Low solid content halogenide-free water-based type cleaning-free scaling powder

Abstract

The present invention relates to a medium-and-high-activity, low-solid-content halideless water-based type wash-free soldering flux which is applicable to the spraying process, the foaming process and the dipping process. The soldering flux is composed of the following weight proportions of substances: 1 percent to 4 percent of promoting agent, 0.5 percent to 1.5 percent of filmerformer, 20 percent to 40 percent of latent solvent, 0.1 percent to 2 percent of wetting agent and 0.01 percent to 0.1 percent of corrosion inhibitor, and the rest is deionized water. The soldering flux of the present invention does not contain halogen and colophony; soldering material can have good spreadability; a PCB board can have good solder permeability; soldering spots are plump and shiny; the surface of the soldered PCB board has no visible residues and is not eroded, and the surface insulation resistance is high; under the normal temperature, the soldering flux does not absorb moisture and cannot be decomposed, and a washing process can be omitted. Since the deionized water is used as solvent, the soldering flux does not contain any volatile organic substance, so the soldering flux cannot be ignited and does not explode, and therefore the soldering flux is environment-friendly. The soldering flux is applicable to the wave-soldering or dip-soldering production line of various printed boards in the fields of communication, aviation, computers, etc.

Description

technical field

[0001] The invention relates to a soldering flux, in particular to a low-solid-content halide-free water-based no-cleaning flux suitable for lead-free solder. Background technique

[0002] In recent years, no-clean flux has been widely used in the electronics industry at home and abroad due to its advantages of no cleaning after soldering and cost savings. However, there are some defects: Some of the no-clean fluxes developed in the past have weak activity and low corrosiveness, which can meet the welding of general electronic devices, but are not suitable for welding materials with poor wettability; some have strong activity, but are corrosive. Larger, there are many residues after welding, which will cause potential harm to electronic products running for a long time in a high temperature and high humidity environment. Secondly, the past research work mainly focused on the development of flux used in traditional Sn-Pb solder. Due to the requirements of glo...