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High-frequency thermosetting resin composition, prepreg and laminated sheet

A technology of resin composition and prepreg, which is applied in the direction of layered products, metal layered products, chemical instruments and methods, etc., can solve the problems of reducing the heat resistance and mechanical properties of finished products, limited flame retardant effect, leakage, etc., and achieves Excellent copper foil peel strength and heat resistance, low dielectric loss, low dielectric constant effect

Active Publication Date: 2011-09-14
SHENGYI TECH SUZHOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Metal compounds such as zinc borate, aluminum hydroxide, etc. can improve the flame retardancy to a certain extent, but the flame retardancy effect is limited, and will seriously deteriorate the dielectric properties; while phosphorus-containing resins and phosphorus-containing compounds are relatively good in flame retardancy, generally Can be divided into two categories: additive type and reactive type
Commonly used additive-type phosphorus-containing compounds mainly include phosphate esters, phosphazenes, etc., which act as plasticizers in the resin system, which will reduce the heat resistance and mechanical properties of the finished product, and there is a problem of exudation at high temperatures. Affect the reliability of finished products; and the commonly used reactive phosphorus-containing resins are mainly phosphorus-containing epoxy or phosphorus-containing phenolic resin, but these resins with epoxy resin or phenolic resin as the structure will also reduce the dielectric properties of the curing system

Method used

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  • High-frequency thermosetting resin composition, prepreg and laminated sheet
  • High-frequency thermosetting resin composition, prepreg and laminated sheet
  • High-frequency thermosetting resin composition, prepreg and laminated sheet

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0047] Add 40g of polyphenylene ether resin (structure as formula 1, R=S1) into 40g of methyl ethyl ketone, and stir to dissolve it completely. After the polyphenylene ether resin is completely dissolved, add 30g of biphenyl epoxy resin (NC-3000, Nippon Kayaku), 15g of phosphorus cyanate resin (structure as in formula 2, R=A1), 15g of bisphenol A Type cyanate (CY-10, Wuqiao Chemical), 0.4g of 2-ethyl-4-methylimidazole and 0.4g of aluminum acetylacetonate, stirred and mixed evenly to obtain glue. Select a flat and smooth E-glass fiber cloth with a thickness of 0.1mm, evenly coat the above glue, and bake it in an oven at 150°C for 5 minutes to prepare a prepreg. Stack 8 of the above-mentioned prepregs, attach 35 μm copper foil up and down, place them in a vacuum hot press and press them for 3 hours at a pressure of 3 MPa and a temperature of 220° C. to obtain a laminate. The properties of the obtained copper-clad laminates are shown in Table 1.

Embodiment 2

[0049]Add 45g of polyphenylene ether resin (structure as in Formula 1, R=S2) to 45g of butanone, and stir to dissolve it completely. After the polyphenylene ether resin is completely dissolved, add 25g of biphenyl epoxy resin (NC-3000, Nippon Kayaku), 15g of phosphorous cyanate resin (structure as in formula 4, R=A1), 15g of bisphenol A Type cyanate (CY-10, Wuqiao Chemical), 0.4g 2-ethyl-4-methylimidazole and 0.4g aluminum acetylacetonate, stir and mix evenly to obtain glue. Select a flat and smooth E-glass fiber cloth with a thickness of 0.1mm, evenly coat the above glue, and bake it in an oven at 150°C for 5 minutes to prepare a prepreg. Stack 8 of the above-mentioned prepregs, attach 35 μm copper foil up and down, place them in a vacuum hot press and press them for 3 hours at a pressure of 3 MPa and a temperature of 220° C. to obtain a laminate. The properties of the obtained copper-clad laminates are shown in Table 1.

Embodiment 3

[0051] Add 35g of polyphenylene ether resin (structure as in Formula 1, R=S1) to 30g of butanone, and stir to dissolve it completely. After the polyphenylene ether resin is completely dissolved, add 30g of trifunctional phenolic epoxy resin (TFE1250, Changchun artificial resin), 25g of phosphorous cyanate resin (structure as in formula 5, R1=D4, R2=D5, R3= D7), 10g of dicyclopentadiene cyanate (CY-3, Wuqiao Chemical), 0.4g of 2-ethyl-4-methylimidazole and 0.4g of zinc acetylacetonate, stirred and mixed evenly to obtain a glue. Select a flat and smooth E-glass fiber cloth with a thickness of 0.1mm, evenly coat the above glue, and bake it in an oven at 150°C for 5 minutes to prepare a prepreg. Stack 8 of the above-mentioned prepregs, attach 35 μm copper foil up and down, place them in a vacuum hot press and press them for 3 hours at a pressure of 3 MPa and a temperature of 220° C. to obtain a laminate. The properties of the obtained copper-clad laminates are shown in Table 1. ...

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Abstract

The invention discloses a high-frequency thermosetting resin composition. The high-frequency thermosetting resin composition comprises the following components in part by weight: 10 to 60 parts of halogen-free epoxy resin, 15 to 70 parts of polyphenyl ether resin, and 5 to 60 parts of composite cyanate resin; an accelerator is 0.01 to 2 parts; and the composite cyanate resin comprises thiocyanate resin. The composition can realize halogen-free flame resistance, and does not influence the heat resistance and dielectric performance of a product; and a laminated sheet prepared from the composition has high peel strength and heat resistance of a copper foil and a low dielectric constant and low dielectric loss under the high-frequency condition.

Description

technical field [0001] The invention relates to a thermosetting resin composition, in particular to a thermosetting resin composition used for a high-frequency laminate, a prepreg made therefrom and a laminate for printed circuits. Background technique [0002] For a long time, epoxy resin has been widely used in FR-4 laminates due to its comprehensive advantages such as wide source of raw materials, good processability, and low cost. However, with the high-speed and high-frequency increase in information processing and information transmission in recent years, higher requirements have been placed on the dielectric properties of laminates for printed circuits. To put it simply, the laminate material needs to have low dielectric constant and dielectric loss to reduce signal delay, distortion and loss during high-speed transmission, as well as interference between signals. However, ordinary epoxy resin has a high dielectric constant and dielectric loss, which is difficult to ...

Claims

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Application Information

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IPC IPC(8): C08L71/12C08L63/00C08L63/02C08L79/04B32B15/08B32B15/20
Inventor 黄荣辉谌香秀李兴敏崔春梅马建肖升高
Owner SHENGYI TECH SUZHOU
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