Preparation method of carbon nanotube composite wave-absorbing material

Abstract

The invention discloses a preparation method of a carbon nanotube composite wave-absorbing material. The method comprises the following steps of: (1) preparing ferrite Dy0.4Ni0.4Fe2O4; (2) pretreatingcarbon nanotubes; (3) respectively adding the ferrite Dy0.4Ni0.4Fe2O4 particles and the pretreated carbon nanotubes into an ethylene glycol solution, then adding a surfactant, fully stirring, addingan ammonium persulfate solution, carrying out a hydrothermal reaction for 3-5 hours, then centrifuging, washing with deionized water to be neutral, and drying to obtain the Dy0.4Ni0.4Fe2O4 / CNTs composite wave-absorbing material. Impure carbon is removed through ultrasonic oscillation of the carbon nanotubes in mixed acid; and the ferrite nanoparticles and the pretreated carbon nanotubes are addedinto the ethylene glycol solution to realize particle dispersion, and the surfactant CTAB / CTAC is added to better disperse the ferrite nanoparticles and the pretreated carbon nanotubes in an ethyleneglycol system, so that bonding agglomeration among the particles is avoided. According to the invention, the ferrite Dy0.4Ni0.4Fe2O4 is used for coating the carbon nanotubes, so that the novel Dy0.4Ni0.4Fe2O4 / CNTs composite wave-absorbing material is prepared.

Description

technical field

[0001] The invention belongs to the technical field of carbon nanotubes, and in particular relates to a preparation method of a carbon nanotube composite wave-absorbing material. Background technique

[0002] At present, with the rapid development of electronic technology, electronic, electrical equipment or other information systems have been more and more widely used in various fields of people's daily production and life. The wide application and development of electronic equipment, while bringing great convenience to people's lives, its electromagnetic radiation has also had a great impact on human health and the environment on which we live. With the development of electronic products in the direction of high frequency, high integration and miniaturization, the electromagnetic compatibility and electromagnetic interference problems of electronic products are becoming more and more prominent, so higher requirements are put forward for the electromagnetic ...