35 results about "Cyanate compound" patented technology

The problem of the present invention can be solved by an adhesive which contains a specific acrylic copolymer (A), an isocyanate compound (B), and a metal chelate (C), and which satisfies all of the following (1)-(3) after curing. (1) 3.0 * 10 < 4 > Pad; g '(-20) lt; 4.0 * 10 < 5 > Pa, (2) 5lt; g '(-20) / G' (200) lt; 17, (3) 2lt; tan delta (-20) / tan delta (200) lt; 6.5); wherein in the formula, G '(-20) refers to the storage modulus at-20 DEG C and 1 Hz, G' (200) refers to the storage modulus at 200 DEG C and 1 Hz, tan delta (-20) refers to the loss tangent at-20 DEG C and 1 Hz, and tan delta (200) refers to the loss tangent at 200 DEG C and 1 Hz.

The present invention relates to a method for preparing 2,4-disubstituted thiophene-3-sulfonyl isocyanate compounds having formula (I), wherein the method comprises reacting a compound having formula (II) with phosgene in the presence of a catalyst and a mixture of a nonpolar solvent and an organosulfur cosolvent, and optionally in the presence of a base.

The present invention provides a curable composition, a cured product, a prepreg, a circuit substrate, a build-up film, a semiconductor sealing material, and a semiconductor device. The present invention aims to provide a curable composition and a cured product thereof which exhibit a low dielectric loss tangent and a low moisture absorption rate upon curing. The present invention is a curable composition characterized by containing a polymaleimide compound (A) and a cyanate ester compound (B), the polymaleimide compound (A) containing a monocyclic or condensed polycyclic aromatic group to which two or more straight-chain or branched alkylene groups are attached.

Disclosed is a solventless adhesive composition comprising (A) an isocyanate component obtained by the reaction of reactants comprising at least one monomeric cycloaliphatic isocyanate compound and at least one first polyol; and (B) a polyol component comprising particularly selected polyols. The solventless adhesive composition can be used for the production of laminate materials, e.g. laminate backsheet of a photovoltaic device, which well meets the requirements of various compliance regulations and has superior performance properties such as bond strength, aging resistance, yellowing resistance, delamination resistance, and the like. A method for producing said laminate material and the resultant laminate material are also disclosed.

Provided is a method for producing a high-purity ethylenic isocyanate compound, in which (meth)acrylic anhydride is suppressed.　Provided is a method for producing a purified ethylenic isocyanate composition from a crude ethylenic isocyanate composition, wherein an alcohol is added to the crude ethylenic isocyanate composition, and the purified ethylenic isocyanate composition contains a (meth)acrylic acid ester compound which has an isocyanate group, and 0.2 mass% or less of an acid anhydride.　Also provided is an ethylenic isocyanate composition which contains an ethylenic isocyanate compound and 0.2 mass% or less of an acid anhydride.

The present invention provides a novel blocked isocyanate compound that can be produced at a high yield, a compound having a double bond that can be crosslinked at a low temperature (100°C or less) using the blocked isocyanate compound, and a resin obtained by curing the compound having a double bond. The present invention includes a compound having an isocyanate group (a1), a blocked isocyanate compound (A) obtained by urethane bonding of a compound having a hydroxyl group (a2) represented by the following formula (1) via the above isocyanate group and the above hydroxyl group. (In formula (1), R 1 and R 2 are each independently a hydrogen atom or a hydrocarbon group having 1 to 20 carbon atoms. R 3 and R 4 are each independently a hydrogen atom or a hydrocarbon group having 1 to 20 carbon atoms.)

