797 results about "Cyanate compound" patented technology

A precursor source mixture useful for CVD or ALD of a film comprising: at least one precursor composed of an element selected from the group consisting of Li, Na, K, Rb, Cs, Fr, Be, Mg, Ti, Zr, Hf, Sc, Y, La, V, Nb, Ta, Cr, Mo, W, Mn, Re, Fe, Ru, Os, Co, Rh, Ir, Ni, Pd, Pt, Cu, Ag, Au, Zn, Cd, Hg, B, Al, Ga, In, Tl, Si, Ge, Sn, Pb, As, P, Sb and Bi, to which is bound at least one ligand selected from the group consisting of hydride, alkyl, alkenyl, cycloalkenyl, aryl, alkyne, carbonyl, amido, imido, hydrazido, phosphido, nitrosyl, nitryl, nitrate, nitrile, halide, azide, alkoxy, siloxy, silyl, and halogenated, sulfonated or silyated derivatives thereof, which is dissolved, emulsified or suspended in an inert liquid selected from the group consisting of aliphatic hydrocarbons, aromatic hydrocarbons, alcohols, ethers, aldehydes, ketones, acids, phenols, esters, amines, alkylnitrile, halogenated hydrocarbons, silyated hydrocarbons, thioethers, amines, cyanates, isocyanates, thiocyanates, silicone oils, nitroalkyl, alkylnitrate, and mixtures thereof. The precursor source mixture may be a solution, emulsion or suspension and may consist of a mixture of solid, liquid and gas phases which are distributed throughout the mixture.

Advantageous aqueous mixed salt systems viscosified with water-soluble or water-dispersable polymers which are superior to corresponding single salt systems of similar densities are provided. The mixed salt systems comprise water; a water-soluble or water-dispersable polymer capable of viscosifying an aqueous medium; one or more cations including a member selected from the group consisting of lithium, sodium, potassium, cesium, magnesium, calcium, zinc, or mixtures thereof; and one or more anions including a member selected from the group consisting of chloride, bromide, iodide, formate, nitrate, acetate, cyanate, thiocyanate, a zinc complex anion or mixtures thereof; there being present either at least two cations or at least two anions. Inventive viscosified mixed salt systems display-under such stressing factors as aging, heat, mechanical agitation, and shear-greater stability compared to the single salt systems of similar densities. Also provided are methods for making viscosified mixed salt systems and methods for advantageously using the same as drilling, drill-in, completion, hydraulic fracturing, work-over, packer, well treating, testing, spacer, or hole abandonment fluids.

The invention relates to an environment-friendly fiber framework material dip solution and a dipping process. The dip solution comprises, by weight parts, 3.3-190 parts of blocked isocyanate compound by dry weight, 6.6-140 parts of epoxy compound by dry weight, 80-100 parts of rubber latex by dry weight, 0.5-20 parts of rubber modifier by dry weight, and the balance water. The content of the dip solution is 5-25%, and a one-bath or double-bath dipping process is adopted to perform coating on a fiber framework material. The dip solution does not contain harmful substances such as resorcinol and formaldehyde and does not cause pollution to the environment, the dipping process is simple in steps and easy to operate, an organic fiber after dipping treatment is low in rigidity and facilitates postprocessing, and the dip solution has a good effect of being bonded to rubber and has a better dipping effect than conventional RFL.

A cyanate ester compound represented by the formula (1),

• • wherein Ar₂ represents a phenylene group, a naphthylene group or a biphenylene group, Ar₁ represents a naphthylene group or a biphenylene group when Ar₂ is a phenylene group, or Ar₁ represents a phenylene group, a naphthylene group or a biphenylene group when Ar₂ is a naphthylene group or a biphenylene group, R_x represents all substituents of Ar₁ each R_x is the same or different and represents hydrogen, an alkyl group or an aryl group, R_y represents all substituents of Ar₂, each R_y is the same or different and represents hydrogen, an alkyl group or an aryl group, and n is an integer of 1 to 50.

An electronic package assembly where a low profile integrated circuit chip package is soldered to an organic (e.g., epoxy resin) substrate, e.g., a printed circuit board or card, the projecting conductive leads of the integrated circuit chip package and the solder which substantially covers these leads (and respective conductors on the substrate) having been substantially covered with ultraviolet photocured encapsulant material (e.g., an epoxy resin or a cyanate with a photoinitiator and silica) to provide reinforcement for the solder-lead connections. The encapsulant material is dispensed about the solder and lead joints following solder reflow and solidification so as to substantially surround the solder and any portions of the leads not covered with solder.

