Compound base copper-clad laminate and manufacturing method thereof

A manufacturing method and technology of copper foil layer, applied in the directions of lamination, lamination device, lamination auxiliary operation, etc., can solve the problems of complex production process of phosphorus-containing epoxy resin, layered copper clad laminate, high cost, and achieve electrical performance. The effect of improved, good dip solder resistance and low water absorption

Active Publication Date: 2010-06-23
建滔积层板(昆山)有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the production process of phosphorus-containing epoxy resin is complicated and the cost is high. Its molecular structure contains a phosphate bond structure. The hydrolysis of the

Method used

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  • Compound base copper-clad laminate and manufacturing method thereof
  • Compound base copper-clad laminate and manufacturing method thereof
  • Compound base copper-clad laminate and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～3

[0063] Surface prepregs were prepared according to the formulation and process conditions of the first immersion solution shown in Table 1. The glass fiber cloth adopts 7628 type glass fiber cloth.

[0064] Table 1

[0065]

[0066] The core prepreg was prepared according to the formulation and process conditions of the second dipping solution shown in Table 2. The paper used is quantitatively 128g / m 2 (grams per square meter) of bleached wood pulp paper.

[0067] Table 2

[0068]

[0069] Electrolytic copper foil matching board with a specification of 10Z for one side and 2 surface prepregs and 6 core prepregs in the middle (3 types of surface prepregs are combined with three core prepregs, a total of 9 types of sheet material stacking specifications), after vacuum The press is hot-pressed and solidified to prepare a halogen-free CEM-1 composite-based copper-clad laminate with a thickness of 1.6 mm. Its structure is as follows figure 1 as shown, figure 1 It is a s...

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PUM

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Abstract

The invention discloses a method for manufacturing a compound base copper-clad laminate, which comprises the following steps of: rubberizing a glass fiber cloth through a first maceration extract, and drying prepregs to manufacture surface prepregs; rubberizing wood pulp paper through a second maceration extract, and drying core prepregs; and cutting more than two of the core prepregs to superpose the core prepregs together, superposing the surface prepregs on two sides respectively, then superposing a copper foil on a single surface or two surfaces, and performing hot press molding to obtain the compound base copper-clad laminate. The method for manufacturing the compound base copper-clad laminate can reduce the water absorbability of the laminate and prevent plate explosion by using the first maceration extract and the second maceration extract to perform optimization and using a phosphazene compound flame retardant to replace part of phosphorus-containing epoxy resin or phosphate, and the prepared compound base copper-clad laminate has the advantages of small content of chlorine and bromine, low water absorption, good dip soldering resistance, improved electrical property, high flame retardance capable of reaching the level of UL94V-0, and increased tenacity.

Description

technical field [0001] The invention relates to a composite base copper-clad laminate and a manufacturing method thereof. The composite base copper-clad laminate is used for a printed circuit board. Background technique [0002] Printed circuit boards have become an indispensable basic component for most electronic products to achieve circuit interconnection. Copper clad laminates are the most basic material for manufacturing printed circuit boards. At present, copper-clad laminates are mainly divided according to the production materials: phenolic resin / paper-based copper-clad laminates (FR-1, FR-2), epoxy resin / glass fiber cloth-based copper-clad laminates (FR-4 ), composite base copper clad laminates (CEM-1, CEM-3). CEM-1 copper clad laminate has good flatness, thickness accuracy and dimensional stability. It is superior to paper substrates in terms of mechanical strength, dielectric properties, and water absorption. Compared with FR-4 epoxy glass fiber cloth substrates,...

Claims

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Application Information

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IPC IPC(8): B32B37/02B32B37/06B32B38/08B32B15/20B32B17/02C08J5/24C08L63/02C08L63/04C08K13/02C08K5/5399C08L61/14
Inventor 闵玉勤张国强张兴宏徐骏王天胜霍宏亮
Owner 建滔积层板(昆山)有限公司
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