To provide a printing ink composition for laminate capable of exhibiting good color developability and easy tearability without using a large amount of a curing agent.SOLUTION: A printing ink composition for laminate, comprising a titanium oxide pigment treated with silica and alumina, a binder resin, isophorone diisocyanate or an adduct thereof, which is a polyfunctional isocyanate compound, as a curing agent, and an organic solvent, wherein the binder resin is a polyurethane resin, a polyester diol accounts for 70 mass% or more of a polymer diol that is a raw material of the polyurethane resin, a solid content ratio of the polyurethane resin to the curing agent is 1:0.10 to 0.40, and the polyurethane resin (1) has one or more of a primary amino group to a tertiary amino group at a terminal, the printing ink composition for laminate has a hydroxyl group, or (2) has one or more of a primary amino group to a tertiary amino group at a terminal, or is a mixture of (1) and (2).SELECTED DRAWING: None

Provided is a composition capable of forming a cured product excelling in adhesion to a substrate, hardness, scratch resistance, and chemical resistance. The composition of the present disclosure contains a polyol compound (A) and an isocyanate compound (B). The polyol compound (A) includes a compound (a1) represented by Formula (1) below, where R1 to R3 each are a group represented by Formula (1a), the compound (a1) having a number average molecular weight (calibrated with polystyrene standard) of 800 or greater. The isocyanate compound (B) includes a polyisocyanate compound having an isocyanurate skeleton.

The present invention provides a polymer composition that exhibits high adhesion to a glass substrate and a glass laminate using the same. [Solution] The polymerizable composition of the present invention comprises a polythiol compound (A), an isocyanate compound (B), and an alkoxysilane compound (D) having one or more functional groups selected from the group consisting of a mercapto group, an isocyanate group, a ureido group, and an isocyanurate group.

The present invention provides a composition suitable for forming a patterned film layer using an inkjet printing process and possessing excellent storage stability, wherein the resulting cured layer maintains high chemical resistance, solder resistance, and adhesion while also exhibiting excellent fold resistance. [Solution] The composition comprises 100 parts by weight of a first monomer, 1 to 10 parts by weight of a second monomer, 10 to 30 parts by weight of a urethane acrylate, and 15 to 35 parts by weight of a blocked isocyanate compound. The first monomer is a monoacrylate compound, a monomethacrylate compound, a vinyl aromatic compound, an oxetane compound, maleic anhydride, dicyclopentadiene, N-vinylpyrrolidone, N-vinylformamide, or a combination of the above. The second monomer is an alcohol compound having at least two reactive functional groups, the reactive functional groups being acrylate groups or methacrylate groups.

The present invention relates to a method of preparing an isocyanate compound. According to the present invention, there is provided a method of preparing an isocyanate compound, which can improve energy efficiency while minimizing thermal denaturation of reaction products and formation of by-products in the process of preparing an isocyanate compound using phosgene.

The present application provides a resin composition and its application. The resin composition comprises 20-100 parts by weight of maleimide resin and / or maleimide prepolymer, 5-50 parts by weight of epoxy resin, 1-50 parts by weight of cyanate compound and 1-70 parts by weight of elastomer which is a mixture of reactive elastomer and non-reactive elastomer. Thus, the present application maintains excellent heat resistance, high modulus and low CTE, improves the brittleness of maleimide resin, increases the toughness, reduces the thermal expansion coefficient to reduce the warping defect, and makes the resin composition have high compatibility, high adhesion, low water absorption, unexpected comprehensive performance improvement and production process performance, and can be applied to IC packaging and high-speed high-frequency field, and has wide application prospect.

A molded packaging material (1) comprising: a heat-resistant resin layer (2) as an outer layer; a polypropylene layer (3) as an inner layer; and a metal foil layer (4) arranged between the heat-resistant resin layer (2) and the polypropylene layer (3), wherein at least one inner surface (4a) of the metal foil layer (4) is subjected to a chemical conversion treatment, and wherein the polypropylene layer (3) is laminated to the chemically converted surface of an inner surface of the metal foil layer (4) by means of an adhesive layer (5), wherein the adhesive layer (5) is formed by applying an adhesive to the chemically converted surface of the inner surface of the metal foil layer (4), wherein the adhesive comprises at least an organic solvent, a polyolefin resin with a carboxyl group, which is dissolved in the organic solvent and has an MFR of 5 g / 10 min to 42 g / 10 min, measured at 130 °C.has a melting point of 50 °C to 90 °C, and contains a multifunctional isocyanate compound, wherein the polypropylene layer (3) is formed as the inner layer from a copolymer resin which contains at least propylene and ethylene as a copolymerization component, has a melting point of 135 °C to 155 °C and has a melting point frustum (MFR) of 6 g / 10 min to 25 g / 10 min, measured at 230 °C, and wherein an equivalent ratio (NCO / OH) of the isocyanate group (NCO) in the multifunctional isocyanate compound and the hydroxyl group (OH), which constitutes the carboxyl group in the polyolefin resin, is 0.1 to 9.0.

