Compound base copper-clad laminate and manufacturing method thereof

Abstract

The invention discloses a method for manufacturing a compound base copper-clad laminate, which comprises the following steps of: rubberizing a glass fiber cloth through a first maceration extract, and drying prepregs to manufacture surface prepregs; rubberizing wood pulp paper through a second maceration extract, and drying core prepregs; and cutting more than two of the core prepregs to superpose the core prepregs together, superposing the surface prepregs on two sides respectively, then superposing a copper foil on a single surface or two surfaces, and performing hot press molding to obtain the compound base copper-clad laminate. The method for manufacturing the compound base copper-clad laminate can reduce the water absorbability of the laminate and prevent plate explosion by using the first maceration extract and the second maceration extract to perform optimization and using a phosphazene compound flame retardant to replace part of phosphorus-containing epoxy resin or phosphate, and the prepared compound base copper-clad laminate has the advantages of small content of chlorine and bromine, low water absorption, good dip soldering resistance, improved electrical property, high flame retardance capable of reaching the level of UL94V-0, and increased tenacity.

Description

technical field [0001] The invention relates to a composite base copper-clad laminate and a manufacturing method thereof. The composite base copper-clad laminate is used for a printed circuit board. Background technique [0002] Printed circuit boards have become an indispensable basic component for most electronic products to achieve circuit interconnection. Copper clad laminates are the most basic material for manufacturing printed circuit boards. At present, copper-clad laminates are mainly divided according to the production materials: phenolic resin / paper-based copper-clad laminates (FR-1, FR-2), epoxy resin / glass fiber cloth-based copper-clad laminates (FR-4 ), composite base copper clad laminates (CEM-1, CEM-3). CEM-1 copper clad laminate has good flatness, thickness accuracy and dimensional stability. It is superior to paper substrates in terms of mechanical strength, dielectric properties, and water absorption. Compared with FR-4 epoxy glass fiber cloth substrates,...

AI Technical Summary

Problems solved by technology

However, the production process of phosphorus-containing epoxy resin is complicated and the cost is high. Its molecular structure contains a phosphate bond structure. The hydrolysis of the ester bond results in a cracking phenomenon, and when the cracking phenomenon occurs, the copper clad laminate will appear delamination, which is what producers and users do not want to see

Images