976 results about "Phosphazene" patented technology

This disclosure encompasses a bioprosthetic heart valve having a polyphosphazene polymer such as poly[bis(trifluoroethoxy)phosphazene], which exhibits improved antithrombogenic, biocompatibility, and hemocompatibility properties. A method of manufacturing a bioprosthetic heart valve having a polyphosphazene polymer is also described.

A lubricant for a magnetic disk that is excellent in heat resistance and is suitably used in a magnetic disk to be mounted on a magnetic recording device of a thermally assisted magnetic recording system and a magnetic disk provided with a lubricant layer containing this lubricant. The lubricant for a magnetic disk contains a compound where perfluoropolyether groups each having a perfluoropolyether main chain in its structure and a phosphazene ring at an end are linked to each other through a linking group. The linking group is an aliphatic group or a phosphazene ring. In a magnetic disk having at least a magnetic recording layer, a protective layer, and a lubricant layer on a substrate, the lubricant layer contains the lubricant for a magnetic disk.

The present invention relates to a poly(organophosphazene)-bioactive molecule conjugates in which biodegradable and thermosensitive poly(organophosphazene) with a functional group showing the sol-gel phase transition with change of temperature is combined with various bioactive molecules, such as drugs, a preparation method thereof, and a use thereof for delivery of bioactive molecules.

a biocompatible and biodegradable implant for a cavity in a bone of a living organism is made of a biocompatible and biodegradable granules which are selected from the group including biopolymers, bioglasses, bioceramics preferably calcium sulfate, calcium phosphate such as monocalcium phosphate monohydrate, monocalcium phosphate anhydrous, dicalcium phosphate dihydrate, dicalcium phosphate anhydrous, tetracalcium phosphate, calcium orthophosphate phosphate, α-tricalcium phosphate, β-tricalcium phosphate, apatite such as hydroxyapatite, or a mixture thereof. The biocompatible and biodegradable granules are provided with a coating, which comprises at least one layer of a biocompatible and biodegradable polymer which is selected from the group including poly((α-hydroxyesters), poly(orthoesters), polyanhydrides, poly(phosphazenes), poly(propylene fumarate), poly(ester amides), poly(ethylene fumarate), polylactide, polyglycolide, polycaprolactone, poly(glycolide-co-trimethylene carbonate), polydioxanone, co-polymers thereof and blends of those polymers. The biocompatible and biodegradable implants are obtained by fusing together the polymer-coated granules through polymer-linkage of the polymer coatings of neighboring granules.

The present invention relates to a poly(organophosphazene)-superparamagnetic nanoparticle complex including a biodegradable and thermosensitive poly(organophosphazene) and a iron oxide (Fe3O4, Magnetite)-series ferrite superparamagnetic nanoparticle, a preparation method, and uses of carrying a physiologically-active material, a bio-material and a biomaterial for cancer hyperthermia. The iron oxide is used as a MRI contrast agent for T-2 and T2* weighted image, and the poly(organophosphazene) shows a sol-to-gel behavior depending upon the temperature change. The complex is a bound-type where the superparamagnetic ferrite nanoparticle is bonded to phosphazene-based polymer via hydrophobic binding, and a mixed-type where the superparamagnetic ferrite nanoparticle is physically mixed with the phosphazene-based polymer.

The present invention provides an additive for a non-aqueous electrolyte comprising a phosphazene derivative represented by the following formula (1): (PNR2)n formula (1) wherein R represents a fluorine-containing substituent or fluorine, at least one of all R's is a fluorine-containing substituent, and n represents 3 to 14. More particularly, the present invention provides a non-aqueous electrolyte secondary cell and a non-aqueous electrolyte electric double layer capacitor comprising the additive for a non-aqueous electrolyte which exhibit good low temperature characteristics, good resistance to deterioration, and good incombustibility, and accordingly are significantly high in safety.