The present invention relates to a method for preparing an isocyanate compound. According to the present invention, there is provided a method for preparing an isocyanate compound, which can recover and reuse materials used in the reaction in the process of preparing an isocyanate compound using phosgene, and can minimize thermal denaturation of a reaction product and formation of a by-product.

The invention belongs to the technical field of epoxy insulating materials, and particularly relates to a high-toughness and high-heat-resistance epoxy resin insulating material based on chain extension-cyanate compound modification and a preparation method of the high-toughness and high-heat-resistance epoxy resin insulating material. In the preparation method provided by the invention, the epoxy resin is subjected to chain extension by using the chain extender, and then the epoxy resin is mixed with the cyanate ester and the curing component for curing to obtain the epoxy resin insulating material; a high-flexibility cross-linked network constructed by chain extension modified epoxy resin is matched with a rigid triazine ring formed by curing cyanate ester, so that the comprehensive properties such as mechanical properties, thermal stability and electrical properties are synergistically improved; meanwhile, after the bisphenol type epoxy resin is subjected to chain extension modification, the curing heat release process is smoother in the curing process, the curing reaction kinetics is adjusted, and the structural defects are improved; the low-temperature gradient curing, the medium-temperature gradient curing and the high-temperature gradient curing are beneficial to construction of a more ordered and compact network structure; therefore, the technical problem of low comprehensive performance of an epoxy resin insulating material in the prior art is solved.

The cyanate ester compound according to the present invention has two or more cyanoxy groups in the molecule, and the content of a compound having one urethane group is 0.5 area% or less in terms of HPLC area fraction.

The present invention provides a resin composition, a resin sheet, a multilayer body, and a semiconductor element. The resin composition according to the present disclosure comprises a polyfunctional cyanate compound (A), a polyfunctional epoxy compound (B), and a thermally-conductive filler (C). The polyfunctional cyanate compound (A) contains a compound represented by formula (IS1) and / or a prepolymer of the compound represented by formula (IS1).

The present disclosure pertains to a dielectric film-forming composition comprising (a) at least one methyl (acrylate)-containing polyphenylene ether resin and (b) at least one second resin selected from the group consisting of: i) at least one fully imidized polyimide polymer; ii) at least one polyamic acid ester; iii) at least one cyclized polydiene resin; and iv) a mixture of a cyclized polydiene resin and a cyanate ester compound.

The content of a compound having a triazine ring in the cyanate ester compound having two or more cyanoxy groups in the molecule of the present invention is 4.0 area% or less in terms of HPLC area fraction.

A polymerizable composition containing a polyiso (thio) cyanate compound (A), an active hydrogen compound (B), a nitrogen-containing compound (C), and water, the nitrogen-containing compound (C) being a nitrogen-containing aromatic heterocyclic compound and / or a tertiary amine compound, and the water content being 1900 ppm by mass or less relative to the total amount of the polymerizable composition.

The present application aims to provide a polarizing plate in which the decrease in transmittance in a high-temperature environment is suppressed. According to the present application, a polarizing plate can be provided which has a polarizing element in which a dichroic dye is adsorbed and oriented in a polyvinyl alcohol-based resin layer, and a transparent protective film laminated to at least one face of the polarizing element, the polarizing element and the transparent protective film being bonded with an adhesive layer formed from an adhesive containing a blocked isocyanate compound, the water content of the polarizing element being equal to or higher than the equilibrium water content at a temperature of 20°C and a relative humidity of 30%, and equal to or lower than the equilibrium water content at a temperature of 20°C and a relative humidity of 50%.

