Halogen-free and phosphorous-free flame-retardant synthetic resin adhesive used for flexible copper clad laminate

Abstract

The invention relates to a halogen-free and phosphorous-free flame-retardant synthetic resin adhesive used for a flexible copper clad laminate, in particular to the adhesive used for producing the flexible copper clad laminate. The adhesive comprises the following components: biphenyl epoxy resin, elastomer modified epoxy resin, a flexibilizer, a curing agent, a curing accelerator, an inorganic filler and an organic solvent. The halogen-free and phosphorous-free flame-retardant synthetic resin adhesive is halogen-free and phosphorous-free, is environmental-friendly and achieves fire retardance up to level UL94V-0; and the flexible copper clad laminate produced by using the adhesive has the characteristics of high folding endurance, high fire retardance, dip-soldering resistance, high peel strength, low water absorption and high dimensional stability.

Description

technical field

[0001] The invention relates to a halogen-free, phosphorus-free, flame-retardant synthetic resin adhesive, in particular to a halogen-free, phosphorus-free, flame-retardant epoxy resin adhesive for producing flexible copper-clad laminates. Background technique

[0002] The traditional three-layer flexible copper clad laminate (FCCL) mainly uses brominated epoxy resin as the main body, and realizes its flame retardancy through bromine. Although this can achieve excellent flame retardancy, when burning, not only smoke A large amount, and will produce corrosive and toxic hydrogen halide gas. It is also reported that substances such as carcinogenic dioxins and dibenzofurans have been detected in electronic equipment wastes containing halogens such as bromine. In 2006, two environmental protection directives promulgated by the European Union were officially implemented. In order to meet the green environmental protection requirements of "halogen-free substrate ma...

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