The invention discloses a composite filler, an interlayer prepreg, a
copper-clad plate and a preparation method and application of the
copper-clad plate, and belongs to the technical field of
copper-clad plates. The preparation method of the composite filler comprises the following steps: dispersing
hexagonal boron nitride nanosheets in a
Piranha solution for reaction to obtain surface hydroxylated BNNS; the preparation method comprises the following steps: dispersing Ni-Zn
ferrite nanoparticles in
nitric acid, and carrying out ultrasonic treatment to obtain activated Ni-Zn ferrite; and carrying out electrostatic self-
assembly on the activated Ni-Zn ferrite and the surface hydroxylated BNNS. The Ni-Zn ferrite is a low-magnetic material, so that the
dielectric constant and
dielectric loss of the copper-clad plate can be reduced, and the copper-clad plate can have relatively
high heat conductivity coefficient and relatively low
dielectric constant and
dielectric loss. The composite filler can form
boron nitride nanosheets which are vertically arranged under the condition of a vertical
magnetic field, and heat can be quickly transferred to the outside of the surface from the inside of the copper-clad plate, so that the heat is transferred to the external environment, and the problem of heat accumulation of the copper-clad plate is solved.