8 results about "Dip soldering" patented technology

The utility model belongs to the technical field of electronic component welding, particularly relates to a welding device for electronic component production, and aims to solve the problems that the quality is influenced by floating residues on the surface of welding flux and a circuit board is thermally deformed in the prior art. A preheating frame is welded to the outer wall of one side of the lead-tin solder pool, and heating rods distributed at equal intervals are installed on the inner wall of the preheating frame. According to the utility model, the preheating frame is arranged on one side of the lead-tin solder pool, after the template is placed on the positioning block, the heating rod in the preheating frame can heat the circuit board, and before dip soldering, pre-soldering preheating can be carried out firstly, so that bridge area deformation of the circuit board caused by heating can be avoided, and the problem of circuit board deformation can be solved; the automatic tin removing structure is arranged on the lead-tin solder pool, the lead scraping plate can be controlled to move by driving the connecting rod to move through the electric guide rail, dross on the surface of solder can be scraped, cleaning is convenient, and the quality of solder joints can be improved.

The utility model relates to the technical field of wire welding, in particular to a double-end tin dipping soldering plate machine. According to the technical scheme, a finished product conveying belt is installed on a bottom plate, a linear guide rail is installed on one section of the finished product conveying belt, a servo motor is installed on one section of the linear guide rail, a ball screw is installed in the linear guide rail, a wire passing plate is installed on the linear guide rail through the ball screw, and a double-station tin furnace is installed on the bottom plate. A welding station is installed on the bottom plate through a sliding rail, a double-station welding gun is erected on the bottom plate and located above the welding station, a finished product taking clamp is erected on the bottom plate, and a raw material taking clamp is installed on the bottom plate. According to the utility model, the ball screw is driven by the servo motor to drive the wire passing plate to move accurately, so that accurate feeding of wires is realized. And the double-station tin furnace and the double-station welding gun work cooperatively, so that the welding efficiency is greatly improved. The finished product and raw material taking clamp is matched with the conveying belt to achieve automatic circulating production, and high efficiency and stability are achieved.

The dip soldering machine with the scraping mechanism comprises a dip soldering machine workbench, a through groove is formed in the inner wall of the top of the dip soldering machine workbench, a sinking groove is formed in the inner wall of the front end of the through groove, a solder pool is installed on the inner wall of the through groove in a matched and clamped mode, sliding grooves are formed in the outer walls of the left side and the right side of the top of the solder pool, and the left side and the right side of the top of the solder pool are provided with the scraping mechanism. A sliding groove is formed in the side wall of the solder pool, a scraping assembly is slidably connected to the inner wall of the sliding groove, the scraping assembly comprises a rotating shaft, a scraping plate is fixedly installed on the outer wall of the rotating shaft, a discharging hole is formed in the side wall of the solder pool, and a waste residue pool is arranged at the output end of the discharging hole. According to the dip soldering machine, the scraping plate with the angle capable of being adjusted in a sliding and overturning mode is arranged at the top of the solder pool, so that when the dip soldering machine is used for welding, residues on the surface of the solder liquid level of the solder pool can be automatically scraped into the waste residue pool, the working efficiency and the automation degree of the dip soldering machine are improved, and the using practicability of the dip soldering machine is improved.

The application discloses an environment-friendly liquid flux for high-temperature dip soldering and a preparation method thereof. The flux comprises, in percentage by mass, 1-5% of a film forming agent, 2-5% of an activator, 0.1-0.5% of a surfactant, 0.05-0.3% of an inhibitor, 5-15% of a cosolvent, 1.5-7.0% of a regulator and the balance of a main solvent. The flux is specially designed for 300-450 DEG C high-temperature lead-free dip soldering, has the advantages of no color or light color transparency after soldering, no corrosion, high insulation resistance, excellent soldering performance, environmental protection and the like, and is suitable for soldering of electronic products with high reliability and appearance requirements.

The invention relates to a liquid soldering flux suitable for various welding processes and a preparation method of the liquid soldering flux. The liquid soldering flux comprises the following components in percentage by weight: 2.0 to 3.0 percent of film-forming agent, 1.0 to 2.0 percent of active agent, 0.1 to 0.5 percent of surfactant, 0.5 to 1.0 percent of corrosion inhibitor and the balance of solvent. According to the invention, a plurality of components such as a film forming substance with water resistance, solvent resistance and chemical resistance, an active agent with chelating property, a polyether modified polysiloxane surfactant with a twin structure, a 2-butoxyethyl benzoate solvent with high boiling point and splashing resistance and the like are compounded; the prepared liquid soldering flux is suitable for wave soldering, dip soldering, series soldering and the like and is halogen-free, low in residue, high in activity, high in reliability, few in splashing and residue and low in corrosion.

This invention discloses a soldering machine for preventing dip soldering misalignment, relating to the field of integrated circuit manufacturing technology. It includes a frame, on which a placement rack, flux nozzle, and solder bath are fixedly connected; a moving mechanism; a hook mechanism including a top frame, hook housing, side slide plate, and pressure mold; and a slag removal mechanism. Through the hook and slag removal mechanisms, as the hook mechanism lifts the PCB to be dip soldered from the placement rack and transports it directly above the solder bath, it moves downwards driven by the moving mechanism. When the bottom surface of the side slide plate abuts against the top surface of the lowering frame, the side slide plate continues to move downwards, causing the lowering frame and slag removal plate to move downwards as well. At this time, the slag removal plate opens to both sides, pushing the oxides on the surface of the solder bath to the sides, thus overflowing the solder bath. This ensures that oxides do not adhere to the pins during dip soldering, guaranteeing the dip soldering effect.

The utility model provides a novel photovoltaic module dip soldering device which comprises a support and a material barrel, a soaking tank is arranged on the support, scaling powder is placed in the soaking tank, the material barrel is used for storing the scaling powder, the soaking tank is provided with a circulation assembly, the circulation assembly comprises a circulation outlet and a circulation inlet, and the circulation inlet is communicated with the circulation outlet. The circulating outlet is formed in one side of the bottom of the soaking tank, the circulating inlet is formed in the outer side face of the wall of the soaking tank, the circulating outlet is connected with the material barrel, a circulating device is arranged on one side of the support and comprises a circulating pump, a circulating pump inlet and a circulating pump outlet are formed in the circulating pump, and the circulating pump inlet and the circulating pump outlet are communicated with the material barrel. An inlet of the circulating pump is connected with the material barrel, an outlet of the circulating pump is connected with the circulating inlet, the structure is simple, safety and reliability are achieved, and the service life is long.

The invention discloses a full-automatic dip soldering machine control method and system, and relates to the technical field of dip soldering machine control, and the method comprises the steps: collecting a PCB image after dip soldering is completed through a high-precision visual perception technology, carrying out the precise positioning and feature extraction of a region of interest of each welding spot on a PCB through machine vision, introducing the concept of a gold standard point, and carrying out the precise positioning and feature extraction of the region of interest of each welding spot on the PCB; the visual features of each welding spot are compared with the ideal state through a deep learning model, and continuous, refined and quantitative scoring and classification of the quality of the welding spots are achieved. And finally, based on the mass fractions of all the welding spots and the classified statistical result, the overall welding effect under the current technological parameters is accurately sensed, and the technological parameter increments needing to be adjusted, such as dip soldering time and welding flux temperature, are calculated in a self-adaptive mode through an intelligent algorithm. In this way, prospective dynamic optimization of the dip soldering process can be achieved, and therefore the consistency and the excellent rate of the welding spot quality are remarkably improved.