Particles are provided for use in therapeutic and / or diagnostic procedures. The particles include poly[bis(trifluoroethoxy) phosphazene] and / or a derivatives thereof which may be present throughout the particles or within an outer coating of the particles. The particles can also include a core having a hydrogel formed from an acrylic-based polymer. Barium sulfate may also be provided to the core of the particles as a coating or absorbed within the core of the particles. The particles can be used to minimize blood flow to mammalian tissues by occluding at least a portion of a blood vessel of the mammal, or to deliver an active agent to a localized area within a body of a mammal by contacting a localized area with at least one of the particles. Further, the particles are useful in sustained release formulations including active agent(s) for oral administration, as tracer particles for injection into the bloodstream of a mammal or for use in enhanced ultrasound imaging. The particles may include agents for increasing density for achieving useful buoyancy levels in suspension.

The halogen-free resin composition comprises (A)100 parts by weight of cyanate ester resin; (B) 5 to 50 parts by weight of styrene-maleic anhydride; (C) 5 to 100 parts by weight of polyphenylene oxide resin; (D) 5 to 100 parts by weight of maleimide; (E) 10 to 150 parts by weight of phosphazene; and (F) 10 to 1000 parts by weight of inorganic filler. By using specific components at specific proportions, the halogen-free resin composition of the invention offers the features of low dielectric constant, low dissipation factor, high heat resistance and high flame retardancy, and can be made into prepreg or resin film, and thereby used in copper clad laminate or printed circuit board.

The present invention relates to a thermosensitive phosphazene-based polymer having a degradation controllable ionic group, a use thereof, and a use thereof as a material for delivering bioactive substances. The phosphazene-based polymer according to the present invention has the thermosensitivity of showing the temperature-dependent sol-gel phase transition. Thus, it forms a gel phase at the body temperature when it is injected into the body to make it easy to control the release of bioactive substances such as drugs, and has the functional groups capable of making chemical bonds such as ionic bond, covalent bond, coordinate bond, etc. with drugs and thus is excellent in bearing the drugs. Since it can control the degradation rate depending on the kind of ionic group, it can selectively control the release time depending on the characteristics of drugs. Furthermore, it has an excellent biocompatibility and thus is very useful as a material for delivery of bioactive substances such as drugs, etc.

Articles and methods for the use of such articles are described for use in immobilizing nucleophile-containing materials. In one aspect, the invention provides an article comprising: a substrate having a first surface and a second surface; and a phosphonitrilic tethering group affixed to the first surface of the substrate, the phosphonitrilic tethering group comprising a reaction product of a complementary functional group on the first surface of the substrate with a phosphonitrilic tethering compound. A method of immobilizing a nucleophile-containing material to a substrate is also described, the method comprising: providing a phosphonitrilic tethering compound; providing a substrate having a complementary functional group capable of reacting with phosphonitrilic tethering compound; preparing a substrate-attached phosphonitrilic tethering group by reacting the phosphonitrilic tethering compound with the complementary functional group on the substrate resulting in an ionic bond, covalent bond, or combinations thereof; and reacting the substrate-attached phosphonitrilic tethering group with a nucleophile-containing material to immobilize the nucleophile-containing material.

Disclosed is a flame-retardant polyamide composition which has excellent mechanical properties such as toughness, excellent heat resistance and flow ability during reflow soldering, and good thermal stability during molding, without using a halogen flame-retardant. This flame-retardant polyamide composition exhibits stable flame retardance particularly when a thin article is molded. Specifically disclosed is a flame-retardant polyamide composition containing 20-80% by mass of a specific polyamide resin (A), 5-30% by mass of a phosphinate compound (B), and 0.01-10% by mass of a phosphazene compound (C).

Provided are a carbon fiber reinforced composite material which exhibits excellent flame retardance, fast curing properties, heat resistance, and mechanical characteristics. Also provided are an epoxy resin composition suitable for use in producing said carbon fiber reinforced composite material as well as a prepreg and housing for electronic / electrical components. The epoxy resin composition is characterized by comprising: [A] an epoxy resin containing at least 50 mass % of a compound as represented by general formula (I), [B] an organic nitrogen compound based curing agent, [C] a phosphoric acid ester, and [D] a phosphazene compound. In general formula (I), R1, R2, and R3 are either a hydrogen atom or a methyl group, and n is an integer of 1 or higher.

