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952 results about "Phosphazene" patented technology

Phosphazenes are a class of chemical compounds in which a phosphorus atom is covalently linked to a nitrogen atom by a double bond and to three other atoms or radicals by single bonds. While other substitutions produce relatively persistent compounds, in organic synthesis the term largely refers to species with three amino substituents bound to phosphorus. The compounds are unusually stable examples of the phosphorane class of molecules and have a remarkable proton affinity. As such, they are one of the eminent examples of neutral, organic superbases. Two examples are hexachlorocyclotriphosphazene and bis(triphenylphosphine)iminium chloride. Phosphazenes are also known as iminophosphoranes and phosphine imides.

Thermosetting resin composition, multilayer body using same, and circuit board

The present invention relates to thermosetting resin compositions which are suitably used for manufacturing circuit boards, such as flexible printed circuit boards (FPCs) and build-up circuit boards, and to multilayer bodies and circuit boards manufactured using such thermosetting resin compositions. A thermosetting resin composition contains a polyimide resin component (A), a phenol resin component (B), and an epoxy resin component (C). The mixing ratio by weight (A)/[(B)+(C)] is in a range of 0.4 to 2.0, the mixing ratio by weight being the ratio of the weight of the component (A) to the total weight of the component (B) and the component (C). By using such a thermosetting resin composition, it is possible to manufacture multilayer bodies and circuit boards which are excellent in dielectric characteristics, adhesiveness, processability, heat resistance, flowability, etc. A thermosetting resin composition contains a polyimide resin (A), a phosphazene compound (D), and a cyanate ester compound (E). The phosphazene compound (D) includes a phenolic hydroxyl group-containing phenoxyphosphazene compound (D-1) and/or a crosslinked phenoxyphosphazene compound (D-2) prepared by crosslinking the phenoxyphosphazene compound (D-1), the crosslinked phenoxyphosphazene compound (D-2) having at least one phenolic hydroxyl group. By using such a thermosetting resin composition, it is possible to manufacture multilayer bodies and circuit boards which are excellent in dielectric characteristics, processability, heat resistance, and flame retardance.
Owner:KANEKA CORP

Oxa-phosphaphenanthrene flame retardant containing cyclotriphosphonitrile structure, and preparation method and application thereof

The invention relates to an oxa-phosphaphenanthrene flame retardant containing cyclotriphosphonitrile structure, and a preparation method and application thereof. The preparation method comprises the following steps: under the actions of K2CO3 and acetone, reacting hexachlorocyclotriphosphonitrile and 2,2'-diphenyldiphenol to obtain an intermediate I, reacting the intermediate I with p-hydroxybenzaldehyde to obtain an intermediate II, and reacting the intermediate II and DOPO (9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide) to obtain the target compound. The appearance of the compound is white, and the melting point is 186-188 DEG C; and the product has the advantages of favorable thermal stability, high flame retardancy and high purity (up to 99%). The invention has the advantages ofaccessible raw materials and advanced technique, and can easily implement industrial production. The flame retardant can be used as a reactive flame retardant to be connected to epoxy resin, polyurethane and other thermosetting resins, and can also be used as an additive flame retardant for halogen-free flame retardancy of ABS (acrylonitrile-butadiene-styrene), nylon and other engineering plastics with high heat resistance requirements.
Owner:HUBEI YAOMEI FLEXIBLE CERAMICS
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