The purpose of the present invention is to provide a cyanate ester compound having a low dielectric constant and a low dielectric loss tangent, and having excellent water absorption, a low thermal expansion coefficient, and a high glass transition temperature, and to also provide a resin composition, a cured product, a prepreg, a sealing material, a fiber-reinforced composite material, and an adhesive. The cyanate ester compound of the present invention has a structure represented by formula (1), and the number average molecular weight (Mn) in terms of standard polystyrene is 850-3,000 as measured by gel permeation chromatography.

Disclosed and claimed herein are optical fiber primary coating composition comprising one or more oligomers (a) which is the reaction product of a hydroxy- or thiol-functional backbone compound, an isocyanate compound, and a hydroxyl-functional end-capper; optionally one or more second oligomer (b); optionally one or more reactive diluent monomer; one or more photoinitiators; and optionally one or more additives. The oligomer is present in an amount of at least 0.01 wt. % relative to the entire coating composition, and it possesses a molar ratio of isocyanate groups to hydroxyl- or thiol groups of less than or equal to 1.0. The total amount of (a)+(b) is between 70 wt. % and 99 wt. %. Also disclosed are methods of coating optical fibers incorporating the compositions described herein, along with the coated optical fibers and cables produced therefrom.

Provided is a resin composition comprises a cyanate ester compound (A), an amine adduct compound (B) and a borate ester (C).

The invention relates to the technical field of chemical synthesis, and discloses a preparation method and application of a pyrimidine derivative. The preparation method of the pyrimidine derivative comprises the following steps: in a solvent I, contacting a polychloro-substituted pyrimidine compound, a cyanate compound and a phase transfer catalyst, and carrying out a reaction I to obtain the pyrimidine derivative, according to the application of the pyrimidine derivative, boscalid is synthesized by adopting the prepared pyrimidine derivative as a catalyst, 2-chloronicotinic acid can directly react with parachloroaminobiphenyl to generate boscalid, and the acyl chloride synthesis step is omitted.

The present disclosure provides a method for obtaining a cured body of a resin containing an epoxy compound and an aromatic vinyl group as a functional group, an epoxy resin-based composition having improved low dielectric properties, a cured body thereof, an electrical insulating material, and the like. The present disclosure provides a composition comprising an epoxy compound, a resin having an aromatic vinyl group as a functional group, and an active vinyl compound, a cured body thereof, and an electrical insulating material. The resin having an aromatic vinyl group as a functional group is preferably an olefin-aromatic vinyl compound-aromatic polyene copolymer. The active vinyl compound is preferably one or more compounds selected from the group consisting of maleimide compounds and cyanate ester compounds.

The present disclosure pertains to a dielectric film-forming composition comprising: (a) at least one resin selected from the group consisting of: i) a fully imidized polyimide polymer; ii) a polyamic acid ester; iii) a cyclized polydiene resin; and iv) a mixture of a cyclized polydiene resin and a cyanate ester compound; and (b) at least one additive selected from the group consisting of: i) a polybenzoxazole (PBO) precursor; ii) a PBO particle; iii) a mixture of PBO and silica particles; and iv) a PBO resin containing at least two reactive functional groups.

This photocurable composition contains a photobase generator (a), a polyiso(thio)cyanate compound (b), a polythiol compound (c), and a di(meth)acrylate compound (d), wherein the photobase generator (a) contains at least one compound selected from the group consisting of compounds represented by formula (1) to formula (5). R1 to R11 are substituents, and n is an integer of 1 to 3.

The present disclosure generally relates to a dispersant obtained from the reaction of a liquid isocyanate compound and a polyoxyalkylene amine and its use in dispersing various particulate solids in an aqueous or organic medium.

To provide a cyanate ester compound, a resin composition, a cured product, a prepreg, a sealing material, a fiber-reinforced composite material, and an adhesive, having a low dielectric constant and a low dielectric loss tangent, and having excellent water absorbency, a low thermal expansion coefficient, and a high glass transition temperature.SOLUTION: The cyanate ester compound of the present invention has a structure represented by the following formula (1), and has a number average molecular weight (Mn) of 850 or more and 3000 or less in terms of standard polystyrene measured by gel permeation chromatography.SELECTED DRAWING: None