A phosphazene compound, which can effectively enhance flame retardancy without deteriorating mechanical properties of a resin molded product, and is also less likely to deteriorate thermal reliability and dielectric properties, is represented by the formula (1) shown below. n represents an integer of 3 to 15.wherein A represents a group selected from the group consisting of an alkoxy group, an aryloxy group and a group having a cyanato group, and at least one is a group having a cyanato group, and an example of A is a cyanatophenyl-substituted phenyloxy group represented by the formula (4) shown below, and Y in the formula (4) represents O, S, SO2, CH2, CHCH3, C(CH3)2, C(CF3)2, C(CH3)CH2CH3 or CO.

The invention discloses a method for manufacturing a compound base copper-clad laminate, which comprises the following steps of: rubberizing a glass fiber cloth through a first maceration extract, and drying prepregs to manufacture surface prepregs; rubberizing wood pulp paper through a second maceration extract, and drying core prepregs; and cutting more than two of the core prepregs to superpose the core prepregs together, superposing the surface prepregs on two sides respectively, then superposing a copper foil on a single surface or two surfaces, and performing hot press molding to obtain the compound base copper-clad laminate. The method for manufacturing the compound base copper-clad laminate can reduce the water absorbability of the laminate and prevent plate explosion by using the first maceration extract and the second maceration extract to perform optimization and using a phosphazene compound flame retardant to replace part of phosphorus-containing epoxy resin or phosphate, and the prepared compound base copper-clad laminate has the advantages of small content of chlorine and bromine, low water absorption, good dip soldering resistance, improved electrical property, high flame retardance capable of reaching the level of UL94V-0, and increased tenacity.

This invention relates to a non-aqueous electrolyte exhibiting a non-combustibility even under a condition having a higher oxygen concentration, and more particularly to a non-aqueous electrolyte characterized by comprising a non-aqueous solvent containing a cyclic phosphazene compound represented by the following general formula (I):(NPR12)n  (I)[wherein R1s are independently a halogen element or a monovalent substituent; and n is 3-4] and a fluorophosphate compound represented by the following general formula (II):[wherein R2s are independently a halogen element, an alkoxy group or an aryloxy group, and at least one of the two R2s is the alkoxy group or the aryloxy group], and a support salt.

The phenoxyphosphazene compound of the present invention is prepared by treating a phenoxyphosphazene compound with (a) at least one adsorbent selected from activated carbon, silica gel, activated alumina, activated clay, synthetic zeolite and macromolecular adsorbents, (b) at least one reagent selected from metal hydrides, hydrazine, hypochlorites, thiosulfates, dialkyl sulfuric acids, ortho esters, diazoalkanes, lactones, alkanesultones, epoxy compounds and hydrogen peroxide or (c) both the adsorbent and reagent. Incorporation of the phenoxyphosphazene compound prepared by the process of the invention into a synthetic resin achives the following advantages: the synthetic resin can be prevented from discoloration; when the resultant resin composition is stored for a long time, the properties of the synthetic resin, such as heat resistance, weatherability, resistance to discoloration and chemical resistance are not deteriorated; and the resin composition gives a resin composition molded article excellent in properties such as flame retardancy, thermal stability, and moldability.

The present invention relates to thermosetting resin compositions which are suitably used for manufacturing circuit boards, such as flexible printed circuit boards (FPCs) and build-up circuit boards, and to multilayer bodies and circuit boards manufactured using such thermosetting resin compositions. A thermosetting resin composition contains a polyimide resin component (A), a phenol resin component (B), and an epoxy resin component (C). The mixing ratio by weight (A) / [(B)+(C)] is in a range of 0.4 to 2.0, the mixing ratio by weight being the ratio of the weight of the component (A) to the total weight of the component (B) and the component (C). By using such a thermosetting resin composition, it is possible to manufacture multilayer bodies and circuit boards which are excellent in dielectric characteristics, adhesiveness, processability, heat resistance, flowability, etc. A thermosetting resin composition contains a polyimide resin (A), a phosphazene compound (D), and a cyanate ester compound (E). The phosphazene compound (D) includes a phenolic hydroxyl group-containing phenoxyphosphazene compound (D-1) and / or a crosslinked phenoxyphosphazene compound (D-2) prepared by crosslinking the phenoxyphosphazene compound (D-1), the crosslinked phenoxyphosphazene compound (D-2) having at least one phenolic hydroxyl group. By using such a thermosetting resin composition, it is possible to manufacture multilayer bodies and circuit boards which are excellent in dielectric characteristics, processability, heat resistance, and flame retardance.