A thermosetting resin composition has particular applications in three dimensional (3-D) printing. The thermosetting resin composition exhibits high performance and is characterized by a high temperature two stage cure resin composition. The thermosetting resin composition comprises cyanate esters and other high temperature resins, photo curable monomers, photo initiator, metal catalyst or ionic liquid catalyst. The thermosetting resin composition cures at room temperature to form 3-D objects and upon further post cure these objects exhibit high temperature properties enabling use at temperatures exceeding 150C.

The invention discloses a high-frequency thermosetting resin composition. The high-frequency thermosetting resin composition comprises the following components in part by weight: 10 to 60 parts of halogen-free epoxy resin, 15 to 70 parts of polyphenyl ether resin, and 5 to 60 parts of composite cyanate resin; an accelerator is 0.01 to 2 parts; and the composite cyanate resin comprises thiocyanate resin. The composition can realize halogen-free flame resistance, and does not influence the heat resistance and dielectric performance of a product; and a laminated sheet prepared from the composition has high peel strength and heat resistance of a copper foil and a low dielectric constant and low dielectric loss under the high-frequency condition.

The invention relates to an epoxy resin composition and a high-frequency circuit board manufactured thereby. The epoxy resin composition comprises the following solid components: (A) cyanate compound or prepolymer thereof, wherein the molecule of the cyanate compound contains at least two cyanato groups; (B) active ester; and (C) epoxy resin containing a naphthol structure; calculated in solid component in parts by weight, the total amount of the component (A), i.e. the cyanate compound containing at least two cyanato groups in the molecule thereof or the prepolymer thereof, and the component (B), i.e. active ester, is 10-70 parts by weight, and the amount of the component (C), i.e. epoxy resin containing naphthol structure, is 30-90 parts by weight, wherein the weight ratio of the component (A), i.e. the cyanate compound containing at least two cyanato groups in the molecule thereof or the prepolymer thereof, to the component (B), i.e. active ester, is (0.2-5):1. The high-frequency circuit board manufactured by using the epoxy resin composition of the invention comprises a plurality of layers of prepregs which are overlapped mutually, and copper foils which are compressed on the two sides respectively; and each of the plurality of layers of prepregs comprises a base material and the epoxy resin composition which is adhered to the base material through impregnation and drying.

The invention relates to an epoxy resin composition and a high frequency circuit board made of the same. The epoxy resin composition comprises the following solid components in part by weight: 10 to 70 parts of component (A) and component (B) and 30 to 90 parts of component (C), wherein the component (A) is a cyanate compound or prepolymer thereof, of which the molecules comprise at least two cyanatos; the component (B) is active ester; the component (C) is epoxy resin of which the molecular structure comprises at least one biphenyl structure; and the weight ratio of the component (A) to the component (B) is 0.2-5. The high-frequency circuit board made of the epoxy resin composition comprises a plurality of layers of semi-solidification sheets which are superimposed and copper foils which are covered on the two sides of the board respectively, wherein the plurality of layers of semi-solidification sheets comprise base materials and the epoxy resin composition which is subjected to soaking and drying and attached to the base materials.

A light-activatable polymer composition and polymer composite includes a polymer binder selected from epoxy resins, silica filled epoxy, bismaleimide resins, bismaleimide triazines, fluoropolymers, polyesters, polyphenylene oxide/polyphenylene ether resins, polybutadiene/polyisoprene crosslinkable resins (and copolymers), liquid crystal polymers, polyamides, cyanate esters, or combinations thereof, the polymer binder being present in an amount from 40, 45, 50, 55, 60, 65, 70, 75, 80, 85, 90, 95, 96, or 97 weight-percent of the total weight of the polymer composition; a spinel crystal filler present in an amount from 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 20, 25, 30, 35, 40, 45, 50, 55 and 60 weight-percent of the total weight of the polymer composition, and methods for making same are provided.

A curable mixture comprising at least one cyanate resin, at least one epoxide compound with more than one epoxy group per molecule, and a metal formula selected from the group consisting of MLxBy, M[SR]xBy, M[SR]x(N)y, M(PHal)m and M(PHal)m(N)n wherein M is a cation of a complexing metal, SR is an organic or inorganic acid residue, L is a chelating ligand, B is a Lewis base, PHal is an ion of a pseudohalide, N is a nitrogen base, x is an integer from 1 to 8, y is an integer from 1 to 5, z is an integer from 7 to 8, m is an integer from 2 to 3 and n is an integer from 1 to 2.

