion. [Solution] The resin composition contains (A) a branched polyphenylene ether, (B) a curing agent component having two or more styrenic double bonds and having a molecular weight of 2500 or less, (C) a radical polymerization initiator, and (D) a filler.

Provided is a resin composition including (a) (a-1) a polyphenylene ether-based resin, (a-2) a styrene-based resin, and (a-3) one or more compounds selected from a phosphoric acid ester-based compound and a phosphazene compound, or (a-1) a polyphenylene ether-based resin and (a-3) one or more compounds selected from a phosphoric acid ester-based compound and a phosphazene compound, and (b) a polyarylate resin, wherein a number average molecular weight of the (a-1) component is 1.5×104 to 2.5×104, the glass transition temperature of the (a) component is 100° C. to 145° C., the amount of the (a-3) component is 5 to 40 parts by mass, and the amount of the (b) component is 1 to 12 parts by mass, relative to 100 parts by mass of the (a-1) component or 100 parts by mass of a total of the (a-1) component and the (a-2) component.

This invention belongs to the field of polymer materials, specifically relating to a low-heat-shrinkage polymeric film for laser drilling and its preparation method. The film comprises modified polyphenylene ether resin, vinyl-containing benzoxazine resin, a specific cationic initiator, a toughening agent, and inorganic modified fillers: gadolinium lanthanum zirconate core-shell nanocrystals and lithium aluminum borosilicate nanowires. The preparation method includes: first, surface-treating the two inorganic fillers with a silane coupling agent and then dispersing them in a solvent to obtain a slurry; then, mixing this slurry with the modified polyphenylene ether resin, vinyl-containing benzoxazine resin, cationic initiator, and toughening agent to form a homogeneous adhesive; finally, coating the adhesive onto a carrier film and drying and curing it at three temperature stages from low to high to obtain the finished film. The film prepared by this method exhibits extremely low heat shrinkage during laser drilling, effectively controlling resin protrusion or indentation defects on the hole wall, and significantly improving the quality and reliability of micropore processing.

Provided is a novel compound that can achieve both dielectric properties and desmearability after curing. A radical polymerizable group-containing ester compound according to an embodiment comprises: an ester bond-containing molecule that consists only of one or more first units which each have a structure derived from a polyphenylene ether having hydroxy groups at both terminals, and one or more second units which each have a structure derived from a bifunctional or trifunctional aromatic acid halide and which are bonded to the first units by ester bonds; and a radical polymerizable group that is added to each molecular terminal of the ester bond-containing molecule.

A resin composition includes 100 parts by weight of an unsaturated C═C double bond-containing polyphenylene ether resin; 5 parts by weight to 100 parts by weight of a compound of Formula (1), a compound of Formula (2), an oligomer of the compound of Formula (1), an oligomer of the compound of Formula (2) or a combination thereof; and 5 parts by weight to 100 parts by weight of a benzocyclobutene-modified polyolefin. Moreover, also provided is an article made from the resin composition, including a prepreg, a resin film, a laminate or a printed circuit board, and improvements in various properties can be achieved including post-plating copper foil peeling strength uniformity, Z-axis coefficient of thermal expansion and storage modulus variation rate.

Provided: A curable resin laminate with low dielectric properties, capable of easily fabricating an insulating layer with excellent adhesion (peel strength) to the conductor layer. A curable resin laminate comprising: a first resin layer formed of a first curable composition; and a second resin layer laminated on the first resin layer and formed of a second curable composition, the second resin layer having a thickness of 5-35% relative to the total thickness of the first and second resin layers, the first curable composition comprising (A1) polyphenylene ether and filler, wherein the filler content (M) as a total solid component is... B1 The content of the second curable composition is 30% or more by mass, and the content of the filler as a solid component is (M). B2 () is less than 40% by mass, which is M B1 >M B2 The slopes of (A1) and (A2) calculated from the conformation diagrams are less than 0.6.

The object of the present invention is polyphenylene oxide based film with crystalline nanoporous phases with surface area equal to or greater than 30 m2 / g, preferably greater than 100 m2 / g, and a procedure for the attainment thereof.

A method of forming a porous carbon includes pyrolyzing a functionalized polyphenylene ether to provide a porous carbon material. The porous carbon material has a specific pore distribution. A porous carbon material prepared according to the method and uses thereof are also disclosed.

The invention relates to a reaction kettle for preparing bisphenol A cyanate resin, and belongs to the technical field of resin preparation, the reaction kettle comprises a resin preparation box, two groups of crushing boxes are arranged on the upper surface of the resin preparation box, and cover plates are arranged on the upper surfaces of the two groups of crushing boxes. A threaded rod and an extension rod are driven to rotate through a motor, a rotating shaft and a scraping plate C are driven to rotate under the meshing connection action of a bevel gear A and a bevel gear B, a rotating rod is driven to rotate integrally under the clamping connection action of a clamping block and a clamping groove, and solid bisphenol A cyanate monomers and solid polyphenyl ether are cut and crushed; raw materials meeting particle conditions penetrate through the filter screen frame and fall to the lower part of the crushing box, a bisphenol A cyanate monomer and polyphenyl ether are rotationally dispersed more uniformly in cooperation with the dispersion frame, and the polyphenyl ether and bisphenol A cyanate monomer melt are mixed more uniformly under the rotation action of the stirring blades and the scraper A, so that the overall mixing efficiency is effectively accelerated.

The present invention provides a photosensitive resin composition, a cured product thereof, and a wiring structure, an electronic component, a semiconductor device, and a camera module containing the cured product thereof. The photosensitive resin composition is not cured by heat treatment at a high temperature, but is cured by irradiation with active energy rays. In the photosensitive resin composition, film reduction after the development process is suppressed. Furthermore, fine patterns can be accurately formed by photolithography. One aspect of the present invention relates to a photosensitive resin composition, a cured product thereof, and a wiring structure, an electronic component, a semiconductor device, and a camera module containing the cured product thereof, wherein the photosensitive resin composition comprises components (A) to (C): (A) a modified polyphenylene ether represented by formula (1) and formula (2), (B) a silsesquioxane compound represented by formula (3), and (C) a photopolymerization initiator.

The invention relates to a fluoride-free flame-retardant HIPS (high impact polystyrene) resin composition and a preparation method thereof. The composition comprises the following components in parts by weight: 62-75 parts of HIPS resin; 5-15 parts of polyphenyl ether resin; 10-18 parts of a brominated aromatic flame retardant; 3-8 parts of a styrene toughening agent; 1.0 to 2.0 parts of an antimony flame retardant synergist; 1-3 parts of a ceramic carbonizing agent; 1-3 parts of a polyol charring agent; 0.2 to 0.5 part of an antioxidant; 0.1-0.5 part of a light stabilizer; and 0.5 to 1.0 part of lubricant. The preparation method comprises the following steps: stirring and fully mixing the raw materials in a high-speed mixer, and carrying out material melting, shearing, homogenizing, bracing, cooling and pelletizing under the conveying, shearing and mixing of screws by a twin-screw extruder to obtain the fluoride-free flame-retardant HIPS resin composition. The invention solves the problem that the traditional flame-retardant HIPS resin needs an anti-dripping agent PTFE for synergistic flame retardance but cannot meet the PFAS prohibition. The material can be widely applied to the fields of display rear shells, chargers, electric control boxes, electric appliance shells and the like.