The present disclosure relates to an electrolyte for a lithium secondary battery capable of improving safety and reliability of the lithium secondary battery and a lithium secondary battery comprising the electrolyte. The electrolyte for a lithium secondary battery of the present embodiments comprises a non-aqueous organic solvent, a lithium salt, flame retarding materials of fluoroalkyl ether and phosphazene, and a solvent comprising at least one ester.

The invention relates to an oxa-phosphaphenanthrene flame retardant containing cyclotriphosphonitrile structure, and a preparation method and application thereof. The preparation method comprises the following steps: under the actions of K2CO3 and acetone, reacting hexachlorocyclotriphosphonitrile and 2,2'-diphenyldiphenol to obtain an intermediate I, reacting the intermediate I with p-hydroxybenzaldehyde to obtain an intermediate II, and reacting the intermediate II and DOPO (9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide) to obtain the target compound. The appearance of the compound is white, and the melting point is 186-188 DEG C; and the product has the advantages of favorable thermal stability, high flame retardancy and high purity (up to 99%). The invention has the advantages ofaccessible raw materials and advanced technique, and can easily implement industrial production. The flame retardant can be used as a reactive flame retardant to be connected to epoxy resin, polyurethane and other thermosetting resins, and can also be used as an additive flame retardant for halogen-free flame retardancy of ABS (acrylonitrile-butadiene-styrene), nylon and other engineering plastics with high heat resistance requirements.

The present invention relates to a flame retardant polycarbonate thermoplastic resin composition that comprises a polycarbonate resin, a rubber modified vinyl-grafted copolymer, a phosphorous mixture of a cyclic phosphazene oligomer compound and a phosphate ester morpholide compound as a flame retardant, and a fluorinated polyolefin resin, which has good flame retardancy, heat resistance, mechanical strength, impact strength, heat stability, processability, and appearance.

A release coating composition according to the present invention comprises an alkenyl functional polysiloxane (1), a silicon hydride functional polysiloxane (11) and a catalyst (111) comprising a platinum group metal. The alkenyl functional polysiloxane (1) is an alkenylterminated polysiloxane prepared by siloxane polycondensation and / or equilibration using a phosphazene base catalyst followed by neutralisation with an acidic neutralising agent. The level of catalyst (III) in the composition can be as low as 2-40 parts per million platinum group metal by weight.

A flame retardant resin composition comprising a specified metal oxide and / or trivalent phosphorus compound (A) and a specified phosphazene compound (B) together with an aromatic resin (C) added according to necessity. This flame retardant composition when mixed into resins, can provide resin compositions excelling in flame resistance, low smoke emission, heat resistance, moisture absorption resistance, dielectric performance, extrudability, mold release, thermal stability, mechanical properties, etc.

The halogen-free resin composition comprises (A) 100 parts by weight of cyanate ester resin; (B) 5 to 50 parts by weight of styrene-maleic anhydride; (C) 5 to 100 parts by weight of polyphenylene oxide resin; (D) 10 to 150 parts by weight of phosphazene; and (E) 10 to 1000 parts by weight of inorganic filler. By using specific components at specific proportions, the halogen-free resin composition offers the features of low dielectric constant, low dissipation factor, high heat resistance and high flame retardancy, and can be made into prepreg or resin film, and thereby used in copper clad laminate or printed circuit board.

The nonaqueous solvent for a nonaqueous secondary battery of the present invention includes: a fluorinated cyclic carbonate having at least one fluorine in each designated location in the molecule; and a fluorinated phosphazene having at least one fluorine bound to a phosphorus atom in the phosphazene molecule and a ratio of the number of fluorine atoms to the number of phosphorus atoms being 4 / 3 or more. The fluorinated cyclic carbonate forms a good protective coat by reductive decomposition at a negative electrode, thereby improving cycle characteristics of the nonaqueous secondary battery. The fluorinated phosphazene suppresses generation of organic ions in the nonaqueous solvent, thereby reducing gas production in the nonaqueous secondary battery.