The present invention relates to thermosetting resin compositions which are suitably used for manufacturing circuit boards, such as flexible printed circuit boards (FPCs) and build-up circuit boards, and to multilayer bodies and circuit boards manufactured using such thermosetting resin compositions. A thermosetting resin composition contains a polyimide resin component (A), a phenol resin component (B), and an epoxy resin component (C). The mixing ratio by weight (A)/[(B)+(C)] is in a range of 0.4 to 2.0, the mixing ratio by weight being the ratio of the weight of the component (A) to the total weight of the component (B) and the component (C). By using such a thermosetting resin composition, it is possible to manufacture multilayer bodies and circuit boards which are excellent in dielectric characteristics, adhesiveness, processability, heat resistance, flowability, etc. A thermosetting resin composition contains a polyimide resin (A), a phosphazene compound (D), and a cyanate ester compound (E). The phosphazene compound (D) includes a phenolic hydroxyl group-containing phenoxyphosphazene compound (D-1) and/or a crosslinked phenoxyphosphazene compound (D-2) prepared by crosslinking the phenoxyphosphazene compound (D-1), the crosslinked phenoxyphosphazene compound (D-2) having at least one phenolic hydroxyl group. By using such a thermosetting resin composition, it is possible to manufacture multilayer bodies and circuit boards which are excellent in dielectric characteristics, processability, heat resistance, and flame retardance.

Disclosed is a resin composition for a PCB, the composition including: (a) a polyphenylene ether resin modified via a redistribution reaction of polyphenylene ether in the presence of 9,9-bis(hydroxyaryl)fluorene or 9,10-dihydro-9-oxa-10-(dihydroxyaryl)-10-phosphaphenanthrene 10-oxide; (b) a polymer binder; and (c) cyanate ester or a prepolymer of the cyanate ester, wherein, when the polyphenylene ether resin is modified via a redistribution reaction of the polyphenylene ether in the presence of 9,9-bis(hydroxyaryl)fluorene, the composition further includes (d) a flame retardant. Also, a composite substrate and a copper laminate using the same are disclosed.

The invention relates to a thermosetting resin composition, a prepreg prepared from the composition, and a laminated board prepared from the composition and used for a printed circuit board. The thermosetting resin composition comprises phosphorus-containing low molecular weight polyphenyl ether resin, epoxy resin, cyanate resin and an accelerator. The prepreg prepared from the resin composition comprises a base material and the thermosetting resin composition which is impregnated and dried and attached to the base material. The laminated board prepared from the resin composition and used for the printed circuit board comprises a plurality of superposed prepregs and metal foils laminated on one side or two sides of the superposed prepregs, wherein each prepreg comprises the base material and the thermosetting resin composition which is impregnated and dried and attached to the base material. The thermosetting resin composition has low dielectric constant and dielectric loss factor and high heat resistance, glass transition temperature, flame retardance and the like; and the laminated board prepared from the composition and used for the printed circuit board has high metal foil peeling strength, heat resistance and dielectric property and is suitable for a high-frequency high-speed electronic circuit board.

Disclosed is an epoxy resin composition essentially containing (A) an epoxy resin having a structure represented by the general formula (1), (B) a curing agent, (C) an inorganic filler and (D) a cyanate resin and/or a prepolymer thereof, wherein Ar represents a fused aromatic hydrocarbon group; r is an integer of 1 or more; X is a hydrogen or an epoxy group (glycidyl ether group); R₁ represents one selected from the group consisting of a hydrogen, a methyl group, an ethyl group, a propyl group, a butyl group, a phenyl group and a benzyl group; n is an integer of 1 or more; p and q are an integer of 1 or more; and p's and q's in respective repeating units may be the same as or different from one another.

A low-free radical TDI polyurethane curing agent, its production and product are disclosed. The process is carried out by putting tolylene-diisoester cyanate, solvent S and catalyst A into reactor, adding into antioxidant and long-chain alcohol, agitating in reactor, heating, keeping temperature, inspecting NCO value, adding into phase-transferring solvent X while reaching NCO value to 20-40%, adding into catalyst B till reaching NCO value to 10-15, adding into inhibitor to stop reaction, adding into solvent S, decreasing pressure, distilling and removing phase-transferring solvent X. It's cheap and convenient.

The invention discloses a fiber reinforced polyurethane modified polyisocyanurate composite material and a preparation method thereof. It is characterized in that it is composed of a fiber mat and a polyisocyanate-containing polyurethane composition poured on the fiber mat, foamed and cured. Among the components of the polyurethane composition, The weight of the polyurethane composite material includes 75%-96% of combined polyalcohol and 1%-3% of foaming agent. The invention adopts polyol as the main raw material and water as the foaming agent, so that the composite material has good fluidity while having excellent characteristics, and can be demolded quickly; the molecular hydroxyl number is between 2 and 4, Polyols with a hydroxyl value between 300 and 700 can reduce the viscosity of the composite material and improve fluidity. The use of small molecular polyols can reduce the viscosity of the composite material, improve fluidity, and increase the initial strength of the product, which can be quickly released from the mold. .