The invention relates to highly cross-linked polyphosphazene hollow microspheres as well as a preparation method thereof, belonging to the technical field of organic micro-nanometer materials. The preparation method comprises the following steps: dissolving 4, 4-disulfydryl dithiophenol, phosphonitrilic chloride trimer and an acid-binding agent in an organic solvent for reaction; and after reaction, carrying out centrifugal separation on a solid product and washing and drying the solid product to obtain the polyphosphazene hollow microspheres. The highly cross-linked polyphosphazene hollow microspheres provided by the invention are prepared by a one-pot method by means of self-assembly of the reactant to a reactive template while a cross-linking agent is introduced, so that the whole preparation method is convenient and concise to implement.

Epoxy resin compositions comprising (A) an epoxy resin, (B) a phenolic resin curing agent, (C) an inorganic filler, (D) a rare earth oxide, and optionally (E) a phosphazene compound cure into products having improved heat resistance and moisture-proof reliability and are best suited for the encapsulation of semiconductor devices.

This invention described the preparation of a series of compounds selected from the group comprising tris(1,1,1,3,3,3-hexafluoro-iso-propyl)phosphate, tris(perfluoroethyl)phosphate, tris(perfluoro-iso-propyl)phosphate, bis(1,1,1-trifluoroethyl)fluorophosphate, tris(1,1,1-trifluoroethyl)phosphate, hexakis(1,1,1-trifluoroethoxy)phosphazene, tris(1,1,1-trifluoroethoxy)trifluorophosphazene, hexakis(perfluoro-t-butyl)phosphazene and tris(perfluoro-t-butyl)phosphate. These compounds may be used as co-solvents, solutes or additives in non-aqueous electrolytes in various electrochemical devices. The inclusion of these compounds in electrolyte systems can enable rechargeable chemistries at high voltages that are otherwise impossible with state-of-the-art electrolyte technologies. These compounds are chosen because of their beneficial effect on the interphasial chemistries formed at high potentials, such as 5.0 V class cathodes for new Li ion chemistries. These compounds may be used in Li ion battery technology and in any electrochemical device that employs non-aqueous electrolytes for the benefit of high energy density resultant from high operating voltages.

A phosphazene compound of the formula (1) or (5) which has an arrangement such that perfluoroxyalkylene units selected from --CF.sub.2O-- and --CF.sub.2CF.sub.2O-- are randomly distributed, the compound having a functional terminal group A or group G A--OCH.sub.2CF.sub.2O(CF.sub.2CF.sub.2O)p(CF.sub.2O)qCF.sub.2CH.sub.2O--A (1) G--[OCH.sub.2CF.sub.2O(CF.sub.2CF.sub.2O)p(CF.sub.2O)qCF.sub.2CH.sub.2OH].- sub.6-z (5) wherein A is a group of the formula (a) and G is a group of the formula (g) shown in the specification, and a lubricant containing at least one of the phosphazene compounds of the formulas (1) and (5).

A halogen-free resin composition includes (A) 100 parts by weight of polyphenylene oxide resin; (B) 10 to 50 parts by weight of maleimide resin; (C) 5 to 100 parts by weight of polybutadiene copolymer; (D) 5 to 30 parts by weight of cyanate ester resin; and (E) 15 to 150 parts by weight of phosphazene. The halogen-free resin composition is characterized by specific ingredients and proportions thereof to achieve circuit board laminate properties, such as a high glass transition temperature, low coefficient of thermal expansion, low dielectric properties, heat resistance, flame retardation, and being halogen-free, and thus is applicable to the manufacturing of a prepreg or resin film, thereby being applicable to the manufacturing of metal laminates and printed circuit boards.

The present invention relates to a flame retardant polycarbonate thermoplastic resin composition that comprises a polycarbonate resin, a rubber modified vinyl-grafted copolymer, a phosphorous mixture of a cyclic phosphazene oligomer compound and a phosphoric acid ester as a flame retardant, and a fluorinated polyolefin resin.