A polyurethane shape memory polymer material and its synthesis are disclosed. The process is carried out by vacuum dewatering, pre-polymerization reacting 2,4-toluene diiso-cyanate with DMF under N2 protection, dripping into polyhydric alcohol to obtain pre-polymer, chain-extending reacting DMPA with 1,4-BDO, neutralization reacting TEA with DMPA carboxyl, and adding water 300-1000 ml to obtain final product. The final solution concentration is 15-25 mol%. It has excellent waterproof, gas-permeation performances and moisture-penetrability.

The invention relates to a modified cyanate adhesive film and a preparation method thereof, belonging to the field of modified cyanate adhesive films and preparation methods thereof. The invention aims at solving the technical problems that the surface of the cyanate adhesive film prepared by using the existing cyanate adhesive film preparation method is apt to be crystallized during placing at room temperature, the mechanical performance is low and the curing temperature is high. The modified cyanate adhesive film is prepared by using the following components in parts by weight: 60-100 parts of cyanate resin, 5-40 parts of epoxy resin, 1-50 parts of toughened resin, 1-10 parts of activated thinner and 1-5 parts of accelerator. The preparation method comprises the following steps of: 1) weighing raw materials; 2) preparing matrix resin; 3) preparing adhesive; and 4) preparing the modified cyanate adhesive film. The modified cyanate adhesive film and the preparation method thereof are used in the fields of aerospace and electronic information.

One-part and two-part fixatives are provided in conjunction with underprinting or overcoating at least one ink printed on a print medium. The one-part fixative of the present invention comprises a polymer in a vehicle. The polymer is selected from the group consisting of vinyl-based polymers, condensation polymers, and copolymers thereof and the polymer has a glass transition temperature within a range of -50° C. to +100° C., a melting temperature within a range of 30° C. to 150° C., and a molecular weight (weight average basis) within a range of 3,000 to 100,000. The fixative is contained in a separate cartridge from the ink-jet ink print cartridge(s). The two-part fixative of the present invention comprises (1) a reactive monomer or oligomer in a vehicle, the reactive monomer or oligomer selected from the group consisting of iso-cyanates and epoxy-terminated oligomers, and (2) at least one second component selected from the group consisting of polyols, polyvinyl alcohols, and base catalysts. The reactive monomer or oligomer is contained in a separate cartridge from the ink-jet ink print cartridge(s), while the second component(s) is contained in at least one ink-jet ink print cartridge. The reactive monomer or oligomer reacts with the second component(s) on the print medium to form a polymer, which has a glass transition temperature within a range of -20° C. to +50° C. and a melting temperature within a range of 30° C. to 100° C. Enhancement of waterfastness, smearfastness, smudgefastness, and lightfastness is provided by use of the fixative solution of the present invention.

The invention relates to a modified cyanate resin and a preparation method thereof. Distilled water and Gamma-Methlacryloyl oxyl propyl trimethoxy silane are evenly mixed according to a mole ratio of 1.4:1 to 1.2:1; high concentration HCI is added to the solution until the PH value thereof is 1 to 2; after 10 to 15 minutes, the solution is heated up to 50 DEG C to 60 DEG C and reacts continuously for 4 hours to 6 hours; a hyperbranched polysiloxane with double bond as terminal group is obtained through vacuum drying. By weight, 1 portion to 25 portions of the hyperbranched polysiloxane and 100 portions of cyanate are evenly mixed at the temperature of 80 DEG C to 150 DEG C to obtain the modified cyanate resin. The resin has high tenacity, quick curing, more prominent thermal stability, more excellent electrical property and damp-heat resistance. The preparation method adopted is characterized by wide applicability and simple operation process.

A cyanate-bimaleimide resin adhesive and a preparation method belong to the adhesive field, solving the problems of poor heat resistance, low dielectric property and poor adhesive property of current high-temperature adhesives. The adhesive of the invention is prepared by a cyanate ester resin, a bismaleimide resin, an internally toughened phenolic resin, an epoxy resin and a catalyst. The preparation method is as follows: 1. carrying out pre-reaction on the epoxy resin and the internally toughened phenolic resin to obtain a prepolymer resin B; 2. carrying out pre-reaction on the cyanate, the bimaleimide and the catalyst to obtain a prepolymer C; 3. carrying out pre-reaction on the prepolymer C and the prepolymer B to prepare the adhesive of the invention. The prepared adhesive has reasonable formulation, good heat resistance, dielectric property, adhesive property and curing process property, can be used for adhesion of high-temperature resistance composite materials with high dielectric property and used as a matrix resin, and is simple in method and easy operation.